DAC108S085
DAC108S085 10-Bit Micro Power OCTAL Digital-to-Analog Converter with
Rail-to-Rail Outputs
Literature Number: SNAS423A
October 2007
DAC108S085
10-Bit Micro Power OCTAL Digital-to-Analog Converter
with Rail-to-Rail Outputs
General Description
The DAC108S085 is a full-featured, general purpose OCTAL
10-bit voltage-output digital-to-analog converter (DAC) that
can operate from a single +2.7V to +5.5V supply and con-
sumes 1.95 mW at 3V and 4.85 mW at 5V. The DAC108S085
is packaged in a 16-lead LLP package and a 16-lead TSSOP
package. The LLP package makes the DAC108S085 the
smallest OCTAL DAC in its class. The on-chip output ampli-
fiers allow rail-to-rail output swing and the three wire serial
interface operates at clock rates up to 40 MHz over the entire
supply voltage range. Competitive devices are limited to 25
MHz clock rates at supply voltages in the 2.7V to 3.6V range.
The serial interface is compatible with standard SPI, QSPI,
MICROWIRE and DSP interfaces. The DAC108S085 also of-
fers daisy chain operation where an unlimited number of
DAC108S085s can be updated simultaneously using a single
serial interface.
There are two references for the DAC108S085. One refer-
ence input serves channels A through D while the other
reference serves channels E through H. Each reference can
be set independently between 0.5V and VA, providing the
widest possible output dynamic range. The DAC108S085 has
a 16-bit input shift register that controls the mode of operation,
the power-down condition, and the DAC channels' register/
output value. All eight DAC outputs can be updated simulta-
neously or individually.
A power-on reset circuit ensures that the DAC outputs power
up to zero volts and remain there until there is a valid write to
the device. The power-down feature of the DAC108S085 al-
lows each DAC to be independently powered with three dif-
ferent termination options. With all the DAC channels
powered down, power consumption reduces to less than 0.3
µW at 3V and less than 1 µW at 5V. The low power consump-
tion and small packages of the DAC108S085 make it an
excellent choice for use in battery operated equipment.
The DAC108S085 is one of a family of pin compatible DACs,
including the 8-bit DAC088S085 and the 12-bit DAC128S085.
All three parts are offered with the same pinout, allowing sys-
tem designers to select a resolution appropriate for their
application without redesigning their printed circuit board. The
DAC108S085 operates over the extended industrial temper-
ature range of −40°C to +125°C.
Features
Guaranteed Monotonicity
Low Power Operation
Rail-to-Rail Voltage Output
Daisy Chain Capability
Power-on Reset to 0V
Simultaneous Output Updating
Individual Channel Power Down Capability
Wide power supply range (+2.7V to +5.5V)
Dual Reference Voltages with range of 0.5V to VA
Operating Temperature Range of −40°C to +125°C
Industry's Smallest Package
Key Specifications
Resolution 10 bits
INL ±2 LSB (max)
DNL +0.35 / −0.2 LSB (max)
Settling Time 6 µs (max)
Zero Code Error +15 mV (max)
Full-Scale Error −0.75 %FSR (max)
Supply Power
Normal 1.95 mW (3V) / 4.85 mW (5V) typ
Power Down 0.3 µW (3V) / 1 µW (5V) typ
Applications
Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage & Current Sources
Programmable Attenuators
Voltage Reference for ADCs
Sensor Supply Voltage
Range Detectors
Ordering Information
Order Numbers Temperature Range Package Top Mark
DAC108S085CISQ −40°C TA +125°C 16-Lead LLP
DAC108S085CISQX −40°C TA +125°C LLP Tape-and-Reel
DAC108S085CIMT −40°C TA +125°C 16-Lead TSSOP X80C
DAC108S085CIMTX −40°C TA +125°C TSSOP Tape-and-Reel X80C
DAC108S085EB Evaluation Board - BOTH
SPI is a trademark of Motorola, Inc.
© 2007 National Semiconductor Corporation 300312 www.national.com
DAC108S085 10-Bit Micro Power OCTAL Digital-to-Analog Converter with Rail-to-Rail Outputs
Block Diagram
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DAC108S085
Pin Configuration
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Pin Descriptions
LLP
Pin No.
TSSOP
Pin No. Symbol Type Description
1 3 VOUTA Analog Output Channel A Analog Output Voltage.
2 4 VOUTB Analog Output Channel B Analog Output Voltage.
3 5 VOUTC Analog Output Channel C Analog Output Voltage.
4 6 VOUTD Analog Output Channel D Analog Output Voltage.
5 7 VASupply Power supply input. Must be decoupled to GND.
6 8 VREF1 Analog Input Unbuffered reference voltage shared by Channels A, B, C, and D.
Must be decoupled to GND.
7 9 VREF2 Analog Input Unbuffered reference voltage shared by Channels E, F, G, and H.
Must be decoupled to GND.
8 10 GND Ground Ground reference for all on-chip circuitry.
9 11 VOUTH Analog Output Channel H Analog Output Voltage.
10 12 VOUTG Analog Output Channel G Analog Output Voltage.
11 13 VOUTF Analog Output Channel F Analog Output Voltage.
12 14 VOUTE Analog Output Channel E Analog Output Voltage.
13 15 SYNC Digital Input
Frame Synchronization Input. When this pin goes low, data is
written into the DAC's input shift register on the falling edges of
SCLK. After the 16th falling edge of SCLK, a rising edge of SYNC
causes the DAC to be updated. If SYNC is brought high before the
15th falling edge of SCLK, the rising edge of SYNC acts as an
interrupt and the write sequence is ignored by the DAC.
14 16 SCLK Digital Input Serial Clock Input. Data is clocked into the input shift register on
the falling edges of this pin.
15 1 DIN Digital Input Serial Data Input. Data is clocked into the 16-bit shift register on
the falling edges of SCLK after the fall of SYNC.
16 2 DOUT Digital Output
Serial Data Output. DOUT is utilized in daisy chain operation and is
connected directly to a DIN pin on another DAC108S085. Data is
not available at DOUT unless SYNC remains low for more than 16
SCLK cycles.
17 PAD
(LLP only) Ground
Exposed die attach pad can be connected to ground or left floating.
Soldering the pad to the PCB offers optimal thermal performance
and enhances package self-alignment during reflow.
