1
FEATURES
SUPPORTS DEFENSE, AEROSPACE,
APPLICATIONS
1
2
3
4
8
7
6
5
OUT A
–IN A
+IN A
V–
V+
OUT B
–INB
+INB
DPACKAGE
(TOP VIEW)
1
2
3
5
4
OUT
V–
+IN
V+
–IN
DBVPACKAGE
(TOP VIEW)
1
2
3
5
4
+IN
V–
–IN
V+
OUT
DCKPACKAGE
(TOP VIEW)
0.1Hz TO 10Hz NOISE
500nV/div
1s/div
OPA333A-EP , , OPA2333A-EP
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............................................................................................................................................................ SGLS383B – APRIL 2007 – REVISED JUNE 2008
1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIERSZERO-DRIFT SERIES
•Low Offset Voltage: 23 µV (Max)
AND MEDICAL APPLICATIONS•0.01-Hz to 10-Hz Noise: 1.1 µV
PP
•Controlled Baseline•Quiescent Current: 17 µA
•One Assembly/Test Site•Single-Supply Operation
•One Fabrication Site•Supply Voltage: 1.8 V to 5.5 V
•Available in Military ( – 55 ° C/125 ° C)•Rail-to-Rail Input/Output
Temperature Range
(1)
•MicroSize Packages: SC70 and SOT23
•Extended Product Life Cycle•Extended Product-Change Notification•Product Traceability•Transducer Applications•Temperature Measurements•Electronic Scales•Medical Instrumentation
•Battery-Powered Instruments•Handheld Test Equipment (1) Custom temperature ranges available
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
DESCRIPTION/ORDERING INFORMATION
1
2
3
5
4
V+
−IN
OUT
V−
+IN
OPA333A
1
2
3
5
4
V+
OUT
+IN
V−
−IN
OPA333A
1
2
3
4
8
7
6
5
V+
OUT B
−IN B
+IN B
OUT A
−IN A
+IN A
V−
A
B
OPA2333A
SOT23-5 SC70-5 SO-8
Absolute Maximum Ratings
(1)
OPA333A-EP , , OPA2333A-EP
SGLS383B – APRIL 2007 – REVISED JUNE 2008 ............................................................................................................................................................
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The OPA333A series of CMOS operational amplifiers uses a proprietary auto-calibration technique tosimultaneously provide very low offset voltage (10 µV max) and near-zero drift over time and temperature. Theseminiature, high-precision, low-quiescent-current amplifiers offer high-impedance inputs that have acommon-mode range 100 mV beyond the rails, and rail-to-rail output that swings within 50 mV of the rails. Singleor dual supplies as low as 1.8 V ( ± 0.9 V) and up to 5.5 V ( ± 2.75 V) may be used. They are optimized forlow-voltage single-supply operation.
The OPA333A family offers excellent common-mode rejection ratio (CMRR) without the crossover associatedwith traditional complementary input stages. This design results in superior performance for drivinganalog-to-digital converters (ADCs) without degradation of differential linearity.
The OPA333A (single version) is available in the SC70-5 and SOT23-5 packages. The OPA2333A (dual version)is offered in the SO-8 package. All versions are specified for operation from – 55 ° C to 125 ° C.
ORDERING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
(2)
OPA333AMDBVREP SOT23-5 DBV OBYMOPA333AMDCKREP SC70-5 DCK CHQOPA2333AMDREP SO-8 D 2333EP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIWeb site at www.ti.com .(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package .
