Pie aes PLUS Power Module For part number see page HD /8 Polarizing Module = - For part number see page HD /7 Winchester Electronics Daughtercard Modules Socket modules are pre-assembled into precisely located holes in an extruded aluminum stiffener. End-stackability offers the same flexibility to the daughtercard assembly as the backpanel modules. Both are available in 3 and 4 row versions, with each offering 15 or 20 positions per row to mate with the corresponding pin modules. The HD+ 1 and HD+2 contacts of the socket module are located on the bottom and top surfaces of the insulator. These wide conductors mate with Plus row cantilever contacts posi- tioned in the backpanel modules. An extended socket module wipe option is available refer to sequence of mating chart on page 15. Guide Modules As connectors become longer, the mechanics of alignment, insertion forces, and length become more important. To insure proper alignment, the HIGH DENSITY PLUS system offers a daughtercard module anda mating backpanel guide pin. Polarization Modules HIGH DENSITY PLUS * offers polarization modules for unique identity. Stainless steel polarizing keys and bushings used in the modules conform to MiL-C-55302. The configurations are octagonal to provide up to sixty-four polarization options when two modules are used per daughtercard. When polarization modules are used, a guide pin must also be used. Power and Ground Modules The HIGH DENSITY PLUS connector system provides daughtercard modules that interconnect to discrete backpanel power modules or an external busing system. Power modules contain two contacts, each rated 20 amperes. This power busing system is designed to distribute power and ground across the backpanel and to the individual daughtercards. Socket Module For part number see page HD/5 Guide Pin Module Stiffener provides low cost method to eliminate daughterboard warpage For part number see page HD /8 fl Spaces are permitted as required between modules. Mounting spacers may be required for long spans. Consult factory. For spacer part number see page HD /8 Socket Module For part number see page HD /5 Polarizing Module For part number see page HD /7 Catalog No. HS27500-X Shown The final socket connector assembly will be assigned a dash number by the factory The socket modules and accessories shown on the following pages afford a wide degree of design flexibility. The example shown illustrates how to combine various modules on a stiffener to produce a complete connector assembly. 400 Park Road Watertown, Connecticut 06795-0500 Phone: (860) 945-5000 FAX: (860) 945-5191 Internet: http://www. litton-wed.com D HD /3 L2eF MM 5544238 0002114 514Ue sO ia PLUS of first row datum for 15 Pos. = (19.78) location on stiffener . 20 Pos. = 950 (24.13) 0.10 (2.5) thru clearance for #2-32 stiffener mounting screw part no. 113069 150 (3.81) of contact row _ 1.400 15 Pos./Row = (35.56) Ref. 1.900 i = 20 Pos./Row (48.26) Ref. a 468 4 390 3 Rows (11/64) 3 Rows 691) 200 aRow= (oa) SRow= 783) _ 865 4 aye 4 my (ia) UU Row meee row A D c B * .069 100 1.75. (2.54) TYP. (178) Daughtercard Mounting Surface HDH2 Contact Socket Contact Insulator HD+1 Contact Tail Alignment Guide 45> (11.43) 026 (0.66) Ref. Hpt2 Contact G .306 HD+I {Refer to code (7.77) Contact order chart on 43 page 6) oy (10.9) 100 r > (2.54) | P- Key Attributes of the High Density Plus System Complete system design enhances product performance and reduces time-to-market C-Press* meets 40-year life telecommunica- tions standards Modular backplane and daughterboard connectors offer unlimited design flexibility = Integral daughterboard stiffener = Higher interconnect density. Up to six row of Winchester Electronics contacts on continuous 0.100" grid. Up to 50% greater contact density Industry keying/polarization standard Integral power management for high current, multi-voltage applications C- Press" the most reliable compliant pin in the industry Two options for modular power distribution: External Bus Bars Internal heavy Copper Multilayer Technology Meets performance requirements of MIL-C-28859 and MIL-STD-2166 Contact Sequencing Options 400 Park Road Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 = FAX: (860) 945-5191 = Internet: htto://www.litton-wed.com HD/4 D LeF MM 5544238 0002115 450 mmEGU ae PLUS COE Daughtercard Socket Module Cm Note: The following information is used to help the user select individual modules. However, HD* socket connectors are supplied assembied from individual socket modules. Consult factory for final assembly part number HS | 2 A 4 | 020 | ac | 3 AC J | | Step 1 Step 2 Step 3 Step 4 Step 5 Step 6 Step 7 Step 8 Series Connector Style: Insulator Number of Insulator Selective Plating Contact Type & Selective Piating Code: 0=HDt* without Style: Rows: Positions/Row: HDti & HD+2 Tail Length: Socket Contact High Density HD*1 and =A=End 3=3 row 015=15 positions Contacts: When using connector (Signal): Socket HD*2 Stack- 4-4 row 020 =20 positions 90=WithoutHD*I style code 0 (without See selective contacts able and HD+2 ground contacts) use plating chart 1=HD+t1 Se errext See next page ground contacts contact type code 0, 1 below contacts pag see selective or 2 only ; lating chart 2 = HD*2 with p See contact type both HDt1 below for chart below and HDt2 sockets with contacts AD*1 and HD*2 ground 3= ea . contacts with eee See selective contacts plating chart below omitted See next page Selective Plating Chart Step 6 and Contact Type Chart Step 7 Code Mating Area Solder Tail P.C.B Socket HD*1 & HD+2, G : ; +L nea | code Contact Contact + O38 AC oonpse min. te ean. Thickness Description Description - os GC ed min. Tne oomin. (283, 0 Standard Wipe Standard Wipe ays, Gold Flash over 000100 min , 1 * Extended Wipe Standard Wipe BC .000025 min. Tin-Lead 3 750 Patan Nick 3) 2 Standard Wipe Standard Wipe (3.81) BK 000040 min. | -000100 min. ioe |* ; Palladium Nickel Tin - Lead 062 3 Standard Wipe Extended Wipe 125 Note: Contact underplate is .000050 minimum Nickel (1.57) 4 | * Extended Wipe | * Extended Wipe (3.18) (238) 5 Standard Wipe | * Extended Wipe (3.81) Winchester Electronics 400 Park Road Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 FAX: (860) 945-5191 Internet: http:/Avww.litton-wed.com D * The Extended Wipe option produces a .025 (0.64 ref.) increase in wipe over the standard socket assembly. LeF MM 5544238 0002116 357 HD/5HIGH DENSITY PLUS LORTIC Daughtercard Socket Modules Socket Connector Style Step 2 (4 Row Socket Modules Shown) Code 1 Code 2 Code 3 D D 0 D c Cc c c B B B B A A A A HDtI HDtI HDt2 HDt2 ) Contact Contact Contact Contact Hpt HD+1 HD+2 HD+3 |! Number Of Rows Step 4 Code 3 DB Cc B B A i A 3 Row Module 4 Row Module Typical Socket Connector Profile Step 5 3 Row 4 Row -97 1.07 + Ref. -_+ aah arate 1p fp Yd] e 55 (14.0) Max A 4 HbDti HDt2 Contact Contact HD**, HD+1 HD+2 HpD**, HD+1 HDt2 Typical Final Socket Connector Assembled To P.C. Board Part Number L M 113069 312 | 081 tg 098 113069-1 | 378 | -094 L Ref. 9.53 |} 2.38 4.22 M (Nominal P.C. Board Thickness) #2-32 type AB self-tapping thread stiffener mounting screw. Cross recessed pan head. Material: Stainless steel One mounting screw is typically supplied for hole position need not be drilled in the P.C. each module or