BC212015-ds-001f Production Information
Page 1 of 36
_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
General Description Applications
BlueCore2-External is a single chip radio and
baseband IC for Bluetooth 2.4GHz systems.
It is implemented in 0.18µm CMOS technology.
When used with external flash containing the CSR
Bluetooth software stack, it provides a fully
compliant Bluetooth system for data and voice
communications.
PCs
Cellular Handsets
Cordless Headsets
Personal Digital Assistants (PDAs)
Computer Accessories (Compact flash
Cards, PCMCIA Cards, SD Cards and USB
Dongles)
Mice, Keyboards and Joysticks
Digital Cameras and Camcorders
RAM
DSP
MCU
I/O
2.4 GHz
Radio
XTAL
SPI
UART/USB
PIO
PCM
8Mbit
FLASH
ROM
RF OUT
RF IN
Up to
BlueCore2-External has been designed to reduce
the number of external RF components required,
which ensures module production costs are
minimised.
The device incorporates auto calibration and
built-in self-test routines to simplify development,
type approval and production test. All hardware
and device firmware is fully compliant with the
Bluetooth specification v1.1.
BlueCore2-External Block Diagram
Device Features
Low power 1.8V operation
Small footprint in 96-ball VFBGA
and LGA packages (6x6mm 8x8mm
and 10x10mm)
Fully qualified Bluetooth component
0.18µm CMOS technology
Full speed BluetoothTM operation
with full piconet support
Support for 8Mbit external flash
Minimum external components
_äìÉ`çêÉqjOJbñíÉêå~ä=
Single Chip Bluetooth System
Production Information Data Sheet for:
BC212013
(UART only version)
BC212015
(USB and UART version)
March 2003
Table of Contents
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Table of Contents
1 Key Features .................................................................................................................................................. 3
2 Device Pinout Diagram.................................................................................................................................. 4
3 Device Terminal Functions ........................................................................................................................... 5
4 Electrical Characteristics .............................................................................................................................. 9
5 Device Diagram ............................................................................................................................................ 14
6 Description of Functional Blocks ............................................................................................................... 15
6.1 RF Receiver ............................................................................................................................................ 15
6.1.1 Low Noise Amplifier .................................................................................................................. 15
6.1.2 Analogue to Digital Converter................................................................................................... 15
6.2 RF Transmitter ........................................................................................................................................ 15
6.2.1 IQ Modulator............................................................................................................................. 15
6.2.2 Power Amplifier ........................................................................................................................ 15
6.3 RF Synthesiser ....................................................................................................................................... 15
6.4 Baseband and Logic ............................................................................................................................... 15
6.4.1 Memory Management Unit ....................................................................................................... 15
6.4.2 Burst Mode Controller............................................................................................................... 15
6.4.3 Physical Layer Hardware Engine DSP ..................................................................................... 16
6.4.4 RAM.......................................................................................................................................... 16
6.4.5 External Memory Driver............................................................................................................ 16
6.4.6 USB .......................................................................................................................................... 16
6.4.7 Synchronous Serial Interface.................................................................................................... 16
6.4.8 UART........................................................................................................................................ 16
6.4.9 Audio PCM Interface................................................................................................................. 16
6.5 Microcontroller ........................................................................................................................................ 17
6.5.1 Programmable I/O .................................................................................................................... 17
7 CSR Bluetooth Software Stacks ................................................................................................................. 18
7.1 BlueCore HCI Stack................................................................................................................................ 18
7.1.1 Key Features of the HCI Stack ................................................................................................. 19
7.2 BlueCore RFCOMM Stack...................................................................................................................... 21
7.2.1 Key Features of the BlueCore2-External RFCOMM Stack ....................................................... 21
7.3 BlueCore Virtual Machine Stack ............................................................................................................. 22
7.4 Host-Side Software ................................................................................................................................. 23
7.5 Device Firmware Upgrade ...................................................................................................................... 23
7.6 Additional Software for Other Embedded Applications ........................................................................... 23
7.7 CSR Development Systems.................................................................................................................... 23
8 External Interfaces....................................................................................................................................... 24
8.1 Transmitter/Receiver Inputs and Outputs ............................................................................................... 24
8.2 Asynchronous Serial Data Port (UART) and USB Port ........................................................................... 24
8.3 PCM CODEC Interface ........................................................................................................................... 24
8.4 Serial Peripheral Interface ...................................................................................................................... 25
8.5 Parallel PIO Port ..................................................................................................................................... 25
8.6 I2C Interface ............................................................................................................................................ 25
9 Schematic ..................................................................................................................................................... 26
10 Package Dimensions ................................................................................................................................... 27
10.1 96-Ball VFBGA....................................................................................................................................... 27
10.2 96-Ball LGA............................................................................................................................................ 28
10.3 96-Ball LFBGA....................................................................................................................................... 29
11 Ordering Information ................................................................................................................................... 30
12 Contact Information ..................................................................................................................................... 31
13 Document References ................................................................................................................................. 32
14 Acronyms and Definitions........................................................................................................................... 33
15 Record of Changes ...................................................................................................................................... 36