PIN CONFIGURATIONS
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage 7 VSignal input terminals, voltage
(2)
– 0.3 (V+) + 0.3 VOutput short circuit
(3)
ContinuousOperating temperature range – 55 125 ° CStorage temperature range – 65 150
(4)
° CJunction temperature 150 ° CHuman-Body Model (HBM) 4000ESD rating VCharged-Device Model (CDM) 1000
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails shouldbe current limited to 10 mA or less.(3) Short circuit to ground, one amplifier per package(4) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction ofoverall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
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Electrical Characteristics: V
S
= 1.8 V to 5.5 V
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............................................................................................................................................................ SGLS383B – APRIL 2007 – REVISED JUNE 2008
Boldface limits apply over the specified temperature range, T
A
= – 55 ° C to 125 ° C. At T
A
= 25 ° C, R
L
= 10 k Ωconnected toV
S
/2, V
CM
= V
S
/2, and V
OUT
= V
S
/2 (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
Input offset voltage V
OS
V
S
= 5 V 2 10 µV
over temperature 22 µV
vs temperature dV
OS
/d
T
0.02 µV/ ° C
vs power supply PSRR V
S
= 1.8 V to 5.5 V 1 6 µV/V
Long-term stability
(1) (1)
Channel separation, dc 0.1 µV/V
INPUT BIAS CURRENT
Input bias current I
B
± 70 ± 200 pA
over Temperature ±150 pA
Input offset current I
OS
± 140 ± 400 pA
NOISE
Input voltage noise,
0.3 µV
PPf = 0.01 Hz to 1 HzInput voltage noise,
1.1 µV
PPf = 0.1 Hz to 10 HzInput current noise, f = 10 Hz i
n
100 fA/ √Hz
INPUT VOLTAGE RANGE
Common mode voltage range V
CM
(V – ) – 0.1 (V+) + 0.1 V
Common-Mode Rejection
CMRR (V – ) – 0.1 V < V
CM
< (V+) + 0.1 V 102 130 dBRatio
INPUT CAPACITANCE
Differential 2 pFCommon mode 4 pF
OPEN-LOOP GAIN
(V – ) + 100 mV < V
O
< (V+) – 100 mV,Open-loop voltage gain A
OL
104 130 dBR
L
= 10 k Ω
FREQUENCY RESPONSE
Gain-bandwidth product GBW C
L
= 100 pF 350 kHzSlew rate SR G = 1 0.16 V/ µs
OUTPUT
Voltage output swing from rail R
L
= 10 k Ω30 50 mV
over temperature R
L
= 10 k Ω85 mV
Short-circuit current ISC ± 5 mACapacitive load drive CL(2)
Open-loop output
f = 350 kHz, I
O
= 0 2 k Ωimpedance
POWER SUPPLY
Specified voltage range V
S
1.8 5.5 VQuiescent current per
I
Q
I
O
= 0 17 25 µAamplifier
over temperature 30 µA
Turn-on time V
S
= 5 V 100 µs
TEMPERATURE RANGE
Specified range – 55 125 ° C
(1) 300-hour life test at 150 ° C demonstrated randomly distributed variation of approximately 1 µV(2) See Typical Characteristics
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TYPICAL CHARACTERISTICS
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Population
−10
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
1
2
3
4
5
6
7
8
9
10
Offset Voltage (µV)
OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION
Population
0
0.0025
0.0050
0.0075
0.0100
0.0125
0.0150
0.0175
0.0200
0.0225
0.0250
0.0275
0.0300
0.0325
0.0350
0.0375
0.0400
0.0425
0.0450
0.0475
0.0500
Offset Voltage Drift (µV/_C)
OPEN−LOOP GAIN vs FREQUENCY
AOL (dB)
10
120
100
80
60
40
20
0
−20
Phase (_)
250
200
150
100
50
0
−50
−100
100k10k1k100
Frequency (Hz)
1M
COMMON−MODE REJECTION RATIO vs FREQUENCY
CMRR (dB)
1
140
120
100
80
60
40
20
0100k10k1k10010
Frequency (Hz)
1M
OPA333A-EP , , OPA2333A-EP
SGLS383B – APRIL 2007 – REVISED JUNE 2008 ............................................................................................................................................................
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Electrical Characteristics: V
S
= 1.8 V to 5.5 V (continued)Boldface limits apply over the specified temperature range, T
A
= – 55 ° C to 125 ° C. At T
A
= 25 ° C, R
L
= 10 k Ωconnected toV
S
/2, V
CM
= V
S
/2, and V
OUT
= V
S
/2 (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Operating range – 55 125 ° CStorage range – 65 150 ° CThermal resistance θ
JA
SOT23-5 200 ° C/WSO-8 150 ° C/WSC70-5 250 ° C/W
At T
A
= 25 ° C, V
S
= 5 V, and C
L
= 0 pF (unless otherwise noted).