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DAC108S085
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage, VA6.5V
Voltage on any Input Pin −0.3V to 6.5V
Input Current at Any Pin (Note 3) 10 mA
Package Input Current (Note 3) 30 mA
Power Consumption at TA = 25°C See (Note 4)
ESD Susceptibility (Note 5)
Human Body Model
Machine Model
Charge Device Mode
2500V
250V
1000V
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Operating Ratings (Notes 1, 2)
Operating Temperature Range −40°C TA +125°C
Supply Voltage, VA+2.7V to 5.5V
Reference Voltage, VREF1,2 +0.5V to VA
Digital Input Voltage (Note 7) 0.0V to 5.5V
Output Load 0 to 1500 pF
SCLK Frequency Up to 40 MHz
Package Thermal Resistances
Package θJA
16-Lead LLP 38°C/W
16-Lead TSSOP 130°C/W
Soldering process must comply with National
Semiconductor's Reflow Temperature Profile specifications.
Refer to www.national.com/packaging. (Note 6)
Electrical Characteristics
The following specifications apply for VA = +2.7V to +5.5V, VREF1 = VREF2 = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code
range 12 to 1011. Boldface limits apply for TMIN TA TMAX and all other limits are at TA = 25°C, unless otherwise specified.
Symbol Parameter Conditions Typical Limits
(Note 8)
Units
(Limits)
STATIC PERFORMANCE
Resolution 10 Bits (min)
Monotonicity 10 Bits (min)
INL Integral Non-Linearity ±0.5 ±2 LSB (max)
DNL Differential Non-Linearity +0.08 +0.35 LSB (max)
−0.04 −0.2 LSB (min)
ZE Zero Code Error IOUT = 0 +5 +15 mV (max)
FSE Full-Scale Error IOUT = 0 −0.1 −0.75 % FSR (max)
GE Gain Error −0.2 −1.0 % FSR (max)
ZCED Zero Code Error Drift −20 µV/°C
TC GE Gain Error Tempco −1.0 ppm/°C
OUTPUT CHARACTERISTICS
Output Voltage Range 0
VREF1,2
V (min)
V (max)
IOZ
High-Impedance Output
Leakage Current (Note 9) ±1 µA (max)
ZCO Zero Code Output
VA = 3V, IOUT = 200 µA 10 mV
VA = 3V, IOUT = 1 mA 45 mV
VA = 5V, IOUT = 200 µA 8 mV
VA = 5V, IOUT = 1 mA 34 mV
FSO Full Scale Output
VA = 3V, IOUT = 200 µA 2.984 V
VA = 3V, IOUT = 1 mA 2.933 V
VA = 5V, IOUT = 200 µA 4.987 V
VA = 5V, IOUT = 1 mA 4.955 V
IOS
Output Short Circuit Current
(source) (Note 10)
VA = 3V, VOUT = 0V,
Input Code = 3FFh −50 mA
VA = 5V, VOUT = 0V,
Input Code = 3FFh −60 mA
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DAC108S085
Symbol Parameter Conditions Typical Limits
(Note 8)
Units
(Limits)
IOS
Output Short Circuit Current (sink)
(Note 10)
VA = 3V, VOUT = 3V,
Input Code = 000h 50 mA
VA = 5V, VOUT = 5V,
Input Code = 000h 70 mA
IO
Continuous Output Current per
channel (Note 9)
TA = 105°C 10 mA (max)
TA = 125°C 6.5 mA (max)
CLMaximum Load Capacitance RL = 1500 pF
RL = 2k1500 pF
ZOUT DC Output Impedance 8
REFERENCE INPUT CHARACTERISTICS
VREF1,2
Input Range Minimum 0.5 2.7 V (min)
Input Range Maximum VAV (max)
Input Impedance 30 k
LOGIC INPUT CHARACTERISTICS
IIN Input Current (Note 9) ±1 µA (max)
VIL Input Low Voltage VA = 2.7V to 3.6V 1.0 0.6 V (max)
VA = 4.5V to 5.5V 1.1 0.8 V (max)
VIH Input High Voltage VA = 2.7V to 3.6V 1.4 2.1 V (min)
VA = 4.5V to 5.5V 2.0 2.4 V (min)
CIN Input Capacitance (Note 9) 3pF (max)
POWER REQUIREMENTS
VA
Supply Voltage Minimum 2.7 V (min)
Supply Voltage Maximum 5.5 V (max)
IN
Normal Supply Current for supply
pin VA
fSCLK = 30 MHz,
output unloaded
VA = 2.7V
to 3.6V 460 585 µA (max)
VA = 4.5V
to 5.5V 650 855 µA (max)
Normal Supply Current for VREF1 or
VREF2
fSCLK = 30 MHz,
output unloaded
VA = 2.7V
to 3.6V 95 135 µA (max)
VA = 4.5V
to 5.5V 160 225 µA (max)
IST
Static Supply Current for supply pin
VA
fSCLK = 0,
output unloaded
VA = 2.7V
to 3.6V 370 µA
VA = 4.5V
to 5.5V 440 µA
Static Supply Current for VREF1 or
VREF2
fSCLK = 0,
output unloaded
VA = 2.7V
to 3.6V 95 µA
VA = 4.5V
to 5.5V 160 µA
IPD
Total Power Down Supply Current
for all PD Modes
(Note 9)
fSCLK = 30 MHz, SYNC =
VA and DIN = 0V after PD
mode loaded
VA = 2.7V
to 3.6V 0.2 1.5 µA (max)
VA = 4.5V
to 5.5V 0.5 3.0 µA (max)
fSCLK = 0, SYNC = VA and
DIN = 0V after PD mode
loaded
VA = 2.7V
to 3.6V 0.1 1.0 µA (max)
VA = 4.5V
to 5.5V 0.2 2.0 µA (max)
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DAC108S085
Symbol Parameter Conditions Typical Limits
(Note 8)
Units
(Limits)
PN
Total Power Consumption (output
unloaded)
fSCLK = 30 MHz
output unloaded
VA = 2.7V
to 3.6V 1.95 3.1 mW (max)
VA = 4.5V
to 5.5V 4.85 7.2 mW (max)
fSCLK = 0
output unloaded
VA = 2.7V
to 3.6V 1.68 mW
VA = 4.5V
to 5.5V 3.80 mW
PPD
Total Power Consumption in all PD
Modes,
(Note 9)
fSCLK = 30 MHz, SYNC =
VA and DIN = 0V after PD
mode loaded
VA = 2.7V
to 3.6V 0.6 5.4 µW (max)
VA = 4.5V
to 5.5V 2.5 16.5 µW (max)
fSCLK = 0, SYNC = VA and
DIN = 0V after PD mode
loaded
VA = 2.7V
to 3.6V 0.3 3.6 µW (max)
VA = 4.5V
to 5.5V 111 µW (max)
A.C. and Timing Characteristics
The following specifications apply for VA = +2.7V to +5.5V, VREF1,2 = VA, CL = 200 pF to GND, fSCLK = 30 MHz, input code range
12 to 1011. Boldface limits apply for TMIN TA TMAX and all other limits are at TA = 25°C, unless otherwise specified.
