ECCM3 Series
• Quartz Crystal Resonators
• 4 Pad Ceramic SMD Package
• Seam Sealed
• AT Cut
• Fundamental Mode
• Tight Tolerance/Stability
• RoHS Compliant (Pb-Free) CRYSTAL
ECCM3
MANUFACTURER CATEGORY SERIES PACKAGE CLASS REV.DATE
ECLIPTEK CORP. CRYSTAL ECCM3 CERAMIC CR59 01/10
NOTES
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ELECTRICAL SPECIFICATIONS
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
Nominal Frequency (MHz) 24.000, 25.000, 26.000, 27.000, 30.000, 32.000, 34.400, 38.400, 40.000, 44.000, and
48.000MHz
Frequency Tolerance / Stability
Over Operating Temperature Range ±10ppm / ±10ppm or ±10ppm / ±15ppm
Operating Temperature Range -10°C to +60°C or -30°C to +85°C
Load Capacitance (CL) 8pF Parallel Resonant
12pF Parallel Resonant
Shunt Capacitance 5pF Maximum
Mode of Operation Fundamental
Crystal Cut AT-Cut
Aging (at 25°C) ±3ppm / year Maximum
Drive Level 100 µWatts Maximum
Storage Temperature Range -40°C to 90°C
Insulation Resistance 500 Megaohms Minimum at 100VDC
Spurious Response -3dB Minimum; F0 to F0 +5000ppm
Equivalent Series Resistance 120 Ohms Maximum from 24.000MHz to 25.999999MHz
100 Ohms Maximum from 26.000MHz to 29.999999MHz
80 Ohms Maximum from 30.000MHz to 35.999999MHz
50 Ohms Maximum from 36.000MHz to 48.000MHz
H 0.40
L 2.00
W 1.60
MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
MANUFACTURER CATEGORY SERIES PACKAGE CLASS REV.DATE
ECLIPTEK CORP. CRYSTAL ECCM3 CERAMIC CR59 01/10
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
M N O P Q
1.5 MIN 50 MIN 20.2 MIN 13±.2 40 MIN
R S T U V
QTY/REEL
2.5 MIN 10 MIN 14.4 MAX 180 MAX 8.4+1.5-0 1,000
REEL
A B C D E
8±.2 3.5±.1 2.75±.1 4 ±.1 2±.1
\
F G H J K L
4±.1 1.85±1.0 1.55±.05 2.25±.1 .25 ±.05 .65±1.0
TAPE
*Compliant to EIA-481A
PACKAGING OPTIONS
Blank=Bulk, TR=Tape and Reel
FREQUENCY
PART NUMBERING GUIDE
ECCM3 Q A 12 - 24.000M TR
LOAD CAPACITANCE
08=8pF Parallel Resonant
12=12pF Parallel Resonant
FREQUENCY TOLERANCE/STABILITY
Q=±10ppm at 25°C, ±15ppm over -30°C to +85°C
R=±10ppm at 25°C, ±10ppm over -10°C to +60°C
MODE OF OPERATION
A=Fundamental
Line 1: XX.X
Frequency in MHz
(3 Digits Maximum + Decimal)
Line 2: XXX
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
2.00
±0.10
1.60
±0.10
0.4 MAX
0.50 ±0.10
0.64
±0.10
MARKING
ORIENTATION
1
2
3
4
0.55 ±0.10 (X4)
0.68
±0.10
(X4)
Pad 1: Input/Output
Pad 2: Cover/Ground
Pad 3: Input/Output
Pad 4: Cover/Ground All Tolerances are ±0.1
Solder Land
(X4)
0.5
0.3
0.8 (X4)
0.9 (X4)
PARAMETER SPECIFICATION
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Flammability UL94-V0
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
