BAT54J / W / AW / CW / SW SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS K2 NC VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE K K A A K2 NC K1 A A K1 BAT54AW BAT54W A2 DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available. K2 A2 K1 K A2 K A2 K1 K2 A1 A1 A1 A1 BAT54SW BAT54CW SOT-323 A 86 K BAT54J SOD-323 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 30 V Continuous forward current 0.3 A 1 A 230 mW - 65 to +150 C IFSM Surge non repetitive forward current tp=10ms sinusoidal Ptot Power dissipation (note 1) Tamb = 25C SOD-323 Tstg SOT-323 Maximum storage temperature range Tj Maximum operating junction temperature * 150 C TL Maximum temperaturefor soldering during 10s 260 C Note 1: for double diodes, Ptot is the total dissipation of both diodes * : dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth(j-a) June 1999 - Ed: 2A 1/5 BAT54J / W / AW / CW / SW THERMAL RESISTANCE Symbol Rth (j-a) Parameters Junction to ambient (*) SOD-323 Value Unit 550 C/W C/W SOT-323 (*) Mounted on epoxy board, with recommended pad layout. STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol VF * Parameters Tests conditions Forward voltage drop IR ** Tj = 25C Reverse leakage current Tj = 25C Min. Typ. Max. Unit IF = 0.1 mA 240 mV IF = 1 mA 320 IF = 10 mA 400 IF = 30 mA 500 IF = 100 mA 900 VR = 30 V 1 Tj = 100C Pulse test : A 100 * tp = 380 s, < 2% ** tp = 5 ms, < 2% DYNAMIC CHARACTERISTICS (Tj = 25 C) Symbol Parameters C Junction capacitance trr Reverse recovery time Tests conditions Tj = 25C VR = 1 V Typ. F = 1 MHz IF = 10 mA IR = 10 mA Tj = 25C Irr = 1 mA RL = 100 Fig. 1-1: Forward voltage drop versus forward current (typical values, low level). 2.00E-2 1.80E-2 Tj=100C 1.60E-2 1.40E-2 Tj=25C 1.20E-2 Tj=50C 1.00E-2 8.00E-3 6.00E-3 4.00E-3 2.00E-3 VFM(V) 0.00E+0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 Max. Unit 10 pF 5 ns Fig. 1-2: Forward voltage drop versus forward current (typical values, high level). IFM(A) IFM(A) 2/5 Min. 5E-1 Tj=100C 1E-1 Tj=50C 1E-2 Tj=25C VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 BAT54J / W / AW / CW / SW Fig. 2: Reverse leakage current versus reverse voltage applied (typical values). Fig. 3: Reverse leakage current versus junction temperature. IR(A) IR(A) 1E+4 1E+2 VR=30V Tj=100C 1E+3 1E+1 1E+2 1E+0 1E+1 Tj=50C 1E+0 Tj=25C 1E-1 1E-1 1E-2 VR(V) 0 5 10 15 20 25 30 Fig. 4: Junction capacitance versus reverse voltage applied (typical values). 1E-2 Tj(C) 0 25 50 75 100 125 150 Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, e(Cu)=35m) C(pF) Zth(j-a)/Rth(j-a) 10 1.00 F=1MHz Tj=25C = 0.5 5 = 0.2 0.10 = 0.1 T 2 Single pulse 1 1 2 =tp/T tp(s) VR(V) 5 10 20 30 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 tp 1E+2 Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printedcircuit board FR4, copper thickness: 35m.) Rth(j-a) (C/W) 600 P=0.2W 550 500 450 400 350 S(Cu) (mm ) 300 0 5 10 15 20 25 30 35 40 45 50 3/5 BAT54J / W / AW / CW / SW PACKAGE MECHANICAL DATA SOT-323 DIMENSIONS REF. A Millimeters Inches Min. Typ. Max. Min. Typ. Max. A1 D b L A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 E 1.15 1.25 1.35 0.045 0.049 0.053 e H E c 4/5 e 0.071 0.079 0.086 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 0 30 0 30 BAT54J / W / AW / CW / SW PACKAGE MECHANICAL DATA SOD-323 H DIMENSIONS A1 REF. b Millimeters Min. E A A D c Q1 L Max. Inches Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Ordering type Marking Package Weight Base qty Delivery mode BAT54W D73 SOT-323 0.006g 3000 Tape & reel BAT54AW D74 SOT-323 0.006g 3000 Tape & reel BAT54CW D77 SOT-323 0.006g 3000 Tape & reel BAT54SW D78 SOT-323 0.006g 3000 Tape & reel BAT54J 86 SOD-323 0.005g 3000 Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringementof patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 5/5