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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADC081S021
SNAS308G –APRIL 2005–REVISED MAY 2016
ADC081S021 Single-Channel, 50-ksps to 200-ksps, 8-Bit A/D Converter
1
1 Features
1• Characterized and Specified Over Multiple
Sample Rates
• 6-Pin WSON and SOT-23 Packages
• Variable Power Management
• Single Power Supply With 2.7-V to 5.25-V Range
• Compatible With SPI™, QSPI™, MICROWIRE™,
and DSP
• DNL: +0.04/–0.03 LSB (Typical)
• INL: +0.04/–0.03 LSB (Typical)
• SNR: 49.6 dB (Typical)
• Power Consumption:
– 3.6-V Supply: 1.3 mW (Typical)
– 5.25-V Supply: 7.7 mW (Typical)
2 Applications
• Portable Systems
• Remote Data Acquisition
• Instrumentation and Control Systems
3 Description
The ADC081S021 device is a low-power, single-
channel CMOS 8-bit analog-to-digital converter with a
high-speed serial interface. Unlike the conventional
practice of specifying performance at a single sample
rate only, the ADC081S021 is fully specified over a
sample rate range of 50 ksps to 200 ksps. The
converter is based upon a successive-approximation
register architecture with an internal track-and-hold
circuit.
The output serial data is straight binary, and is
compatible with several standards, such as SPI,
QSPI, MICROWIRE, and many common DSP serial
interfaces.
The ADC081S021 operates with a single supply that
can range from 2.7 V to 5.25 V. Normal power
consumption using a 3.6-V or 5.25-V supply is
1.3 mW and 7.7 mW, respectively. The power-down
feature reduces the power consumption to as low as
2.6 µW using a 5.25-V supply.
The ADC081S021 is packaged in 6-pin WSON and
SOT-23 packages. Operation over the industrial
temperature range of −40°C to 85°C is ensured.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
ADC081S021 SOT-23 (6) 2.50 mm × 2.20 mm
WSON (6) 1.60 mm × 2.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements................................................ 7
7.7 Typical Characteristics.............................................. 9
8 Detailed Description............................................ 12
8.1 Overview................................................................. 12
8.2 Functional Block Diagram....................................... 12
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 13
9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application.................................................. 17
10 Power Supply Recommendations ..................... 19
10.1 Noise Considerations............................................ 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 20
12 Device and Documentation Support................. 21
12.1 Device Support...................................................... 21
12.2 Documentation Support ........................................ 22
12.3 Community Resources.......................................... 22
12.4 Trademarks........................................................... 22
12.5 Electrostatic Discharge Caution............................ 22
12.6 Glossary................................................................ 22
13 Mechanical, Packaging, and Orderable
Information........................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (November 2013) to Revision G Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
• Changed table title Pin-Compatible Alternatives by Resolution and Speed to Device Comparison Table............................ 3
Changes from Revision E (March 2013) to Revision F Page
• Changed sentence in the "Using the ADC081S021" section............................................................................................... 12
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ............................................................................................................. 1
1VA 6 CS
2GND 5 SDATA
3VIN  4 SCLK
1VA 6 CS
2GND 5 SDATA
3VIN  4 SCLK
3
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(1) All devices are fully pin and function compatible.
5 Device Comparison Table
RESOLUTION SPECIFIED SAMPLE RATE RANGE(1)
50 TO 200 KSPS 200 TO 500 KSPS 500 KSPS TO 1 MSPS
12 Bits ADC081S021121S021 ADC081S021121S051 ADC081S021121S101
10 Bits ADC081S021101S021 ADC081S021101S051 ADC081S021101S101
8 Bits ADC081S021 ADC081S021081S051 ADC081S021081S101
6 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View NGF Package
6-Pin WSON
Top View
(1) G = Ground, I = Input, O = Output, P = Power
Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 VAPPositive supply pin. This pin must be connected to a quiet 2.7-V to 5.25-V source and bypassed to GND
with a 1-µF capacitor and a 0.1-µF monolithic capacitor placed within 1 cm of the power pin.
2 GND G The ground return for the supply and signals.
3 VIN I Analog input. This signal can range from 0 V to VA.
4 SCLK I Digital clock input. This clock directly controls the conversion and readout processes.
5 SDATA O Digital data output. The output samples are clocked out of this pin on falling edges of the SCLK pin.
6 CS I Chip select. On the falling edge of CS, a conversion process begins.
4
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the TI Office/Distributors for availability and specifications.
(4) When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin must be limited to
10 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an
input current of 10 mA to two. These specifications do not apply to the VApin. The current into the VApin is limited by the analog supply
voltage specification.