Symbol Parameter Conductions Typical Limits
(Note 8)
Units
(Limits)
fSCLK SCLK Frequency 40 30 MHz (max)
ts
Output Voltage Settling Time
(Note 9)
100h to 300h code change
RL = 2k, CL = 200 pF 4.5 6.0 µs (max)
SR Output Slew Rate 1 V/µs
GI Glitch Impulse Code change from 200h to 1FFh 40 nV-sec
DF Digital Feedthrough 0.5 nV-sec
DC Digital Crosstalk 0.5 nV-sec
CROSS DAC-to-DAC Crosstalk 1 nV-sec
MBW Multiplying Bandwidth VREF1,2 = 2.5V ± 2Vpp 360 kHz
ONSD Output Noise Spectral Density DAC Code = 200h, 10kHz 40 nV/sqrt(Hz)
ON Output Noise BW = 30kHz 14 µV
tWU Wake-Up Time VA = 3V 3 µsec
VA = 5V 20 µsec
1/fSCLK SCLK Cycle Time 25 33 ns (min)
tCH SCLK High time 7 10 ns (min)
tCL SCLK Low Time 7 10 ns (min)
tSS
SYNC Set-up Time prior to SCLK
Falling Edge 310 ns (min)
1 / fSCLK - 3 ns (max)
tDS
Data Set-Up Time prior to SCLK
Falling Edge 1.0 2.5 ns (min)
tDH
Data Hold Time after SCLK Falling
Edge 1.0 2.5 ns (min)
tSH
SYNC Hold Time after the 16th falling
edge of SCLK 03ns (min)
1 / fSCLK - 3 ns (max)
tSYNC SYNC High Time 5 15 ns (min)
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DAC108S085
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 30 mA maximum package
input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to three.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values
for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond
the operating ratings, or the power supply polarity is reversed). Such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k resistor. Machine model is 220 pF discharged through 0 . Charge device model
simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged.
Note 6: Reflow temperature profiles are different for lead-free packages.
Note 7: The inputs are protected as shown below. Input voltage magnitudes up to 5.5V, regardless of VA, will not cause errors in the conversion result. For
example, if VA is 3V, the digital input pins can be driven with a 5V logic device.
30031204
Note 8: Test limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 9: This parameter is guaranteed by design and/or characterization and is not tested in production.
Note 10: This parameter does not represent a condition which the DAC can sustain continuously. See the continuous output current specification for the maximum
DAC output current per channel.
Timing Diagrams
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FIGURE 1. Serial Timing Diagram
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DAC108S085
Specification Definitions
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB,
which is VREF / 1024 = VA / 1024.
DAC-to-DAC CROSSTALK is the glitch impulse transferred
to a DAC output in response to a full-scale change in the out-
put of another DAC.
DIGITAL CROSSTALK is the glitch impulse transferred to a
DAC output at mid-scale in response to a full-scale change in
the input register of another DAC.
DIGITAL FEEDTHROUGH is a measure of the energy inject-
ed into the analog output of the DAC from the digital inputs
when the DAC outputs are not updated. It is measured with a
full-scale code change on the data bus.
FULL-SCALE ERROR is the difference between the actual
output voltage with a full scale code (3FFh) loaded into the
DAC and the value of VA x 1023 / 1024.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated from Zero and Full-
Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE
is Full-Scale Error and ZE is Zero Error.
GLITCH IMPULSE is the energy injected into the analog out-
put when the input code to the DAC register changes. It is
specified as the area of the glitch in nanovolt-seconds.
INTEGRAL NON-LINEARITY (INL) is a measure of the de-
viation of each individual code from a straight line through the
input to output transfer function. The deviation of any given
code from this straight line is measured from the center of that
code value. The end point method is used. INL for this product
is specified over a limited range, per the Electrical Tables.
LEAST SIGNIFICANT BIT (LSB) is the bit that has the small-
est value or weight of all bits in a word. This value is
LSB = VREF / 2n
where VREF is the supply voltage for this product, and "n" is
the DAC resolution in bits, which is 10 for the DAC108S085.
MAXIMUM LOAD CAPACITANCE is the maximum capaci-
tance that can be driven by the DAC with output stability
maintained.
MONOTONICITY is the condition of being monotonic, where
the DAC has an output that never decreases when the input
code increases.
MOST SIGNIFICANT BIT (MSB) is the bit that has the largest
value or weight of all bits in a word. Its value is 1/2 of VA.
MULTIPLYING BANDWIDTH is the frequency at which the
output amplitude falls 3dB below the input sine wave on
VREF1,2 with the DAC code at full-scale.
NOISE SPECTRAL DENSITY is the internally generated ran-
dom noise. It is measured by loading the DAC to mid-scale
and measuring the noise at the output.
POWER EFFICIENCY is the ratio of the output current to the
total supply current. The output current comes from the power
supply. The difference between the supply and output cur-
rents is the power consumed by the device without a load.
SETTLING TIME is the time for the output to settle to within
1/2 LSB of the final value after the input code is updated.
TOTAL HARMONIC DISTORTION PLUS NOISE (THD+N)
is the ratio of the harmonics plus the noise present at the out-
put of the DACs to the rms level of an ideal sine wave applied
to VREF1,2 with the DAC code at mid-scale.
WAKE-UP TIME is the time for the output to exit power-down
mode. This is the time from the rising edge of SYNC to when
the output voltage deviates from the power-down voltage of
0V.
ZERO CODE ERROR is the output error, or voltage, present
at the DAC output after a code of 000h has been entered.
