1. General description
The CBT3245A provides eight bits of high-speed TTL-compatible bus switching. The low
ON resistance of the switch allows connections to be made with minimal propagation
delay.
The CBT3245A is organized as one 8-bit bus switches with one outp ut enable (OE) input.
When OE is LOW, the switch is on and port A is connected to the B port. When OE is
HIGH, each switch is disabled. The CBT3245A is characterized for operation from 40 C
to +85 C.
2. Features and benefits
5 switch connection between two ports
TTL-compatible control input levels
Multiple package options
Latch-up protection exceeds 500 mA per JESD78
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115B exceeds 150 V
CDM JESD22-C101C exceeds 1000 V
3. Ordering information
[1] Also known as QSOP20 package
CBT3245A
Octal bus switch
Rev. 3 — 5 January 2012 Product data sheet
Table 1. Ordering information
Type number Package
Temperature
range Name Description Version
CBT3245AD 40 C to +85 C SO20 plastic small outline package; 20 leads;
body width 7.5 mm SOT163-1
CBT3245ADB 40 C to +85 C SSOP20 plastic shrink small outline package; 20 leads;
body width 5.3 mm SOT339-1
CBT3245ADS 40 C to +85 C SSOP20[1] plastic shrink small outline package; 20 leads; body
width 3.9 mm; lead pitch 0.635 mm SOT724-1
CBT3245APW 40 C to +85 C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm SOT360-1
CBT3245ABQ 40 C to +85 C DHVQFN20 plastic dual-in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals; body
2.5 4.5 0.85 mm
SOT764-1
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Product data sheet Rev. 3 — 5 January 2012 2 of 16
NXP Semiconductors CBT3245A
Octal bus switch
4. Functional diagram
5. Pinning information
5.1 Pinning
Fig 1. Logic diag ra m
001aao117
A1 18 B1
2
A8 11 B8
9
OE 19
Fig 2. Pin configuration for SOT163-1 (SO20),
SOT339-1 (SSOP20) and SOT360-1 (TSSOP20) Fig 3. Pin configuration for SOT724-1 (SSOP20)
CBT3245A
n.c. VCC
A1 OE
A2 B1
A3 B2
A4 B3
A5 B4
A6 B5
A7 B6
A8 B7
GND B8
aaa-001831
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
CBT3245A
n.c. VCC
A1 OE
A2 B1
A3 B2
A4 B3
A5 B4
A6 B5
A7 B6
A8 B7
GND B8
aaa-001832
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
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Product data sheet Rev. 3 — 5 January 2012 3 of 16
NXP Semiconductors CBT3245A
Octal bus switch
5.2 Pin description
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state.
(1) This is not a supply pin. The substrate is attached to this pad using conductive die attach material. There is no electrical or
mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to
GND.
Fig 4. Pin configuration for SOT764-1 (DHVQFN20)
aaa-001833
CBT3245A
Transparent top view
B7
GND(1)
A7
A8
B6
A6 B5
A5 B4
A4 B3
A3 B2
A2 B1
A1 OE
GND
B8
n.c.
VCC
912
813
714
615
516
417
318
219
10
11
1
20
terminal 1
index area
Table 2. Pin description
Symbol Pin Description
n.c. 1 not connected
A1 to A8 2, 3, 4, 5, 6, 7, 8, 9 data input/output (A port)
GND 10 ground (0 V)
B1 to B8 18, 17, 16, 15, 14, 13, 12, 11 data input/output (B port)
OE 19 output enable input (active LOW)
VCC 20 positive supply voltage
Table 3. Function selection[1]
Input Input/output
OE An, Bn
LAn = Bn
HZ
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Product data sheet Rev. 3 — 5 January 2012 4 of 16
NXP Semiconductors CBT3245A
Octal bus switch
7. Limiting values
[1] S tresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under Section 8. is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
[2] The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
8. Recommended operating conditions
9. Static characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Tamb =
40
C to +85
C, unless otherwise specified.
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7.0 V
VIinput voltage [2] 0.5 +7.0 V
IOK output clamping current VO<0V 50 - mA
VOoutput voltage [2] 0.5 +7.0 V
IOoutput current VO<0V - 128 mA
IIK input clamping current VI=0V 50 - mA
Tstg storage temp erature 65 +150 C
Table 5. Operating conditions
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation.
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.0 - 5.5 V
VIH HIGH-level input voltage 2.0 - - V
VIL LOW-level input voltage - - 0.8 V
Tamb ambient temperature operating in free air 40 - +85 C
Table 6. Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb = 40 C to +85 CUnit
Min Typ[1] Max
VIK input clamping voltage VCC =4.5V; I
I=18 mA - - 1.2 V
IIinput leakage current VCC =5.5V; V
I= GND or 5.5 V - - 5A
ICC supply current VCC =5.5V; I
O=0mA;
VI=V
CC or GND -13A
ICC additional supply current per input pin; VCC = 5.5 V; one input at
3.4 V, other inputs at VCC or GND [2] --3.5mA
CIinput capacitance control pins; VI=3V or 0V - 3.2 - pF
Cio(off) off-state input/output
capacitance port off; VI= 3 V or 0 V; OE =V
CC -6.6-pF
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Product data sheet Rev. 3 — 5 January 2012 5 of 16
NXP Semiconductors CBT3245A
Octal bus switch
[1] All typical values are at VCC =5V, T
amb =25C.
[2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
[3] Measured by the voltage drop between the An and the Bn terminals at the indicated current through the switch. ON resistance is
determined by the lowest voltage of the two (An or Bn) terminals.