(5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax −TA) / θJA. The values for maximum power dissipation listed above is reached only when the device is operated in a
severe fault condition (that is, when input or output pins are driven beyond the power supply voltages, or the power supply polarity is
reversed). Such conditions must always be avoided.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Analog supply voltage, VA–0.3 6.5 V
Voltage on any analog pin to GND –0.3 VA+ 0.3 V
Voltage on any digital pin to GND –0.3 6.5 V
Input current at any pin(4) ±10 mA
Package input current(4) ±20 mA
Power consumption at TA= 25°C See(5)
Junction temperature, TJ150 °C
Storage temperature, Tstg –65 150 °C
(1) Human body model is 100-pF capacitor discharged through a 1.5-kΩresistor. Machine model is 220 pF discharged through 0 Ω.
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge(1) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(2) ±3500 V
Machine model (MM) ±300
(1) All voltages are measured with respect to GND = 0 V, unless otherwise specified.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VASupply voltage 2.7 5.25 V
Digital input pins voltage (regardless of supply voltage) –0.3 5.25 V
Analog input pins voltage 0 VAV
Clock frequency 25 20000 kHz
Sample rate 1 Msps
TAOperating temperature –40 85 °C
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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1) ADC081S021
UNITDBV (SOT-23) NGF (WSON)
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 184.5 99.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 151.2 118.3 °C/W
RθJB Junction-to-board thermal resistance 29.7 68.9 °C/W
ψJT Junction-to-top characterization parameter 29.8 6.6 °C/W
ψJB Junction-to-board characterization parameter 29.1 69.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 14.8 °C/W
(1) Tested limits are ensured to TI's AOQL (Average Outgoing Quality Level).
(2) Data sheet minimum and maximum specification limits are specified by design, test, or statistical analysis.
7.5 Electrical Characteristics
Typical values correspond to TA= 25°C, and minimum and maximum limits apply over –40°C to 85°C operating temperature
range (unless otherwise noted). VA= 2.7 V to 5.25 V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps, and CL= 15 pF
(unless otherwise noted).(1)
PARAMETER TEST CONDITIONS MIN(2) TYP MAX(2) UNIT
STATIC CONVERTER CHARACTERISTICS
Resolution with
no missing codes 8 Bits
INL Integral non-linearity VA= 2.7 V to 3.6 V ±0.03 ±0.3 LSB
VA= 4.75 V to 5.25 V TA= 25°C –0.03 0.04 LSB
TA= –40°C to 85°C ±0.3 ±0.3
DNL Differential non-linearity VA= 2.7 V to 3.6 V ±0.03 ±0.2 LSB
VA= 4.75 V to 5.25 V TA= 25°C –0.03 0.04 LSB
TA= –40°C to 85°C ±0.2 ±0.2
VOFF Offset error VA= 2.7 V to 3.6 V –0.01 ±0.2 LSB
VA= 4.75 V to 5.25 V 0.03 ±0.2 LSB
GE Gain error VA= 2.7 V to 3.6 V 0.04 ±0.4 LSB
VA= 4.75 V to 5.25 V 0.1 ±0.4 LSB
TUE Total unadjusted error VA= 2.7 V to 3.6 V TA= 25°C –0.065 0.055 LSB
TA= –40°C to 85°C ±0.3 ±0.3
VA= 4.75 V to 5.25 V TA= 25°C –0.06 0.03 LSB
TA= –40°C to 85°C ±0.3 ±0.3
DYNAMIC CONVERTER CHARACTERISTICS
SINAD Signal-to-noise
plus distortion ratio VA= 2.7 V to 5.25 V, fIN = 100 kHz,
–0.02 dBFS 49 49.5 dBFS
SNR Signal-to-noise ratio VA= 2.7 V to 5.25 V, fIN = 100 kHz,
–0.02 dBFS 49 49.6 dBFS
THD Total harmonic distortion VA= 2.7 V to 5.25 V, fIN = 100 kHz,
–0.02 dBFS –77 –65 dBFS
SFDR Spurious-free dynamic range VA= 2.7 V to 5.25 V, fIN = 100 kHz,
–0.02 dBFS 65 68 dBFS
ENOB Effective number of bits VA= 2.7 V to 5.25 V, fIN = 100 kHz,
–0.02 dBFS 7.8 7.9 Bits
IMD
Intermodulation distortion,
second order terms VA= 5.25 V, fa= 103.5 kHz, fb= 113.5 kHz –83 dBFS
Intermodulation distortion,
third order terms VA= 5.25 V, fa= 103.5 kHz, fb= 113.5 kHz –82 dBFS
6
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Electrical Characteristics (continued)
Typical values correspond to TA= 25°C, and minimum and maximum limits apply over –40°C to 85°C operating temperature
range (unless otherwise noted). VA= 2.7 V to 5.25 V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps, and CL= 15 pF
(unless otherwise noted).(1)
PARAMETER TEST CONDITIONS MIN(2) TYP MAX(2) UNIT
(3) This is the frequency range over which the electrical performance is ensured. The device is functional over a wider range which is
specified under Operating Ratings.