Transfer Characteristic
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FIGURE 2. Input / Output Transfer Characteristic
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DAC108S085
Typical Performance Characteristics VA = +2.7V to +5.5V, VREF1,2 = VA, fSCLK = 30 MHz, TA = 25°C,
unless otherwise stated
INL vs Code
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DNL vs Code
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INL/DNL vs VREF
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INL/DNL vs fSCLK
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INL/DNL vs VA
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INL/DNL vs Temperature
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DAC108S085
Zero Code Error vs. VA
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Zero Code Error vs. VREF
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Zero Code Error vs. fSCLK
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Zero Code Error vs. Temperature
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Full-Scale Error vs. VA
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Full-Scale Error vs. VREF
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DAC108S085
Full-Scale Error vs. fSCLK
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Full-Scale Error vs. Temperature
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IVA vs. VA
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IVA vs. Temperature
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IVREF vs. VREF
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IVREF vs. Temperature
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DAC108S085
Settling Time
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Glitch Response
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Wake-Up Time
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DAC-to-DAC Crosstalk
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Power-On Reset
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Multiplying Bandwidth
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DAC108S085
1.0 Functional Description
1.1 DAC ARCHITECTURE
The DAC108S085 is fabricated on a CMOS process with an
architecture that consists of switches and resistor strings that
are followed by an output buffer. The reference voltages are
externally applied at VREF1 for DAC channels A through D and
VREF2 for DAC channels E through H.
For simplicity, a single resistor string is shown in Figure 3.
This string consists of 1024 equal valued resistors with a
switch at each junction of two resistors, plus a switch to
ground. The code loaded into the DAC register determines
which switch is closed, connecting the proper node to the
amplifier. The input coding is straight binary with an ideal out-
put voltage of:
VOUTA,B,C,D = VREF1 x (D / 1024)
VOUTE,F,G,H = VREF2 x (D / 1024)
where D is the decimal equivalent of the binary code that is
loaded into the DAC register. D can take on any value be-
tween 0 and 1023. This configuration guarantees that the
DAC is monotonic.
30031207
FIGURE 3. DAC Resistor String
Since all eight DAC channels of the DAC108S085 can be
controlled independently, each channel consists of a DAC
register and a 10-bit DAC. Figure 4 is a simple block diagram
of an individual channel in the DAC108S085. Depending on
the mode of operation, data written into a DAC register causes
the 10-bit DAC output to be updated or an additional com-
mand is required to update the DAC output. Further descrip-
tion of the modes of operation can be found in the Serial
Interface description.
30031269
FIGURE 4. Single Channel Block Diagram
1.2 OUTPUT AMPLIFIERS
The output amplifiers are rail-to-rail, providing an output volt-
age range of 0V to VA when the reference is VA. All amplifiers,
even rail-to-rail types, exhibit a loss of linearity as the output
approaches the supply rails (0V and VA, in this case). For this
reason, linearity is specified over less than the full output
range of the DAC. However, if the reference is less than VA,
there is only a loss in linearity in the lowest codes.
The output amplifiers are capable of driving a load of 2 k in
parallel with 1500 pF to ground or to VA. The zero-code and
full-scale outputs for given load currents are available in the
Electrical Characteristics Table.
1.3 REFERENCE VOLTAGE
The DAC108S085 uses dual external references, VREF1 and
VREF2, that are shared by channels A, B, C, D and channels
E, F, G, H respectively. The reference pins are not buffered
and have an input impedance of 30 k. It is recommended
that VREF1 and VREF2 be driven by voltage sources with low
output impedance. The reference voltage range is 0.5V to
VA, providing the widest possible output dynamic range.
1.4 SERIAL INTERFACE
The three-wire interface is compatible with SPI, QSPI and
MICROWIRE, as well as most DSPs and operates at clock
rates up to 40 MHz. A valid serial frame contains 16 falling
edges of SCLK. See the Timing Diagram for information on a
write sequence.
A write sequence begins by bringing the SYNC line low. Once
SYNC is low, the data on the DIN line is clocked into the 16-
bit serial input register on the falling edges of SCLK. To avoid
mis-clocking data into the shift register, it is critical that
SYNC not be brought low on a falling edge of SCLK (see
minimum and maximum setup times for SYNC in the Timing
Characteristics and Figure 5). On the 16th falling edge of
SCLK, the last data bit is clocked into the register. The write
sequence is concluded by bringing the SYNC line high. Once
SYNC is high, the programmed function (a change in the DAC
channel address, mode of operation and/or register contents)
is executed. To avoid mis-clocking data into the shift register,
it is critical that SYNC be brought high between the 16th and
17th falling edges of SCLK (see minimum and maximum hold
times for SYNC in the Timing Characteristics and Figure 5).
30031265
FIGURE 5. CS Setup and Hold Times
If SYNC is brought high before the 15th falling edge of SCLK,
the write sequence is aborted and the data that has been
shifted into the input register is discarded. If SYNC is held low
beyond the 17th falling edge of SCLK, the serial data pre-
sented at DIN will begin to be output on DOUT. More informa-
tion on this mode of operation can be found in the Daisy Chain
Section. In either case, SYNC must be brought high for the
minimum specified time before the next write sequence is ini-
tiated with a falling edge of SYNC.
Since the DIN buffer draws more current when it is high, it
should be idled low between write sequences to minimize
power consumption. On the other hand, SYNC should be
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DAC108S085
idled high to avoid the activation of daisy chain operation
where DOUT is active.
1.5 DAISY CHAIN OPERATION
Daisy chain operation allows communication with any number
of DAC108S085s using a single serial interface. As long as
the correct number of data bits are input in a write sequence
(multiple of sixteen bits), a rising edge of SYNC will properly
update all DACs in the system.
To support multiple devices in a daisy chain configuration,
SCLK and SYNC are shared across all DAC108S085s and
DOUT of the first DAC in the chain is connected to DIN of the
second. Figure 6 shows three DAC108S085s connected in
daisy chain fashion. Similar to a single channel write se-
quence, the conversion for a daisy chain operation begins on
a falling edge of SYNC and ends on a rising edge of SYNC.
A valid write sequence for n devices in a chain requires n
times 16 falling edges to shift the entire input data stream
through the chain. Daisy chain operation is guaranteed for a
maximum SCLK speed of 30MHz.
