16-Bit Transceivers
CY74FCT16245T
CY74FCT162245T
CY74FCT162H245T
SCCS026B - July 1994 - Revised September 2001
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
Copyright © 2001, Texas Instruments Incorporated
1CY74FCT16445T/2
H245T
Features
Ioff supports partial-power-down mode operation
Edge-rate control circuitry for significantly improved
noise characteristics
Typical output skew < 250 ps
ESD > 2000V
TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
Industrial temperature range of –40˚C to +85˚C
VCC = 5V ± 10%
CY74FCT16245T Features:
64 mA sink current, 32 mA source current
Typical VOLP (ground bounce)<1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162245T Features:
Balanced output drivers: 24 mA
Reduced system switching noise
Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
CY74FCT162H245T Features:
Bus hold on data inputs
Eliminates the need for external pull-up or pull-down
resistors
Functional Description
These 16-bit transceivers are designed for use in bidirectional
synchronous communication between two buses, where high
speed and low power are required. With the exception of the
CY74FCT16245T, these devices can be operated either as
two independent octals or a single 16-bit transceiver. Direction
of data flow is controlled by (DIR), the Output Enable (OE)
transfers data when LOW and isolates the buses when HIGH.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
The CY74FCT16245T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
The CY74FCT162245T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for mini-
mal undershoot and reduced ground bounce. The
CY74FCT162245T is ideal for driving transmission lines.
TheCY74FCT162H245Tisa24-mAbalancedoutputpartthat
has bus hold on the data inputs. The device retains the input’s
last state whenever the input goes to high impedance. This
eliminates the need for pull-up/down resistors and prevents
floating inputs.
GND
LogicBlock Diagrams CY74FCT16245T,CY74FCT162245T,
CY74FCT162H245T Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
12
33
32
31
30
29
25
26
27
28
36
35
1DIR
34
SSOP/TSSOP
Top View
13
14
15
16
17
18
19
20
21
22
23
24
45
44
43
42
41
37
38
39
40
48
47
46
1B1
1B2
1B3
1B4
1A1
1A2
1A3
1A4
1OE
GND
GND
VCC
1B7
1B8
1B5
1B6
1A5
1A6
1A7
1A8
VCC
GND
GND
2B3
2B4
2B1
2B2
2A1
2A2
2A3
2A4
GND
GND
VCC
2B7
2B8
2B5
2B6
2A5
2A6
2A7
2A8
VCC
GND
2DIR 2OE
FCT16245–1
1A1
1A2
1A3
1A4
1A5
1A6
1A7
1OE
1B1
1B2
1B3
1B4
1B5
1B6
1B7
1DIR
1A8
1B8
FCT16245–2
2A1
2A2
2A3
2A4
2A5
2A6
2A7
2OE
2B1
2B2
2B3
2B4
2B5
2B6
2B7
2DIR
2A8
2B8FCT16245–3
16245T
162245T
162H245T
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
2
Maximum Ratings[3, 4]
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Storage Temperature ........................Com’l -55°C to +125°C
Ambient Temperature with
Power Applied....................................Com’l -55°C to +125°C
DC Input Voltage ........................................... –0.5V to +7.0V
DC Output Voltage......................................... –0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin) ........................–60 to +120 mA
Power Dissipation..........................................................1.0W
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Notes:
1. On CY74FCT162H245T these pins have bus hold.
2. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = High Impedance.
3. Operationbeyondthelimitssetforthmayimpairthe usefullifeofthe device.Unlessotherwise noted,theselimitsareovertheoperatingfree-air temperaturerange.
4. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Pin Description
Name Description
OE Three-State Output Enable Inputs (Active LOW)
DIR Direction Control
A Inputs or Three-State Outputs[1]
B Inputs or Three-State Outputs[1]
Function Table[2]
Inputs
OutputsOE DIR
L L Bus B Data to Bus A
L H Bus A Data to Bus B
H X High Z State Operating Range
Range Ambient
Temperature VCC
Industrial –40°C to +85°C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.[5] Max. Unit
VIH Input HIGH Voltage 2.0 V
VIL Input LOW Voltage 0.8 V
VHInput Hysteresis[6] 100 mV
VIK Input Clamp Diode Voltage VCC=Min., IIN=–18 mA –0.7 –1.2 V
IIH Input HIGH Current Standard VCC=Max., VI=VCC ±1µA
Bus Hold ±100
IIL Input LOW Current Standard VCC=Max., VI=GND ±1µA
Bus Hold ±100 µA
IBBH
IBBL Bus Hold Sustain Current on Bus Hold Input[7] VCC=Min. VI=2.0V –50 µA
VI=0.8V +50
IBHHO
IBHLO Bus Hold Overdrive Current on Bus Hold Input[7] VCC=Max., VI=1.5V TBD mA
IOZH High Impedance Output Current
(Three-State Output pins) VCC=Max., VOUT=2.7V ±1µA
IOZL High Impedance Output Current
(Three-State Output pins) VCC=Max., VOUT=0.5V ±1µA
IOS Short Circuit Current[8] VCC=Max., VOUT=GND –80 –140 –200 mA
IOOutput Drive Current[8] VCC=Max., VOUT=2.5V –50 –180 mA
IOFF Power-Off Disable VCC=0V, VOUT4.5V[9] ±1µA
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
3
Output Drive Characteristics for CY74FCT16245T
Parameter Description Test Conditions Min. Typ.[5] Max. Unit
VOH Output HIGH Voltage VCC=Min., IOH=–3 mA 2.5 3.5 V
VCC=Min., IOH=–15 mA 2.4 3.5 V
VCC=Min., IOH=–32 mA 2.0 3.0 V
VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V
Output Drive Characteristics for CY74FCT162245T, CY74FCT162H245T
Parameter Description Test Conditions Min. Typ.[5] Max. Unit
IODL Output LOW Current[8] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA
IODH Output HIGH Current[8] VCC=5V, VIN=VIH or VIL, VOUT=1.5V –60 –115 –150 mA
VOH Output HIGH Voltage VCC=Min., IOH=–24 mA 2.4 3.3 V
VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V
Notes:
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.
6. This parameter is specified but not tested.
7. Pins with bus hold are described in Pin Description.
8. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
9. Tested at +25˚C.
Capacitance[6] (TA = +25˚C, f = 1.0 MHz)
Parameter Description Test Conditions Typ.[5] Max. Unit
CIN Input Capacitance VIN = 0V 4.5 6.0 pF
COUT Output Capacitance VOUT = 0V 5.5 8.0 pF
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
4
Power Supply Characteristics
Parameter Description Test Conditions Typ.[5] Max. Unit
ICC Quiescent Power Supply Current VCC=Max. VIN<0.2V,
VIN>VCC-0.2V 5 500 µA
ICC Quiescent Power Supply Current
(TTL inputs HIGH) VCC=Max. VIN=3.4V[10] 0.5 1.5 mA
ICCD Dynamic Power Supply
Current[11] VCC=Max., One Input Toggling,
50%DutyCycle,OutputsOpen,
OE=DIR=GND
VIN=VCC or
VIN=GND 60 100 µA/MHz
ICTotal Power Supply Current[12] VCC=Max., f1=10 MHz,
50%DutyCycle,OutputsOpen,
One Bit Toggling,
OE=DIR=GND
VIN=VCC or
VIN=GND 0.6 1.5 mA
VIN=3.4V or
VIN=GND 0.9 2.3 mA
VCC=Max., f1=2.5 MHz, 50%
Duty Cycle, Outputs Open,
Sixteen Bits Toggling,
OE=DIR=GND
VIN=VCC or
VIN=GND 2.4 4.5[13] mA
VIN=3.4V or
VIN=GND 6.4 16.5[13] mA
Notes:
10. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
12. IC=I
QUIESCENT + IINPUTS + IDYNAMIC
IC=I
CC+ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH= Duty Cycle for TTL inputs HIGH
NT= Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
f0= Clock frequency for registered devices, otherwise zero
f1= Input signal frequency
N1= Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
5
]
Switching Characteristics Over the Operating Range[14]
Description
74FCT16245T
74FCT162245T 74FCT16245AT
74FCT162245AT
74FCT162H245AT Fig.
No.[15]
Parameter Min. Max. Min. Max. Unit
tPLH
tPHL Propagation Delay Data to Output
A to B, B to A 1.5 7.0 1.5 4.5 ns 1, 3
tPZH
tPZL Output Enable Time
OE to A or B 1.5 9.5 1.5 6.2 ns 1, 7, 8
tPHZ
tPLZ Output Disable Time
OE to A or B 1.5 7.5 1.5 5.0 ns 1, 7, 8
tPZH
tPZL Output Enable Time
DIR to A or B 1.5 9.5 1.5 6.2 ns 1, 7, 8
tPHZ
tPLZ Output Disable Time
DIR to A or B 1.5 7.5 1.5 5.0 ns 1, 7, 8
tSK(O) Output Skew[16] 0.5 0.5 ns
Description
74FCT16245CT
74FCT162245CT
74FCT162H245CT Fig.