(4) Minimum quiet time required by bus relinquish and the start of the next conversion.
FPBW –3 dB full power bandwidth VA= 5 V 11 MHz
VA= 3 V 8 MHz
ANALOG INPUT CHARACTERISTICS
VIN Input range 0 to VAV
IDCL DC leakage current ±1 µA
CINA Input capacitance Track mode 30 pF
Hold mode 4 pF
DIGITAL INPUT CHARACTERISTICS
VIH Input high voltage VA= 5.25 V 2.4 V
VA= 3.6 V 2.1 V
VIL Input low voltage VA= 5 V 0.8 V
VA= 3 V 0.4 V
IIN Input current VIN = 0 V or VA±0.1 ±1 µA
CIND Digital input capacitance 2 4 pF
DIGITAL OUTPUT CHARACTERISTICS
VOH Output high voltage ISOURCE = 200 µA VA– 0.2 VA– 0.07 V
ISOURCE = 1 mA VA– 0.1 V
VOL Output low voltage ISINK = 200 µA 0.03 0.4 V
ISINK = 1 mA 0.1 V
IOZH, IOZL TRI-STATE leakage current ±0.1 ±10 µA
COUT TRI-STATE output capacitance 2 4 pF
Output coding Straight (natural) binary
POWER SUPPLY CHARACTERISTICS
VASupply voltage 2.7 5.25 V
IA
Supply current, normal mode
(operational, CS low) VA= 5.25 V, fSAMPLE = 200 ksps 1.47 2.2 mA
VA= 3.6 V, fSAMPLE = 200 ksps 0.36 0.9 mA
Supply current, shutdown
(CS high) fSCLK = 0 MHz, VA= 5.25 V, fSAMPLE = 0 ksps 500 nA
VA= 5.25 V, fSCLK = 4 MHz, fSAMPLE = 0 ksps 60 µA
PD
Power consumption, normal
mode
(operational, CS low)
VA= 5.25 V 7.7 11.6 mW
VA= 3.6 V 1.3 3.24 mW
Power consumption, shutdown
(CS high) fSCLK = 0 MHz, VA= 5.25 V, fSAMPLE = 0 ksps 2.6 µW
fSCLK = 4 MHz, VA= 5.25 V, fSAMPLE = 0 ksps 315 µW
AC ELECTRICAL CHARACTERISTICS
fSCLK Clock frequency See(3) 1 4 MHz
fSSample rate See(3) 50 200 ksps
tHOLD Hold time, falling edge 13 SCLK
DC SCLK duty cycle fSCLK = 4 MHz 40% 50% 60%
tACQ Minimum time required for
acquisition 350 ns
tQUIET Quiet time See(4) 50 ns
tAD Aperture delay 3 ns
tAJ Aperture jitter 30 ps
Z2 Z1 Z0 DB7 Zero Zero Zero Zero
tQUIET
Track
3 leading zero bits 8 data bits
CS
SCLK
SDATA
1 2 3 4 5 12 13 14 15 16
TRI-STATE
||
|
tSU tCL
tEN tCH tACC tHtDIS
tCS
Hold
tACQ
17 18 19 20
4 trailing zeroes
7
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(1) Data sheet minimum and maximum specification limits are specified by design, test, or statistical analysis.
(2) Measured with the timing test circuit and defined as the time taken by the output signal to cross 1 V.
(3) Measured with the timing test circuit and defined as the time taken by the output signal to cross 1 V or 2 V.
(4) tDIS is derived from the time taken by the outputs to change by 0.5 V with the timing test circuit. The measured number is then adjusted
to remove the effects of charging or discharging the output capacitance. This means that tDIS is the true bus relinquish time, independent
of the bus loading.
7.6 Timing Requirements
The following specifications apply for VA= 2.7 V to 5.25 V, GND = 0 V, fSCLK = 1.0 MHz to 4.0 MHz, CL= 25 pF, fSAMPLE = 50
ksps to 200 ksps, and TA= –40°C to 85°C (unless otherwise noted).(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tCS Minimum CS pulse width 10 ns
tCSSU CS setup time prior to SCLK falling edge 10 ns
tCSH CS hold time after SCLK falling edge 1 ns
tEN Delay from CS until SDATA TRI-STATE disabled(2) 20 ns
tACC Data access time after SCLK falling edge(3) VA= 2.7 V to 3.6 V 40 ns
VA= 4.75 V to 5.25 V 20 ns
tCL SCLK low pulse width 0.4 × tSCLK ns
tCH SCLK high pulse width 0.4 × tSCLK ns
tHSCLK to data valid hold time VA= 2.7 V to 3.6 V 7 ns
VA= 4.75 V to 5.25 V 5 ns
tDIS SCLK falling edge to SDATA high impedance(4) VA= 2.7 V to 3.6 V 6 25 ns
VA= 4.75 V to 5.25 V 5 25 ns
tPOWER-UP Power-up time from full power down TA= 25°C 1 µs
Figure 1. Timing Test Circuit
Figure 2. Serial Timing Diagram
tCSH
SCLK
CS
tCSSU
1 2
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Figure 3. SCLK and CS Timing Parameters
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7.7 Typical Characteristics
TA= 25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz (unless otherwise noted)
Figure 4. DNL fSCLK = 1 MHz Figure 5. INL fSCLK = 1 MHz
Figure 6. DNL fSCLK = 4 MHz Figure 7. INL fSCLK = 4 MHz
Figure 8. DNL vs Clock Frequency Figure 9. INL vs Clock Frequency
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Typical Characteristics (continued)
TA= 25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz (unless otherwise noted)
Figure 10. Total Unadjusted Error vs Clock Frequency
VA= 3 V or 5 V Figure 11. SNR vs Clock Frequency
Figure 12. SINAD vs Clock Frequency Figure 13. SFDR vs Clock Frequency
Figure 14. THD vs Clock Frequency Figure 15. Spectral Response, VA= 5 V
fSCLK = 1 MHz
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Typical Characteristics (continued)
TA= 25°C, fSAMPLE = 50 ksps to 200 ksps, fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz (unless otherwise noted)
Figure 16. Spectral Response, VA= 5 V
fSCLK = 4 MHz Figure 17. Power Consumption vs Throughput
fSCLK = 4 MHz
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8 Detailed Description
8.1 Overview
The ADC081S021 is a successive-approximation analog-to-digital converter designed around a charge-
redistribution digital-to-analog converter core. Simplified schematics of the ADC081S021 in both track and hold
modes are shown in Figure 19 and Figure 18, respectively. In Figure 19, the device is in track mode: switch SW1
connects the sampling capacitor to the input, and SW2 balances the comparator inputs. The device is in this
state until CS is brought low, at which point the device moves to hold mode.
8.2 Functional Block Diagram
8.3 Feature Description
The serial interface timing diagram for the ADC is shown in Timing Requirements. CS is chip select, which
initiates conversions on the ADC and frames the serial data transfers. SCLK (serial clock) controls both the
conversion process and the timing of serial data. SDATA is the serial data out pin, where a conversion result is
found as a serial data stream.
Basic operation of the ADC begins with CS going low, which initiates a conversion process and data transfer.
Subsequent rising and falling edges of SCLK are labelled with reference to the falling edge of CS; for example,
the third falling edge of SCLK shall refer to the third falling edge of SCLK after CS goes low.
At the fall of CS, the SDATA pin comes out of TRI-STATE and the converter moves from track mode to hold
mode. The input signal is sampled and held for conversion on the falling edge of CS. The converter moves from
hold mode to track mode on the 13th rising edge of SCLK (see Timing Requirements). It is at this point that the
interval for the TACQ specification begins. At least 350 ns must pass between the 13th rising edge of SCLK and
the next falling edge of CS. The SDATA pin is placed back into TRI-STATE after the 16th falling edge of SCLK,
or at the rising edge of CS, whichever occurs first. After a conversion is completed, the quiet time (tQUIET) must
be satisfied before bringing CS low again to begin another conversion.
Sixteen SCLK cycles are required to read a complete sample from the ADC. The sample bits (including leading
or trailing zeroes) are clocked out on falling edges of SCLK, and are intended to be clocked in by a receiver on
subsequent rising edges of SCLK. The ADC produces three leading zero bits on SDATA, followed by eight data
bits, most significant first. After the data bits, the ADC clocks out four trailing zeros.
If CS goes low before the rising edge of SCLK, an additional (fourth) zero bit may be captured by the next falling
edge of SCLK.
8.3.1 Determining Throughput
Throughput depends on the frequency of SCLK and how much time is allowed to elapse between the end of one
conversion and the start of another. At the maximum specified SCLK frequency, the maximum ensured
throughput is obtained by using a 20 SCLK frame. As shown in Timing Requirements, the minimum allowed time
between CS falling edges is determined by:
1. 12.5 SCLKs for Hold mode.