30031267
FIGURE 6. Daisy Chain Configuration
The serial data output pin, DOUT, is available on the
DAC108S085 to allow daisy-chaining of multiple
DAC108S085 devices in a system. In a write sequence,
DOUT remains low for the first fourteen falling edges of SCLK
before going high on the fifteenth falling edge. Subsequently,
the next sixteen falling edges of SCLK will output the first six-
teen data bits entered into DIN. Figure 7 shows the timing of
three DAC108S085s in Figure 6. In this instance, It takes
forty-eight falling edges of SCLK followed by a rising edge of
SYNC to load all three DAC108S085s with the appropriate
register data. On the rising edge of SYNC, the programmed
function is executed in each DAC108S085 simultaneously.
30031268
FIGURE 7. Daisy Chain Timing Diagram
1.6 SERIAL INPUT REGISTER
The DAC108S085 has two modes of operation plus a few
special command operations. The two modes of operation are
Write Register Mode (WRM) and Write Through Mode
(WTM). For the rest of this document, these modes will be
referred to as WRM and WTM. The special command oper-
ations are separate from WRM and WTM because they can
be called upon regardless of the current mode of operation.
The mode of operation is controlled by the first four bits of the
control register, DB15 through DB12. See Table 1 for a de-
tailed summary.
TABLE 1. Write Register and Write Through Modes
DB[15:12] DB[11:0] Description of Mode
1 0 0 0 X X X X X X X X X X X X WRM: The registers of each DAC Channel can be written to
without causing their outputs to change.
1 0 0 1 X X X X X X X X X X X X WTM: Writing data to a channel's register causes the DAC
output to change.
www.national.com 14
DAC108S085
When the DAC108S085 first powers up, the DAC is in WRM.
In WRM, the registers of each individual DAC channel can be
written to without causing the DAC outputs to be updated.
This is accomplished by setting DB15 to "0", specifying the
DAC register to be written to in DB[14:12], and entering the
new DAC register setting in DB[11:0] (see Table 2).The
DAC108S085 remains in WRM until the mode of operation is
changed to WTM. The mode of operation is changed from
WRM to WTM by setting DB[15:12] to "1001". Once in WTM,
writing data to a DAC channel's register causes the DAC's
output to be updated as well. Changing a DAC channel's reg-
ister in WTM is accomplished in the same manner as it is done
in WRM. However, in WTM the DAC's register and output are
updated at the completion of the command (see Table 2).
Similarly, the DAC108S085 remains in WTM until the mode
of operation is changed to WRM by setting DB[15:12] to
"1000".
TABLE 2. Commands Impacted by WRM and WTM
DB15 DB[14:12] DB[11:0] Description of Mode
0 0 0 0 D11 D10 ... D2 X X WRM: D[11:0] written to ChA's data register only
WTM: ChA's output is updated by data in D[11:0]
0 0 0 1 D11 D10 ... D2 X X WRM: D[11:0] written to ChB's data register only
WTM: ChB's output is updated by data in D[11:0]
0 0 1 0 D11 D10 ... D2 X X WRM: D[11:0] written to ChC's data register only
WTM: ChC's output is updated by data in D[11:0]
0 0 1 1 D11 D10 ... D2 X X WRM: D[11:0] written to ChD's data register only
WTM: ChD's output is updated by data in D[11:0]
0 1 0 0 D11 D10 ... D2 X X WRM: D[11:0] written to ChE's data register only
WTM: ChE's output is updated by data in D[11:0]
0 1 0 1 D11 D10 ... D2 X X WRM: D[11:0] written to ChF's data register only
WTM: ChF's output is updated by data in D[11:0]
0 1 1 0 D11 D10 ... D2 X X WRM: D[11:0] written to ChG's data register only
WTM: ChG's output is updated by data in D[11:0]
0 1 1 1 D11 D10 ... D2 X X WRM: D[11:0] written to ChH's data register only
WTM: ChH's output is updated by data in D[11:0]
As mentioned previously, the special command operations
can be exercised at any time regardless of the mode of op-
eration. There are three special command operations. The
first command is exercised by setting data bits DB[15:12] to
"1010". This allows a user to update multiple DAC outputs
simultaneously to the values currently loaded in their respec-
tive control registers. This command is valuable if the user
wants each DAC output to be at a different output voltage but
still have all the DAC outputs change to their appropriate val-
ues simultaneously (see Table 3).
The second special command allows the user to alter the DAC
output of channel A with a single write frame. This command
is exercised by setting data bits DB[15:12] to "1011" and data
bits DB[11:0] to the desired control register value. It also has
the added benefit of causing the DAC outputs of the other
channels to update to their current control register values as
well. A user may choose to exercise this command to save a
write sequence. For example, the user may wish to update
several DAC outputs simultaneously, including channel A. In
order to accomplish this task in the minimum number of write
frames, the user would alter the control register values of all
the DAC channels except channel A while operating in WRM.
The last write frame would be used to exercise the special
command "Channel A Write Mode". In addition to updating
channel A's control register and output to a new value, all of
the other channels would be updated as well. At the end of
this sequence of write frames, the DAC108S085 would still
be operating in WRM (see Table 3).
The third special command allows the user to set all the DAC
control registers and outputs to the same level. This com-
mand is commonly referred to as "broadcast" mode since the
same data bits are being broadcast to all of the channels si-
multaneously. This command is exercised by setting data bits
DB[15:12] to "1100" and data bits DB[11:0] to the value that
the user wishes to broadcast to all the DAC control registers.
Once the command is exercised, each DAC output is updated
by the new control register value. This command is frequently
used to set all the DAC outputs to some known voltage such
as 0V, VREF/2, or Full Scale. A summary of the commands
can be found in Table 3.
TABLE 3. Special Command Operations
DB[15:12] DB[11:0] Description of Mode
1 0 1 0 X X X X H G F E D C B A Update Select: The DAC outputs of the channels selected with
a "1" in DB[7:0] are updated simultaneously to the values in
their respective control registers.
1 0 1 1 D11 D10 ... D3 D2 X X Channel A Write: Channel A's control register and DAC output
are updated to the data in DB[11:0]. The outputs of the other
seven channels are also updated according to their respective
control register values.
1 1 0 0 D11 D10 ... D3 D2 X X Broadcast: The data in DB[11:0] is written to all channels'
control register and DAC output simultaneously.
15 www.national.com
DAC108S085
1.7 POWER-ON RESET
The power-on reset circuit controls the output voltages of the
eight DACs during power-up. Upon application of power, the
DAC registers are filled with zeros and the output voltages are
set to 0V. The outputs remain at 0V until a valid write se-
quence is made.
