STPS2H100 Power Schottky rectifier Datasheet - production data Features Negligible switching losses A A High junction temperature capability K K SMA STPS2H100A Low leakage current SMAflat STPS2H100AF Good trade-off between leakage current and forward voltage drop Avalanche capability specified A A Description K K SMB STPS2H100U SMBflat STPS2H100UF Table 1. Device summary Symbol Value IF(AV) 2A VRRM 100 V Tj (max) 175 C VF (max) 0.65 V June 2013 This is information on a product in full production. Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adapters and on board DC/DC converters. Available in SMA, low-profile SMA, SMB, lowprofile SMB. DocID6115 Rev 8 1/12 www.st.com Characteristics 1 STPS2H100 Characteristics Table 2. Absolute ratings (limiting values -Tamb = 25 C unless otherwise stated) Symbol VRRM IF(AV) Repetitive peak reverse voltage Average forward current SMA / SMB TL = 130 C = 0.5 SMAflat TL = 145 C = 0.5 SMBflat TL = 150 C = 0.5 Value Unit 100 V 2 A IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1 s Tj = 25 C 2400 W -65 to + 175 C 175 C Value Unit Tstg Tj 1. Parameter Storage temperature range Maximum operating junction temperature (1) 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistance Symbol Rth(j-l) Parameter SMA 30 SMAflat 20 SMB 25 SMBflat 15 Junction to lead C/W Table 4. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VF(2) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C Min. VR = VRRM 0.4 Max. Unit 1 A 1 mA 0.79 IF = 2 A 0.6 0.65 V 0.88 IF = 4 A 1. Pulse test: tp = 5 ms, < 2% 2. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.56 x IF(AV) + 0.045 IF2(RMS) 2/12 Typ. DocID6115 Rev 8 0.69 0.74 STPS2H100 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature ( = 0.5) (SMA / SMB) PF(AV)(W) IF(AV)(A) 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 = 0.2 = 0.1 = 0.05 2.2 = 0.5 Rth(j-a)=Rth(j-I) 2.0 SMB 1.8 SMA 1.6 =1 SMA Rth(j-a)=100C/W S(CU)=1.5cm2 1.4 1.2 SMB Rth(j-a)=80C/W S(CU)=1.5cm2 1.0 0.8 0.6 T T 0.4 IF(AV)(A) 0.0 0.2 0.4 0.6 0.8 1.0 0.2 =tp/T 1.2 1.4 1.6 1.8 =tp/T tp 0.0 2.0 2.2 0 Figure 3. Average forward current versus ambient temperature ( = 0.5) (SMBflat) Tamb(C) tp 25 50 75 100 125 175 Figure 4. Average forward current versus ambient temperature ( = 0.5) (SMAflat) IF(AV)(A) 2.2 2.2 Rth(j-a)=Rth(j-l) 2.0 2.0 1.8 1.8 1.6 1.6 IF(AV)(A) Rth(j-a)=Rth(j-l) SMAflat 1.4 1.4 1.2 SMBflat 1.2 150 1.0 1.0 0.8 0.8 Rth(j-a)=40C/W . SCU=2.5 cm2 0.6 0.6 T T 0.4 0.4 0.2 0.2 =tp/T 0.0 0 Tamb(C) tp 25 50 75 =tp/T 0.0 100 125 150 0 175 Tamb(C) tp 25 50 75 100 125 150 175 Figure 5. Normalized avalanche power derating Figure 6. Normalized avalanche power derating versus pulse duration versus junction temperature PARM(tp) PARM(1 s) PARM(Tj) PARM(25 C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 Tj(C) tp(s) 0.1 1 0 10 100 1000 25 DocID6115 Rev 8 50 75 100 125 150 3/12 12 Characteristics STPS2H100 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 8. Relative variation of thermal impedance junction to lead versus pulse duration (SMAflat) Zth(j-a)/Rth(j-a) 1.0 1.0 Zth(j-l)/Rth(j-l) SMA 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 SMAflat tp(s) 0.0 1.E-02 Single pulse 0.1 Single pulse 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) tp(s) 0.0 1.E-04 1.E-02 1.E-01 1.E+00 1.E+01 Figure 10. Relative variation of thermal impedance junction to lead versus pulse duration (SMBflat) Zth(j-l)/Rth(j-l) Zth(j-a)/Rth(j-a) 1.0 1.0 SMB SMBflat 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.1 1.E-03 0.2 Single pulse tp(s) 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 11. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 Single pulse 0.1 tp(s) 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 12. Junction capacitance versus reverse voltage applied (typical values) IR(A) C(pF) 100 1.E+03 F=1MHz VOSC=30mVRMS Tj=25C Tj=150C Tj=125C 1.E+02 Tj=100C 1.E+01 Tj=75C Tj=50C 1.E+00 Tj=25C 1.E-01 VR(V) VR(V) 1.E-02 10 0 4/12 20 40 60 80 100 1 DocID6115 Rev 8 10 100 STPS2H100 Characteristics Figure 13. Forward voltage drop versus forward Figure 14. Forward voltage drop versus forward current (low level) current (high level) IFM(A) 2.0 IFM(A) 100 1.8 Tj=125C (Maximum values) 1.6 Tj=125C (Maximum values) 1.4 1.2 Tj=125C (Typical values) Tj=125C (Typical values) 1.0 10 0.8 Tj=25C (Maximum values) 0.6 Tj=25C (Maximum values) 0.4 0.2 VFM(V) VFM(V) 1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0.4 1.2 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Figure 15. Thermal resistance junction to Figure 16. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead (SMA) (SMAflat) Rth(j-a)(C/W) 200 130 Epoxy printed circuit board FR4, Copper thickness = 35 m 120 SMA Rth(j-a)(C/W) Epoxy printed circuit board FR4, Copper thickness = 35 m 180 110 160 100 90 140 80 120 70 100 60 SMAflat 80 50 40 60 30 40 20 20 10 SCU(cm) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 SCU(cm) 0 0 3.5 4.0 4.5 0.0 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 17. Thermal resistance junction to Figure 18. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead (SMB) (SMBflat) Rth(j-a)(C/W) Rth(j-a)(C/W) 110 110 Epoxy printed circuit board FR4, Copper thickness = 35 m 100 SMB 90 90 80 80 70 70 60 60 50 50 40 40 30 30 20 20 10 Epoxy printed circuit board FR4, Copper thickness = 35 m 100 SMBflat 10 SCU(cm) 0 SCU(cm) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 DocID6115 Rev 8 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5/12 12 Package information 2 STPS2H100 Package information Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Figure 19. SMA dimension definitions E1 D E A1 A2 C L b Table 5. SMA dimension values Dimensions Ref. 6/12 Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 DocID6115 Rev 8 STPS2H100 Package information Figure 20. SMA footprint (dimensions in mm) 2.63 1.4 1.4 1.64 5.43 Figure 21. SMB dimension definitions E1 D E A1 A2 C L b Table 6. SMB dimension values Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.50 0.030 0.059 DocID6115 Rev 8 7/12 12 Package information STPS2H100 Figure 22. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 Figure 23. SMAflat dimension definitions A c D L 2x L1 2x E E1 L L2 2x b Table 7. SMAflat dimensions Dimensions Ref. Millimeters Min. 8/12 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.088 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 0.50 0.019 L2 0.50 0.019 DocID6115 Rev 8 STPS2H100 Package information Figure 24. SMAflat footprint dimensions 5.52 (0.217) 1.52 (0.060) 1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeters (inches) Figure 25. SMBflat dimension definitions A c D L L2 E E1 L L1 b Table 8. SMBflat dimensions Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b(1) 1.95 2.20 0.077 0.087 (1) 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 c L1 0.40 0.016 L2 0.60 0.024 1. Applies to plated leads DocID6115 Rev 8 9/12 12 Package information STPS2H100 Figure 26. SMBflat footprint (dimensions in mm) 5.84 2.07 1.20 10/12 3.44 DocID6115 Rev 8 1.20 STPS2H100 3 Ordering information Ordering information Table 9. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS2H100A S21 SMA 0.068 g 5000 Tape and reel STPS2H100AF F21 SMAflat 0.035 g 10000 Tape and reel STPS2H100U G21 SMB 0.107 g 2500 Tape and reel STPS2H100UF FG21 SMBflat 0.050 g 5000 Tape and reel Revision history Table 10. Document revision history Date Revision Changes Jul-2003 4A Aug-2004 5 SMA package dimensions update. Reference A1 max. changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches). 08-Feb-2007 6 Reformatted to current standards. Added ECOPACK statement. Added SMBflat package. 15-Feb-2010 7 Updated weight for SMBflat in Table 9. 24-Jun-2013 8 Added SMAflat package Last update. DocID6115 Rev 8 11/12 12 STPS2H100 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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