Key Features
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
1 Key Features
Radio
Operation with common TX/RX terminals
simplifies external matching circuitry and
eliminates external antenna switch
Extensive built-in self-test minimises production
test time
No external trimming is required in production
Full RF reference designs are available
Transmitter
Up to +6dBm RF transmit power with level
control from the on-chip 6-bit DAC over a
dynamic range greater than 30dB
Supports Class 2 and Class 3 radios without the
need for an external power amplifier or TX/RX
switch
Supports Class 1 radios with an external power
amplifier provided by a power control terminal
controlled by an internal 8-bit voltage DAC and
an external RF TX/RX switch
Receiver
Integrated channel filters
Digital demodulator for improved sensitivity and
co-channel rejection
Digitised RSSI available in real time over the
HCI interface
Fast AGC for enhanced dynamic range
Synthesiser
Fully integrated synthesiser; no external VCO
varactor diode or resonator
Compatible with crystals between 8 and 32MHz
(in multiples of 250kHz) or an external clock
Auxiliary Features
Crystal oscillator with built-in digital trimming
Power management includes digital shut down
and wake up commands and an integrated low
power oscillator for ultra-low Park/Sniff/Hold
mode power consumption
Device can be used with an external Master
oscillator and provides a ‘clock request signal’ to
control external clock source
Uncommitted 8-bit ADC and 8-bit DAC are
available to application programs
Baseband and Software
External 8Mbit flash for complete system solution
and application flexibility
32kbyte on-chip RAM allows full speed Bluetooth
data transfer, mixed voice and data, plus full 7
slave piconet operation
Dedicated logic for forward error correction,
header error control, access code correlation,
demodulation, cyclic redundancy check,
encryption bitstream generation, whitening and
transmit pulse shaping
Transcoders for A-law, µ-law and linear voice
from host and A-law, µ-law and CVSD voice over
air
Physical Interfaces
Synchronous serial interface up to 4Mbaud
UART interface with programmable Baud rate up
to 1.5MBaud
Full speed USB interface supports OHCI and
UHCI host interfaces. Compliant with USB v1.1
Synchronous bi-directional serial programmable
audio interface
Optional I2CTM compatible interface
Bluetooth Stack Running on an
Internal Microcontroller
CSR’s Bluetooth Protocol Stack runs on-chip in a
variety of configurations:
Standard HCI (UART or USB)
Fully embedded to RFCOMM, thus reducing host
CPU load
Package Options
96-ball LFBGA 10x10x1.4mm 0.80mm pitch
96-ball VFBGA 8x8x1.0mm 0.65mm pitch
96-ball VFBGA 6x6x1.0mm 0.50mm pitch
96-ball VFLGA 6x6x0.65mm 0.50mm pitch
Device Pinout
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
2 Device Pinout Diagram
Orientation from top of device
A
B
C
D
E
F
G
H
J
K
L
1
2
3
45
6
7
8
9
10
11
Figure 2.1: BlueCore2-External Device Pinout Diagram
Notes:
Device pinout diagram is the same for:
10x10mm LFBGA (BN)
8x8x1mm VFBGA package (DN)
6x6x1mm VFBGA package (EN)
6x6x0.6mm LGA package (LN)
Device Terminal Functions
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
3 Device Terminal Functions
Radio Ball Pad Type Description
RF_IN E1 Analogue Single ended receiver input
PIO[0]/RXEN C1
Bi-directional with weak
internal pull-up/down Control output for external LNA (if fitted)
PIO[1]/TXEN C2
Bi-directional with weak
internal pull-up/down
Control output for external PA Class 1
applications only
TX_A G1 Analogue Transmitter output/Switched Receiver input
TX_B F1 Analogue Complement of TX_A
AUX_DAC D2 Analogue Voltage DAC output
Synthesiser and
Oscillator Ball Pad Type Description
XTAL_IN L1 Analogue For crystal or external clock input
XTAL_OUT L2 Analogue Drive for crystal
LOOP_FILTER J1 Analogue Connection to external PLL loop filter
External Memory
Port Ball Pad Type Description
REB D10
CMOS output, tristatable
with internal weak pull-up
Read enable for external memory (active
low)
WEB E10
CMOS output, tristatable
with internal weak pull-up
Write enable for external memory (active
low)
CSB C10
CMOS output, tristatable
with internal weak pull-up Chip select for external memory (active low)
Address Lines Ball Pad Type Description
A[0] D9 CMOS output, tristatable Address line
A[1] E9 CMOS output, tristatable Address line
A[2] E11 CMOS output, tristatable Address line
A[3] F9 CMOS output, tristatable Address line
A[4] F10 CMOS output, tristatable Address line
A[5] F11 CMOS output, tristatable Address line
A[6] G9 CMOS output, tristatable Address line
A[7] G10 CMOS output, tristatable Address line
A[8] G11 CMOS output, tristatable Address line
A[9] H9 CMOS output, tristatable Address line
A[10] H10 CMOS output, tristatable Address line
A[11] H11 CMOS output, tristatable Address line
A[12] J8 CMOS output, tristatable Address line
A[13] J9 CMOS output, tristatable Address line
A[14] J10 CMOS output, tristatable Address line
A[15] J11 CMOS output, tristatable Address line
A[16] K9 CMOS output, tristatable Address line
A[17] K10 CMOS output, tristatable Address line
A[18] K11 CMOS output, tristatable Address line
Device Terminal Functions
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Data Bus Ball Pad Type Description
D[0] K8
Bi-directional with weak
internal pull-down Data line
D[1] L9
Bi-directional with weak
internal pull-down Data line
D[2] L10
Bi-directional with weak
internal pull-down Data line
D[3] L11
Bi-directional with weak
internal pull-down Data line
D[4] L8
Bi-directional with weak
internal pull-down Data line
D[5] J7
Bi-directional with weak
internal pull-down Data line
D[6] K7
Bi-directional with weak
internal pull-down Data line
D[7] L7
Bi-directional with weak
internal pull-down Data line
D[8] J6
Bi-directional with weak
internal pull-down Data line
D[9] K6
Bi-directional with weak
internal pull-down Data line
D[10] L6
Bi-directional with weak
internal pull-down Data line
D[11] J5
Bi-directional with weak
internal pull-down Data line
D[12] K5
Bi-directional with weak
internal pull-down Data line
D[13] L5
Bi-directional with weak
internal pull-down Data line
D[14] J4
Bi-directional with weak
internal pull-down Data line
D[15] K4
Bi-directional with weak
internal pull-down Data line
PCM Interface Ball Pad Type Description
PCM_OUT B9
CMOS output, tristatable
with internal weak pull-down Synchronous data output
PCM_IN B10
CMOS input, with internal
weak pull-down Synchronous data input
PCM_SYNC B11
Bi-directional with weak
internal pull-down Synchronous data SYNC
PCM_CLK B8
Bi-directional with weak
internal pull-down Synchronous data clock
USB and UART Ball Pad Type Description
UART_TX C8 CMOS output UART data output active high
UART_RX C9
CMOS input with weak
internal pull-down UART data input active high
UART_RTS B7
CMOS output, tristatable
with internal pull-up UART request to send active low
UART_CTS B6
CMOS input with weak
internal pull-down UART clear to send active low
USB_D+ (1) A7 Bi-directional USB data plus
USB_D- (1) A6 Bi-directional USB data minus
Device Terminal Functions
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Test and Debug Ball Pad Type Description
RESET F3
CMOS input with weak
internal pull-down
Reset if high. Input debounced so must be
high for >5ms to cause a reset
SPI_CSB A4
CMOS input with weak
internal pull-up
Chip select for Synchronous Serial Interface
active low
SPI_CLK B5
CMOS input with weak
internal pull-down Serial Peripheral Interface clock
SPI_MOSI A5
CMOS input with weak
internal pull-down Serial Peripheral Interface data input
SPI_MISO B4
CMOS output, tristatable
with weak internal pull-
down
Serial Peripheral Interface data output
TEST_EN G3
CMOS input with strong
internal pull-down For test purposes only (leave unconnected)
PIO Port(3) Ball Pad Type Description
PIO[2]/
USB_PULL_UP (1) (2) B3
Bi-directional with
programmable weak
internal pull-up/down
PIO or USB pull-up (via 1.5k resistor to
USB_D+)
PIO[3]/USB_WAKE_
UP/RAM_CSB (1) (2) B2
Bi-directional with
programmable weak
internal pull-up/down
PIO or output goes high to wake up PC when
in USB mode or external RAM chip select
PIO[4]/USB_ON (1) (2) B1
Bi-directional with
programmable weak
internal pull-up/down
PIO or USB on (input senses when VBUS is
high, wakes BlueCore2-External)
PIO[5]/USB_DETACH
(1) (2) A3
Bi-directional with
programmable weak
internal pull-up/down
PIO line or chip detaches from USB when
this input is high
PIO[6]/CLK_REQ C3
Bi-directional with
programmable weak
internal pull-up/down
PIO line or clock request output to enable
external clock for external clock line
PIO[7] E3
Bi-directional with
programmable weak
internal pull-up/down
Programmable input/output line
PIO[8] D3
Bi-directional with
programmable weak
internal pull-up/down
Programmable input/output line
PIO[9] C4
Bi-directional with
programmable weak
internal pull-up/down
Programmable input/output line
PIO[10] C5
Bi-directional with
programmable weak
internal pull-up/down
Programmable input/output line
PIO[11] C6
Bi-directional with
programmable weak
internal pull-up/down
Programmable input/output line
AIO[0] K3 Bi-directional Programmable input/output line
AIO[1] L4 Bi-directional Programmable input/output line
AIO[2] J3 Bi-directional Programmable input/output line
Notes:
(1) USB functions are available on BC212015 only.
(2) USB functions can be software mapped to any PIO terminal.
(3) All PIO’s are configured as inputs with weak pull-downs at reset.