1.8 POWER-DOWN MODES
The DAC108S085 has three power-down modes where dif-
ferent output terminations can be selected (see Table 4). With
all channels powered down, the supply current drops to 0.1
µA at 3V and 0.2 µA at 5V. By selecting the channels to be
powered down in DB[7:0] with a "1", individual channels can
be powered down separately or multiple channels can be
powered down simultaneously. The three different output ter-
minations include high output impedance, 100k ohm to
ground, and 2.5k ohm to ground.
The output amplifiers, resistor strings, and other linear cir-
cuitry are all shut down in any of the power-down modes. The
bias generator, however, is only shut down if all the channels
are placed in power-down mode. The contents of the DAC
registers are unaffected when in power-down. Therefore,
each DAC register maintains its value prior to the
DAC108S085 being powered down unless it is changed dur-
ing the write sequence which instructed it to recover from
power down. Minimum power consumption is achieved in the
power-down mode with SYNC idled high, DIN idled low, and
SCLK disabled. The time to exit power-down (Wake-Up Time)
is typically 3 µsec at 3V and 20 µsec at 5V.
TABLE 4. Power-Down Modes
DB[15:12] DB[11:8] 7 6 54 3 2 1 0 Output Impedance
1 1 0 1 X X X X H G F E D C B A High-Z outputs
1 1 1 0 X X X X H G F E D C B A 100 k outputs
1 1 1 1 X X X X H G F E D C B A 2.5 k outputs
2.0 Applications Information
2.1 EXAMPLES PROGRAMMING THE DAC108S085
This section will present the step-by-step instructions for pro-
gramming the serial input register.
2.1.1 Updating DAC Outputs Simultaneously
When the DAC108S085 is first powered on, the DAC is op-
erating in Write Register Mode (WRM). Operating in WRM
allows the user to program the registers of multiple DAC
channels without causing the DAC outputs to be updated. As
an example, here are the steps for setting Channel A to a full
scale output, Channel B to three-quarters full scale, Channel
C to half-scale, Channel D to one-quarter full scale and having
all the DAC outputs update simultaneously.
As stated previously, the DAC108S085 powers up in WRM.
If the device was previously operating in Write Through Mode
(WTM), an extra step to set the DAC into WRM would be re-
quired. First, the DAC registers need to be programmed to the
desired values. To set Channel A to an output of full scale,
write "0FFC" to the control register. This will update the data
register for Channel A without updating the output of Channel
A. Second, set Channel B to an output of three-quarters full
scale by writing "1C00" to the control register. This will update
the data register for Channel B. Once again, the output of
Channel B and Channel A will not be updated since the DAC
is operating in WRM. Third, set Channel C to half scale by
writing "2800" to the control register. Fourth, set Channel D
to one-quarter full scale by writing "3400" to the control reg-
ister. Finally, update all four DAC channels simultaneously by
writing "A00F" to the control register. This procedure allows
the user to update four channels simultaneously with five
steps.
Since Channel A was one of the DACs to be updated, one
command step could have been saved by writing to Channel
A last. This is accomplished by writing to Channel B, C, and
D first and using the the special command "Channel A Write"
to update Channel A's DAC register and output. This special
command has the added benefit of updating all DAC outputs
while updating Channel A. With this sequence of commands,
the user was able to update four channels simultaneously with
four steps. A summary of this command can be found in Table
3.
2.1.2 Updating DAC Outputs Independently
If the DAC108S085 is currently operating in WRM, change
the mode of operation to WTM by writing "9XXX" to the control
register. Once the DAC is operating in WTM, any DAC chan-
nel can be updated in one step. For example, if a design
required Channel G to be set to half scale, the user can write
"6800" to the control register and Channel G's data register
and DAC output will be updated. Similarly, if Channel F's out-
put needed to be set to full scale, "5FFC" would need to be
written to the control register. Channel A is the only channel
that has a special command that allows its DAC output to be
updated in one command regardless of the mode of opera-
tion. Setting Channel A's DAC output to full scale could be
accomplished in one step by writing "BFFF" to the control
register.
2.2 USING REFERENCES AS POWER SUPPLIES
While the simplicity of the DAC108S085 implies ease of use,
it is important to recognize that the path from the reference
input (VREF1,2) to the DAC outputs will have zero Power Sup-
ply Rejection Ratio (PSRR). Therefore, it is necessary to
provide a noise-free supply voltage to VREF1,2. In order to uti-
lize the full dynamic range of the DAC108S085, the supply
pin (VA) and VREF1,2 can be connected together and share the
same supply voltage. Since the DAC108S085 consumes very
little power, a reference source may be used as the reference
input and/or the supply voltage. The advantages of using a
reference source over a voltage regulator are accuracy and
stability. Some low noise regulators can also be used. Listed
below are a few reference and power supply options for the
DAC108S085.
www.national.com 16
DAC108S085
2.2.1 LM4132
The LM4132, with its ±0.05% accuracy over temperature, is
a good choice as a reference source for the DAC108S085.
The 4.096V version is useful if a 0V to 4.095V output range
is desirable. Bypassing the LM4132 voltage input pin with a
4.7µF capacitor and the voltage output pin with a 4.7µF ca-
pacitor will improve stability and reduce output noise. The
LM4132 comes in a space-saving 5-pin SOT23.
30031213
FIGURE 8. The LM4132 as a power supply
2.2.2 LM4050
Available with accuracy of ±0.1%, the LM4050 shunt refer-
ence is also a good choice as a reference for the
DAC108S085. It is available in 4.096V and 5V versions and
comes in a space-saving 3-pin SOT23.
30031214
FIGURE 9. The LM4050 as a power supply
The minimum resistor value in the circuit of must be chosen
such that the maximum current through the LM4050 does not
exceed its 15 mA rating. The conditions for maximum current
include the input voltage at its maximum, the LM4050 voltage
at its minimum, and the DAC108S085 drawing zero current.
The maximum resistor value must allow the LM4050 to draw
more than its minimum current for regulation plus the maxi-
mum DAC108S085 current in full operation. The conditions
for minimum current include the input voltage at its minimum,
the LM4050 voltage at its maximum, the resistor value at its
maximum due to tolerance, and the DAC108S085 draws its
maximum current. These conditions can be summarized as
R(min) = ( VIN(max) − VZ(min) ) /IZ(max)
and
R(max) = ( VIN(min) − VZ(max) ) / ( (IDAC(max) + IZ(min) )
where VZ(min) and VZ(max) are the nominal LM4050 output
voltages ± the LM4050 output tolerance over temperature, IZ
(max) is the maximum allowable current through the LM4050,
IZ(min) is the minimum current required by the LM4050 for
proper regulation, and IDAC(max) is the maximum
DAC108S085 supply current.
2.2.3 LP3985
The LP3985 is a low noise, ultra low dropout voltage regulator
with a ±3% accuracy over temperature. It is a good choice for
applications that do not require a precision reference for the
DAC108S085. It comes in 3.0V, 3.3V and 5V versions, among
others, and sports a low 30 µV noise specification at low fre-
quencies. Since low frequency noise is relatively difficult to
filter, this specification could be important for some applica-
tions. The LP3985 comes in a space-saving 5-pin SOT23 and
5-bump micro SMD packages.
30031215
FIGURE 10. Using the LP3985 regulator
An input capacitance of 1.0µF without any ESR requirement
is required at the LP3985 input, while a 1.0µF ceramic ca-
pacitor with an ESR requirement of 5m to 500m is required
at the output. Careful interpretation and understanding of the
capacitor specification is required to ensure correct device
operation.
2.2.4 LP2980
The LP2980 is an ultra low dropout regulator with a ±0.5% or
±1.0% accuracy over temperature, depending upon grade. It
is available in 3.0V, 3.3V and 5V versions, among others.
30031216
FIGURE 11. Using the LP2980 regulator
Like any low dropout regulator, the LP2980 requires an output
capacitor for loop stability. This output capacitor must be at
least 1.0µF over temperature, but values of 2.2µF or more will
provide even better performance. The ESR of this capacitor
should be within the range specified in the LP2980 data sheet.
Surface-mount solid tantalum capacitors offer a good combi-
17 www.national.com
DAC108S085
nation of small size and low ESR. Ceramic capacitors are
attractive due to their small size but generally have ESR val-
ues that are too low for use with the LP2980. Aluminum
electrolytic capacitors are typically not a good choice due to
their large size and high ESR values at low temperatures.
2.3 BIPOLAR OPERATION
The DAC108S085 is designed for single supply operation and
thus has a unipolar output. However, a bipolar output may be
achieved with the circuit in . This circuit will provide an output
voltage range of ±5 Volts. A rail-to-rail amplifier should be
used if the amplifier supplies are limited to ±5V.
30031217
FIGURE 12. Bipolar Operation
The output voltage of this circuit for any code is found to be
VO = (VA x (D / 1024) x ((R1 + R2) / R1) - VA x R2 / R1)
where D is the input code in decimal form. With VA = 5V and
R1 = R2,
VO = (10 x D / 1024) - 5V
A list of rail-to-rail amplifiers suitable for this application are
indicated in .
TABLE 5. Some Rail-to-Rail Amplifiers
AMP PKGS Typ VOS Typ ISUPPLY
LMP7701 SOT23-5 ±37 µV 0.79 mA
LMV841 SOT23-5 −17 µV 1.11 mA
LMC7111 SOT23-5 900 µV 25 µA
LM7301 SOT23-5 30 µV 620 µA
LM8261 SOT23-5 700 µV 1 mA
2.4 VARIABLE CURRENT SOURCE OUTPUT
The DAC108S085 is a voltage output DAC but can be easily
converted to a current output with the addition of an opamp.
In , one of the channels of the DAC108S085 is converted to
a variable current source capable of sourcing up to 40mA.
30031258
FIGURE 13. Variable Current Source
The output current of this circuit (IO) for any DAC code is found
to be
IO = (VREF x (D / 1024) x (R2) / (R1 x RB)
where D is the input code in decimal form and R2 = RA + RB.
2.5 APPLICATION CIRCUITS
The following figures are examples of the DAC108S085 in
typical application circuits. These circuits are basic and will
generally require modification for specific circumstances.
2.5.1 Industrial Application
shows the DAC108S085 controlling several different circuits
in an industrial setting. Channel A is shown providing the ref-
erence voltage to the ADC101S625, one of National
Semiconductor's general purpose Analog-to-Digital Convert-
ers (ADCs). The reference for the ADC121S625 may be set
to any voltage from 0.2V to 5.5V, providing the widest dy-
namic range possible. Typically, the ADC121S625 will be
monitoring a sensor and would benefit from the ADC's refer-
ence voltage being adjustable. Channel B is providing the
drive or supply voltage for a sensor. By having the sensor
supply voltage adjustable, the output of the sensor can be
optimized to the input level of the ADC monitoring it. Channel
C is defined to adjust the offset or gain of an amplifier stage
in the system. Channel D is configured with an opamp to pro-
vide an adjustable current source. Being able to convert one
of the eight channels of the DAC108S085 to a current output
eliminates the need for a separate current output DAC to be
added to the circuit. Channel E, in conjunction with an opamp,
provides a bipolar output swing for devices requiring control
voltages that are centered around ground. Channel F and G
are used to set the upper and lower limits for a range detector.
Channel H is reserved for providing voltage control or acting
as a voltage setpoint.
www.national.com 18
DAC108S085
30031253
FIGURE 14. Industrial Application
2.5.2 ADC Reference
shows Channel A of the DAC108S085 providing the drive or
supply voltage for a bridge sensor. By having the sensor sup-
ply voltage adjustable, the output of the sensor can be opti-
mized to the input level of the ADC monitoring it. The output
of the sensor is amplified by a fixed gain amplifier stage with
a differential gain of 1 + 2 × (RF / RI). The advantage of this
amplifier configuration is the high input impedance seen by
the output of the bridge sensor. The disadvantage is the poor
common-mode rejection ratio (CMRR). The common-mode
voltage (VCM) of the bridge sensor is half of Channel A's DAC
output. The VCM is amplified by a gain of 1V/V by the amplifier
stage and thus becomes the bias voltage for the input of the
ADC121S705. Channel B of the DAC108S085 is providing
the reference voltage to the ADC121S705. The reference for
the ADC121S705 may be set to any voltage from 1V to 5V,
providing the widest dynamic range possible.
The reference voltage for Channel A and B is powered by an
external 5V power supply. Since the 5V supply is common to
the sensor supply voltage and the reference voltage of the
ADC, fluctuations in the value of the 5V supply will have a
minimal effect on the digital output code of the ADC. This type
of configuration is often referred to as a "Ratio-metric" design.