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POWER−SUPPLY REJECTION RANGE vs FREQUENCY
PSRR (dB)
1
120
100
80
60
40
20
010k 100k1k10010
Frequency (Hz)
1M
+PSRR
−PSRR
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
Output Swing (V)
0
3
2
1
0
−1
−2
−31
Output Current (mA)
107 8 965432
−40_C
−40_C
−40_C
+25_C
+25_C
+25_C
+125_C
+125_C
VS=±2.75V
VS=±0.9V
INPUT BIAS CURRENT vs COMMON−MODE VOLTAGE
IB(pA)
0
100
80
60
40
20
0
−20
−40
−60
−80
−100 1
Common−Mode Voltage (V)
5432
−IB
+IB
VS = 5V
INPUT BIAS CURRENT vs TEMPERATURE
IB(pA)
−50
200
150
100
50
0
−50
−100
−150
−200 −25
Temperature (_C)
1251007550250
VS= 5.5V
VS= 1.8V
−IB
−IB
+IB
+IB
QUIESCENT CURRENT vs TEMPERATURE
IQ(µA)
−50
25
20
15
10
5
0−25
Temperature (_C)
1251007550250
VS= 1.8V
VS= 5.5V
OPA333A-EP , , OPA2333A-EP
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............................................................................................................................................................ SGLS383B – APRIL 2007 – REVISED JUNE 2008
TYPICAL CHARACTERISTICS (continued)
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POSITIVE OVER−VOLTAGE RECOVERY
2V/div
0
1V/div
0
Time (50µs/div)
Input
Output
10kΩ
1kΩ
OPA333
+2.5V
−2.5V
NEGATIVE OVER−VOLTAGE RECOVERY
2V/div
0
1V/div
0
Time (50µs/div)
Input
Output
10kΩ
1kΩ
OPA333
+2.5V
−2.5V
SETTLING TIME vs CLOSED−LOOP GAIN
Settling Time (µs)
1
600
500
400
300
200
100
010
Gain (dB)
100
0.001%
0.01%
4V Step
0.1Hz TO 10Hz NOISE
500nV/div
1s/div
SMALL−SIGNAL OVERSHOOT vs LOAD CAPACITANCE
Overshoot (%)
10
40
35
30
25
20
15
10
5
0100
Load Capacitance (pF)
1000
OPA333A-EP , , OPA2333A-EP
SGLS383B – APRIL 2007 – REVISED JUNE 2008 ............................................................................................................................................................
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TYPICAL CHARACTERISTICS (continued)
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CURRENT AND VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
Voltage Noise (nV//Hz)
1
1000
100
10
Current Noise (fA//Hz)
1000
100
10
1k10010
Frequency (Hz)
10k
Current Noise
Voltage Noise
Continues with no 1/f (flicker) noise.
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............................................................................................................................................................ SGLS383B – APRIL 2007 – REVISED JUNE 2008
TYPICAL CHARACTERISTICS (continued)
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APPLICATION INFORMATION
The OPA333A and OPA2333A are unity-gain stable and free from unexpected output phase reversal. They use a
Operating Voltage
Input Voltage
5kΩ
OPA333A
10mA max
+5V
VIN
VOUT
IOVERLOAD
Current−limiting resistor
required if input voltage
exceeds supply rails by
≥0.5V.
Internal Offset Correction
OPA333A-EP , , OPA2333A-EP
SGLS383B – APRIL 2007 – REVISED JUNE 2008 ............................................................................................................................................................
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proprietary auto-calibration technique to provide low offset voltage and very low drift over time and temperature.For lowest offset voltage and precision performance, circuit layout and mechanical conditions should beoptimized. Avoid temperature gradients that create thermoelectric (Seebeck) effects in the thermocouplejunctions formed from connecting dissimilar conductors. These thermally-generated potentials can be made tocancel by ensuring they are equal on both input terminals. Other layout and design considerations include:•Use low thermoelectric-coefficient conditions (avoid dissimilar metals)•Thermally isolate components from power supplies or other heat sources•Shield op amp and input circuitry from air currents, such as cooling fans
Following these guidelines will reduce the likelihood of junctions being at different temperatures, which can causethermoelectric voltages of 0.1 µV/ ° C or higher, depending on materials used.
The OPA333A and OPA2333A op amps operate over a power-supply range of 1.8 V to 5.5 V ( ± 0.9 V to± 2.75 V). Supply voltages higher than 7 V (absolute maximum) can permanently damage the device. Parametersthat vary over supply voltage or temperature are shown in the Typical Characteristics section of this data sheet.
The OPA333A and OPA2333A input common-mode voltage range extends 0.1 V beyond the supply rails. TheOPA333A is designed to cover the full range without the troublesome transition region found in some otherrail-to-rail amplifiers.
Normally, input bias current is about 70 pA; however, input voltages exceeding the power supplies can causeexcessive current to flow into or out of the input pins. Momentary voltages greater than the power supply can betolerated if the input current is limited to 10 mA. This limitation is easily accomplished with an input resistor(seeFigure 1 ).