10. Dynamic characteristics
[1] The propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
[2] tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
RON ON resistance VCC =4.5V; V
I=0V; I
I=64mA [3] -57
VCC =4.5V; V
I=0V; I
I=30mA [3] -57
VCC =4.5V; V
I=2.4V; I
I=15 mA [3] -1015
Table 6. Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Tamb = 40 C to +85 CUnit
Min Typ[1] Max
Table 7. Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). Fo r test circuit see Figure 7.
Symbol Parameter Conditions Tamb = 40 C to +85 CUnit
Min Max
tpd propagation delay An, Bn to Bn, An; see Figure 5 [1][2]
VCC = 5.0 V 0.5 V - 0.25 ns
ten enable time OE to An or Bn; see Figure 6 [2]
VCC = 5.0 V 0.5 V 1.0 5.9 ns
tdis disable time OE to An or Bn; see Figure 6 [2]
VCC = 5.0 V 0.5 V 1.0 6.0 ns
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Product data sheet Rev. 3 — 5 January 2012 6 of 16
NXP Semiconductors CBT3245A
Octal bus switch
11. Waveforms
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 5. The dat a inp ut (An, Bn) to ou tput (Bn, An) propagation delay times
001aam475
An, Bn input
Bn, An output
GND
VOH
VM
tPLH
tPHL
VM
VOL
VI
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6. Enable and disable times
001aam476
OE input
output
LOW-to-OFF
OFF-to-LOW
output
HIGH-to-OFF
OFF-to-HIGH
VI
VM
VOL
VOH
3.5 V
GND
GND
VM
VX
tPLZ tPZL
tPZH
tPHZ
outputs
disabled outputs
enabled
outputs
enabled
VYVM
Table 8. Measurement points
Supply voltage Input Output
VCC VIVMVMVXVY
VCC = 5.0 V 0.5 V GND to 3.0 V 1.5 V 1.5 V VOL + 0.3 V VOH 0.3 V
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Product data sheet Rev. 3 — 5 January 2012 7 of 16
NXP Semiconductors CBT3245A
Octal bus switch
12. Test information
Test data is given in Table 9.
All input pulses are supplied by generators having the following characteristics: PRR 10 MHz; Zo=50.
The outputs are measured one at a time with one transition per measurement.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 7. Test circuit for measuring switching times
V
M
V
M
t
W
t
W
10 %
90 %
0 V
V
I
V
I
negative
pulse
positive
pulse
0 V
V
M
V
M
90 %
10 %
t
f
t
r
t
r
t
f
001aae331
V
EXT
V
CC
V
I
V
O
DUT
CL
RT
RL
RL
G
Table 9. Test data
Supply voltage Input Load VEXT
VItr, tfCLRLtPLH, tPHL tPLZ, tPZL tPHZ, tPZH
VCC = 5.0 V 0.5 V GND to 3.0 V 2.5 ns 50 p F 500 open 7.0 V open
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Product data sheet Rev. 3 — 5 January 2012 8 of 16
NXP Semiconductors CBT3245A
Octal bus switch
13. Package outline
Fig 8. Package outline SOT163-1 (SO20)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
99-12-27
03-02-19
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Product data sheet Rev. 3 — 5 January 2012 9 of 16
NXP Semiconductors CBT3245A
Octal bus switch
Fig 9. Package outline SOT339-1 (SSOP20)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQ(1)
Zywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 7.4
7.0 5.4
5.2 0.65 7.9
7.6 0.9
0.7 0.9
0.5 8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150 99-12-27
03-02-19
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
A
max.
2
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Product data sheet Rev. 3 — 5 January 2012 10 of 16
NXP Semiconductors CBT3245A
Octal bus switch
Fig 10. Package outline SOT724-1 (SSOP20)
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Product data sheet Rev. 3 — 5 January 2012 11 of 16
NXP Semiconductors CBT3245A
Octal bus switch
Fig 11. Package outline SOT360-1 (TSSOP20)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153 99-12-27
03-02-19
wM
bp
D
Z
e
0.25
110
20 11
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.1
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Product data sheet Rev. 3 — 5 January 2012 12 of 16
NXP Semiconductors CBT3245A
Octal bus switch
Fig 12. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.6
4.4
Dh
3.15
2.85
y1
2.6
2.4 1.15
0.85
e1
3.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
29
19 12
11
10
1
20
X
D
E
C
BA
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
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Product data sheet Rev. 3 — 5 January 2012 13 of 16
NXP Semiconductors CBT3245A
Octal bus switch
14. Abbreviations
15. Revision history
Table 10. Abbreviations
Acronym Description
CDM Charged Device Model
ESD ElectroStatic Discharge
DUT Device Under Test
HBM Human Body Model
MM Machine Model
PRR Pulse Rate Repetition
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Relea se date Data sheet status Change notice Supersedes
CBT3245A v.3 20120105 Product data sheet - CBT3245A v.2
Modifications: •The format of this document has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
•Marking code removed from order info rma ti o n section.
•Description of CI and CI/O corrected (errata).
CBT3245A v.2 20020627 Product data sheet - CBT3245A v.1
CBT3245A v.1 20020218 Product data sheet - -
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Product data sheet Rev. 3 — 5 January 2012 14 of 16
NXP Semiconductors CBT3245A
Octal bus switch
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information se e the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat ion — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
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Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
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Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-crit ical or
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malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or envi ronmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
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Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
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NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings onl y and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyri ghts, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
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NXP Semiconductors CBT3245A
Octal bus switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product i s automotive qualified,
the product is not suitable for automo tive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automo tive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever cust omer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product cl aims resulting f rom customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors CBT3245A
Octal bus switch
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 January 2012
Document identifier: CBT3245A
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 3
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 4
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
12 Te st information. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
17 Contact information. . . . . . . . . . . . . . . . . . . . . 15
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16