2. The larger of two quantities: either the minimum required time for Track mode (tACQ) or 2.5 SCLKs to finish
reading the result.
GND
SAMPLING
CAPACITOR
SW1 -
+CONTROL
LOGIC
CHARGE
REDISTRIBUTION
DAC
SW2
VIN
VA
2
GND
SAMPLING
CAPACITOR
SW1 -
+CONTROL
LOGIC
CHARGE
REDISTRIBUTION
DAC
SW2
VIN
VA
2
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Feature Description (continued)
3. 0, 1/2, or 1 SCLK padding to ensure an even number of SCLK cycles so there is a falling SCLK edge when
CS next falls.
For example, at the fastest rate for this family of parts, SCLK is 20 MHz and 2.5 SCLKs are 125 ns, so the
minimum time between CS falling edges is calculated by Equation 1.
12.5 × 50 ns + 350 ns + 0.5 × 50 ns = 1000 ns (1)
(12.5 SCLKs + tACQ + 1/2 SCLK) which corresponds to a maximum throughput of 1 MSPS. At the slowest rate for
this family, SCLK is 1 MHz. Using a 20 cycle conversion frame as shown in Timing Requirements yields a 20-μs
time between CS falling edges for a throughput of 50 KSPS. It is possible, however, to use fewer than 20 clock
cycles provided the timing parameters are met. With a 1-MHz SCLK, there are 2500 ns in 2.5 SCLK cycles,
which is greater than tACQ. After the last data bit has come out, the clock needs one full cycle to return to a falling
edge. Thus the total time between falling edges of CS is 12.5 × 1 μs + 2.5 × 1 μs + 1 × 1 μs = 16 μs which is a
throughput of 62.5 KSPS.
8.4 Device Functional Modes
Figure 18 shows the device in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining
the sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the charge-
redistribution DAC to add or subtract fixed amounts of charge from the sampling capacitor until the comparator is
balanced. When the comparator is balanced, the digital word supplied to the DAC is the digital representation of
the analog input voltage. The device moves from hold mode to track mode (Figure 19) on the 13th rising edge of
SCLK.
Figure 18. Hold Mode
Figure 19. Track Mode
8.4.1 Transfer Function
The output format of the ADC is straight binary. Code transitions occur midway between successive integer LSB
values. The LSB width for the ADC is VA/256. The ideal transfer characteristic is shown in Figure 20. The
transition from an output code of 0000 0000 to a code of 0000 0001 is at 1/2 LSB, or a voltage of VA/512. Other
code transitions occur at steps of one LSB.
000...001
000...010
0V
011...111
111...000
000...000
111...111
111...110
ADC CODE
ANALOG INPUT
1 LSB = VA/256
1 LSB +VA-1 LSB
||
|
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Device Functional Modes (continued)
Figure 20. Ideal Transfer Characteristic
8.4.2 Modes of Operation
The ADC has two possible modes of operation: normal mode and shutdown mode. The ADC enters normal
mode (and a conversion process is begun) when CS is pulled low. The device enters shutdown mode if CS is
pulled high before the tenth falling edge of SCLK after CS is pulled low, or stays in normal mode if CS remains
low. Once in shutdown mode, the device stays there until CS is brought low again. By varying the ratio of time
spent in the normal and shutdown modes, a system may trade off throughput for power consumption, with a
sample rate as low as zero.
8.4.2.1 Normal Mode
The fastest possible throughput is obtained by leaving the ADC in normal mode at all times, so there are no
power-up delays. To keep the device in normal mode continuously, CS must be kept low until after the 10th
falling edge of SCLK after the start of a conversion (remember that a conversion is initiated by bringing CS low).
If CS is brought high after the 10th falling edge, but before the 16th falling edge, the device remains in normal
mode, but the current conversion is aborted and the SDATA returns to TRI-STATE (truncating the output word).
Sixteen SCLK cycles are required to read all of a conversion word from the device. After sixteen SCLK cycles
have elapsed, CS may be idled either high or low until the next conversion. If CS is idled low, it must be brought
high again before the start of the next conversion, which begins when CS is again brought low.
After sixteen SCLK cycles, SDATA returns to TRI-STATE. Another conversion may be started, after tQUIET has
elapsed, by bringing CS low again.
8.4.2.2 Shutdown Mode
Shutdown mode is appropriate for applications that either do not sample continuously, or it is acceptable to trade
throughput for power consumption. When the ADC is in shutdown mode, all of the analog circuitry is turned off.
To enter shutdown mode, a conversion must be interrupted by bringing CS high anytime between the second
and tenth falling edges of SCLK, as shown in Figure 21. Once CS has been brought high in this manner, the
device enters shutdown mode, the current conversion is aborted and SDATA enters TRI-STATE. If CS is brought
high before the second falling edge of SCLK, the device does not change mode; this is to avoid accidentally
changing mode as a result of noise on the CS line.
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Device Functional Modes (continued)
Figure 21. Entering Shutdown Mode
Figure 22. Entering Normal Mode
To exit shutdown mode, bring CS back low. Upon bringing CS low, the ADC begins powering up (power-up time
is specified in Timing Requirements). This microsecond of power-up delay results in the first conversion result
being unusable. The second conversion performed after power up, however, is valid, as shown in Figure 22.
If CS is brought back high before the 10th falling edge of SCLK, the device returns to shutdown mode. This is
done to avoid accidentally entering normal mode as a result of noise on the CS line. To exit shutdown mode and
remain in normal mode, CS must be kept low until after the 10th falling edge of SCLK. The ADC is fully powered
up after 16 SCLK cycles.
VIN
D1 R1 C2
26 pF
VA
D2
C1
4 pF
Conversion Phase - Switch Open
Track Phase - Switch Closed
Copyright © 2016, Texas Instruments Incorporated
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
A typical application of the ADC is shown in Typical Application. Power is provided in this example by the Texas
Instruments LP2950 low-dropout voltage regulator (see LP295x-N Series of Adjustable Micropower Voltage
Regulators,SNVS764), available in a variety of fixed and adjustable output voltages. The power supply pin is
bypassed with a capacitor network placed close to the ADC. Because the reference for the ADC is the supply
voltage, any noise on the supply degrades device noise performance. To keep noise off the supply, use a
dedicated linear regulator for this device, or provide sufficient decoupling from other circuitry to keep noise off the
ADC supply pin. Because of the ADC's low power requirements, it is also possible to use a precision reference
as a power supply to maximize performance. The three-wire interface is shown connected to a microprocessor or
DSP.
9.1.1 Analog Inputs
An equivalent circuit for the ADC's input is shown in Figure 23. Diodes D1 and D2 provide ESD protection for the
analog inputs. At no time must the analog input go beyond (VA+ 300 mV) or (GND −300 mV), as these ESD
diodes begin to conduct, which could result in erratic operation. For this reason, the ESD diodes must not be
used to clamp the input signal.
The capacitor C1 in Figure 23 has a typical value of 4 pF, and is mainly the package pin capacitance. Resistor
R1 is the ON resistance of the track or hold switch, and is typically 500 Ω. Capacitor C2 is the ADC sampling
capacitor and is typically 26 pF. The ADC delivers best performance when driven by a low-impedance source to
eliminate distortion caused by the charging of the sampling capacitance. This is especially important when using
the ADC to sample AC signals. Also important when sampling dynamic signals is an anti-aliasing filter.
Figure 23. Equivalent Input Circuit
9.1.2 Digital Inputs and Outputs
The ADC digital inputs (SCLK and CS) are not limited by the same maximum ratings as the analog inputs. The
digital input pins are instead limited to 5.25 V with respect to GND, regardless of VA, the supply voltage. This
allows the ADC to be interfaced with a wide range of logic levels, independent of the supply voltage.
Copyright © 2016, Texas Instruments Incorporated
MICROPROCESSOR
DSP
SCLK
CS
SDATA
GND
VA
ADC081S021
LP2950 5V
1 PF0.1 PF 0.1 PF1 PF
VIN
17
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9.2 Typical Application
The ADC081S021 is a low-power, single-channel CMOS 8-bit analog-to-digital converter that uses the supply
voltage as a reference, enabling the devices to operate with a full-scale input range of 0 to VA. An example low
power application with the LMT87 which is a wide range ±0.3°C (typical) accurate temperature sensor is shown
in Figure 24.
Figure 24. Typical Application Circuit
9.2.1 Design Requirements
A successful ADC081S021 and LMT87 design is contrained by the following factors:
• VIN range needs to be 0 V to VA where VA can range from 2.7 V to 5.25 V
• Output level of the LMT87 can range from 538 mV to 3277 mV (which satisfies the VIN condition)
9.2.2 Detailed Design Procedure
Designing for an accurate measurement requires careful attention to timing requirements for the ADC081S021.
Because the ADC081S021 uses the supply voltage as a reference, it is important to make sure that the supply
voltage is settled to its final level before exiting the shutdown mode and beginning a conversion. After the supply
voltage is settled, the CS is brought to a low level (ideally 0 V) to start a conversion.
It is also important to ensure that any noise on the power supply must be less than ½ LSB in amplitude. The
supply voltage must be regarded as a precise voltage reference.
After the CS is brought low, the user needs to wait for one complete conversion cycle (approximately 1 μs) for
meaningful data. The dummy conversion cycle can be considered the start-up time of the ADC081S021.
The ADC081S021 digital output can then be correlated to the LMT87 output level to get an accurate temperature
reading. At VDD = 2.7 V, 1 LSB of ADC081S021 is 10.54 mV. This information can be used to calculate the
output level of LMT87 which can then be correlated to temperature.
000...001
000...010
0V
011...111
111...000
000...000
111...111
111...110
ADC CODE
ANALOG INPUT
1 LSB = VA/256
1 LSB +VA-1 LSB
||
|
0
500
1000
1500
2000
2500
3000
3500
±65 ±15 35 85 135 185
VOUT Level (mV)
Temperature (ƒC)
C001
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Typical Application (continued)
9.2.3 Application Curves
Figure 25. LMT87 Output Voltage vs Temperature Figure 26. Ideal Transfer Characteristic
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10 Power Supply Recommendations
The ADC takes time to power up, either after first applying VA, or after returning to normal mode from shutdown
mode. This corresponds to one dummy conversion for any SCLK frequency within the specifications in this
document. After this first dummy conversion, the ADC performs conversions properly.
NOTE
The tQUIET time must still be included between the first dummy conversion and the second
valid conversion.
When the VAsupply is first applied, the ADC may power up in either of the two modes: normal or shutdown. As
such, one dummy conversion must be performed after start-up, as described in the previous paragraph. The part
may then be placed into either normal mode or the shutdown mode, as described in Normal Mode and Shutdown
Mode.
When the ADC is operated continuously in normal mode, the maximum ensured throughput is fSCLK / 20 at the
maximum specified fSCLK. Throughput may be traded for power consumption by running fSCLK at its maximum
specified rate and performing fewer conversions per unit time, raising the ADC CS line after the 10th and before
the 15th fall of SCLK of each conversion. A plot of typical power consumption versus throughput is shown in
Typical Characteristics. To calculate the power consumption for a given throughput, multiply the fraction of time
spent in the normal mode by the normal mode power consumption and add the fraction of time spent in
shutdown mode multiplied by the shutdown mode power consumption. The curve of power consumption vs
throughput (Figure 17) is essentially linear. This is because the power consumption in the shutdown mode is so
small that it can be ignored for all practical purposes.
10.1 Noise Considerations
The charging of any output load capacitance requires current from the power supply, VA. The current pulses
required from the supply to charge the output capacitance causes voltage variations on the supply. If these
variations are large enough, they could degrade SNR and SINAD performance of the ADC. Furthermore,
discharging the output capacitance when the digital output goes from a logic high to a logic low dumps current
into the die substrate, which is resistive. Load discharge currents cause ground bounce noise in the substrate
that degrades noise performance if that current is large enough. The larger the output capacitance, the more
current flows through the die substrate and the greater is the noise coupled into the analog channel, degrading
noise performance.
To keep noise out of the power supply, keep the output load capacitance as small as practical. It is good practice
to use a 100-Ωseries resistor at the ADC output, placed as close to the ADC output pin as practical. This limits
the charge and discharge current of the output capacitance and maintain noise performance.
11 Layout
11.1 Layout Guidelines
Capacitive coupling between noisy digital circuitry and sensitive analog circuitry can lead to poor performance. TI
strongly recommends keeping the analog and digital circuitry separated from each other and the clock line as
short as possible.
Digital circuits create substantial supply and ground current transients. This digital noise could have significant
impact upon system noise performance. To avoid performance degradation due to supply noise, do not use the
same supply for the ADC081S021 that is used for digital logic.
Generally, analog and digital lines must cross each other at 90° to avoid crosstalk. However, to maximize
accuracy in high resolution systems, avoid crossing analog and digital lines altogether. It is important to keep
clock lines as short as possible and isolated from ALL other lines, including other digital lines. In addition, the
clock line must also be treated as a transmission line and be properly terminated.
The analog input must be isolated from noisy signal lines to avoid coupling of spurious signals into the input. Any
external component (that is, a filter capacitor) connected between the converter’s input pins and ground or to the
reference input pin and ground must be connected to a very clean point in the ground plane.
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Layout Guidelines (continued)
TI recommends the use of a single, uniform ground plane and the use of split power planes. The power planes
must be placed within the same board layer. All analog circuitry (input amplifiers, filters, reference components,
and so on) must be placed over the analog power plane. All digital circuitry and I/O lines must be placed over the
digital power plane. In addition, all components in the reference circuitry and the input signal chain that are
connected to ground must be connected together with short traces and enter the analog ground plane at a
single, quiet point.
