SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 * * * (1) For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008. * * * * * DBQ, DGV, OR PW PACKAGE (TOP VIEW) S 1B1 1B2 1A 2B1 2B2 2A GND 1 16 2 15 3 14 4 13 5 12 6 7 11 10 8 9 VCC OE 4B1 4B2 4A 3B1 3B2 3A RGY PACKAGE (TOP VIEW) 1B1 1B2 1A 2B1 2B2 2A VCC * * * 1 16 15 OE 14 4B1 2 3 13 4B2 12 4A 11 3B1 4 5 6 10 3B2 7 8 9 3A * * Data and Control Inputs Provide Undershoot Clamp Diodes Low Power Consumption (ICC = 0.7 mA Typ) VCC Operating Range From 2.3 V to 3.6 V Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 - 2000-V Human-Body Model (A114-B, Class II) - 1000-V Charged-Device Model (C101) Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface, Bus Isolation, Low-Distortion Signal Gating S * High-Bandwidth Data Path (up to 500 MHz (1)) 5-V Tolerant I/Os With Device Powered Up or Powered Down Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4 Typ) Rail-to-Rail Switching on Data I/O Ports - 0- to 5-V Switching With 3.3-V VCC - 0- to 3.3-V Switching With 2.5-V VCC Bidirectional Data Flow With Near-Zero Propagation Delay Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 3.5 pF Typ) Fast Switching Frequency (fOE = 20 MHz Max) GND * FEATURES * DESCRIPTION/ORDERING INFORMATION ORDERING INFORMATION PACKAGE (1) TA -40C to 85C (1) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN - RGY Tape and reel SN74CB3Q3257RGYR BU257 SSOP (QSOP) - DBQ Tape and reel SN74CB3Q3257DBQR BU257 TSSOP - PW Tape and reel SN74CB3Q3257PWR BU257 TVSOP - DGV Tape and reel SN74CB3Q3257DGVR BU257 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2003-2005, Texas Instruments Incorporated SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The SN74CB3Q3257 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3257 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems. The SN74CB3Q3257 is a 4-bit 1-of-2 high-speed FET multiplexer/demultiplexer with a single output-enable (OE) input. The select (S) input controls the data path of the multiplexer/demultiplexer. When OE is low, the multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS S INPUT/OUTPUT A FUNCTION L L B1 A port = B1 port L H B2 A port = B2 port H X Z Disconnect OE 2 SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 LOGIC DIAGRAM (POSITIVE LOGIC) 4 2 1A 1B1 SW 3 1B2 SW 7 5 2A 2B1 SW 6 2B2 SW 3A 9 11 SW 3B1 10 SW 12 3B2 14 4A 4B1 SW 13 4B2 SW 1 S 15 OE SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN(1) (1) EN is the internal enable signal applied to the switch. 3 SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range -0.5 4.6 V VIN Control input voltage range (2) (3) -0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) IIK Control input clamp current VIN < 0 -50 mA II/OK I/O port clamp current VI/O < 0 -50 mA IIO ON-state switch current 64 mA 100 mA -0.5 Continuous current through VCC or GND JA Package thermal impedance (1) (2) (3) (4) (5) (6) 7 D package (5) 73 DB package (5) 82 DBQ package (5) 90 DGV package (5) 120 PW package (5) 108 RGY Tstg UNIT package (6) V C/W 39 Storage temperature range -65 C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) 4 MIN MAX 2.3 3.6 VCC = 2.3 V to 2.7 V 1.7 5.5 VCC = 2.7 V to 3.6 V 2 5.5 VCC = 2.3 V to 2.7 V 0 0.7 VCC = 2.7 V to 3.6 V 0 0.8 0 5.5 V -40 85 C Supply voltage UNIT V V V All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 3.6 V, IIN MIN TYP (2) MAX TEST CONDITIONS II = -18 mA Control inputs VCC = 3.6 V, VIN = 0 to 5.5 V IOZ (3) VCC = 3.6 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 ICC VCC = 3.6 V, II/O = 0, Switch ON or OFF, VIN = VCC or GND One input at 3 V, Other inputs at VCC or GND ICC (4) Control inputs VCC = 3.6 V, ICCD (5) Per control input Cin Control inputs VCC = 3.3 V, VIN = 5.5 V, 3.3 V, or 0 A port VCC = 3.3 V, Switch OFF, VIN = VCC or GND, B port VCC = 3.3 V, VCC = 3.3 V, A port B port VCC = 2.3 V, TYP at VCC = 2.5 V ron (6) VCC = 3 V (1) (2) (3) (4) (5) (6) V 1 A 1 A 1 A 1.5 mA 30 VCC = 3.6 V, A and B ports open, Control input switching at 50% duty cycle Cio(OFF) Cio(ON) 0.7 UNIT -1.8 A 0.3 0.35 mA/ MHz 2.5 3.5 pF VI/O = 5.5 V, 3.3 V, or 0 5.5 7 pF Switch OFF, VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 3.5 5 pF Switch ON, VIN = VCC or GND, VI/O = 5.5 V, 3.3 V, or 0 10.5 13 10.5 13 VI = 0, IO = 30 mA 4 8 VI = 1.7 V, IO = -15 mA 4 9 VI = 0, IO = 30 mA 4 6 VI = 2.4 V, IO = -15 mA 4 8 pF VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see Figure 2). Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) VCC = 3.3 V 0.3 V TO (OUTPUT) fOE or fS (1) OE or S A or B 10 20 MHz tpd (2) A or B B or A 0.12 0.2 ns tpd(s) S A 1.5 6.5 1.5 5.5 ns S B 1.5 6.5 1.5 5.5 OE A or B 1.5 6.5 1.5 5.5 ten tdis (1) (2) VCC = 2.5 V 0.2 V FROM (INPUT) PARAMETER MIN MAX MIN UNIT MAX S B 1 6 1 6 OE A or B 1 6 1 6 ns ns Maximum switching frequency for control inputs (VO > VCC, VI = 5 V, RL 1 M, CL = 0). The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). 5 SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 TYPICAL ron vs VI 16 VCC = 3.3 V TA = 25C , IO = -15 mA ron - Resistance - 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VI - V Figure 1. Typical ron vs VI TYPICAL ICC vs CONTROL-INPUT SWITCHING FREQUENCY 12 VCC = 3.3 V TA = 25C A and B Ports Open ICC - mA 10 8 6 S Switching OE Switching 4 2 0 0 2 4 6 8 10 12 14 OE or S Switching Frequency - MHz Figure 2. Typical ICC vs OE or S Switching Frequency 6 16 18 20 SN74CB3Q3257 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH www.ti.com SCDS135A - SEPTEMBER 2003 - REVISED MARCH 2005 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 50 VG1 TEST CIRCUIT DUT 2 x VCC Input Generator RL VO VI S1 50 50 VG2 CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s) 2.5 V 0.2 V 3.3 V 0.3 V Open Open 500 500 VCC or GND VCC or GND 30 pF 50 pF tPLZ/tPZL 2.5 V 0.2 V 3.3 V 0.3 V 2 x VCC 2 x VCC 500 500 GND GND 30 pF 50 pF 0.15 V 0.3 V tPHZ/tPZH 2.5 V 0.2 V 3.3 V 0.3 V GND GND 500 500 VCC VCC 30 pF 50 pF 0.15 V 0.3 V Output Control (VIN) V VCC VCC/2 VCC VCC/2 VCC/2 0V tPLH VOH Output VCC/2 VCC/2 VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES Output Waveform 1 S1 at 2 x VCC (see Note B) tPLZ VCC VCC/2 VOL + V VOL tPZH tPHL VCC/2 0V tPZL Output Control (VIN) Open GND Output Waveform 2 S1 at GND (see Note B) tPHZ VOH VCC/2 VOH - V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) 74CB3Q3257DBQRE4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BU257 74CB3Q3257DBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BU257 74CB3Q3257DGVRE4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 74CB3Q3257DGVRG4 ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 74CB3Q3257RGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BU257 SN74CB3Q3257DBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BU257 SN74CB3Q3257DGVR ACTIVE TVSOP DGV 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 BU257 SN74CB3Q3257RGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BU257 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74CB3Q3257DGVR TVSOP DGV 16 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1 SN74CB3Q3257PWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74CB3Q3257PWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74CB3Q3257RGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CB3Q3257DGVR TVSOP DGV 16 2000 367.0 367.0 35.0 SN74CB3Q3257PWR TSSOP PW 16 2000 364.0 364.0 27.0 SN74CB3Q3257PWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 SN74CB3Q3257RGYR VQFN RGY 16 3000 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MPDS006C - FEBRUARY 1996 - REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0-8 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins - MO-153 14/16/20/56 Pins - MO-194 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated