LC2MOS Precision
Mini-DIP Analog Switch
ADG419
Rev. B
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2009 Analog Devices, Inc. All rights reserved.
FEATURES
44 V supply maximum ratings
VSS to VDD analog signal range
Low on resistance: <35 Ω
Ultralow power dissipation: < 35 μW
Fast transition time: 160 ns maximum
Break-before-make switching action
Plug-in replacement for DG419
APPLICATIONS
Precision test equipment
Precision instrumentation
Battery-powered systems
Sample hold systems
FUNCTIONAL BLOCK DIAGRAM
ADG419
D
SWITCH SHOWN FOR A
LOGIC 1 INPUT
S
1
S2
IN
0
7850-001
Figure 1.
GENERAL DESCRIPTION
The ADG419 is a monolithic CMOS SPDT switch. This switch
is designed on an enhanced LC2MOS process that provides low
power dissipation yet gives high switching speed, low on resistance,
and low leakage currents.
The on resistance profile of the ADG419 is very flat over the full
analog input range, ensuring excellent linearity and low distortion.
The part also exhibits high switching speed and high signal
bandwidth. CMOS construction ensures ultralow power
dissipation, making the parts ideally suited for portable and
battery-powered instruments.
Each switch of the ADG419 conducts equally well in both
directions when on and has an input signal range that extends
to the supplies. In the off condition, signal levels up to the
supplies are blocked. The ADG419 exhibits break-before-make
switching action.
PRODUCT HIGHLIGHTS
1. Extended Signal Range.
The ADG419 is fabricated on an enhanced LC2MOS
process, giving an increased signal range that extends to
the supply rails.
2. Ultralow Power Dissipation.
3. Low RON.
4. Single-Supply Operation.
For applications where the analog signal is unipolar, the
ADG419 can be operated from a single rail power supply.
The part is fully specified with a single 12 V power supply
and remains functional with single supplies as low as 5 V.
ADG419
Rev. B | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Dual Supply ................................................................................... 3
Single Supply ................................................................................. 4
Absolute Maximum Ratings ............................................................5
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions ..............................6
Typical Performance Characteristics ..............................................7
Test Circuits ........................................................................................9
Terminology .................................................................................... 11
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 13
REVISION HISTORY
8/09—Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Updated Outline Dimensions ....................................................... 12
Changes to Ordering Guide .......................................................... 13
ADG419
Rev. B | Page 3 of 16
SPECIFICATIONS
DUAL SUPPLY
VDD = 15 V ± 10%, VSS = −15 V ± 10%, VL = 5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
B Version T Version
Parameter1 +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−55°C to
+125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range V
SS to VDD V
SS to VDD
RON 25 25 Ω typ VD = ±12.5 V, IS = −10 mA
35 45 45 35 45 Ω max VDD = +13.5 V, VSS = −13.5 V
LEAKAGE CURRENTS VDD = +16.5 V, VSS = −16.5 V
Source Off Leakage, IS (Off) ±0.1 ±0.1 nA typ VD = ±15.5 V, VS = ∓15.5 V;
see Figure 12
±0.25 ±5 ±15 ±0.25 ±15 nA max
Drain Off Leakage, ID (Off) ±0.1 ±0.1 nA typ VD = ±15.5 V, VS = ∓15.5 V;
see Figure 12
±0.75 ±5 ±30 ±0.75 ±30 nA max
Channel On Leakage, ID, IS (On) ±0.4 ±0.4 nA typ VS = VD = ±15.5 V; see Figure 13
±0.75 ±5 ±30 ±0.75 ±30 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 0.8 V max
Input Current
IINL or IINH ±0.005 ±0.005 ±0.005 μA typ VIN = VINL or VINH
±0.5 ±0.5 ±0.5 μA max
DYNAMIC CHARACTERISTICS2
tTRANSITION 160 200 200 145 200 ns max
RL = 300 Ω, CL = 35 pF; VS1 = ±10 V,
VS2 = ∓10 V; see Figure 14
Break-Before-Make Time Delay, tD 30 30 ns typ RL = 300 Ω, CL = 35 pF;
VS1 = VS2 = ±10 V; see Figure 15
5 5 ns min
Off Isolation 80 80 dB typ RL = 50 Ω, f = 1 MHz; see Figure 16
Channel-to-Channel Crosstalk 90 70 dB typ RL = 50 Ω, f = 1 MHz; see Figure 17
CS (Off) 6 6 pF typ f = 1 MHz
CD, CS (On) 55 55 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = +16.5 V, VSS = −16.5 V