11.2 Layout Example
Figure 27. DBV Package Layout
Figure 28. NGF Package Layout
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Device Nomenclature
ACQUISITION TIME is the time required to acquire the input voltage. That is, it is time required for the hold
capacitor to charge up to the input voltage. Acquisition time is measured backwards from the falling
edge of CS when the signal is sampled and the part moves from track to hold. The start of the time
interval that contains TACQ is the 13th rising edge of SCLK of the previous conversion when the part
moves from hold to track. The user must ensure that the time between the 13th rising edge of
SCLK and the falling edge of the next CS is not less than TACQ to meet performance specifications.
APERTURE DELAY is the time after the falling edge of CS when the input signal is acquired or held for
conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample.
Aperture jitter manifests itself as noise in the output.
CONVERSION TIMEis the time required, after the input voltage is acquired, for the ADC081S021 to convert the
input voltage to a digital word. This is from the falling edge of CS when the input signal is sampled
to the 16th falling edge of SCLK when the SDATA output goes into TRI-STATE.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The
specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise
and Distortion or SINAD. ENOB is defined as (SINAD −1.76) / 6.02 and says that the converter is
equivalent to a perfect ADC081S021 of this (ENOB) number of bits.
FULL POWER BANDWIDTHis a measure of the frequency at which the reconstructed output fundamental drops
3 dB below its low frequency value for a full scale input.
GAIN ERRORis the deviation of the last code transition (111...110) to (111...111) from the ideal (VREF −1 LSB),
after adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from
negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above
the last code transition). The deviation of any given code from this straight line is measured from
the center of that code value.
INTERMODULATION DISTORTION (IMD)is the creation of additional spectral components as a result of two
sinusoidal frequencies being applied to the ADC081S021 input at the same time. It is defined as
the ratio of the power in the second and third order intermodulation products to the sum of the
power in both of the original frequencies. IMD is usually expressed in dB.
MISSING CODES are those output codes that never appear at the ADC081S021 outputs. The ADC081S021 is
ensured not to have any missing codes.
OFFSET ERROR is the deviation of the first code transition (000...000) to (000...001) from the ideal (that is,
GND + 1 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the RMS value of the input signal to the RMS
value of the sum of all other spectral components below one-half the sampling frequency, not
including harmonics or DC
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the RMS value of
the input signal to the RMS value of all of the other spectral components below half the clock
frequency, including harmonics but excluding DC
2
1f
2
6f
2
2f
10
‡AA++A
log20=THD
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Device Support (continued)
SPURIOUS FREE DYNAMIC RANGE (SFDR)is the difference, expressed in dB, between the desired signal
amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral
component is any signal present in the output spectrum that is not present at the input and may or
may not be a harmonic.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB or dBc, of the RMS total of the first five
harmonic components at the output to the RMS level of the input signal frequency as seen at the
output. THD is calculated as where Af1 is the RMS power of
the input frequency at the output and Af2 through Af6 are the RMS power in the first 5 harmonic
frequencies.
THROUGHPUT TIME is the minimum time required between the start of two successive conversion. It is the
acquisition time plus the conversion time.
TOTAL UNADJUSTED ERROR is the worst deviation found from the ideal transfer function. As such, it is a
comprehensive specification which includes full scale error, linearity error, and offset error.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
LP295x-N Series of Adjustable Micropower Voltage Regulators,SNVS764
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
SPI, QSPI, MICROWIRE, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
ADC081S021CIMF NRND SOT-23 DBV 6 1000 Non-RoHS
& Green Call TI Call TI -40 to 85 X09C
ADC081S021CIMF/NOPB ACTIVE SOT-23 DBV 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 X09C
ADC081S021CIMFX/NOPB ACTIVE SOT-23 DBV 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 X09C
ADC081S021CISD/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 X9C
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 11-Jan-2021
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
ADC081S021CIMF SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
ADC081S021CIMF/NOPB SOT-23 DBV 6 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
ADC081S021CIMFX/NOP
BSOT-23 DBV 6 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
ADC081S021CISD/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADC081S021CIMF SOT-23 DBV 6 1000 210.0 185.0 35.0
ADC081S021CIMF/NOPB SOT-23 DBV 6 1000 210.0 185.0 35.0
ADC081S021CIMFX/NOP
BSOT-23 DBV 6 3000 210.0 185.0 35.0
ADC081S021CISD/NOPB WSON NGF 6 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
MECHANICAL DATA
NGF0006A
www.ti.com
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
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EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/B 03/2018
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
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EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
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