Phycomp Product specification
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402 TFx13 series, 0.1% TC25
10 Ω to 1 MΩ
2003 Jul 10 Rev.3 7 www.yageo.com
TEST AND REQUIREMENTS
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
55/125/56 (rated temperat ure range
−55 to +125 °C; damp heat, lon g
term, 56 days). The testing also
covers the requirements specified by
EIA and MIL-STD-202F.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions in
accordance with “IEC 60068-1”,
subclause 5.3.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa
(860 mbar to 1060 mbar).
Table 6 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
MIL-STD TEST PROCEDURE REQUIREMENTS
4.4.1 visual
examination no holes; clean surface;
no damage
4.4.2 dimensions
(outline) gauge see Table 3
applied voltage (+0/−10%):
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
4.5 resistance
1 MΩ: 50 V
R − Rnom: max. ±0.1%
4.18 20 (Tb) 202F
method
210C
resistance to
soldering heat unmounted chips;
10 ±1 s; 260 ±5 °C no visible damage
∆R/R max.: ±(0.5% + 0.05 Ω)
4.17 20 (Ta) 202F
method
208G
solderability unmounted chips completely
immersed for 5 ±0.5 s in a
solder bath at 230 ±5 °C
good tinning (≥95% covered);
no damage
4.7 202F
method
301
voltage proof on
insulation maximum voltage (RMS)
during 1 minute,
metal block method
no breakdown or flashover
4.13 MIL-R
55342D
para.
4.7.5
short time
overload room temperature;
V = 2.5 × Vrated;
5 s (voltage not more
than 2 × Vmax);
specimen stabilized at room
temperature for 30 minutes
∆R/R max.: ±(0.5% + 0.05 Ω)
In Table 6 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8, 60068
and MIL-STD”; a short description of
the test procedure is also given. In
some instances deviations from the
IEC recommendations were
necessary for our method of
specifying.
All soldering tests are performed
with mildly activat ed flux.