DATA SHEET ANTI-SULFURATED CHIP RESISTORS AF series 5%, 1% sizes 0402/0603/0805/1206 Product specification - Jan 07, 2011 V.0 RoHS compliant & Halogen free Product specification Chip Resistor Surface Mount AF 8 SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER This specification describes AF0402 to AF1206 chip resistors with anti-sulfuration capabilities. Part number is identified by the series name, size, tolerance, packaging type, temperature coefficient, taping reel and resistance value. APPLICATIONS Environments exposed to high levels of contamination, such as industrial control systems Car electronics, sensors, electric instrumentation and communication base stations 2 0402 to 1206 SERIES GLOBAL PART NUMBER AF XXXX X X X XX XXXX L (1) (2) (3) (4) (5) (6) (7) (1) SIZE 0402 / 0603 / 0805 / 1206 (2) TOLERANCE F = 1% J = 5% FEATURES Superior resistance against sulfur containing atmosphere Halogen free product and production RoHS - - compliant Products with lead free terminations meet RoHS requirements Pb-glass contained in electrodes, resistor element and glass are exempted by RoHS Reduces environmentally hazardous waste High component and equipment reliability Saving of PCB space (3) PACKAGING TYPE R = Paper taping reel (4) TEMPERATURE COEFFICIENT OF RESISTANCE - = Base on spec (5) TAPING REEL 07 = 7 inch dia. Reel 10 = 10 inch dia. Reel 13 = 13 inch dia. Reel 7D = 7 inch Dia. Reel with double quantity (6) RESISTANCE VALUE 1 to 22 M There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point, no need to mention the last zero after R/K/M, e.g.1K2, not 1K20. Detailed resistance rules are displayed in the table of "Resistance rule of global part number". (7) DEFAULT CODE Letter L is system default code for ordering only (Note) Resistance rule of global part number Resistance coding rule Example XRXX (1 to 9.76 ) 1R = 1 1R5 = 1.5 9R76 = 9.76 XXRX (10 to 97.6 ) 10R = 10 97R6 = 97.6 XXXR (100 to 976 ) 100R = 100 XKXX (1 to 9.76 K) 1K = 1,000 9K76 = 9760 XMXX (1 to 9.76 M) 1M = 1,000,000 9M76= 9,760,000 ORDERING EXAMPLE The ordering code for an AF0402 chip resistor, value 100 KX with 1% tolerance, supplied in 7-inch tape reel with 10Kpcs quantity is: AF0402FR-07100KL. NOTE 1. All our RSMD products are RoHS compliant and Halogen free. "LFP" of the internal 2D reel label states "Lead-Free Process" 2. On customized label, "LFP" or specific symbol can be printed www.yageo.com Jan 07, 2011 V.0 Product specification Chip Resistor Surface Mount AF SERIES 3 8 0402 to 1206 MARKING AF0402 ynsc007 No marking Fig. 1 AF0603 / AF0805 / AF1206 03 YNSC001 Fig. 2 Value=10 K E-24 series: 3 digits, 5%, 10 X First two digits for significant figure and 3rd digit for number of zeros AF0603 0 YNSC Fig. 3 Fig. 4 Value = 24 Value = 12.4 K E-24 series: 3 digits, 1% One short bar under marking letter E-96 series: 3 digits, 1% First two digits for E-96 marking rule and 3rd letter for number of zeros AF0805 / AF1206 00 YNSC004 Fig. 5 Value = 10 K Both E-24 and E-96 series: 4 digits, 1% First three digits for significant figure and 4th digit for number of zeros NOTE For further marking information, please see special data sheet "Chip resistors marking". Marking of AF series is the same as RC series www.yageo.com Jan 07, 2011 V.0 Product specification Chip Resistor Surface Mount AF 4 8 0402 to 1206 SERIES CONSTRUCTION The resistors are constructed on top of a high grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The resistive glaze is covered by a lead-free glass. The composition of the glaze is adjusted to give the approximate required resistance value and laser trimming of this resistive glaze achieves the value within tolerance. The whole element is covered by a protective overcoat. Size 0603 and bigger is marked with the resistance value on top. Finally, the two external terminations (Ni / matte tin) are added. See fig.6 OUTLINES For dimensions see Table 1 marking layer overcoat primary glass layer resistive layer (Jumper chip is a conductor) inner electrode termination(Ni/matte tin) inner electrode H ceramic substrate I2 overcoat I1 DIMENSIONS Table 1 For outlines see fig. 6 TYPE L (mm) W (mm) H (mm) I1 (mm) I2 (mm) W AF0402 1.00 0.05 0.50 0.05 0.32 0.05 0.20 0.10 0.25 0.10 AF0603 1.60 0.10 0.80 0.10 0.45 0.10 0.25 0.15 0.25 0.15 YNSC086 L AF0805 2.00 0.10 1.25 0.10 0.50 0.10 0.35 0.20 0.35 0.20 Fig. 6 Chip resistor outlines AF1206 3.10 0.10 1.60 0.10 0.55 0.10 0.45 0.20 0.40 0.20 ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS TYPE RESISTANCE RANGE Max. Max. Dielectric Operating Working Overload Withstanding Temperature Range Voltage Voltage Voltage AF0402 AF0603 AF0805 5% (E24), 1 to 22 M 1% (E24/E96), 1 to 10 M -55 C to +155 C Zero Ohm Jumper < 0.05 AF1206 50 V 100 V 100 V 50 V 100 V 100 V 150 V 300 V 300 V 200 V 400 V 500 V Temperature Coefficient of Resistance 1 R 10 , 200 ppm/C 10 < R 10 M, 100 ppm/C 10 M< R 22 M, 200 ppm/C FOOTPRINT AND SOLDERING PROFILES For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special data sheet "Chip resistors mounting". PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PACKING STYLE Paper taping reel (R) REEL DIMENSION AF0402 AF0603 AF0805 AF1206 7" (178 mm) 10,000/20,000 5,000 5,000 5,000 10" (254 mm) 20,000 10,000 10,000 10,000 13" (330 mm) 50,000 20,000 20,000 20,000 NOTE 1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet "Chip resistors packing". www.yageo.com Jan 07, 2011 V.0 Product specification Chip Resistor Surface Mount AF SERIES 5 8 0402 to 1206 FUNCTIONAL DESCRIPTION OPERATING TEMPERATURE RANGE handbook, halfpage Range: -55 C to +155 C P (%Prated ) POWER RATING 100 Each type rated power at 70 C: AF0402=1/16 W (0.0625W) AF0603=1/10 W (0.1W) AF0805=1/8 W (0.125W) AF1206=1/4 W (0.25W) 50 0 RATED VOLTAGE The DC or AC (rms) continuous working voltage corresponding to the rated power is determined by the following formula: MLB206_2 55 0 50 70 100 155 o Tamb ( C) Fig. 7 Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb ) V = (P X R) Where V = Continuous rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (X) www.yageo.com Jan 07, 2011 V.0 Product specification Chip Resistor Surface Mount AF SERIES 6 8 0402 to 1206 TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Temperature Coefficient of Resistance (T.C.R.) IEC 60115-1 4.8 At +25/-55 C and +25/+125 C Refer to table 2 Formula: R2-R1 T.C.R= ------------------------- x106 (ppm/C) R1(t2-t1) Where t1=+25 C or specified room temperature t2=-55 C or +125 C test temperature R1=resistance at reference temperature in ohms R2=resistance at test temperature in ohms IEC 60115-1 4.25 MIL-STD-202 Method 108 At 702 C for 1,000 hours, RCWV applied for 1.5 hours on, 0.5 hour off, still air required High Temperature Exposure/ Endurance at Upper Category Temperature MIL-STD-202 Method 108 1,000 hours at 1555 C, unpowered Moisture Resistance MIL-STD-202 Method 106 Life/Endurance (1.0%+0.05 ) <100 m for Jumper (1.0%+0.05 ) for 1% tol. (1.0%+0.05 ) for 5% tol. <100 m for Jumper Each temperature / humidity cycle is defined at 8 hours, 3 cycles / 24 hours for 10d. with 25 C / 65 C 95% R.H, without steps 7a & 7b, unpowered (0.5%+0.05 ) for 1% tol. (1.0%+0.05 ) for 5% tol. <100 m for Jumper Parts mounted on test-boards, without condensation on parts Thermal Shock MIL-STD-202 Method 107 -55 / +125 C (0.5%+0.05 ) for 1% tol. Number of cycles required is 300. Devices unmounted (1%+0.05 ) for 5% tol. <100 m for Jumper Maximum transfer time is 20 seconds. Dwell time is 15 minutes Short Time Overload IEC60115-1 4.13 Bending IEC 60115-1 4.33 IEC 60068-2-21 2.5 times of rated voltage or maximum overload voltage whichever is less for 5 seconds at room temperature (1.0%+0.05 ) Chips mounted on a 90 mm glass epoxy resin PCB (FR4) (1.0%+0.05 ) Bending: 0402: 5 mm 0603/0805: 3 mm 1206: 2 mm No visible damage No visible damage <100 m for Jumper Bending time: 605 seconds www.yageo.com Jan 07, 2011 V.0 Product specification Chip Resistor Surface Mount AF SERIES 7 8 0402 to 1206 TEST TEST METHOD PROCEDURE REQUIREMENTS Biased Humidity (steady state) IEC 60115-1 4.37 MIL-STD-202 Method 103 1,000 hours at 85 C / 85% R.H. (3.0%+0.05 ) 10% operating power Measurement at 242 hours after test conclusion Solderability - Resistance to Soldering Heat - Wetting IEC 60115-1 4.18 MIL-STD-202 Method 215 J-STD-002 Condition B, no pre-heat of samples (0.5%+0.05 ) for 1% tol. Lead-free solder, 2605 C, 101 seconds immersion time (1.0%+0.05 ) for 5% tol. Procedure 2 for SMD: devices fluxed and cleaned with isopropanol No visible damage <50 m for Jumper Electrical test not required Well tinned (95% covered) Magnification 10X No visible damage SMD conditions: (a) Method B, aging 4 hours at 155 C dry heat, lead-free solder bath at 245 C (b) Method B, dipping at 215 C for 3 seconds ESD AEC-Q200-002 Human body model, (3.0%+0.05 ) 1 pos. + 1 neg. discharges: 0402/0603: 1 KV 0805/1206: 2 KV Terminal Strength IEC 60115-1 4.32 IEC 60068-2-21 A force of 5N applied for 101 seconds (1.0%+0.05 ) FOS ASTM-B-809-95 Sulfur (saturated vapor) 1,000 hours, 602 C, (1.0%+0.05 ) 91-93% R.H., unpowered www.yageo.com Jan 07, 2011 V.0 Product specification Chip Resistor Surface Mount AF SERIES 8 8 0402 to 1206 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 0 Jan 07, 2011 - - First issue of this specification " Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any product change will be announced by PCN." www.yageo.com Jan 07, 2011 V.0