DATA SHEE
T
ANTI-SULFURATED
CHIP RESISTORS
AF series
5%, 1%
sizes 0402/0603/0805/1206
RoHS compliant & Halogen free
Product specification – Jan 07, 2011 V.0
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Product specification
2
8
SERIES
AF
0402 to 1206
ORDERING INFORMATION
-
GLOBAL PART NUMBER
Part number is identified by the series name, size, tolerance, packaging
type, temperature coefficient, taping reel and resistance value.
SCOPE
This specification describes
AF0402 to AF1206 chip resistors
with anti-sulfuration capabilities.
APPLICATIONS
Environments exposed to high
levels of contamination, such
as industrial control systems
Car electronics, sensors,
electric instrumentation and
communication base stations
FEATURES
Superior resistance against
sulfur containing atmosphere
Halogen free product and
production
RoHS compliant
- Products with lead free
terminations meet RoHS
requirements
- Pb-glass contained in electrodes,
resistor element and glass are
exempted by RoHS
Reduces environmentally
hazardous waste
High component and equipment
reliability
Saving of PCB space
GLOBAL PART NUMBER
AF XXXX X X X XX XXXX L
(1) (2) (3) (4) (5) (6) (7)
(1) SIZE
0402 / 0603 / 0805 / 1206
(2) TOLERANCE
F = ±1%
J = ±5%
(3) PACKAGING TYPE
R = Paper taping reel
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Base on spec
(5) TAPING REEL
07 = 7 inch dia. Reel
13 = 13 inch dia. Reel
10 = 10 inch dia. Reel
7D = 7 inch Dia. Reel with double quantity
(6) RESISTANCE VALUE
1 Ω to 22 MΩ
There are 2~4 digits indicated the resistance value. Letter R/K/M is decimal point, no
need to mention the last zero after R/K/M, e.g.1K2, not 1K20.
Detailed resistance rules are displayed in the table of “Resistance rule of global part
number”.
(7) DEFAULT CODE
Letter L is system default code for ordering only
(Note)
O
RDERING EXAMPLE
The ordering code for an AF0402
chip resistor, value 100 KX with
±1% tolerance, supplied in 7-inch
tape reel with 10Kpcs quantity is:
AF0402FR-07100KL.
NOTE
1. All our RSMD products are RoHS
compliant and Halogen free. "LFP" of the
internal 2D reel label states "Lead-Free
Process"
2. On customized label, "LFP" or specific
symbol can be printed
Resistance rule of
global part
number
Resistance coding rule
Example
XRXX
(1 to 9.76 Ω)
1R = 1 Ω
1R5 = 1.5 Ω
9R76 = 9.76 Ω
XXRX
(10 to 97.6 Ω)
10R = 10 Ω
97R6 = 97.6 Ω
XXXR
(100 to 976 Ω) 100R = 100 Ω
XKXX
(1 to 9.76 KΩ)
1K = 1,000 Ω
9K76 = 9760 Ω
XMXX
(1 to 9.76 MΩ)
1M = 1,000,000 Ω
9M76= 9,760,000 Ω
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Product specification
3
8
SERIES
AF
0402 to 1206
MARKING
AF0402
No marking
AF0603 / AF0805 / AF1206
E-24 series: 3 digits, ±5%, ≥10 X
First two digits for significant figure and 3rd digit for number of zeros
AF0603
E-24 series: 3 digits, ±1%
One short bar under marking letter
E-96 series: 3 digits, ±1%
First two digits for E-96 marking rule and 3rd letter for number of zeros
AF0805 / AF1206
Both E-24 and E-96 series: 4 digits, ±1%
First three digits for significant figure and 4th digit for number of zeros
NOTE
For further marking information, please see special data sheet “Chip resistors marking”. Marking of AF series is the same as RC series
Fig. 1
ynsc007
Fig. 2 Value=10 KΩ
YNSC001
03
Fig. 3 Value = 24 Ω
YNS
C
0
Fig. 5 Value = 10 KΩ
YNSC004
00
Fig. 4 Value = 12.4 KΩ
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Product specification
4
8
SERIES
AF
0402 to 1206
CHARACTERISTICS
TYPE RESISTANCE RANGE Operating
Temperature Range
Max.
