This is information on a product in full production.
June 2013 DocID6115 Rev 8 1/12
STPS2H100
Power Schottky rectifier
Datasheet - production data
Features
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade-off between leakage current and
forward voltage drop
Avalanche capability specified
Description
Schottky rectifiers designed for high frequency
miniature switched mode powe r supplies su ch as
adapters and on bo ard DC/DC converters.
Available in SMA, low-profile SMA, SMB, low-
profile SMB.
Table 1. Device summary
Symbol Value
IF(AV) 2 A
VRRM 100 V
Tj (max) 175 °C
VF (max) 0.65 V
K
A
K
A
K
A
SMA
STPS2H100A
SMB
STPS2H100U
K
A
SMBflat
STPS2H100UF
SMAflat
STPS2H100AF
www.st.com
Characteristics STPS2H100
2/12 DocID6115 Rev 8
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.56 x IF(AV) + 0.045 IF2(RMS)
Table 2. Absolute rati ngs (limiting values -Tamb = 25° C unless otherwise stated)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 100 V
IF(AV) Average forward current SMA / SMB TL = 130 °C = 0.5 2ASMAflat TL = 145 °C = 0.5
SMBflat TL = 150 °C = 0.5
IFSM Surge non repetitive forward current tp =10 ms sinusoida l 75 A
PARM Repetitive peak avalanch e power tp = 1 µs Tj = 25 °C 2400 W
Tstg Storage temperature range -65 to + 175 °C
TjMaximum operating juncti on temperature (1) 175 °C
1. condition to avoid thermal runaway for a diode on its own heatsink
dPtot
dTj <1
Rth(j-a)
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to lead
SMA 30
°C/W
SMAflat 20
SMB 25
SMBflat 15
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current Tj = 25 °C VR = VRRM 1µA
Tj = 125 °C 0.4 1 mA
VF(2) Forward voltage drop
Tj = 25 °C IF = 2 A 0.79
V
Tj = 125 °C 0.6 0.65
Tj = 25 °C IF = 4 A 0.88
Tj = 125 °C 0.69 0.74
1. Pulse test: tp = 5 ms, < 2%
2. Pulse test: tp = 380 µs, < 2%
DocID6115 Rev 8 3/12
STPS2H100 Characteristics
12
Figure 1. Average forward power dissipation
versus average forward current Figure 2. Average forward current versus
ambient temperature ( = 0.5) (SMA / SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
P (W)
F(AV)
T
δ=tp/T tp
δ= 1
δ= 0.1
δ= 0.05
I (A)
F(AV)
δ= 0.5
δ= 0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150 175
I (A)
F(AV)
T
δ=tp/T tp
SMB
R =80°C/W
S =1.5cm
th(j-a)
(CU) 2
T (°C)
amb
R=R
th(j-a) th(j-I)
SMA
R =100°C/W
S =1.5cm
th(j-a)
(CU) 2
SMA
SMB
Figure 3. Average forward current versus
ambient temperature ( = 0.5) (SMBflat) Figure 4. Average forward current versus
ambient temperature ( = 0.5) (SMAflat)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150 175
SMBflat
R=R
th(j-a) th(j-l)
R =40°C/W
th(j-a)
. S =2.5 cm
CU
2
I (A)
F(AV)
T
δ
=tp/T tp
T (°C)
amb
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150 175
Rth(j-a)=Rth(j-l)
SMAflat
T
δ=tp/T tp T (°C)
amb
I (A)
F(AV)
Figure 5. Normalized avalanche powe r derating
versus pulse duration Figure 6. Normalized avalanche power derating
versus junction temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Characteristics STPS2H100
4/12 DocID6115 Rev 8
Figure 7. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SMA)
Figure 8. Relative variation of thermal
impedance junction to lead versus pulse
duration (SMAflat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
t (s)
p
Single pulse
SMA
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Single pulse
SM flatA
Z/R
th(j-l) th(j-l)
0.9
1.0
t (s)
p
Figure 9. Relative variation of thermal
impedance junction to ambient versus pulse
duration (SMB)
Figure 10. Relative variation of thermal
impedance junction to lead versus pulse
duration (SMBflat)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
t (s)
p
Single pulse
SMB
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
SMBflat
Z/R
th(j-l) th(j-l)
t (s)
p
Single pulse
Figure 11. Reverse lea ka ge cu rren t ve rsus