For example, an increase of 5% to the 5V supply will cause
the sensor supply voltage to increase by 5%. This causes the
gain or sensitivity of the sensor to increase by 5%. The gain
of the amplifier stage is unaffected by the change in supply
voltage. The ADC121S705 on the other hand, also experi-
ences a 5% increase to its reference voltage. This causes the
size of the ADC's least significant bit (LSB) to increase by 5%.
As a result of the sensor's gain increasing by 5% and the LSB
size of the ADC increasing by the same 5%, there is no net
effect on the circuit's performance. It is assumed that the am-
plifier gain is set low enough to allow for a 5% increase in the
sensor output. Otherwise, the increase in the sensor output
level may cause the output of the amplifiers to clip.
30031256
FIGURE 15. Driving an ADC Reference
19 www.national.com
DAC108S085
2.5.3 Programmable Attenuator
shows one of the channels of the DAC108S085 being used
as a single-quadrant multiplier. In this configuration, an AC or
DC signal can be driven into one of the reference pins. The
SPI interface of the DAC can be used to digitally attenuate the
signal to any level from 0dB (full scale) to 0V. This is accom-
plished without adding any noticeable level of noise to the
signal. An amplifier stage is shown in as a reference for ap-
plications where the input signal requires amplification. Note
how the AC signal in this application is ac-coupled to the am-
plifier before being amplified. A separate bias voltage is used
to set the common-mode voltage for the DAC108S085's ref-
erence input to VA / 2, allowing the largest possible input
swing. The multiplying bandwidth of VREF1,2 is 360kHz with a
VCM of 2.5V and a peak-to-peak signal swing of 2V.
30031254
FIGURE 16. Programmable Attenuator
2.6 DSP/MICROPROCESSOR INTERFACING
Interfacing the DAC108S085 to microprocessors and DSPs
is quite simple. The following guidelines are offered to hasten
the design process.
2.6.1 ADSP-2101/ADSP2103 Interfacing
Figure 17 shows a serial interface between the DAC108S085
and the ADSP-2101/ADSP2103. The DSP should be set to
operate in the SPORT Transmit Alternate Framing Mode. It is
programmed through the SPORT control register and should
be configured for Internal Clock Operation, Active Low Fram-
ing and 16-bit Word Length. Transmission is started by writing
a word to the Tx register after the SPORT mode has been
enabled.
30031209
FIGURE 17. ADSP-2101/2103 Interface
2.6.2 80C51/80L51 Interface
A serial interface between the DAC108S085 and the
80C51/80L51 microcontroller is shown in . The SYNC signal
comes from a bit-programmable pin on the microcontroller.
The example shown here uses port line P3.3. This line is tak-
en low when data is transmitted to the DAC108S085. Since
the 80C51/80L51 transmits 8-bit bytes, only eight falling clock
edges occur in the transmit cycle. To load data into the DAC,
the P3.3 line must be left low after the first eight bits are trans-
mitted. A second write cycle is initiated to transmit the second
byte of data, after which port line P3.3 is brought high. The
80C51/80L51 transmit routine must recognize that the
80C51/80L51 transmits data with the LSB first while the
DAC108S085 requires data with the MSB first.
30031210
FIGURE 18. 80C51/80L51 Interface
2.6.3 68HC11 Interface
A serial interface between the DAC108S085 and the 68HC11
microcontroller is shown in . The SYNC line of the
DAC108S085 is driven from a port line (PC7 in the figure),
similar to the 80C51/80L51.
The 68HC11 should be configured with its CPOL bit as a zero
and its CPHA bit as a one. This configuration causes data on
the MOSI output to be valid on the falling edge of SCLK. PC7
is taken low to transmit data to the DAC. The 68HC11 trans-
mits data in 8-bit bytes with eight falling clock edges. Data is
transmitted with the MSB first. PC7 must remain low after the
first eight bits are transferred. A second write cycle is initiated
to transmit the second byte of data to the DAC, after which
PC7 should be raised to end the write sequence.
30031211
FIGURE 19. 68HC11 Interface
2.6.4 Microwire Interface
shows an interface between a Microwire compatible device
and the DAC108S085. Data is clocked out on the rising edges
of the SK signal. As a result, the SK of the Microwire device
needs to be inverted before driving the SCLK of the
DAC108S085.
30031212
FIGURE 20. Microwire Interface
www.national.com 20
DAC108S085
2.7 LAYOUT, GROUNDING, AND BYPASSING
For best accuracy and minimum noise, the printed circuit
board containing the DAC108S085 should have separate
analog and digital areas. The areas are defined by the loca-
tions of the analog and digital power planes. Both of these
planes should be located in the same board layer. A single
ground plane is preferred if digital return current does not flow
through the analog ground area. Frequently a single ground
plane design will utilize a "fencing" technique to prevent the
mixing of analog and digital ground current. Separate ground
planes should only be utilized when the fencing technique is
inadequate. The separate ground planes must be connected
in one place, preferably near the DAC108S085. Special care
is required to guarantee that digital signals with fast edge
rates do not pass over split ground planes. They must always
have a continuous return path below their traces.
For best performance, the DAC108S085 power supply should
be bypassed with at least a 1µF and a 0.1µF capacitor. The
0.1µF capacitor needs to be placed right at the device supply
pin. The 1µF or larger valued capacitor can be a tantalum
capacitor while the 0.1µF capacitor needs to be a ceramic
capacitor with low ESL and low ESR. If a ceramic capacitor
with low ESL and low ESR is used for the 1µF value and it
can be placed right at the supply pin, the 0.1µF capacitor can
be eliminated. Capacitors of this nature typically span the
same frequency spectrum as the 0.1µF capacitor and thus
eliminate the need for the extra capacitor. The power supply
for the DAC108S085 should only be used for analog circuits.
It is also advisable to avoid the crossover of analog and digital
signals. This helps minimize the amount of noise from the
transitions of the digital signals from coupling onto the sensi-
tive analog signals such as the reference pins and the DAC
outputs.
21 www.national.com
DAC108S085
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead LLP
Order Numbers DAC108S085CISQ
NS Package Number SQA16A
16-Lead TSSOP
Order Numbers DAC108S085CIMT
NS Package Number MTC16
www.national.com 22
DAC108S085
Notes
23 www.national.com
DAC108S085
Notes
DAC108S085 10-Bit Micro Power OCTAL Digital-to-Analog Converter with Rail-to-Rail Outputs
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