Working
Voltage
Max.
Overload
Voltage
Dielectric
Withstanding
Voltage
Temperature Coefficient
of Resistance
AF0402
50 V
100 V
100 V
AF0603
50 V
100 V
100 V
AF0805
150 V
300 V
300 V
AF1206
±5% (E24), 1 Ω to 22 MΩ
±1% (E24/E96), 1 Ω to 10 MΩ
Zero Ohm Jumper < 0.05 Ω
–55 °C to +155 °C
200 V
400 V
500 V
1 Ω≤ R ≤ 10 Ω, ±200 ppm/°C
10 Ω< R ≤ 10 MΩ, ±100 ppm/°C
10 MΩ< R ≤ 22 MΩ, ±200 ppm/°C
ELECTRICAL CHARACTERISTICS
Ta bl e 2
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles of AF-series is the same as RC-series. Please see the special
data sheet “Chip resistors mounting”.
PACKING STYLE AND P
A
CKAGING QUANTITY
PACKING STYLE REEL DIMENSION AF0402
AF0603
AF0805 AF1206
Paper taping reel (R)
7" (178 mm) 10,000/20,000
5,000
5,000 5,000
10" (254 mm) 20,000
10,000
10,000 10,000
13" (330 mm) 50,000
20,000
20,000 20,000
NOTE
1. For paper/embossed tape and reel specification/dimensions, please see the special data sheet “Chip resistors packing”.
Table 3 Packing style and packaging quantity
overcoat
primary glass layer
resistive layer
(Jumper chip is a conductor)
inner electrode
termination(Ni/matte tin)
ceramic substrate
marking layer
overcoat
inner electrode
YNSC086
W
L
I
1
H
I2
Fig. 6
Chip resistor outlines
O
OU
UT
TL
LI
IN
NE
ES
S
For dimensions see Table
1
CONSTRUCTION
The resistors are constructed on top of a high grade
ceramic body. Internal metal electrodes are added at
each end and connected by a resistive glaze. The
resistive glaze is covered by a lead-free glass.
The composition of the glaze is adjusted to give the
approximate required resistance value and laser trimming
of this resistive glaze achieves the value within tolerance.
The whole element is covered by a protective overcoat.
Size 0603 and bigger is marked with the resistance value
on top. Finally, the two external terminations (Ni / matte
tin) are added. See fig.6
DIMENSIONS
TYPE L (mm)
W (mm) H (mm) I
1
(mm)
I
2
(mm)
AF0402
1.00 ±0.05
0.50 ±0.05 0.32 ±0.05 0.20 ±0.1
0
0.25 ±0.1
0
AF0603
1.60 ±0.1
0
0.80 ±0.1
0
0.45 ±0.1
0
0.25 ±0.15
0.25 ±0.15
AF0805
2.00 ±0.1
0
1.25 ±0.1
0
0.50 ±0.1
0
0.35 ±0.2
0
0.35 ±0.2
0
AF1206
3.10 ±0.1
0
1.60 ±0.1
0
0.55 ±0.1
0
0.45 ±0.2
0
0.40 ±0.2
0
Ta bl e 1 For outlines see fig. 6
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Product specification
5
8
SERIES
AF
0402 to 1206
MLB206_2
70 10055 50
T
amb( C)
o
(%P )
rated
0
0
50
100
155
P
handbook
,
halfpage
Fig. 7
Maximum dissipation (P
max
) in percentage of rated power
as a function of the operating ambient temperature (T
amb
)
FUNCTIONAL DESCRIPTION
O
OP
PE
ER
RA
AT
TI
IN
NG
G
T
TE
EM
MP
PE
ER
RA
AT
TU
UR
RE
E
R
RA
AN
NG
GE
E
Range: –55 °C to +155 °C
P
PO
OW
WE
ER
R
R
RA
AT
TI
IN
NG
G
Each type rated power at 70 °C:
AF0402=1/16 W (0.0625W)
AF0603=1/10 W (0.1W)
AF0805=1/8 W (0.125W)
AF1206=1/4 W (0.25W)
R
ATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V = √(P X R)
Where
V = Continuous rated DC or AC (rms) working voltage (V)
P = Rated power (W)
R = Resistance value (X)
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Product specification
6
8
SERIES
AF
0402 to 1206
TESTS AND REQUIREMENTS
TEST TEST METHOD PROCEDURE REQUIREMENTS
At +25/–55 °C and +25/+125 °C
Temperature
Coefficient of
Resistance
(T.C.R.)
