Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Overview KEMET's high temperature surface mount C0G Multilayer Ceramic Capacitors (MLCCs) feature a robust, proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance stability at extreme temperatures up to +200C. This new platform promotes downsizing opportunities of existing high temperature C0G technology, and offers replacement opportunities of existing X7R/BX/BR technologies. KEMET's high temperature C0G dielectric features a 200C maximum operating temperature and is considered "stable." The Benefits * * * * * * * * * * * * * -55C to +200C operating temperature range Pb-Free and RoHS compliant EIA 0603, 0805, 1206, 1210, 1812 & 2220 case sizes DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V Capacitance offerings ranging from 0.5pF up to 0.47F Available capacitance tolerances of 0.25pF, 0.5pF, 1%, 2%, 5%, 10% or 20% No piezoelectric noise Extremely low ESR and ESL High thermal stability High ripple current capability Preferred capacitance solution at line frequencies and into the MHz range No capacitance change with respect to applied rated DC voltage Negligible capacitance change with respect to temperature from -55C to +200C Electronics Components, Assemblies & Materials Association (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to 30ppm/C from -55C to +200C. * No capacitance decay with time * Non-polar device, minimizing installation concerns * 100% pure matte tin-plated end metallization allowing for excellent solderability Applications Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes. Ordering Information C 1210 H 124 J 5 G A C TU Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance1 Voltage Dielectric Failure Rate/ Design End Metallization (Plated)2 Packaging/Grade (C-Spec)3 0603 0805 1206 1210 1812 2220 H= High Temp (200C) 2 Sig. Digits + Number of Zeros Use 9 for 1.0 - 9.9pF Use 8 for 0.5 - .99pF ex. 2.2pF = 229 ex. 0.5pF = 508 C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20% 8 = 10V 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V G = C0G A = N/A C = 100% Matte Sn L = SnPb (5% min) Blank = Bulk TU = 7" Reel Unmarked Additional capacitance tolerance offerings may be available. Contact KEMET for details. Additional termination options may be available. Contact KEMET for details. 3 Additional reeling or packaging options may be available. Contact KEMET for details. 1 2 One WORLD One Brand One Strategy One Focus One Team (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com One KEMET C1001-1 * 9/14/2010 1 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Dimensions - Millimeters (Inches) W 100% Tin or SnPb Plate L B T S EIA Size Code Metric Size Code L Length W Width B Bandwidth 0603 0805 1206 1210 1812 2220 1608 2012 3216 3225 4532 5650 1.60 (.063) 0.15 (.006) 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.20 (.008) 3.20 (.126) 0.20 (.008) 4.50 (.177) 0.30 (.012) 5.70 (.224) 0.40 (.016) 0.80 (.032) 0.15 (.006) 1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 3.20 (.126) 0.30 (.012) 5.00 (.197) 0.40 (.016) 0.35 (.014) 0.15 (.006) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) Nickel Plate Electrodes T Thickness See Table 2 for Thickness Conductive Metalization Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only Qualification/Certification Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Environmental Compliance RoHS PRC ( Peoples Republic of China) compliant Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range: Capacitance Change with Reference to +25C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25C: Insulation Resistance (IR) Limit @ 25C: Insulation Resistance (IR) Limit @ 200C: -55C to +200C 30PPM/C (up to 200C) 0% 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50mA) 0.1% 1000 megohm microfarads or 100G 10 megohm microfarads or 1G To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz 50Hz and 1.0 0.2 Vrms if capacitance 10F 120Hz 10Hz and 0.5 0.1 Vrms if capacitance >10F (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 2 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Electrical Characteristics Delta Cap vs. Temperature (Typical) C1210H104J1GAC - Life Test IR Distribution (Lognormal) 20 99 15 5 P e rc e n t Delta Cap (%) 10 0 -5 -10 0 Vr -15 100% Vr -20 0 hrs 2000 hrs 95 90 80 70 60 50 40 30 20 10 5 200 180 160 140 120 100 80 60 40 20 0 -20 -40 -60 1 0.1 1.0 10.0 100.0 25C IR (GOhms) Temperature (C) Capacitance vs. Temperature with 25V DC Bias (Rated Voltage) DF vs. Temperature without DC Bias. 200 1.00 200C C0G MLCC 100nF 200C C0G 100nF 25V DC 150 0.50 DF (%) Capacitance (nF) 200C C0G 100nF no DC 100 0.00 50 -0.50 0 -1.00 Temperature (C) IR vs. Temperature with 25V DC Bias (Rated Voltage) BME vs. PME/IR vs. Temperature with 25V DC Bias (Rated Voltage) 1.E+08 1.E+08 1.E+07 1.E+07 1.E+06 1.E+06 1.E+05 IR (MOhms) IR (MOhms) 200 180 160 140 120 100 80 60 40 20 0 -20 -40 -60 200 180 160 