mounting spacer. When using Board, providing the distance between multiple combinations of power, polarizing and mounting holes is not greater than two inches. guide pin modules, each designated mounting Winchester Electronics 400 Park Road = Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 = FAX: (860) 945-5191 Internet: http://www .litton-wed.com HD/6 D 3J2F @@ 5544238 0002117 223HIGH DENSITY PLUS ETC a A Modular High Density Pin and Socket Interconnection System Aluminum Stiffener Locates Modules Multilayer Mounting Backpanel Hole / Boss Contact Tail Stiffener Alignment Guide Insulation Insulator HD+2 yaar aA Contacts HpbDt1 Contacts C-Press Compliant Pin Daughtercard Contact Socket Connector Pin Module Density the HD+ 1 and HD+ 2 contacts, grounding To demonstrate the density achievable with and impedance matching requirements can HIGH DENSITY PLUS, a good comparison be addressed without sacrificing signal can be made using the Double Eurocard Format, Contact density. a standard for VME Bus and Multibus II designs. 192 I/O's are provided using Din 41612 Power and Ground Capability connectors. Todays designs often require the ability to instal! and remove daughtercards while the system is @ operating. To facilitate this, HIGH DENSITY PLUS provides 3 distinct levels of contact sequencing for ground, power and signal. Without addressing power, grounding and impedance matching requirements, conventional 4 row, high density connectors can increase this number up to 344 I/Os. With the addition of Power Module Backpanel Modules Connect To Internal Copper Layers External Bus Bars Connect To Source At Termination Studs Termination Stud Winchester Electronics 400 Park Road Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 = FAX: (860) 945-5191 = Internet: http://www litton-wed.com HD /2 D 1eF MB 5544238 0002113 bodHIGH DENSITY ON A -bf-/S = Complete system design enhances product performance and reduces time-to market = Modular backplane and daughter- board connectors offer unlimited design flexibility Integral daughterboard stiffener Le = Optional HDt1 and HD*2 rows of contacts provide additional grounding and shielding without sacrificing signal contact density = Higher interconnect density. Up to six rows of contacts on continuous 0.100" grid. Up to 50% greater contact density Industry keying / polarization standard = Integral power management for high current, multi-voltage applications = C-Press* the most reliable compliant pin in the industry meets 40 year life telecommunications standards = Two options for the modular power distribution: External Bus Bars Internal Heavy Copper Multilayer Technology = Meets performance requirements of MIL-C-28859 and MIL-STD-2166 = Contact Sequencing Options Pin Modules On Backpanel CEL A Modular High Density Pin and Socket Interconnection System Plus Contacts Socket Connector On Daughtercard Evolution and Revolution Using higher speed and higher power semiconductors, todays electronic systems combine many functions into one totally integrated package. These systems must operate faster, more efficiently and be more cost-effective to produce. Meeting these performance parameters demands that designers must: 1. Minimize reflections due to impedance mismatch. 2. Reduce crosstalk between adjacent signal contacts. 3. Minimize inductance of contacts used for power and ground. 