IDD 0.0001 0.0001 μA typ VIN = 0 V or 5 V
1 2.5 2.5 1 2.5 μA max
ISS 0.0001 0.0001 μA typ
1 2.5 2.5 1 2.5 μA max
IL 0.0001 0.0001 μA typ VL = 5.5 V
1 2.5 2.5 1 2.5 μA max
1 Temperature ranges are as follows: B Version: −40°C to +125°C; T Version: −55°C to +125°C.
2 Guaranteed by design, not subject to production test.
ADG419
Rev. B | Page 4 of 16
SINGLE SUPPLY
VDD = 12 V ± 10%, VSS = 0 V, VL = 5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 2.
B Version T Version
Parameter1 +25°C
−40°C to
+85°C
−40°C to
+125°C +25°C
−55°C to
+125°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to VDD 0 to VDD V
RON 40 40 Ω typ VD = 3 V, 8.5 V, IS = −10 mA
60 70 70 Ω max VDD = 10.8 V
LEAKAGE CURRENT VDD = 13.2 V
Source OFF Leakage, IS (Off) ±0.1 ±0.1 nA typ VD = 12.2 V/1 V, VS = 1 V/12.2 V;
see Figure 12
±0.25 ±5 ±15 ±0.25 ±15 nA max
Drain OFF Leakage, ID (Off) ±0.1 ±0.1 nA typ VD = 12.2 V/1 V, VS = 1 V/12.2 V;
see Figure 12
±0.75 ±5 ±30 ±0.75 ±30 nA max
Channel ON Leakage, ID, IS (On) ±0.4 ±0.4 nA typ VS = VD = 12.2 V/1 V; see Figure 13
±0.75 ±5 ±30 ±0.75 ±30 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 0.8 V max
Input Current
IINL or IINH ±0.005 ±0.005 ±0.005 μA typ VIN = VINL or VINH
±0.5 ±0.5 ±0.5 μA max
DYNAMIC CHARACTERISTICS2
tTRANSITION 180 250 250 170 250 ns max RL = 300 Ω, CL = 35 pF; VS1 = 0 V/8 V,
VS2 = 8 V/0 V; see Figure 14
Break-Before-Make Time Delay, tD 60 60 ns typ RL = 300 Ω, CL = 35 pF;
VS1 = VS2 = 8 V; see Figure 15
Off Isolation 80 80 dB typ RL = 50 Ω, f = 1 MHz; see Figure 16
Channel-to-Channel Crosstalk 90 70 dB typ RL = 50 Ω, f = 1 MHz; see Figure 17
CS (Off) 13 13 pF typ f = 1 MHz
CD, CS (On) 65 65 pF typ f = 1 MHz
POWER REQUIREMENTS VDD = 13.2 V
IDD 0.0001 0.0001 μA typ VIN = 0 V or 5 V
1 2.5 2.5 1 2.5 μA max
IL 0.0001 0.0001 μA typ VL = 5.5 V
1 2.5 2.5 1 2.5 μA max
1 Temperature ranges are as follows: B Version: −40°C to +125°C; T Version: −55°C to +125°C.
2 Guaranteed by design, not subject to production test.
ADG419
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA= 25°C unless otherwise noted.
Table 3.
Parameter Rating
VDD to VSS 44 V
VDD to GND −0.3 V to +25 V
VSS to GND +0.3 V to −25 V
VL to GND −0.3 V to VDD + 0.3 V
Analog, Digital Inputs1 VSS − 2 V to VDD + 2 V
or 30 mA, whichever
occurs first
Continuous Current, S or D 30 mA
Peak Current, S or D (Pulsed at 1 ms,
10% Duty-Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Extended (T Version) −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 600 mW
θJA, Thermal Impedance 110°C/W
Lead Temperature, Soldering (10 sec) 300°C
PDIP Package, Power Dissipation 400 mW
θJA, Thermal Impedance 100°C/W
Lead Temperature, Soldering (10 sec) 260°C
SOIC Package, Power Dissipation 400 mW
θJA, Thermal Impedance 155°C/W
MSOP Package, Power Dissipation 315 mW
θJA, Thermal Impedance 205°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
1Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the
maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ADG419
Rev. B | Page 6 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
8
7
6
5
1
2
3
4
D
S1
G
ND
S2
IN
ADG419
TOP VIEW
(Not to Scale)