140 120 100 80 60 40 20 0 -20 -40 -60 Temperature (C) 1.E+04 1.E+03 1.E+02 1.E+01 1.E+05 1.E+04 1.E+03 PME C0G MLCC 1206/10nF 1.E+02 200C C0G MLCC 100nF 1.E+00 BME C0G MLCC 1206/10nF 1.E+01 200 180 160 140 120 80 100 60 40 0 20 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com -20 -40 -60 200 180 160 140 120 100 80 60 40 0 20 -20 -40 -60 Temperature (C) Temperature (C) C1001-1 * 9/14/2010 3 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Table 1A - (0603 - 1210 Case Sizes) 4 3 5 1 2 8 4 3 5 1 2 Voltage VDC 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DD DD DF DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DC DC DD DD DD DD DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DE DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DC DC DC DC DC DC DD DD Voltage VDC 100 8 50 2 25 1 16 5 10 3 200 4 100 8 50 2 25 1 16 5 10 Voltage Code 8 4 3 5 1 2 8 4 3 5 1 Series C0603 EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC ED ED ED ED EE EC EC EC EE EE EF EC EC ED ED EB EB EB EB EB EB EB EB EB EC EE EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC ED EE EB EB EC EC ED ED ED EE EC EC FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FF FB FB FB FB FB FB FB FB FC FC FC FC FE FE FF FF FG FG FG FG FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FC FF FF FF FF FG FG FG FG FG FC FC FE FF FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FE FE FE FE FG FC FC FF FF FF FF FF FG FG FG 25 50 100 200 10 16 25 50 100 200 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 16 G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions 10 Cap Code D D D D D D D D F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F 200 Cap C C C C C C C1210 3 16 508-759 109-249 279-519 569-919 100-130 150-240 270-360 390-510 560-910 101-181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273 C1206 4 Cap Tolerance 0.5-0.75 pF 1.0-2.4 pF 2.7-5.1 pF 5.6-9.1 pF 10-13 pF 15-24 pF 27-36 pF 39-51 pF 56-91 pF 100-180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF C0805 8 25 C0603 Voltage Code 10 Cap Series Cap Code 2 8 4 3 5 1 2 8 4 3 5 1 2 C0805 C1206 C1210 UD = Under Developement (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. C1001-1 * 9/14/2010 4 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Table 1A con't - (0603 - 1210 Case Sizes) 3 5 1 2 8 4 3 5 1 10 16 25 50 100 200 10 16 25 50 100 2 200 4 200 200 8 Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions M M M M M M M M M M DG DG DG EB EC ED EF EH EH UD UD UD EB EC ED EF EH EH EB EC ED EF EH EH EB EE EF EH EH EE EH FB FB FB FB FB FB FB FB FC FC FE FE FG FG FH FH FB FB FB FB FC FE FG FH FB FB FB FC FF FG FH FM FB FE FF FG FH FM 50 100 200 10 16 25 50 100 200 10 16 25 50 100 200 8 25 Voltage Code 16 Voltage VDC 10 UD UD UD UD UD UD 200 K K K K K K K K K K 2 100 J J J J J J J J J J 1 50 G G G G G G G G G G 5 16 Cap Cap Code F F F F F F F F F F 3 25 333 473 563 683 823 104 124 154 184 224 10 33,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF C1210 4 100 100 Cap Tolerance C1206 8 50 2 25 1 16 5 10 3 50 Voltage VDC C0805 4 16 C0603 8 25 Series Voltage Code 10 Cap Cap Code 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 Series C0603 C0805 C1206 C1210 Table 1B - (1812 - 2220 Case Sizes) Cap Cap Code 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF 0.27 uF 0.33 uF 0.47 uF 0.56 uF 0.68 uF 0.82 uF 153 183 223 273 333 473 563 683 823 104 124 154 184 224 274 334 474 564 684 824 Cap Cap Code Series F F F F F F F F F F F F F F F F F F F F Voltage Code Voltage VDC Cap Tolerance G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K Voltage VDC Voltage Code Series C1812 M M M M M M M M M M M M M M M M M M M M C2220 1 2 5 1 100 200 50 100 See Table 2 for Chip Thickness Dimensions GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GB GH GD GN GH GK JG 100 1 200 2 C1812 50 5 100 1 C2220 UD = Under Developement (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. C1001-1 * 9/14/2010 5 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Table 2 - Chip Thickness / Packaging Quantities Thickness Code AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF Chip Size 01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225 Thickness Range (mm) 0.20 0.02 0.30 0.03 0.50 0.05 0.80 0.07 0.80 0.10 0.80 0.15 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.25 0.20 0.78 0.10 0.80 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.25 0.15 1.60 0.15 1.60 0.20 1.70 0.20 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.40 0.15 1.50 0.20 1.55 0.15 1.60 0.20 1.70 0.20 1.85 0.20 1.85 0.20 1.90 0.20 2.10 0.20 2.25 0.20 2.50 0.20 0.80 0.10 0.80 0.10 0.90 0.10 0.90 0.10 0.90 0.10 1.40 0.15 1.60 0.15 2.00 0.15 1.00 0.10 1.10 0.10 1.25 0.15 1.30 0.10 1.40 0.15 1.50 0.10 1.55 0.10 1.60 0.20 1.70 0.15 1.70 0.20 1.90 0.20 2.00 0.20 2.50 0.20 1.10 0.15 1.15 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.70 0.15 1.80 0.15 2.40 0.15 