Part: IRFC9130NB 0escrifl1ion: 1OOV Size 120x1 06 Gen 5 HEXFET DIE ON WAFER Support Docs: Datasheet I Specifica1ions I Parameter I p roduct Family p ackage p ackage Equivalent IHEXFET I DIE ON WAFER I1RFR5410 5 100 I DieProduct ~en illoltage p ie Product Product 10 Value Status Description 00 v Size 3 Gen 5 Hexfet Die Pack Active Package Support Docs tR can offer a range of carrier options to suit individual customer needs. As standard, we offer probed Die on wafer, sawn Die on film and in waffle trav I chip pack. For certain Die products. Tape and Reel, in the form of Pocket Tape is available. Please use our online help utilitv for details. Details on the advantages/disadvantages of the various carrier options can be found in the application note on carrier options above. Part Search: 1 or the links 1