4. Integrate power distribution into the backpanel design. Dont Conform... Create! HIGH DENSITY PLUS a fully integrated interconnection system, is specifically designed to meet existing and anticipated semiconductor technology needs. Winchester Electronics Modularity HD* combines a modular design concept with the density and electro-mechanical perfor- mance vital to VLSI designs. Both pin and socket modules are end stackable providing a virtually continuous .100 x .100, (2.54 x 2.54) contact grid. Pin modules are available with both ends open for continuous stacking, with one end wall and with one end polarized to ensure a unique identity. HD+ incorporates a product family of off-the- shelf back plane and daughtercard connectors including: 3 row modules and 4 row modules, including the HD* 1 and HD*2 contacts illustrated on the next page, address grounding and power requirements, without increasing the size of the connector envelope. CSA Certified File No. @: LR34182 Recognized under the Component Program . AY of Underwriters Laboratories Inc. File No. E31850 @. 400 Park Road = Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 = FAX: (860) 945-5191 = Internet: http:/Avww.litton-wed.com HD/1 D JeF MM 55442398 0002112 74)HIGH DENSITY PLUS CORE Daughtercard Hole Patterns Socket Module 3 and 4 Row 15 and 20 Positions HD+ 15 Position 14 Equal Spaces 100 _ 1.400 (2.54) ~ (35.56) _ 20 Position 19 Equal Spaces _ .700 100 _ 1.900 15 Pos. = (47 78) (2.54) = (48.26) _ .950 | 20 Pos. = (24.13) ., 0404 .003 Finished 100 Dia. (2.54) TYP-_yI (1.02 + 0.08) Hole Dia .O60 Artwork .150 " (1.52) Pad Ref. $ (3.81) - * _ .200 aE 3 Row = 5 og) .300 4 Row = T4090 (7.62) .200 (2.54) TYP (5.08) HD+1 15 Position 14 Equal Spaces 100 _ 1.400 (2.54) (35.56) >| 20 Position 19 Equal Spaces _ .700 -100 _ 1.900 15 Pos.= (47 78) | (2.54) ~ (48.26) _ 9507 20 Pos. = (24.13) 100 T Dia, -040 + .003 Finished (2.54) YP) "(1.02 + 0.08) Hole ~, .060 Artwork Dia. (+ 50) Pad Ret. * _ .300 3 Row = (7 69) -400 4 Row = -100 (10.16) 100 (2.54) TYP. (2.54) HD+2 15 Position 14 Equal Spaces -100 _ 1.400 (2.54) (35.56) > 20 Position 19 Equal Spaces 18 Pos. =, 700 100 _ 1.900 9S: = (47.78) (2.54) ~ (48.26) -950 FT 20 Pos. = (24.13) , .040 4.003 Finished (2.54) TYP Dia. (4 02 + 0.08) Hole iq -O60 Artwork 150 Dia. (4.52) Pad Ref. 300 3 Row (7.62) 500 4 Row = 1970) Accessory 3 and 4 Row Hole Patterns HD*+*, HD+1 > Me 150 5 . 3.81) Min. 100 (2.54) 150 (3.81) Dia. 9,098 com 100 (2.54) TYP- 4 +++ +++ tt (2.49) Dia. 0.040 (1.02) Min. Finished Hole End row of adjacent socket module >| Power Module HD+2 _ 100 (2.54) 250 (6.35) lq .150... (3.81) Min. y 0.098 Dia. 2.49) Dia. 0.040 (1.02) Min. t Finished Hole .300 D t (7.62) oo-/ +4 8 t t [x F End row of adjacent .200 socket module {5.08) 100 (2.54) TYP- ; \ ett + +++ od >| -200 (5.08) Guide Pin Receptacte/Polarizing Module > .200 Mi (6.08) Min. +0 4ym_ -150 HD**, & HD*1 = 3.81) ., 9.098 HDt2 = 6.38) Dia. (3 49) * 3 Row 4 Row End row of adjacent oho kK i : socket module (5.08) * Delete row D for 3 row hole patterns Winchester Electronics _ .200 = (5.08) 300 (7.62) 400 Park Road = Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 = FAX: (860) 945-5191 Internet: http:/Awww.litton-wed.com D 22F MB 55442398 0002120 615 HD/9HIGH DENSITY PLUS* EEE High Density Plus Specifications and Operating Characteristics @ MATERIALS AND FINISHES The following materials and finishes apply to all High Density Plus series daughtercard and backpanel connector modules. Insulators: Thermoplastic polyester, glass filled, color black, UL rated 94 V-O. BACKPANEL CONTACTS Signal Contacts: Material: Copper alloy 4 Finish: See Selective Plating Chart on page HD / 12 HD+1 & HD+2 Contacts: Material: Copper alloy Finish: See Selective Plating Chart on page HD /12 Dual Power Blade Contacts: Material: Copper alloy Finish: See Selective Plating Chart on page HD/15 DAUGHTERCARD CONTACTS Signal