Device Terminal Functions
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Power Supplies
and Control Ball Pad Type Description
VDD_RADIO D1
H3 VDD Positive supply connection for RF circuitry
VDD_VCO H1 VDD Positive supply for VCO and synthesiser
circuitry
VDD_ANA K1 VDD Positive supply for analogue circuitry
VDD_CORE A8 VDD Positive supply for internal digital circuitry
VDD_PIO A1 VDD Positive supply for PIO and AUX DAC
VDD_PADS A10 VDD Positive supply for all other input/output
VDD_MEM D11 VDD Positive supply for external memory port and
AIO
VSS_RADIO
E2
F2
G2
VSS Ground connections for RF circuitry
VSS_VCO J2
H2 VSS Ground connections for VCO and
synthesiser
VSS_ANA L3
K2 VSS Ground connections for analogue circuitry
VSS_CORE A9 VSS Ground connection for internal digital
circuitry
VSS_PIO A2 VSS Ground connection for PIO and AUX DAC
VSS_PADS A11 VSS Ground connection for input/output except
memory port
VSS_MEM C11 VSS Ground connection for external memory port
VSS C7 VSS Ground connection for internal package
shield
Electrical Characteristics
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
4 Electrical Characteristics
Absolute Maximum Ratings
Rating Min Max
Storage Temperature -40°C +150°C
Supply Voltage: VDD_RADIO, VDD_VCO, VDD_ANA,
VDD_CORE -0.40V 1.90V
Supply Voltage: VDD_PADS, VDD_PIO, VDD_MEM -0.40V 3.60V
Recommended Operating Conditions
Operating Condition Min Max
Operating Temperature Range(1) -40°C 105°C
Supply Voltage: VDD_RADIO, VDD_VCO, VDD_ANA,
VDD_CORE 1.70V 1.90V
Supply Voltage: VDD_PADS, VDD_PIO, VDD_MEM 1.70V 3.60V
Note:
(1) The device functions across this range. See long form data book for guaranteed performance over
temperature.
Electrical Characteristics
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Input/Output Terminal Characteristics
Digital Terminals Min Typ Max Unit
Input Voltage
-0.4 - +0.8 V VIL input logic level low (VDD=3.0V)
(VDD=1.8V) -0.4 - +0.4 V
VIH input logic level high 0.7VDD - VDD+0.4 V
Output Voltage
VOL output logic level low, (lO = 4.0mA), VDD=3.0V - - 0.2 V
VOL output logic level low, (lO = 4.0mA), VDD=1.8V - - 0.4 V
VOH output logic level high, (lO = -4.0mA), VDD=3.0V VDD-0.2 - - V
VOH output logic level high, (lO = -4.0mA), VDD=1.8V VDD-0.4 - - V
Input and Tristate Current with:
Strong pull-up -100 -20 -10 µA
Strong pull-down +10 +20 +100 µA
Weak pull-up -5 -1 0 µA
Weak pull-down 0 +1 +5 µA
I/O pad leakage current -1 0 +1 µA
CI Input Capacitance 2.5 - 10 pF
Input/Output Terminal Characteristics (Continued)
USB Terminals Min Typ Max Unit
Input threshold
VIL input logic level low - - 0.3VDD_PADS V
VIH input logic level high 0.7VDD_PADS - - V
Input leakage current
VSS_PADS< VIN< VDD_PADS(1) -1 - 1
µA
CI Input capacitance 2.5 - 10 pF
Output levels to correctly terminated USB
Cable
VOL input logic level low 0 - 0.2 V
VOH input logic level high 2.8 - VDD_PADS V
Notes:
VDD_CORE, VDD_RADIO, VDD_VCO and VDD_ANA are at 1.8V unless shown otherwise
VDD_PADS, VDD_PIO and VDD_MEM are at 3.0V unless shown otherwise
Current drawn into a pin is defined as positive; current supplied out of a pin is defined as negative.
(1) Internal USB pull-up disabled
Electrical Characteristics
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Input/Output Terminal Characteristics (Continued)
Auxiliary DAC, 8-Bit Resolution Min Typ Max Unit
Resolution - - 8 Bits
Average output step size(1) 12.5 14.5 17 mV
Output Voltage monotonic(1)
Voltage range (IO=0) VSS_PIO - VDD_PIO V
Current range -10 - +0.1 mA
Minimum output voltage (IO=100µA) 0 - 0.2 V
Maximum output voltage (IO=10mA) VDD_PIO-0.3 - VDD_PIO V
High Impedance leakage current -1 - +1 µA
Offset -220 - +120 mV
Integral non-linearity(1) -2 - +2 LSB
Starting time (50pF load) - - 10 µs
Settling time (50pF load) - - 5 µs
Input/Output Terminal Characteristics (Continued)
Crystal Oscillator Min Typ Max Unit
Crystal frequency (2) 8.0 - 32.0 MHz
Digital trim range (3) 5 6.2 8 pF
Trim step size (3) - 0.1 - pF
Transconductance 2.0 - - mS
Negative resistance (4) 870 1500 2400
Input/Output Terminal Characteristics (Continued)
Power-on reset Min Typ Max Unit
VDD falling threshold 1.40 1.50 1.60 V
VDD rising threshold 1.50 1.60 1.70 V
Hysteresis 0.05 0.10 0.15 V
Notes:
VDD_CORE, VDD_RADIO, VDD_VCO and VDD_ANA are at 1.8V unless shown otherwise
VDD_PADS, VDD_PIO and VDD_MEM are at 3.0V unless shown otherwise
The same setting of the digital trim is applied to both XTAL_IN and XTAL_OUT.
Current drawn into a pin is defined as positive, current supplied out of a pin is defined as negative.
(1) Specified for an output voltage between 0.2V and VDD_PIO -0.2V
(2) Integer multiple of 250kHz.
(3) The difference between the internal capacitance at minimum and maximum settings of the internal digital
trim.
(4) XTAL frequency = 16MHz; XTAL C0 = 0.75pF; XTAL load capacitance = 8.5pF
Electrical Characteristics
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Radio Characteristics, VDD = 1.8V Temperature = +20°C
Frequency
(GHz) Min Typ Max Bluetooth
Specification Unit
2.402 - -83 - dBm
2.441 - -85 - dBm
Sensitivity at 0.1% BER
2.480 - -85 -
-70
dBm
2.402 - - - dBm
2.441 - - - dBm
Maximum received signal at 0.1%
BER
2.480 - - -
-20
dBm
2.402 - 6.0 - dBm
2.441 - 6.0 - dBm
RF transmit power (1)
2.480 - 6.0 -
-6 to +4(2)
dBm
2.402 - 12 - kHz
2.441 - 10 - kHz
Initial carrier frequency tolerance
2.480 - 9 -
±75
kHz
2.402 - 879 - kHz
2.441 - 816 - kHz
20dB bandwidth for modulated
carrier
2.480 - 819 -
1000
kHz
RF power control range - 35 - 16 dB
RF power range control resolution - 1.8 - - dB
Notes:
(1) BlueCore2-External firmware maintains the transmit power to be within the Bluetooth specification v1.1 limits.
(2) Class 2 RF transmit power range, Bluetooth specification v1.1
Electrical Characteristics
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Average Current Consumption (1)
VDD=1.8V Temperature = 20°C
Mode Avg Unit
SCO connection HV3 (40ms interval Sniff Mode) (Slave) 26.0 mA
SCO connection HV3 (40ms interval Sniff Mode) (Master) 26.0 mA
SCO connection HV1 (Slave) 53.0 mA
SCO connection HV1 (Master) 53.0 mA
ACL data transfer 115.2kbps UART (Master) 15.5 mA
ACL data transfer 720kbps USB (Slave) 53.0 mA
ACL data transfer 720kbps USB (Master) 53.0 mA
ACL connection, Sniff Mode 40ms interval, 38.4kbps UART 4.0 mA
ACL connection, Sniff Mode 1.28s interval, 38.4kbps UART 0.5 mA
Parked Slave, 1.28s beacon interval, 38.4kbps UART 0.6 mA
Standby Mode (Connected to host, no RF activity) 0.047 mA
Deep Sleep Mode(2) 20.0
µA
Notes:
(1) Current consumption is the sum of both BC212013B or BC212015B and the flash.