IEC 60115-1 4.8
Formula:
T.C . R = ------------------------- ×10
6
(ppm/°C)
Where
t
1
=+25 °C or specified room temperature
t
2
=–55 °C or +125 °C test temperature
R
1
=resistance at reference temperature in ohms
R
2
=resistance at test temperature in ohms
Refer to table 2
Life/Endurance
IEC 60115-1 4.25
MIL-STD-202 Method 108
At 70±2 °C for 1,000 hours, RCWV applied for
1.5 hours on, 0.5 hour off, still air required
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
High
Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202 Method 108 1,000 hours at 155±5 °C, unpowered ±(1.0%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Moisture
Resistance
MIL-STD-202 Method 106 Each temperature / humidity cycle is defined at 8
hours, 3 cycles / 24 hours for 10d. with 25 °C /
65 °C 95% R.H, without steps 7a & 7b,
unpowered
Parts mounted on test-boards, without
condensation on parts
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Thermal Shock
MIL-STD-202 Method 107 –55 / +125 °C
Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes
±(0.5%+0.05 Ω) for 1% tol.
±(1%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Short Time
Overload
IEC60115-1 4.13 2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 seconds at room
temperature
±(1.0%+0.05 Ω)
No visible damage
Bending
IEC 60115-1 4.33
IEC 60068-2-21
Chips mounted on a 90 mm glass epoxy resin
PCB (FR4)
Bending: 0402: 5 mm
0603/0805: 3 mm
1206: 2 mm
Bending time: 60±5 seconds
±(1.0%+0.05 Ω)
<100 mΩ for Jumper
No visible damage
Ta bl e 4 Test condition, procedure and requirements
R
2
–R
1
R
1
(t
2
–t
1
)
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Product specification
7
8
SERIES
AF
0402 to 1206
TEST TEST METHOD PROCEDURE REQUIREMENTS
Biased Humidity
(steady state)
IEC 60115-1 4.37
MIL-STD-202 Method 103
1,000 hours at 85 °C / 85% R.H.
10% operating power
Measurement at 24±2 hours after test
conclusion
±(3.0%+0.05 Ω)
Solderability
- Resistance to
Soldering Heat
IEC 60115-1 4.18
MIL-STD-202 Method 215
Condition B, no pre-heat of samples
Lead-free solder, 260±5 °C, 10±1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(0.5%+0.05 Ω) for 1% tol.
±(1.0%+0.05 Ω) for 5% tol.
<50 mΩ for Jumper
No visible damage
- Wetting
J-STD-002 Electrical test not required
Magnification 10X
SMD conditions:
(a) Method B, aging 4 hours at 155 °C
dry heat, lead-free solder bath at 245 °C
(b) Method B, dipping at 215 °C for 3 seconds
Well tinned (≥95% covered)
No visible damage
ESD
AEC-Q200-002 Human body model,
1 pos. + 1 neg. discharges:
0402/0603: 1 KV
0805/1206: 2 KV
±(3.0%+0.05 Ω)
Terminal Strength
IEC 60115-1 4.32
IEC 60068-2-21
A force of 5N applied for 10±1 seconds ±(1.0%+0.05 Ω)
FOS
ASTM-B-809-95 Sulfur (saturated vapor) 1,000 hours, 60±2 °C,
91-93% R.H., unpowered
±(1.0%+0.05 Ω)
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Product specification
8
8
SERIES
AF
0402 to 1206
REVISION HISTORY
“ Yageo reserves all the rights for revising the content of this datasheet without further notification, as long as the products are unchanged. Any
product change will be announced by PCN.”
REVISION DATE CHANGE NOTIFICATION DESCRIPTION
Version 0 Jan 07, 2011 - - First issue of this specification