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.60 0.20 Qty per Reel 7" Plastic 4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 Qty per Reel 13" Plastic 10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 Qty per Reel 7" Paper 15000 15000 10000 4000 4000 4000 4000 4000 4000 Qty per Reel 13" Paper Qty per Bulk Cassette 50000 10000 10000 10000 10000 10000 50000 15000 10000 Package Quantity Based on Finished Chip Thickness Specifications (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 6 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Soldering Process Recommended Soldering Technique: * Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 * All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile * KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1 Table 3 - Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) C Y X V1 Density Level B: Median (Nominal) Land Protrusion (mm) V2 C Y X V1 Density Level C: Minimum (Least) Land Protrusion (mm) V2 C Y X V1 V2 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70 1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60 2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00 Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 7 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Table 4 - Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL-STD-202//JESD22 High Temperature Life Load Humidity Low Voltage Humidity Temperature Cycling Thermal Shock Moisture Resistance 200C, Rated Voltage, 2000 Hours 85C /85%RH, Rated Voltage, 1000 Hours 85C /85%RH, 1.5V, 1000 Hours -55C to +200C, 50 Cycles -55C to +150C, 20s transfer, 15 min dwell, 300 Cycles Cycled Temp/RH. 0V, 10 cycles @ 24 Hours each Physical, Mechanical & Process Tests per MIL-STD 202/JIS-C-6429 Resistance to Solvents Mechanical Shock and Vibration Resistance to Soldering Heat Terminal Strength Board Flex Include Aqueous wash chemical - OKEM Clean or equivalent Method 213: Figure 1, Condition F Method 204: 5gs for 20min, 12 cycles Condition B, no per-heat of samples, Single Wave Solder Force of 1.8 kg for 60 seconds 3mm minimum (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 8 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips. Bar Code Label Anti-Static Reel (R) Embossed Plastic* or Punched Paper Carrier. T ME KE Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military) Sprocket Holes Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape 178mm (7.00") or 330mm (13.00") Anti-Static Cover Tape (.10mm (.004") Max Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 - Carrier Tape Configuration (mm) EIA Case Size Tape size (W)* Pitch (P1)* 01005 - 0402 8 2 0603 - 1210 8 4 1805 - 1808 12 4 1812 12 8 KPS 1210 12 8 KPS 1812 & 2220 16 12 Array 0508 & 0612 8 4 *Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 9 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo Po [10 pitches cumulative tolerance on tape 0.2 mm] E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 6 User Direction of Unreeling Table 6 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8mm 12mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16mm D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 T Max. T1 Max. 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8mm Single (4mm) 12mm Single (4mm) & Double (8mm) 16mm Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. F P1 T2 Max W Max A0,B0 & K0 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 5.5 0.05 (0.217 0.002) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 8.0 0.10 (0.315 0.004) 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12mm tapes and 10 maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 10 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Figure 2 - Punched (Paper) Carrier Tape Dimensions P2 T Po ODo [10 pitches cumulative tolerance on tape 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 - Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 E1 P0 P2 T1Max G Min 8mm 1.5 +0.10-0.0 (0.059 +0.004, -0.0) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 0.10 (.004) Max. 0.75 (.030) R Ref. Note 2 25 (.984) T Max W Max A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8mm Half (2mm) 8mm Single (4mm) E2 Min 6.25 (0.246) F 3.5 0.05 (0.138 0.002) P1 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) Note 5 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5). (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 11 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8mm 12mm & 16mm 0.1 Newton to 1.0 Newton (10g to 100g) 0.1 Newton to 1.3 Newton (10g to 130g) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 30010 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624. Figure 3 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16-200 Bo Maximum Rotation ( 20 10 T) Typical Component Centerline Ao s Tape Width (mm) 8,12 16-56 72-200 Maximum Rotation ( 20 10 5 S) Figure 4 - Maximum Lateral Movement 8mm & 12mm Tape 16mm Tape 0.5 mm maximum 0.5 mm maximum 1.0 mm maximum 1.0 mm maximum Figure 5 - Bending Radius Embossed Carrier R Punched Carrier Bending Radius R (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 12 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Figure 6 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm min.) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 - Reel Dimensions Metric Dimensions Will Govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Min C D Min 8mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12mm 16mm Variable Dimensions -- Millimeters (Inches) Tape Size N Min 8mm 12mm 16mm 50 (1.969) W1 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com W2 Max 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) W3 Shall accommodate tape width without interference C1001-1 * 9/14/2010 13 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Figure 7 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only Round Sprocket Holes END START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm minimum, Components 100 mm Min. Leader 400 mm Minimum, Top Cover Tape Figure 8 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 14 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Figure 9 - Bulk Cassette Packaging (Ceramic Chips Only) Meets Dimensional Requirements IEC-286 and EIAJ 7201 6 8 0.1 8 8 0.1 12.0 0.1 Unit mm *Reference 19.0* 36 00.2 31.5 0.2 0 53 3* 10* 1.5 2.0 3.0 0.1 0 0 0.1 0.2 0 5 0* 110 0.7 Table 9 - Capacitor Dimensions for Bulk Cassette Cassette Packaging - Millimeters EIA Size Metric Size L Length Code Code W Width B Bandwidth S Separation minimum T Thickness Number of Pcs/Cassette 0402 1005 1.0 0.05 0.5 0.05 0.2 to 0.4 0.3 0.5 .05 50,000 0603 1608 1.6 0.07 0.8 0.07 0.2 to 0.5 0.7 0.8 .07 15,000 Table 10 - Capacitor Marking Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional - Not Available for 0402 Size) Numeral Alpha Character A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y Capacitance (pF) For Various Numeral Identifiers 9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Example shown is 1,000 pF capacitor C1001-1 * 9/14/2010 15 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Other KEMET Resources Tools Resource Location Configure A Part: CapEdge http://capacitoredge.kemet.com SPICE & FIT Software http://www.kemet.com/spice Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask Product Information Resource Location Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Product Request Resource Location Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Contact Resource Location Website Contact Us Investor Relations www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir Call Us 1-877-MyKEMET Twitter http://twitter.com/kemetcapacitors Disclaimer All product specifications, statements, information and data (collectively, the "Information") are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 16 Surface Mount Multilayer Ceramic Chip Capacitors - High Temperature 200C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) KEMET Corporation World Headquarters P.O. Box 5928 Greenville, SC 29606 2835 KEMET Way Simpsonville, SC 29681 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 North America Corporate Offices 101 NE Third Avenue Tower 101, Suite 1700 Fort Lauderdale, FL 33301 Tel: 954-766-2800 Fax: 954-766-2805 Southeast 801 International Parkway, Suite 5070 Lake Mary, FL 32746 Tel: 407-855-8886 Northeast 340-X Fordham Road Wilmington, MA 01887 Tel: 978-658-1663 Fax: 978-658-1790 Central 1900 North Roselle Road, Suite 405 Schaumburg, IL 60195 Tel: 847-882-3590 Fax: 847-882-3046 Europe Southern Europe 15bis chemin des Mines, 4th floor 1202 Geneva Switzerland Tel: 41-22-715-0100 Fax: 41-22-715-0170 Zac Paris Rive Gauche 118-122 avenue de France 75013 Paris France Tel: 33-1-4646-1009 Fax: 33-1-4646-1599 Via San Lorenzo 19 Sasso Marconi, BO 40037 Italy Tel: 39-051-939111 Fax: 39-051-840684 Viale Milanofiori 1 Palazzo E1 20090 Assago Milano Italy Tel: 39-02-57518176 Fax: 39-02-57512093 Central Europe Hermann-Koehl-Str. 2 Landsberg am Lech 86899 Germany Tel: 49-8191-3350800 Fax: 49-8191-3350990 West 1551 McCarthy Boulevard, Suite 117 Milpitas, CA 95035 Tel: 408-433-9946 Fax: 408-433-9946 Ruhrallee 9 Dortmund 44139 Germany Tel: 49-2307-3619672 Fax: 49-2307-961527 Mexico Northern Europe Tezozomoc No. 47 Col. 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Road Bangalore 560 001 India Tel: 91-80-653-76817 Fax: 91-80-2532-0160 Room 1411, 14/F New China Insurance Edifice Mintian Road, CBD Futian District Shenzhen 518001 China Tel: 1-867-55-25181306 Fax: 1-867-55-25181307 Floor 17, Tower B, Ping An IFC No.1-3 Xin Yuan South Road Chao Yang District Beijing 100027 China Tel: 86-10-5829-1711 Fax: 86-10-5829-1963 Room 2602, Grand Gateway Tower 1 No.1 Hong Qiao Road Shanghai 200030 China Tel: 86-21-6447-0707 Fax: 86-21-6447-0070 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com C1001-1 * 9/14/2010 17