(2) Current consumption is for the BC212013B and BC212015B devices only.
Figure 4.1: Current Measurement Circuit
Flash
A
BlueCore2
VREG
3.0V 1.8V
Device Diagram
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
5 Device Diagram
Microcontroller
Interrupt
controller
Event
timer
RISC
micro-controller
Programmable
I/O
PIO[5]/USB_DETACH
PIO[6]/CLK_REQ
PIO[7]
PIO[2]/USB_PULL_UP
PIO[3]/USB_WAKE_UP/RAM_CS
B
PIO[4]/USB_ON
VSS_MEM
VSS_PADS
VSS_CORE
Baseband and Logic
UART_TX
UART_RX
UART_RTS
UART_CTS
SPI_CSB
SPI_CLK
SPI_MOSI
SPI_MISO
USB_D+
USB_D-
Synchronous
Serial
Interface
USB
UART
Memory
management
unit
Burst
mode
controller
RAM
Memory
mapped
control/
status
Physical
layer
DSP
hardware
engine
RESET
VDD_ANA
XTAL_OUT
XTAL_IN
Clock
generation
V
DD_RADIO
RSSI
PIO[0]/RXEN
RF_IN
TX_A
TX_B
PIO[1]/TXEN
PA
LNA
IQ DEMOD
RF
synthesiser
/N/N+1
VCO
LOOP_FILTE
ADC
Demodulator
VSS_ANA
VSS_RADIO
+45
-45
RF Receiver
RF Transmitter
IQ MOD
AUX_DAC
RF Synthesiser
Fref
External
Memory
Driver
CSB
A[18:0]
D[15:0]
WEB
REB
PCM_OUT
PCM_IN
PCM_SYNC
Audio
PCM
Interface
VDD_PADS
VDD_MEM
VDD_CORE
AUX
DAC
VSS_VCO
AIO[0]
AIO[1]
AIO[2]
19
VSS_PIO
16
PCM_CLK
DAC
TEST_EN
PIO[8]
PIO[9]
PIO[10]
PIO[11]
VDD_PIO
VSS
VDD_VCO
Figure 5.1: BlueCore2-External Device Diagram
Functional Blocks
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
6 Description of Functional Blocks
6.1 RF Receiver
The receiver features a near-zero Intermediate Frequency (IF) architecture that allows the channel filters to be
integrated on to the die. Sufficient out-of-band blocking specification at the Low Noise Amplifier (LNA) input
allows the radio to be used in close proximity to Global System for Mobile Communications (GSM) and Wideband
Code Division Multiple Access (W-CDMA) cellular phone transmitters without being desensitised. The use of a
digital Frequency Shift Keying (FSK) discriminator means that no discriminator tank is needed and its excellent
performance in the presence of noise allows BlueCore2-External to exceed the Bluetooth requirements for
co-channel and adjacent channel rejection.
6.1.1 Low Noise Amplifier
The LNA can be configured to operate in single-ended or differential mode. Single-ended mode is used for
Class 1 Bluetooth operation; differential mode is used for Class 2 operation.
6.1.2 Analogue to Digital Converter
The Analogue to Digital Converter (ADC) is used to implement fast Automatic Gain Control (AGC). The ADC
samples the Received Signal Strength Indicator (RSSI) voltage on a slot-by-slot basis. The front-end LNA gain is
changed according to the measured RSSI value, keeping the first mixer input signal within a limited range. This
improves the dynamic range of the receiver, improving performance in interference limited environments.
6.2 RF Transmitter
6.2.1 IQ Modulator
The transmitter features a direct IQ modulator to minimise the frequency drift during a transmit timeslot which
results in a controlled modulation index. A digital baseband transmit filter provides the required spectral shaping.
6.2.2 Power Amplifier
The internal Power Amplifier (PA) has a maximum output power of +6dBm allowing BlueCore2-External to be
used in Class 2 and Class 3 radios without an external RF PA. Support for transmit power control allows a simple
implementation for Class 1 with an external RF PA.
6.3 RF Synthesiser
The radio synthesiser is fully integrated onto the die with no requirement for an external Voltage Controlled
Oscillator (VCO) screening can, varactor tuning diodes or LC resonators.
6.4 Baseband and Logic
6.4.1 Memory Management Unit
The Memory Management Unit (MMU) provides a number of dynamically allocated ring buffers that hold the data
which is in transit between the host and the air or vice versa. The dynamic allocation of memory ensures efficient
use of the available Random Access Memory (RAM) and is performed by a hardware MMU to minimise the
overheads on the processor during data/voice transfers.
6.4.2 Burst Mode Controller
During radio transmission the Burst Mode Controller (BMC) constructs a packet from header information
previously loaded into memory-mapped registers by the software and payload data/voice taken from the
appropriate ring buffer in the RAM. During radio reception, the BMC stores the packet header in memory-mapped
registers and the payload data in the appropriate ring buffer in RAM. This architecture minimises the intervention
required by the processor during transmission and reception.
Functional Blocks
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6.4.3 Physical Layer Hardware Engine DSP
Dedicated logic is used to perform the following:
Forward error correction
Header error control
Cyclic redundancy check
Encryption
Data whitening
Access code correlation
Audio transcoding
The following voice data translations and operations are performed by firmware:
A-law/µ-law/linear voice data (from host)
A-law/µ-law/Continuously Variable Slope Delta (CVSD) (over the air)
Voice interpolation for lost packets
Rate mismatches
6.4.4 RAM
32Kbytes of on-chip RAM is provided and is shared between the ring buffers used to hold voice/data for each
active connection and the general purpose memory required by the Bluetooth stack.
6.4.5 External Memory Driver
The External Memory Driver interface can be used to connect to the external Flash memory and also to the
optional external RAM for memory intensive applications.
6.4.6 USB
This is a full speed Universal Serial Bus interface for communicating with other compatible digital devices.
BlueCore2-External acts as a USB peripheral, responding to requests from a Master host controller such as a
PC.
6.4.7 Synchronous Serial Interface
This is a synchronous serial port interface for interfacing with other digital devices. The SPI port can be used for
software debugging and for programming the external Flash memory.
6.4.8 UART
This is a standard Universal Asynchronous Receiver Transmitter (UART) interface for communicating with other
serial devices.
6.4.9 Audio PCM Interface
The Audio Pulse Code Modulation (PCM) Interface supports continuous transmission and reception of PCM
encoded audio data over Bluetooth.
Functional Blocks
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6.5 Microcontroller
The microcontroller, interrupt controller and event timer run the Bluetooth software stack and control the radio
and host interfaces. A 16-bit Reduced Instruction Set Computer (RISC) microcontroller is used for low power
consumption and efficient use of memory.
6.5.1 Programmable I/O
BlueCore2-External has a total of 15 (12 digital and 3 analogue) programmable I/O terminals. These are
controlled by firmware running on the device.
CSR Bluetooth Software Stacks
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7 CSR Bluetooth Software Stacks
BlueCore2-External is supplied with Bluetooth stack firmware which runs on the internal RISC microcontroller.
This is compliant with the Bluetooth specification v1.1.
The BlueCore2-External software architecture allows Bluetooth processing overheads to be shared in different
ways between the internal RISC microcontroller and the host processor. The upper layers of the Bluetooth stack
(above HCI) can be run either on-chip or on the host processor.
Running the upper stack on BlueCore2-External reduces (or eliminates, in the case of a virtual machine (VM)
application) the need for host-side software and processing time. Running the upper layers on the host processor
allows greater flexibility.