V
DD
V
L
V
SS
07850-002
Figure 2. Pin Configuration
Table 4. Pin Function Description
Pin No. Mnemonic Description
1 D Drain terminal. May be an input or an output.
2 S1 Source terminal. May be an input or an output.
3 GND Ground (0 V) reference.
4 VDD Most positive power supply potential.
5 VL Logic power supply (5 V).
6 IN Logic control input.
7 VSS Most negative power supply potential in dual-supply applications. In single-supply applications, it may be
connected to GND.
8 S2 Source terminal. May be an input or an output.
Table 5. Truth Table
Logic Switch 1 Switch 2
0 On Off
1 Off On
ADG419
Rev. B | Page 7 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
50
40
30
20
10
0
–15 –10 –5 0 5 10 15
R
ON
(Ω)
V
S
, V
D
(V)
V
DD
= +5V
V
SS
= –5V
V
DD
= +10V
V
SS
= –10V
V
DD
= +12V
V
SS
= –12V
V
DD
= +15V
V
SS
= –15V
T
A
= 25°C
07850-003
Figure 3. RON as a Function of VD (VS), Dual-Supply Voltage
50
0
10
20
30
40
–15 –10 –5 0 5 10 15
R
ON
(Ω)
V
S
, V
D
(V)
V
DD
= +15V
V
SS
= –15V
V
L
= +5V
125°C
25°C
85°C
07850-004
Figure 4. RON as a Function of VD (VS) for Different Temperatures
0.02
–0.03
–0.02
–0.01
0
0.01
LEAKAGE CURRENT (nA)
V
S
, V
D
(V)
–15 –10 –5 0 5 10 15
V
DD
= +15V
V
SS
= –15V
T
A
= 25°C
I
D
(ON)
I
S
(OFF)
I
D
(OFF)
07850-005
Figure 5. Leakage Currents as a Function of VS (VD)
100
0
20
40
60
80
01105
R
ON
(Ω)
V
S
, V
D
(V)
5
V
DD
= 5V
V
SS
= 0V
T
A
= 25°C
V
DD
= 10V
V
SS
= 0V V
DD
= 12V
V
SS
= 0V
V
DD
= 15V
V
SS
= 0V
07850-006
Figure 6. RON as a Function of VD (VS), Single-Supply Voltage
100
0
20
40
60
80
0369
R
ON
(Ω)
V
S
, V
D
(V)
12
125°C
25°C
85°C
V
DD
= 12V
V
SS
= 0V
V
L
= 5V
07850-007
Figure 7. RON as a Function of VD (VS) for Different Temperatures
0.006
–0.004
–0.002
0
0.002
0.004
LEAKAGE CURRENT (nA)
V
S
, V
D
(V)
024681012
V
DD
= 12V
V
SS
= 0V
T
A
= 25°C
I
D
(ON)
I
S
(OFF)
I
D
(OFF)
07850-008
Figure 8. Leakage Currents as a Function of VS (VD)
ADG419
Rev. B | Page 8 of 16
10m
A
1mA
100µA
1nA
10nA
100nA
1µA
10µA
100 1k 10k 100k 1M 10M
I
SUPPLY
FREQUENCY (Hz)
V
DD
= +15V
V
SS
= –15V
V
L
= +5V
I+, I–
I
L
07850-009
Figure 9. Supply Current (ISUPPLY) vs. Input Switching Frequency
220
200
80
100
120
140
160
180
611412108
t
TRANSITION
(ns)
SUPPLY VOLTAGE (V)
6
SINGLE SUPPLY
V
IN
= 0V/+5V
DUAL SUPPLY
V
IN
= ±5V
07850-010
Figure 10. Transition Time (tTRANSITION) vs. Power Supply Voltage
ADG419
Rev. B | Page 9 of 16
TEST CIRCUITS
S
R
ON
= V
1
/I
DS
V
S
I
DS
D
V1
07850-011
Figure 11. On Resistance
V
S
V
D
I
S
(OFF) I
D
(OFF)
SD
AA
07850-012
Figure 12. Off Leakage
V
S
V
D
I
D
(ON)
SD
A
07850-013
Figure 13. On Leakage
VS1 VOUT
t
TRANSITION
t
TRANSITION
VIN
VS2
VIN
RL
300Ω
CL
35pF
VSS
+15
V
S2
IN
GND
–15V
D
V
L
V
DD
S1
3V
0V
50% 50%
90%
90%
OUTPUT
07850-014
+5
V
Figure 14. Transition Time, tTRANSITION
V
S1
V
OUT
V
OUT
t
D
t
D
ADDRESS
DRIVE (V
IN
)
V
S2
0.9V
O
0.9V
O
0.9V
O
V
IN
R
L
300Ω
C
L
35pF
V
SS
+15
V
S2
IN
GND
–15V
D
V
L
V
DD
S1
3V
0V
0.9V
O
0
7850-015
+5
V
Figure 15. Break-Before-Make Time Delay, tD
ADG419
Rev. B | Page 10 of 16
V
OUT
V
S
V
IN
V
DD
V
SS
V
L
0.1µF
0.1µF
0.1µF
R
L
50Ω
IN
GND
–15V
D
S
+15
V
+5
V
07850-016
Figure 16. Off Isolation
VOUT
VS
VIN
RL
VDD
VSS
VL
–15V
0.1µF
0.1µF0.1µF
GND
D
S1
S2
CHANNEL-TO-CHANNEL CROSSTALK = 20 × log | VS/VOUT |
+15
V
+5
V
50Ω
50Ω
07850-017
Figure 17. Crosstalk
ADG419
Rev. B | Page 11 of 16
TERMINOLOGY
VDD
Most positive power supply potential.
VSS
Most negative power supply potential in dual-supply applications.
In single-supply applications, it may be connected to GND.
VL
Logic power supply (5 V).
GND
Ground (0 V) reference.
S
