SFH 4680
SFH 4685
Engwinklige LED im MIDLED-Gehäuse (880 nm)
Narrow beam LED in MIDLED package (880 nm)
Lead (Pb) Free Product - RoHS Compliant
2009-03-19 1
SFH 4680 SFH 4685
Wesentliche Merkmale
• AlGaAs-LED
• Enger Abstrahlwinkel (± 20°)
• Geringe Bauhöhe
• Als Toplooker und Sidelooker einsetzbar
•SFH 4680: Gurtung als Toplooker
SFH 4685: Gurtung als Sidelooker
Anwendungen
• Sensorik in der Automobiltechnik
• Datenübertragung
• Fernsteuerrung
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type Bestellnummer
Ordering Code Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4680
SFH 4685 Q65110A1570
Q65110A1571 ≥ 10 (typ. 20)
≥ 10 (typ. 20)
1) gemessen bei einem Raumwin ke l Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr
Features
• AlGaAs-LED
• Narrow halfangle (± 20°)
• Low profile component
• Usable as top-looking and side-looking device
•SFH 4680: Taping as Toplooker
SFH 4685: Taping as Sidelooker
Applications
• Automotive senso r s
• Data transmission
• Remote controls
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2009-03-19 2
SFH 4680, SFH 4685
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range Top , Tstg – 40 … + 100 °C
Sperrspannung
Reverse voltage VR5 V
Vorwärtsgleichstrom, TA ≤ 60 °C
Forward current IF100 mA
Stoßstrom, tp = 300 μs, D = 0, TA ≤ 60 °C
Surge current IFSM 1 A
Verlustleistung TA = 25 °C
Power dissipation Ptot 180 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
340
180
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 100 mA
λpeak 880 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 100 mA
Δλ 80 nm
Abstrahlwinkel
Half angle ϕ± 20 Grad
deg.
Aktive Chipfläche
Active chip area A0.09 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area L × B
L × W0.3 × 0.3 mm²
SFH 4680, SFH 4685
2009-03-19 3
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 100 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 100 mA, RL = 50 Ω
tr, tf0.5 µs
Durchlassspannung
Forward voltage
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
VF
VF
1.5 (< 1.8)
3.0 (< 3.8)
V
V
Sperrstrom
Reverse current
VR = 5 V
IRnot designed for
reverse
operation
μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 100 mA, tp = 20 ms
Φe typ 23 mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 100 mA
Temperature coefficient of Ie or Φe, IF = 100 mA
TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 100 mA
Temperature coefficient of VF, IF = 100 mA TCV– 2 mV/K
Temperaturkoeffizient von λ, IF = 100 mA
Temperature coefficient of λ, IF = 100 mA TCλ+ 0.25 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
2009-03-19 4
SFH 4680, SFH 4685
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Werte
Values Einheit
Unit
-R -S -T
Strahlstärke
Radiant intensity
IF = 100 mA, tp = 20 ms
Ie min
Ie max
10
20 16
32 25
50 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 1 A, tp = 100 μs
Ie typ 130 160 240 mW/sr
1) Nur eine Gruppe in einer Verp ackungseinheit (Streuung kleiner 2:1) /
Only one group in one packing unit (variation lower 2:1)
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
OHF02432
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4680, SFH 4685
2009-03-19 5
Relative Spectral Emission
Irel = f (λ)
Forward Current IF = f (VF)
Single pulse, tp = 20 μs
0
750
Ι
rel
OHR00877
800 850 900 950 nm 1000
20
40
60
80
%
100
λ
10
OHR00881
F
V
-3
-2
10
-1
10
0
10
1
10
0123456V8
A
Ι
F
Radiant Intensity
Single pulse, tp = 20 μs
Permissible Pulse Handling
Capability IF = f (τ), TA ≤ 60 °C,
duty cycle D = parameter
Ie
Ie 100 mA = f (IF)
10
OHR00878
Ιe
F
Ι
-3
-2
10
-1
10
0
10
1
10
2
10
0
10 10 110 210 4
mA
e
Ι
(100mA)
3
10
0.05
210-1-2-3-4-5
1010 1010 10
t
p
10 10s10
0
0.1
0.005
0.02
0.01
D
=
T
t
A
I
F
D
=
I
P
T
F
P
t
OHF02532
0.2
0.5
1
0.2
0.4
0.6
0.8
1.0
1.2
Max. Permissible Forward Current
IF = f (TA), RthJA = 340 K/W
40200
01008060 ˚C
T
I
F
mA
OHF02533
A
10
20
30
40
50
60
70
80
90
110
2009-03-19 6
SFH 4680, SFH 4685
Maßzeichnung
Package Outlines
Maße in mm / Dimensions in mm.
Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm
oder 9000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
or 9000/reel, ø330 mm
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package MID mit klarem Silikonverguss / MID casted with clear Silicone
Anschlussbelegung
Pin configuration Pad 1 = Anode / anode
Pad 2 = Kathode / cathode
OHF02956
(1.2)
2.35
2.15
Isolating area
metallisation
Pad 2
Pad 1
metallisation (0.8)
1.7
1.5
0.75
0.55
3.3
2.9
metallisation
Backside
Silicone area
1)
Device casted with silicone.
1)
Avoid mechanical stress on silicone surface.
0.75
0.55
0.420.42
0.53
0.83
0.83
0.53
OHAY2430
2.3 (0.091)
8 (0.315)
4 (0.157)
3.3 (0.130)
±0.15 (0.006)
±0.15 (0.006)
0.3 (0.012)
±0.02 (0.001)
±0.05 (0.002)
2.45 (0.096)
3.25 (0.128)
±0.05 (0.002)
2˚
±0.05 (0.002)
2 (0.079)
1.7 (0.067)
±0.05 (0.002)
±0.05 (0.002)
3.5 (0.138)
±0.05 (0.002)
1.75 (0.069)
1.5 (0.059)
+0.1 (0.004)
Pad 1 Orientation
Optical axis/viewing direction
SFH 4680, SFH 4685
2009-03-19 7
Empfohlenes Lötpaddesign
Recommended Solder Pad Design
Maße in mm / Dimensions in mm.
Verarbeitungshinweis: Das Gehäuse ist mit Silikon vergossen. Mechanischer Stress auf der
Bauteiloberfläche sollte so gering wie möglich gehalten werden.
Handling indication: The package is casted with silicone. Mechanical stress at the surface of
the unit should be as low as possible.
OHF02422
4.0
2.4
1.35
Padgeometrie für
heat dissipation
Lötstopplack
Solder resist
verbesserte Wärmeableitung
Paddesign for improved
Cu-Fläche > 16 mm
Cu-area 2
SFH 4680
4.5
1.7
1.25
verbesserte Wärmeableitung
OHF02421
Solder resist
Cu-Fläche > 16 mm
Paddesign for improved
Lötstopplack
heat dissipation
Padgeometrie für
Cu-area
2
SFH 4685
2009-03-19 8
SFH 4680, SFH 4685
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organiza tion.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-supp ort devices or systems 2 with the express written approval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain
and sustain human life. If they fail, it is reas onable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C +0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C -0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