7.1 BlueCore HCI Stack
Figure 7.1: BlueCore HCI Stack
In this implementation the internal processor runs the Bluetooth stack up to the Host Controller Interface (HCI).
All upper layers must be provided by the Host processor.
LC
Baseband Micro
PCM I/O
Host I/O
32KB RAM
LM
HCI
Radio
Host
External Flash
UART
USB
CSR Bluetooth Software Stacks
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7.1.1 Key Features of the HCI Stack
Standard Bluetooth Functionality
The firmware has been written against the Bluetooth Core Specification v1.1.
Bluetooth components: Baseband (including LC), LM and HCI
Standard USB v1.1 and UART (H4) HCI Transport Layers
All standard radio packet types
Full Bluetooth data rate, up to 723.2kb/s asymmetric(1)
Operation with up to 7 active slaves (1)
Maximum number of simultaneous active ACL connections: 7(2)
Maximum number of simultaneous active SCO connections: 3(2)
Operation with up to 3 SCO links, routed to one or more slaves
Role switch: can reverse Master/Slave relationship
All standard SCO voice codings, plus “transparent SCO”
Standard operating modes: page, inquiry, page-scan and inquiry-scan
All standard pairing, authentication, link key and encryption operations
Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes, including “Forced Hold”
Dynamic control of peers’ transmit power via LMP
Master/Slave switch
Broadcast
Channel quality driven data rate
All standard Bluetooth Test Modes
Standard firmware upgrade via USB (DFU)
The firmware’s supported Bluetooth features are detailed in the standard PICS documents, available from
www.csr.com.
Note:
(1) Maximum allowed by Bluetooth specification v1.1.
(2) BlueCore2-External supports all combinations of active ACL and SCO channels for both Master and Slave
operation, as specified by the Bluetooth specification v1.1.
CSR Bluetooth Software Stacks
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Extra Functionality
The firmware extends the standard Bluetooth functionality with the following features:
Supports BlueCore Serial Protocol (BCSP) – a proprietary, reliable alternative to the standard Bluetooth
H4 UART Host Transport.
Provides a set of approximately 50 manufacturer-specific HCI extension commands. This command set
(called BCCMD – “BlueCore Command”), provides:
Access to the chip’s general-purpose PIO port
Access to the chip’s Bluetooth clock – this can help transfer connections to other Bluetooth devices
The negotiated effective encryption key length on established Bluetooth links
Access to the firmware’s random number generator
Controls to set the default and maximum transmit powers – these can help minimise interference
between overlapping, fixed-location piconets
Dynamic UART configuration
Radio transmitter enable/disable – a simple command connects to a dedicated hardware switch that
determines whether the radio can transmit
The firmware can read the voltage on a pair of the chip’s external pins. This is normally used to build a
battery monitor, using either VM or host code.
A block of BCCMD commands provides access to the chip’s “persistent store” configuration database
(PS). The database sets the device’s Bluetooth address, Class of Device, radio (transmit class)
configuration, SCO routing, LM, USB and DFU constants, etc.
A UART “break” condition can be used in three ways:
Presenting a UART break condition to the chip can force the chip to perform a hardware reboot
Presenting a break condition at boot time can hold the chip in a low power state, preventing normal
initialisation while the condition exists
With BCSP, the firmware can be configured to send a break to the host before sending data –
normally used to wake the host from a deep sleep state
The DFU standard has been extended with public/private key authentication, allowing manufacturers to
control the firmware that can be loaded onto their Bluetooth modules.
A modified version of the DFU protocol allows firmware upgrade via the chip’s UART.
A block of “radio test” or BIST commands allows direct control of the chip’s radio. This aids the
development of modules’ radio designs, and can be used to support Bluetooth qualification.
Virtual Machine (VM). The firmware provides the VM environment in which to run application-specific
code. Although the VM is mainly used with BlueLab and “RFCOMM builds” (alternative firmware builds
providing L2CAP, SDP and RFCOMM), the VM can be used with this build to perform simple tasks such
as flashing LED’s via the chip’s PIO port.
Hardware low power modes: shallow sleep and deep sleep. The chip drops into modes that significantly
reduce power consumption when the software goes idle.
SCO channels are normally routed over HCI (over BCSP). However, a single SCO channel can be
routed over the chip’s single PCM port (at the same time as routing up to two other SCO channels over
HCI). [Future versions of the BC02x firmware will be able to exploit the hardware's ability to route up to
three SCO channels through the single PCM port.]
CSR Bluetooth Software Stacks
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7.2 BlueCore RFCOMM Stack
Figure 7.2: BlueCore RFCOMM Stack
In this version of the firmware the upper layers of the Bluetooth stack up to RFCOMM are run on-chip. This
reduces host-side software and hardware requirements at the expense of some of the power and flexibility of the
HCI only stack.
7.2.1 Key Features of the BlueCore2-External RFCOMM Stack
Interfaces to Host
RFCOMM, an RS-232 serial cable emulation protocol
SDP, a service database look-up protocol
Connectivity
Maximum number of active slaves: 3
Maximum number of simultaneous active ACL connections: 3
Maximum number of simultaneous active SCO connections: 3
Data Rate: up to 350 Kb/s
Security
Full support for all Bluetooth security features up to and including strong (128-bit) encryption.
Power Saving
Full support for all Bluetooth power saving modes (Park, Sniff and Hold).
Data Integrity
CQDDR increases the effective data rate in noisy environments.
RSSI used to minimise interference to other radio devices using the ISM band.
LC
LM
L2CAP
External Flash
RFCOMM SDP
Baseband Micro
PCM I/O
Host I/O
32KB RAM
Radio
Host
UART
USB
CSR Bluetooth Software Stacks
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7.3 BlueCore Virtual Machine Stack
Figure 7.3: Virtual Machine
This version of the stack firmware requires no host processor. All software layers, including application software,
run on the internal RISC processor in a protected user software execution environment known as a Virtual
Machine (VM).
The user may write custom application code to run on the BlueCore VM using BlueLabTM software development
kit (SDK) supplied with the BlueLab and Casira development kits, available separately from CSR. This code will
then execute alongside the main BlueCore firmware. The user is able to make calls to the BlueCore firmware for
various operations.
The execution environment is structured so the user application does not adversely affect the main software
routines, thus ensuring that the Bluetooth stack software component does not need re-qualification when the
application is changed.
Using the VM and the BlueLab SDK the user is able to develop applications such as a cordless headset or other
profiles without the requirement of a host controller. BlueLab is supplied with example code including a full
implementation of the headset profile.
Note:
Sample applications to control PIO lines can also be written with BlueLab SDK and the VM for the HCI stack.
LC
LM
L2CAP
External Flash
RFCOMM SDP
Baseband Micro
PCM I/O
Host I/O
32KB RAM
Radio
Host
UART
VM Application Software
CSR Bluetooth Software Stacks
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7.4 Host-Side Software
BlueCore2-External can be ordered with companion host-side software:
BlueCore2-PC includes software for a full Windows 98/ME, Windows 2000 or Windows XP Bluetooth host-side
stack together with IC hardware described in this document.
BlueCore2-Mobile includes software for a full host-side stack designed for modern ARM based mobile handsets
together with IC hardware described in this document.
7.5 Device Firmware Upgrade
BlueCore2-External is supplied with boot loader software which implements a Device Firmware Upgrade (DFU)
capability. This allows new firmware to be uploaded to the external Flash memory through BlueCore2-External's
UART or USB ports.