Source terminal. May be an input or an output.
D
Drain terminal. May be an input or an output.
IN
Logic control input.
RON
Ohmic resistance between D and S.
IS (Off)
Source leakage current with the switch off.
ID (Off)
Drain leakage current with the switch off.
ID, IS (On)
Channel leakage current with the switch on.
VD (VS)
Analog voltage on terminals D, S.
CS (Off)
Off switch source capacitance.
CD, CS (On)
On switch capacitance.
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
tD
Off time or on time measured between the 90% points of both
switches when switching from one address state to the other.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Off Isolation
A measure of unwanted signal coupling through an off channel.
IDD
Positive supply current.
ISS
Negative supply current.
ADG419
Rev. B | Page 12 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-001
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
070606-A
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
SEATING
PLANE
0.015
(0.38)
MIN
0.210 (5.33)
MAX
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
8
14
5
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.100 (2.54)
BSC
0.400 (10.16)
0.365 (9.27)
0.355 (9.02)
0.060 (1.52)
MAX
0.430 (10.92)
MAX
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
0.015 (0.38)
GAUGE
PLANE
0.005 (0.13)
MIN
Figure 18. 8-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-8)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.310 (7.87)
0.220 (5.59)
0.005 (0.13)
MIN 0.055 (1.40)
MAX
0.100 (2.54) BSC
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
SEATING
PLANE
0.200 (5.08)
MAX
0.405 (10.29) MAX
0.150 (3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36) 0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
14
58
Figure 19. 8-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-8)
Dimensions shown in inches and (millimeters)
ADG419
Rev. B | Page 13 of 16
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
8°
0°
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
.95
.85
.75
Figure 20. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-A A
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099) 45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
Figure 21. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADG419BN −40°C to +125°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8
ADG419BNZ1 −40°C to +125°C 8-Lead Plastic Dual In-Line Package [PDIP] N-8
ADG419BR −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BR-REEL −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BR-REEL7 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRZ1 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRZ-REEL1 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRZ-REEL71 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADG419BRM −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB
ADG419BRM-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB
ADG419BRM-REEL7 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB
ADG419BRMZ1 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB#
ADG419BRMZ-REEL1 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB#
ADG419BRMZ-REEL71 −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 SBB#
ADG419TQ −55°C to +125°C 8-Lead Ceramic Dual In-Line Package [CERDIP] Q-8
1 Z = RoHS Compliant Part, # denotes that RoHS compliant part is top or bottom marked.
ADG419
Rev. B | Page 14 of 16
NOTES
ADG419
Rev. B | Page 15 of 16
NOTES
ADG419
Rev. B | Page 16 of 16
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07850-0-8/09(B)