reverse voltage applied (typical values) Figure 12. Juncti on capa cit ance versus reverse
voltage applied (typical values)
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 20406080100
T
j
=150°C
T
j
=125°C
T
j
=25°C
T
j
=100°C
T
j
=75°C
T
j
=50°C
V (V)
R
I (µA)
R
10
100
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T=25°C
OSC RMS
j
DocID6115 Rev 8 5/12
STPS2H100 Characteristics
12
Figure 13. Forward v oltage drop versus forward
current (low level) Figure 14. Forward v oltage dr op versus forward
current (high level)
I (A)
FM
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
I (A)
FM
1
10
100
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
Figure 15. Thermal resistance junction to
ambient versus coppe r surface under each lead
(SMA)
Figure 16. Thermal resistance junction to
ambient versus copper surface under each lead
(SMAflat)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMA
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
R (°C/W)
th(j-a)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMAflat
S (cm²)
CU
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
Figure 17. Thermal resistance junction to
ambient versus coppe r surface under each lead
(SMB)
Figure 18. Thermal resistance junction to
ambient versus copper surface under each lead
(SMBflat)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMBflat
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
Package information STPS2H100
6/12 DocID6115 Rev 8
2 Package information
Epoxy meets UL94, V0
Lead-free p ackages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 19. SMA dimension definitions
Table 5. SMA dimension values
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2 b
DocID6115 Rev 8 7/12
STPS2H100 Package information
12
Figure 20. SMA footprint (dimensions in mm)
Figure 21. SMB dimension definitions
Table 6. SMB dimension values
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
2.63
5.43
1.4
1.64
1.4
E
C
L
E1
D
A1
A2
b
Package information STPS2H100
8/12 DocID6115 Rev 8
Figure 22. SMB footprint (dimensions in mm)
Figure 23. SMAflat dimension definitions
Table 7. SMAflat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.95 0.088 0.116
E 4.80 5.60 0.189 0.220
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.50 0.019
L2 0.50 0.019
2.60
5.84
1.62
2.18
1.62
D
A
L 2x
LL2 2x
L1 2x
EE1
b
c
DocID6115 Rev 8 9/12
STPS2H100 Package information
12
Figure 24. SMAflat footprint dimensions
Figure 25. SMBflat dimension definitions
Table 8. SMBflat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b(1)
1. Applies to plated leads
1.95 2.20 0.077 0.087
c(1) 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.200 0.220
E1 4.05 4.60 0.189 0.181
L 0.75 1.50 0.029 0.059
L1 0.40 0.016
L2 0.60 0.024
1.20
(0.047)
1.20
(0.047)
3.12
(0.123)
5.52
(0.217)
1.52
(0.060)
millimeters
(inches)
D
A
L
LL1
L2
EE1
b
c
Package information STPS2H100
10/12 DocID6115 Rev 8
Figure 26. SMBflat footprint (dimensions in mm)
1.20 1.203.44
5.84
2.07
DocID6115 Rev 8 11/12
STPS2H100 Ordering information
12
3 Ordering information
4 Revision history
Table 9. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS2H100A S21 SMA 0.068 g 5000 Tape and reel
STPS2H100AF F21 SMAflat 0.035 g 10000 Tape and reel
STPS2H100U G21 SMB 0.107 g 2500 Tape and reel
STPS2H100UF FG21 SMBflat 0.050 g 5000 Tape and reel
Table 10. Document revision history
Date Revision Changes
Jul-2003 4A Last update.
Aug-2004 5 SMA package dimensions update. Reference A1 max.
changed from 2.70 (0.106 inches) to 2.03 mm (0.080 inches).
08-Feb-2007 6 Reformatted to current standards. Added ECOPACK
statement. Added SMBflat package.
15-Feb-2010 7 Updated weight for SMBflat in Table 9.
24-Jun-2013 8 Added SMAflat package
STPS2H100
12/12 DocID6115 Rev 8
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