7.6 Additional Software for Other Embedded Applications
When the upper layers of the Bluetooth protocol stack are run as firmware on BlueCore2-External, a UART
software driver is supplied that presents the L2CAP, RFCOMM and Service Discovery (SDP) APIs to higher
Bluetooth stack layers running on the host. The code is provided as ‘C’ source or object code.
7.7 CSR Development Systems
CSR’s BlueLab, Casira and MicroSira development kits are available to allow the evaluation of the
BlueCore2-External hardware and software, and as toolkits for developing on-chip and host software.
External Interfaces
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8 External Interfaces
8.1 Transmitter/Receiver Inputs and Outputs
Terminals TX_A and TX_B form a balanced current output. They require a DC path to VDD and should be
connected through a balun to the antenna. The output impedance is capacitive and remains constant,
irrespective of whether the transmitter is enabled or disabled. For Class 2 operation these terminals also act as
differential receive input terminals with an internal TX/RX switch.
For Class 1 operation the RF_IN ball is provided which is single-ended. A swing of up to 0.5V root mean squared
(rms) can be tolerated at this terminal. An external antenna switch can be connected to RF_IN.
8.2 Asynchronous Serial Data Port (UART) and USB Port
UART_TX, UART_RX, UART_RTS and UART_CTS form a conventional asynchronous serial data port. The
interface is designed to operate correctly when connected to other UART devices such as the 16550A. The
signalling levels are 0V and VDD_PADS and are inverted with respect to the signaling on an RS232 cable. The
interface is programmable over a variety of bit rates; no, even or odd parity; one or two stop bits and hardware
flow control on or off. The default condition on power-up is pre-assigned in the external Flash.
The maximum UART data rate is 1.5 MBaud. Two-way hardware flow control is implemented by UART_RTS and
UART_CTS. UART_RTS is an output and is active low. UART_CTS is an input and is active low. These signals
operate according to normal industry convention.
The port carries a number of logical channels: HCI data (both SCO and ACL), HCI commands and events,
L2CAP API, RFCOMM API, SDP and device management. For the UART, these are combined into a robust
tunnelling protocol, BlueCore Serial Protocol (BCSP), where each channel has its own software flow control and
cannot block other data channels. In addition, the Bluetooth specification v1.1, HCI UART Transport Layer (part
H4) format is supported.
Full speed USB (12Mbit/s) is supported in accordance with the Bluetooth specification v1.1, HCI USB Transport
Layer (H2). USB_D+ and USB_D- are available on dedicated terminals. Both Open Host Controller Interface
(OHCI) and Universal Host Controller Interfaces (UHCI) are supported.
The firmware in Flash can be downloaded through the USB or UART ports by DFU if the CSR supplied boot
loader is first programmed. Firmware shipped with BlueCore2-External includes security features to prevent
misuse of this upgrade facility.
8.3 PCM CODEC Interface
PCM_OUT, PCM_IN, PCM_CLK and PCM_SYNC carry up to three bi-directional channels of voice data, each at
8ksamples/s. The format of the PCM samples can be 8-bit A-law, 8-bit µ-law, 13-bit linear or 16-bit linear. The
PCM_CLK and PCM_SYNC terminals can be configured as inputs or outputs, depending on whether
BlueCore2-External is the Master or Slave of the PCM interface.
BlueCore2-External interfaces directly to PCM audio devices includes the following:
Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband devices
OKI MSM7705 four channel A-law and µ-law CODEC
Motorola MC145481 8-bit A-law and µ-law CODEC
Motorola MC145483 13-bit linear CODEC
BlueCore2-External is also compatible with the Motorola SSITM interface
External Interfaces
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8.4 Serial Peripheral Interface
BlueCore2-External is a slave device that uses terminals SPI_MOSI, SPI_MISO, SPI_CLK and SPI_CSB. This
interface is used for program emulation/debug and IC test. It is also the means by which the external Flash may
be programmed ‘in situ’ before any 'boot' program is loaded.
Note:
The designer should be aware that no security protection is built into the hardware or firmware associated with
this port, so the terminals should not be permanently connected in a PC application.
8.5 Parallel PIO Port
Fifteen lines of programmable bi-directional input/outputs (I/O) are provided. PIO[11:0] are powered from
VDD_PIO and AIO[2:0] are powered from VDD_MEM. PIO[0] and PIO[1] are normally dedicated to RXEN and
TXEN respectively, but they are available for general use. Any of the PIO lines can be configured as interrupt
request lines or as wake-up lines from sleep modes. PIO[6] can be configured as a request line for an external
clock source. This is useful when the clock to BlueCore2-External is provided from a system application specific
integrated circuit (ASIC). PIO[2] can be configured as a chip select for additional external RAM.
BlueCore2-External has three general purpose analogue interface pins, AIO[0], AIO[1] and AIO[2]. These are
used to access internal circuitry and control signals. One pin is allocated to decoupling for the on-chip bandgap
reference voltage, the other two may be configured to provide additional functionality.
Auxiliary functions available via these pins include an 8-bit ADC and an 8-bit DAC. Typically the ADC is used for
battery voltage measurement. Signals selectable at these pins include the bandgap reference voltage and a
variety of clock signals; 48, 24, 16, 8 MHz and the Xtal clock frequency. When used with analogue signals the
voltage range is constrained by the analogue supply voltage (1.8V).
These pins may also be configured to drive out digital level signals (clocks) generated from within the analogue
part of the device, the output voltage levels are determined by VDD_MEM which may be either 1.8V or 3.0V,
dependant upon the external flash.
8.6 I2C Interface
PIO[3] and PIO[2] can be used to form a Master I2C interface. The interface is formed using software to drive
these lines. Therefore it is suited only to relatively slow functions such as driving a dot matrix liquid crystal display
(LCD), keyboard scanner or EEPROM.