Contacts: Materials: Copper alloy | Finish: See Selective Plating Chart on page HD / 15 | HD+1 & HD+2 Contacts: | Material: Copper alloy | Finish: See Selective Plating Chart on page HD/5 , | Power Module Contacts: Material: Finish: Daughtercard Stiffener: Stiffener Mounting Screws: Polarizing Bushings: Polarizing & Guide Pins: Guide Pin Screws: Guide Pins: Copper alloy See Selective Plating Code Chart on page HD/8 Extruded aluminum alloy 6061-T6 per QQ-200/8. Clear anodize finish per MIL-A-8625. CRES Type 302, passivated Sintered metal CRES Type 316 CRES Type 303, passivated CRES Type 303, passivated CRES Type 203, passivated HD+ ACCESSORY TOOLING Repair Tools DESCRIPTION CATALOG NUMBER ! Polarization Key (Socket Connector) | Polarization Key Removal Tool 107-43248 Polarization Key Insertion Tool 107-43247 Polarization Bushing (Pin Header) Polarization Bushing Removal Tool 107-43241 Polarization Busing Insertion Tool 107-43240 Dual Power Blade Module Insertion Tool 3 Row 107-43313 @ | 4 Row 107-43312 | Winchester Electronics : 400 Park Road = Watertown, Connecticut 06795-0500 Phone: (860) 945-5000 FAX: (860) 945-5191 = Internet: http://www litton-wed.com HD /20 D 22F MM 5544238 0002151 L713HIGH DENSITY PLUS EE High Density Plus Specifications and Operating Characteristics Sate by OPERATING CHARACTERISTICS Signal Contact Resistance: C-Press* Contact to Plated Through Hole Resistance: HD+1 Contact Resistance: HD+2 Contact Resistance: Power Blade Contact Resistance: Signal Contact Normal Force: Power Contact Normal Force: HD+i & HD+2 Contact Normal Force: Individual Signal Contact Engagement Force: Individual Signal Contact Separation Force: Contact Life (Durability): C-Press Signal Contact to Backpanel Retention: C-Press Signal Contact torque: Insulation Resistance: Voltage Rating @ Sea Level (@ 60 Hz): Signal Contact Current Rating: HD+t1 & HD+2 Contact Current Rating: Power Contact Current Rating: Temperature Range: 20 milliohms maximum initial 2 milliohms (max) 4 milliohnms maximum 7 millionms maximum 1.5 milliohms maximum 75g minimum 100 g mininum 100 g minimum 2.5 oz max average 0.5 oz minimum 200 cycles, with 30 microinches plating on mating contacts, and 500 cycles, with 50 microinches plating on mating contacts 10 Ib minimum 3.0 in.-oz minimum 5000 megohms minimum 1000 Vrms 1A @ 70C, 3 A Maximum 4A @ 70C, 8 A Maximum 20A @ 70C, 25 A Maximum 55C to +105C HOLE SIZE REQUIREMENTS Printed Circuit Board Dielectric Maierial +.0015 -.0010 .0453 Diameter Hole Standard Diameter P.T.H. 1. Hole drilled to .0453 +.0015, -.001 diameter. -040 Finished Copper Thickness .001-.003 Diameter . Solder Thickness -0001-.0008 2. Plating thickness must be .001 to .003 copper and .0001 to .0008 solder. 3. Final hole dimension must be gauged to .040 +.003 diameter. 4. See Winchester drawing number 27331 HD+* PIN HEADER TOOLING Repair Tools DESCRIPTION CATALOG NUMBER [| DESCRIPTION CATALOG NUMBER Pin Contact Repair Shroud & Insulator Repair Single Contact Pullout Tool 107-43238 Removal Tool 4x 15 107-43234 Single Contact KO Tool Handle 107-42500 Removal Tool 3x 15 107-43235 Single Contact Seating Tool Tip 107-43230 Removal Tool 4 x 20 107-43236 Single Contact KO Too! Tip 107-42031 Removal Tool 3 x 20 107-43237 Ground Contact Repair Seating Tool 4x 15 107-43244 Removal Tool 107-43239 Seating Tool 3 x 15 107-43246 Insertion Arbor Press Tool 107-43232 Seating Tool 4 x 20 107-43243 Seating Tool 3 x 20 107-43245 Winchester Electronics 400 Park Road Watertown, Connecticut 06795-0500 = Phone: (860) 945-5000 = FAX: (860) 945-5191 = Internet: http://www.litton-wed.com HD /21 D 3e2F Me 5544238 0002132 S3T