Figure 1. Input Current Protection
The OPA333A and OPA2333A op amps use an auto-calibration technique with a time-continuous 350-kHz opamp in the signal path. This amplifier is zero corrected every 8 µs using a proprietary technique. Upon power up,the amplifier requires approximately 100 µs to achieve specified V
OS
accuracy. This design has no aliasing orflicker noise.
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Achieving Output Swing to the Op Amp Negative Rail
VOUT
RP= 20kΩ
Op Amp V−= Gnd
OPA333A
VIN
V+ = +5V
−5V
Additional
Negative
Supply
General Layout Guidelines
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............................................................................................................................................................ SGLS383B – APRIL 2007 – REVISED JUNE 2008
Some applications require output voltage swings from 0 V to a positive full-scale voltage (such as 2.5 V) withexcellent accuracy. With most single-supply op amps, problems arise when the output signal approaches 0 V,near the lower output swing limit of a single-supply op amp. A good single-supply op amp may swing close tosingle-supply ground, but will not reach ground. The output of the OPA333A and OPA2333A can be made toswing to ground, or slightly below, on a single-supply power source. To do so requires the use of another resistorand an additional, more negative, power supply than the op amp negative supply. A pulldown resistor may beconnected between the output and the additional negative supply to pull the output down below the value that theoutput would otherwise achieve (see Figure 2 ).
Figure 2. V
OUT
Range to Ground
The OPA333A and OPA2333A have an output stage that allows the output voltage to be pulled to its negativesupply rail, or slightly below, using the technique previously described. This technique only works with sometypes of output stages. The OPA333A and OPA2333A have been characterized to perform with this technique;however, the recommended resistor value is approximately 20 k Ω. Note that this configuration will increase thecurrent consumption by several hundreds of microamps. Accuracy is excellent down to 0 V and as low as– 2 mV. Limiting and nonlinearity occurs below – 2 mV, but excellent accuracy returns as the output is againdriven above – 2 mV. Lowering the resistance of the pulldown resistor allows the op amp to swing even furtherbelow the negative rail. Resistances as low as 10 k Ωcan be used to achieve excellent accuracy down to– 10 mV.
Attention to good layout practices is always recommended. Keep traces short and, when possible, use a printedcircuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.Place a 0.1- µF capacitor closely across the supply pins. These guidelines should be applied throughout theanalog circuit to improve performance and provide benefits, such as reducing the electromagnetic interference(EMI) susceptibility.
Operational amplifiers vary in their susceptibility to radio frequency interference (RFI). RFI can generally beidentified as a variation in offset voltage or dc signal levels with changes in the interfering RF signal. TheOPA333A has been specifically designed to minimize susceptibility to RFI and demonstrates remarkably lowsensitivity compared to previous-generation devices. Strong RF fields may still cause varying offset levels.
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+ +
+
− −
+
4.096V
0.1µF
+5V
Zero Adj.
K−Type
Thermocouple
40.7µV/_C
R2
549Ω
R9
150kΩ
R5
31.6kΩ
R1
6.04kΩ
R6
200Ω
+5V
0.1µF
R2
2.94kΩ
VO
R3
60.4Ω
R4
6.04kΩ
OPA333A
D1
REF3140
R1
VEX
VOUT
VREF
R1
OPA333A
R
R
R R +5V
OPA333A-EP , , OPA2333A-EP
SGLS383B – APRIL 2007 – REVISED JUNE 2008 ............................................................................................................................................................
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Figure 3. Temperature Measurement
Figure 4 shows the basic configuration for a bridge amplifier.
Figure 4. Single Op-Amp Bridge Amplifier
A low-side current shunt monitor is shown in Figure 5 . R
N
are operational resistors used to isolate the ADS1100from the noise of the digital I
2
C bus. Since the ADS1100 is a 16-bit converter, a precise reference is essential formaximum accuracy. If absolute accuracy is not required, and the 5-V power supply is sufficiently stable, theREF3130 may be omitted.
10 Submit Documentation Feedback Copyright © 2007 – 2008, Texas Instruments Incorporated
Product Folder Link(s): OPA333A-EP OPA2333A-EP
OPA333A
ADS1100
Load
V
I2C
R1
4.99kΩ
R3
4.99kΩR4
48.7kΩ
R2
49.9kΩ
+5V 3V
REF3130
R7
1.18kΩ
RSHUNT
1Ω
R6
71.5kΩRN
56Ω
RN
56Ω
(PGA Gain = 4)
FS = 3.0V
NOTE: 1% resistors provide adequate common−mode rejection at small ground−loop errors.