Schematic
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9 Schematic
C11
3p3
C12
10p
C4
15p
1V8
C10
47p
1V8 1V8
1V8 3V3
XT1
16MHz TSX-10
C15
220p (COG)
R3
180k
C5
10n
C9
10n
C16
47n
C14
2u2
VIN
1
GND
2
CE
3
BYP
4
VOUT 5
U3
XC6209B182MR
1V8
3V3
3V3
L2
3n9
L3
3n9
C2
1p8
C3
1p8
L1
3n9
C1
15p
1V8
1
2
34
5
6
T1
HHM-1517
T2 1
GND
2GND 3
T1
4
F1
MDR741F
C7
10n
R2
2R2
VDD_PIO A1
VSS_PIO
A2
PIO[5] A3
SPI_CSB A4
SPI_MOSI A5
USB_D- A6
USB_D+ A7
VDD_CORE A8
VSS_CORE
A9
VDD_PADS A10
VSS_PADS
A11
PIO[4] B1
PIO[3] B2
PIO[2] B3
SPI_MISO B4
SPI_CLK B5
UART_CTS B6
UART_RTS B7
PCM_CLK B8
PCM_OUT B9
PCM_IN B10
PCM_SYNC B11
PIO[0] C1
PIO[1] C2
PIO[6] C3
PIO[9] C4
PIO[10] C5
PIO[11] C6
VSS
C7
UART_TX C8
UART_RX C9
CSB
C10
VSS_MEM
C11
VDD_RADIO D1
AUX_DAC
D2
PIO[8] D3
A[0]
D9
REB
D10
VDD_MEM D11
RF_IN
E1
VSS_RADIO
E2
PIO[7] E3
A[1]
E9
WEB
E10
A[2]
E11
TX_B
F1
VSS_RADIO
F2
RST F3
A[3]
F9 A[4]
F10 A[5]
F11
TX_A
G1
VSS_RADIO
G2
TEST_EN G3
A[6]
G9 A[7]
G10 A[8]
G11
VDD_VCO H1
VSS_VCO
H2 VDD_RADIO H3
A[9]
H9 A[10]
H10 A[11]
H11
LOOP_FILTER
J1
VSS_VCO
J2
AIO[2] J3
D[14]
J4
D[11]
J5
D[8]
J6
D[5]
J7
A[12]
J8 A[13]
J9 A[14]
J10 A[15]
J11
VDD_ANA K1
VSS_ANA K2
AIO[0] K3
D[15]
K4
D[12]
K5
D[9]
K6
D[6]
K7
D[0]
K8
A[16]
K9 A[17]
K10 A[18]
K11
XTAL_IN L1
XTAL_OUT L2
VSS_ANA
L3
AIO[1] L4
D[13]
L5
D[10]
L6
D[7]
L7
D[4]
L8
D[1]
L9 D[2]
L10 D[3]
L11
U1
BlueCore2 External
A3 A1
A7 A2
RY/BY B
A3
WEB A4
A9 A5
A13 A6
A4 B1
A17 B2
NC
B3
RESETB B4
A8 B5
A12 B6
A2 C1
A6 C2
A10 C5
A14 C6
NC
C4
A1 D1
A5 D2
NC
D3 NC
D4
A11 D5
A15 D6
A0 E1
DQ0 E2
DQ2 E3
DQ5 E4
DQ7 E5
A16 E6
CEB F1
DQ8 F2
DQ10 F3
DQ12 F4
DQ14 F5
BYTEB F6
OEB G1
DQ9 G2
DQ11 G3
VCC G4
DQ13 G5
DQ15/A-1 G6
VSS
H1
DQ1 H2
DQ3 H3
DQ4 H4
DQ6 H5
VSS
H6 A18 C3
U2
MBM29LV800BA-90PBT
C17
1u
R5
470k
3V3
R4
22k
RF IN/OUT
R1
0R
C6
10n
C8
10n
C13
2u2
3V3
USER ASSIGNABLE
UART CONNECTION
(BCSP, H4 or USER DATA)
BRING OUT TO TEST PADS
FOR PROGRAMMING
TO EXTERNAL CODEC
12 MBIT/S USB TO PC
GENERAL PURPOSE I/O
FLASH MEMORY
NOTE: R1 MAY BE A SMALL INDUCTOR (e.g. 3.9nH, 6.8nH)
NOTES
GROUND USB_D+, USB_D- IF UNUSED
Z=50
Figure 9.1: Example Application Circuit
Note:
For a full BlueCore2-External reference design contact your local CSR representative.
Package Dimensions
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
10 Package Dimensions
10.1 96-Ball VFBGA
Top View Bottom View
98765432110
A
B
C
D
E
F
G
H
J
K
11
SEATING
PLANE
SEE DETAIL K
DETAIL K
Z
A
(A2)
(A3)
2
A1
3
0.08 Z
0.1 Z
D1
PIN 1
CORNER
E1
10X e
Ø
b1
3456789101121
D
PIN A1
E
DIM MIN MAX NOTES
A
A1
A2
A3
0.25
D
E
e
D1
E1
1
2
3
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM
PLANE Z.
DATUM Z IS DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
0.8 1
0.2 0.3
0.22 REF
0.45 REF
0.35
6 BSC
6 BSC
0.5 BSC
5 BSC
5 BSC
VFBGA 96 BALLS
6X6X1mm
(JEDEC MO-225)
b
DIM MIN MAX NOTES
A
A1
A2
A3
0.25
D
E
e
D1
E1
UNIT
MM
1
2
3
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM
PLANE Z.
DATUM Z IS DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
0.8 1
0.2 0.3
0.22 REF
0.45 REF
0.35
8 BSC
8 BSC
0.65 BSC
6.5 BSC
6.5 BSC
VFBGA 96 BALLS
8X8X1mm
(JEDEC MO-225)
b
UNIT
MM
L
A
B
C
D
E
F
G
H
J
K
L
BC212015EN and 6x6x1mm VFBGABC212013EN
BC212015DN and 8x8x1mm VFBGABC212013DN
Figure 10.1: BlueCore2-External VFBGA Package Dimensions
Package Dimensions
BC212015-ds-001f Production Information
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
10.2 96-Ball LGA
Top View Bottom View
98 76 5432110
A
B
C
D
E
F
G
H
J
K
11
PIN 1
CORNER
E1
10X e
Ø
b1
3456789101121
D
PIN A1
E
DIM MIN MAX NOTES
A
A1
A2
0.15
D
E
e
D1
E1
UNIT
MM
1
PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
0.6 0.65
0.22 REF
0.25
6 BSC
6 BSC
0.5 BSC
5 BSC
5 BSC
LGA 96 BALLS
6X6X0.6mm
(JEDEC MO-222)
b
L
A
B
C
D
E
F
G
H
J
K
L
BC212015LN and 6x6x0.6mm LGABC212013LN
0.37 0.420.32
SEE DETAIL K
DETAIL K
A
(A1)
(A2)
SEATING
PLANE
Z
1
0.1 Z
METAL
LEAD
0.08 Z
TYP
Figure 10.2: BlueCore2-External LGA Package Dimensions
Package Dimensions
BC212015-ds-001f Production Information
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
10.3 96-Ball LFBGA
Top View Bottom View
98765432110
A
B
C
D
E
F
G
H
J
K
11
SEATING
PLANE
SEE DETAIL K
DETAIL K
Z
A
(A2)
(A3)
2
A
1
3
0.08
Z
0.1 Z
PIN 1
CORNER
E1
10X e
Ø
b1
3456789101121
D
PIN A1
E
DIM MIN MAX NOTES
A
A1
A2
A3
0.35
D
E
e
D1
E1
UNIT
MM
1
2
3
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM
PLANE Z.
DATUM Z IS DEFINED BY THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASUREMENT SHALL EXCLUDE
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
--- 1.4
0.3 0.4
0.26 REF
0.8 REF
0.45
10 BSC
10 BSC
0.8 BSC
8 BSC
8 BSC
LFBGA 96 BALLS
10X10X1.4mm
(JEDEC MO-210)
b
L
A
B
C
D
E
F
G
H
J
K
L
BC212015BN 10x10x1.4mm LFBGA
Figure 10.3: BlueCore2-External LFBGA Package Dimensions
Ordering Information
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
11 Ordering Information
BlueCore2-External Standard Packaging Options
Firmware: HCI/on-chip RFCOMM
Package
Interface Version
Type Size
(mm)
Shipment
Method
Order Number
96-ball VFBGA 6x6x1 Tape and reel BC212013BEN-E4
96-ball VFBGA
Lead Free 6x6x1 Tape and reel BC212013BRN-E4
UART
96-ball LGA 6x6x0.65 Tape and reel BC212013BLN-E4
96-ball LFBGA 10x10x1.4 Tape and reel BC212015BBN-E4
96-ball VFBGA 8x8x1 Tape and reel BC212015BDN-E4
96-ball VFBGA 6x6x1 Tape and reel BC212015BEN-E4
96-ball VFBGA
Lead Free 6x6x1 Tape and reel BC212015BRN-E4
UART and USB
96-ball LGA 6x6x0.65 Tape and reel BC212015BLN-E4
Additional Software Options: BlueCore2-External is available with additional software options. These are shown
in table below. To order these versions attach the appropriate order code to the main packaging order number,
e.g., BC212013BDN-E4-0112.
Additional Software Options
Product Family Description Order Code
BlueCore2-Ext-PC Bluetooth for Windows v1.2 English -0112
BlueCore2-Ext-Embedded Bluetooth Embedded v1.2 -4012
BlueCore2-Ext-BCHS(1) BlueCore Host Software -8010
Note:
(1) Only available for UART interface versions.