No.[15]
Parameter Min. Max. Unit
tPLH
tPHL Propagation Delay Data to Output
A to B, B to A 1.5 4.1 ns 1, 3
tPZH
tPZL Output Enable Time
OE to A or B 1.5 5.8 ns 1, 7, 8
tPHZ
tPLZ Output Disable Time
OE to A or B 1.5 4.8 ns 1, 7, 8
tPZH
tPZL Output Enable Time
DIR to A or B 1.5 5.8 ns 1, 7, 8
tPHZ
tPLZ Output Disable Time
DIR to A or B 1.5 4.8 ns 1, 7, 8
tSK(O) Output Skew[16] 0.5 ns
Note:
14. Minimum limits are specified but not tested on Propagation Delays.
15. See “Parameter Measurement Information” in the General Information section.
16. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
Ordering Information CY74FCT16245
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
4.1 CY74FCT16245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16245CTPVC/PVCT O48 48-Lead (300-Mil) SSOP
4.5 CY74FCT16245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16245ATPVC/PVCT O48 48-Lead (300-Mil) SSOP
7.0 CY74FCT16245TPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT16245TPVC/PVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
6
Ordering Information CY74FCT162245
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
4.1 CY74FCT162245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162245CTPVC O48 48-Lead (300-Mil) SSOP
74FCT162245CTPVCT O48 48-Lead (300-Mil) SSOP
4.5 74FCT162245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162245ATPVC O48 48-Lead (300-Mil) SSOP
74FCT162245ATPVCT O48 48-Lead (300-Mil) SSOP
7.0 CY74FCT162245TPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162245TPVC/PVCT O48 48-Lead (300-Mil) SSOP
Ordering Information CY74FCT162H245
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
4.1 74FCT162H245CTPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162H245CTPVC O48 48-Lead (300-Mil) SSOP
74FCT162H245CTPVCT O48 48-Lead (300-Mil) SSOP
4.5 74FCT162H245ATPACT Z48 48-Lead (240-Mil) TSSOP Industrial
CY74FCT162H245ATPVC O48 48-Lead (300-Mil) SSOP
74FCT162H245ATPVCT O48 48-Lead (300-Mil) SSOP
CY74FCT16245T/2245T
CY74FCT16445T/2H245T
7
Package Diagrams
48-Lead Shrunk Small Outline Package O48
CY74FCT16245
T
CY74FCT162245
T
CY74FCT162H245
T
8
Package Diagrams
48-Lead Thin Shrunk Small Outline Package Z48
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74FCT162245ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
74FCT162245ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
74FCT162245ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
74FCT162245TPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162245TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
74FCT16245ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
74FCT16245ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
74FCT16245CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245TPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245TPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245TPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT16245TPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162H245ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162H245ATPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162H245CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162H245CTPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162H245CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
74FCT162H245ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
74FCT162H245ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
74FCT162H245ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
74FCT162H245ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
CY74FCT162245ATPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT162245CTPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT162245ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
CY74FCT162245ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
CY74FCT162245TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CY74FCT162245TPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT162245TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245ATPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
CY74FCT16245ATPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245ATPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245CTPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245CTPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245CTPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245ETPAC OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
CY74FCT16245ETPACT OBSOLETE TSSOP DGG 48 TBD Call TI Call TI Samples Not Available
CY74FCT16245ETPVC OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
CY74FCT16245ETPVCT OBSOLETE SSOP DL 48 TBD Call TI Call TI Samples Not Available
CY74FCT16245TPACT ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245TPVC ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
CY74FCT16245TPVCT ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162245ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
FCT162245ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
FCT162245ATPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162245CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
FCT162245CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162245CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245ATPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245ATPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245ATPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245CTPACTE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245CTPACTG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245CTPVCG4 ACTIVE SSOP DL 48 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
FCT162H245CTPVCTG4 ACTIVE SSOP DL 48 1000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 5
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
74FCT162245ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162245ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
74FCT162245CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162245CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
74FCT162H245ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162H245CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
74FCT162H245CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT162245TPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT162245TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT16245ATPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16245ATPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT16245CTPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16245CTPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
CY74FCT16245TPACT TSSOP DGG 48 2000 330.0 24.4 8.6 15.8 1.8 12.0 24.0 Q1
CY74FCT16245TPVCT SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74FCT162245ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0
74FCT162245ATPVCT SSOP DL 48 1000 367.0 367.0 55.0
74FCT162245CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0
74FCT162245CTPVCT SSOP DL 48 1000 367.0 367.0 55.0
74FCT162H245ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0
74FCT162H245CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0
74FCT162H245CTPVCT SSOP DL 48 1000 367.0 367.0 55.0
CY74FCT162245TPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT162245TPVCT SSOP DL 48 1000 367.0 367.0 55.0
CY74FCT16245ATPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT16245ATPVCT SSOP DL 48 1000 367.0 367.0 55.0
CY74FCT16245CTPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT16245CTPVCT SSOP DL 48 1000 367.0 367.0 55.0
CY74FCT16245TPACT TSSOP DGG 48 2000 367.0 367.0 45.0
CY74FCT16245TPVCT SSOP DL 48 1000 367.0 367.0 55.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040048/E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°ā8°
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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