Stray Ground−Loop Resistance
ILOAD
OPA333A
Output
RSHUNT
Load
V+
V+
RG
RL
R1(2)
10kΩ
RBIAS
+5V
zener(1)
Two zener
biasing methods
are shown.(3)
MOSFET rated to
stand−off supply voltage
such as BSS84 for
up to 50V.
(1) zener rated for op amp supply capability (that is, 5.1V for OPA333).
(2) Current−limiting resistor.
(3) Choose zener biasing resistor or dual NMOSFETS (FDG6301N, NTJD4001N, or Si1034)
NOTES:
OPA333A-EP , , OPA2333A-EP
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............................................................................................................................................................ SGLS383B – APRIL 2007 – REVISED JUNE 2008
Figure 5. Low-Side Current Monitor
Figure 6. High-Side Current Monitor
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Product Folder Link(s): OPA333A-EP OPA2333A-EP
OPA333
3V NTC
Thermistor
1 MΩ60 kΩ100 kΩ
1 MΩ
V1
−In
V2
+In
R1
R22
3
5
6
1
R2
OPA333
OPA333
INA152
VO
VO= (1 + 2R2/R1) (V2−V1)
R1
100kΩ1/2
OPA2333
RA
Inverted
VCM
+VS
INA321(1)
+VS
VOUT
+VS
+VS
+VS
OPA333
+VS
1/2 VS
dc
3
21
4
5
6
GTOT = 1kV/V
GINA = 5
GOPA = 200
fLPF = 150Hz
fHPF = 0.5Hz
(provides ac signal coupling)
VS= +2.7V to +5.5V
BW = 0.5Hz to 150Hz
fO= 0.5Hz
Wilson
VCENTRAL
(RA + LA + LL)/3
7
ac
1/2 VS
R2
100kΩ1/2
OPA2333
LL
+VS
R3
100kΩ1/2
OPA2333
LA
R4
100kΩ
R9
20kΩ
R6
100kΩ
RL
+VS
+VS
1/2
OPA2333
1/2
OPA2333
1/2
OPA2333
C4
1.06nF
C3
1µF
R14
1MΩ
R12
5kΩ
R13
318kΩ
R7
100kΩ
R8
100kΩ
R10
1MΩ
C2
0.64µFR11
1MΩ
C1
47pF
R5
390kΩ
NOTE: (1) Other instrumentation amplifiers can be used,
such as the INA326, which has lower noise,
but higher quiescent current.
OPA333A-EP , , OPA2333A-EP
SGLS383B – APRIL 2007 – REVISED JUNE 2008 ............................................................................................................................................................
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Figure 7. Thermistor Measurement Figure 8. Precision Instrumentation Amplifier
Figure 9. Single-Supply, Very-Low-Power ECG Circuit
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Product Folder Link(s): OPA333A-EP OPA2333A-EP
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
OPA2333AMDREP ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 2333EP
OPA2333AMDREPG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 2333EP
OPA333AMDBVREP ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 0 OBYM
OPA333AMDCKREP ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 0 CHQ
V62/07633-01XE ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 OBYM
V62/07633-01YE ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 0 CHQ
V62/07633-02ZE ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 2333EP
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 2
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
OPA2333AMDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
OPA333AMDBVREP SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
OPA333AMDCKREP SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
OPA2333AMDREP SOIC D 8 2500 367.0 367.0 35.0
OPA333AMDBVREP SOT-23 DBV 5 3000 203.0 203.0 35.0
OPA333AMDCKREP SC70 DCK 5 3000 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
0.22
0.08
0.25
3.0
2.6
2X 0.95
1.9
1.45 MAX
TYP
0.15
0.00
5X 0.5
0.3
TYP
0.6
0.3
TYP
8
0
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/C 04/2017
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
www.ti.com
PACKAGE OUTLINE
C
TYP
0.22
0.08
0.25
3.0
2.6
2X 0.95
1.9
1.45 MAX
TYP
0.15
0.00
5X 0.5
0.3
TYP
0.6
0.3
TYP
8
0
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/C 04/2017
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
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V62/07633-01XE V62/07633-01YE OPA333AMDBVREP OPA333AMDCKREP OPA333AMDBVREPG4