Packaging Option
2kpcs Taped and Reeled
Contact Information
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
12 Contact Information
CSR U.S.
1651 N. Collins Blvd.
Suite 210
Richardson
TX75080
Tel: +1 (972) 238 2300
Fax: +1 (972) 231 1440
e-mail: sales@csr.com
CSR UK
Cambridge Science Park
Milton Road
Cambridge, CB4 0WH
United Kingdom
Tel: +44 (0) 1223 692 000
Fax: +44 (0) 1223 692 001
e-mail: sales@csr.com
CSR Denmark
Novi Science Park
Niels Jernes Vej 10
9220 Aalborg East
Denmark
Tel: +45 72 200 380
Fax: +45 96 354 599
e-mail: sales@csr.com
CSR Japan
CSR KK
Miyasaka LK Bld. 3F
43-23, 3 Chome Shimorenjaku
Mitaka-shi, Tokyo Japan
181-0013
Tel: +81 0422 40 4760
Fax: +81 0422 40 4765
e-mail: sales@csr.com
CSR Singapore
Blk 5, Ang Mo Kio
Industrial Park 2A,
AMK Tech II, #07-08
Singapore 567760
Tel: +65 6484 2212
Fax: +65 6484 2219
e-mail: sales@csr.com
CSR Korea
Room 1111 Keumgang Venturetel,
#1108, Beesan-dong, DongAn-ku,
Anyang-city,
Kyunggi-do 431-050,
Korea
Tel: +82 31 389 0541
Fax: +82 31 389 0545
e-mail: sales@csr.com
To contact a CSR representative, go to www.csr.com/contacts.htm
Document References
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
13 Document References
Document References Version
Specification of the Bluetooth system v1.1, 22 February 2001
Universal Serial Bus Specification v1.1, 23 September 1998
Acronyms and Definitions
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14 Acronyms and Definitions
Term: Definition:
BlueCore Group term for CSR’s range of Bluetooth chips.
Bluetooth A set of technologies providing audio and data transfer over short-range radio
connections
ACL Asynchronous Connection-Less. A Bluetooth data packet.
AC Alternating Current
ADC Analogue to Digital Converter
AGC Automatic Gain Control
A-law Audio encoding standard
API Application Programming Interface
ASIC Application Specific Integrated Circuit
BCSP BlueCore™ Serial Protocol
BER Bit Error Rate. Used to measure the quality of a link
BGA Ball Grid Array
BIST Built-In Self-Test
BOM Bill of Materials. Component part list
BMC Burst Mode Controller
BSC Basic. Represents theoretical exact dimension or dimension target.
C/I Carrier Over Interferer
CMOS Complementary Metal Oxide Semiconductor
CODEC Coder Decoder
CPU Central Processing Unit
CQDDR Channel Quality Driven Data Rate
CSB Chip Select
CSR Cambridge Silicon Radio
CTS Clear to Send
CVSD Continuous Variable Slope Delta Modulation
DAC Digital to Analogue Converter
dBm Decibels relative to 1mW
DC Direct Current
DFU Device Firmware Upgrade
FSK Frequency Shift Keying
GCI General Circuit Interface. Standard synchronous 2B+D ISDN timing interface
GSM Global System for Mobile communications
HCI Host Controller Interface
Host Application’s microcontroller
Host Controller Bluetooth integrated chip
HV Header Value
IQ Modulation In-Phase and Quadrature Modulation
IAC Inquiry Access Code
IF Intermediate Frequency
ISDN Integrated Services Digital Network
ISM Industrial, Scientific and Medical
ksamples/s kilosamples per second
L2CAP Logical Link Control and Adaptation Protocol (protocol layer)
LC Link Controller
LCD Liquid Crystal Display
LGA Land Grid Array
LNA Low Noise Amplifier
LSB Least-Significant Bit
µ-law Encoding standard
MMU Memory Management Unit
MISO Master In Serial Out
OHCI Open Host Controller Interface
Acronyms and Definitions
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PA Power Amplifier
PCB Printed Circuit Board
PCM Pulse Code Modulation. Refers to digital voice data
PDA Personal Digital Assistant
PIO Parallel Input Output
PLL Phase Lock Loop
ppm parts per million
PS Key Persistent Store Key
RAM Random Access Memory
REB Not Read enable
REF Reference. Represents dimension for reference use only.
RF Radio Frequency
RFCOMM Protocol layer providing serial port emulation over L2CAP
RISC Reduced Instruction Set Computer
rms root mean squared
ROM Read Only Memory
RSSI Receive Signal Strength Indication
RTS Ready To Send
RX Receive or Receiver
SCO Synchronous Connection-Oriented. Voice oriented Bluetooth packet
SD Secure Digital
SDK Software Development Kit
SDP Service Discovery Protocol
SIG Special Interest Group
SMS Short Message Service
SOC System On Chip
SPI Serial Peripheral Interface
SPP Serial Port Profile
SRAM Static Random Access Memory
SS Supplementary Services
SSI Signal Strength Indication
SSL Secure Sockets Layer
SUT System Under Test
SW Software
SWAP Shared Wireless Access Protocol
TA Terminal Adaptor
TAE Terminal Adaptor Equipment
TBD To Be Defined
TX Transmit or Transmitter
UART Universal Asynchronous Receiver Transmitter
USB Universal Serial Bus or Upper Side Band (depending on context)
VCO Voltage Controlled Oscillator
VFBGA Very Fine Ball Grid Array
VM Virtual Machine
W-CDMA Wideband Code Division Multiple Access
WEB Write Enable
www world wide web
Status of Information
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
Status of Information
The progression of CSR Product Data Sheets follows the following format:
Advance Information
Information for designers on the target specification for a CSR product in development.
All detailed specifications including pinouts and electrical specifications may be changed by CSR without notice.
Pre-Production Information
Final pinout and mechanical dimensions. All electrical specifications may be changed by CSR without notice.
Production Information
Final Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications.
Production Data Sheets supersede all previous document versions.
The status of this Data Sheet is Production Information.
Life Support Policy and Use in Safety-Critical Applications
CSR’s products are not authorised for use in life-support or safety-critical applications.
Trademarks, Patents and Licenses
BlueCoreTM, BlueLabTM, CasiraTM, CompactSiraTM and MicroSiraTM are trademarks of CSR Ltd.
BluetoothTM and the Bluetooth logos are trademarks owned by Bluetooth SIG Inc, USA and licensed to CSR.
Windows, Windows 98, Windows 2000, Windows XP and Windows NT are registered trademarks of the Microsoft
Corporation.
I2CTM is a trademark of Philips Corporation.
All other product, service and company names are trademarks, registered trademarks or service marks of their
respective owners.
The publication of this information does not imply that any license is granted under any patent or other rights
owned by CSR Ltd.
CSR Ltd reserves the right to make technical changes to its products as part of its development programme.
While every care has been taken to ensure the accuracy of the contents of this document, CSR cannot accept
responsibility for any errors.
Record of Changes
BC212015-ds-001f
Production Information
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_äìÉ`çêÉOJbñíÉêå~ä Product Data Sheet
15 Record of Changes
Date: Revision: Reason for Change:
12 SEPT 2001 a Original publication of document.
20 OCT 2001 b Application information added.
27 MAR 2002 c Amendments made to ordering codes.
5 MAY 2002 d Production information added.
28 JUNE 2002 e RF characteristics, current consumption and 10x10
packaging information added in line with
BlueCore2-External Data Book.
28 MARCH 2003 f Changes made to 10 x 10 package order code
_äìÉ`çêÉqjOJbñíÉêå~ä=mêçÇìÅí=a~í~=pÜÉÉí
BC212015-ds-001f
March 2003