Page 1
QW-JP049
REV:A
Comchip Technology CO., LTD.
CPDT-5V0USP-HF
Mechanical data
- Case: SOT-23 Standard package, molded
plastic.
- Mounting position: Any.
- Weight: 0.0078 grams(approx.).
- Terminals: Solderable per MIL-STD-750,
method 2026.
Low Capacitance SMD ESD Protection Diode
RoHS Device
Halogen Free
Company reserves the right to improve product design , functions and reliability without notice.
Dimensions in inches and (millimeter)
SOT-23
3
1 2
0.118(3.00)
0.110(2.80)
0.055(1.40)
0.047(1.20)
0.079(2.00)
0.071(1.80)
0.045(1.15)
0.035(0.90)
0.020(0.50)
0.012(0.30)
0.006(0.15)
0.003(0.08)
0.100(2.55)
0.089(2.25)
0.004(0.10)
0.012(0.30)
0.020(0.50)
0.000(0.00)
Circuit diagram
3
1 2
Maximum Rating (at TA=25°C unless otherwise noted)
Symbol
Parameter Value Unit
Conditions
Peak pulse power PPP W
76
Operation temperature range Tj°C
Storage temperature range TSTG -55~+150 °C
-55~+150
Symbol Typ
Parameter Min Max Unit
Conditions
Breakdown voltage VBR V
IT = 1mA
6
Reverse leakage current IRuA
VRWM = 5V 0.5
Clamping voltage VCV
12
IPP = 1A, TP = 8/20us
IPP = 4A, TP = 8/20us 19
V
Working peak reverse voltage VRWM
5
Peak pulse current IPP A
TP = 8/20us 4
TP = 8/20us
Junction capacitance 0.45
CJpF
VR = 0V, f = 1MHz (I/O pin to I/O pin)
Electrical Characteristics (at TA=25°C unless otherwise noted)
0.3
ESD kV
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
ESD capability ±15
±8
Forward voltage VFV
IF = 10mA 1.2
CJpF
VR = 0V, f = 1MHz (I/O pin to GND pin)0.6
- IEC61000-4-2 Level 4 ESD protection
- Surface mount package.
- High component density.
Features
0.9
RATING AND CHARACTERISTIC CURVES (CPDT-5V0USP-HF)
Page 2
REV:A
Comchip Technology CO., LTD.
QW-JP049
Company reserves the right to improve product design , functions and reliability without notice.
Power Rating (%)
Ambient Temperature, ( °C )
Mounting on glass epoxy PCBs
0
20
40
60
80
100
120
Clamping Voltage, (V)
Fig.4 - Clamping Voltage Vs.
Peak Pulse Current
Peak Pulse Current, (A)
4
4
0
12
16
8
3
21
8/20us waveform
25 50 75 1000 125
Capacitance Between Terminals, (pF)
Reverse Voltage, (V)
Fig.5 - Capacitance Between
Terminals Characteristics
Fig.2 - Power Rating Derating Curve
20
Time, (us)
0%
20%
40%
60%
80%
100%
0 5 15 25 3010 20
120%
Percentage of Ipp
Ta=25°C Peak Valur Ipp
Test Waveform
parameters
tf=8us
td=20us
e
-t
td= t Ipp/2
Fig.1 - 8/20us Peak Pulse Current
Wave Form Acc. IEC 61000-4-5
1.00.90.80.70.5 0.6
0
1
10
Forward Current, (mA)
Forward Voltage, ( V )
Fig.3 - Forward Characteristic
25°C
50°C
75°C
150°C
125°C
100°C
150
0.0
0.3
0.9
0.6
01 2 35
4
I/O Pin to I/O Pin
I/O Pin to GND
Low Capacitance SMD ESD Protection Diode
Page 3
REV:A
Comchip Technology CO., LTD.
QW-JP049
Reel Taping Specification
XXX
d
F E
B
P1 P0
o
120
D1
D2
D
W1
Company reserves the right to improve product design , functions and reliability without notice.
B C dD D2D1
SOT-23
SYMBOL
A
(mm)
(inch) 2.142 ± 0.039
4.00 ± 0.10
1.50 ± 0.10 54.40 ± 1.00 13.00 ± 1.00
4.00 ± 0.10 2.00 ± 0.10
178.00 ± 2.00
0.059 ± 0.004 7.008 ± 0.079 0.512 ± 0.039
SYMBOL
(mm)
(inch) 0. ± 0.004157 0.157 ± 0.004 0.079 ± 0.004
E F P P0P1W W1
1.75 ± 0.10
0.069 ± 0.004
3.50 ± 0.10
0.138 ± 0.004
SOT-23
3.15 ± 0.10
0.124 ± 0.004
2.77 ± 0.10
0.109 ± 0.004
1.22 ± 0.10
0.048 ± 0.004
12.30 ± 1.00
0.484 ± 0.039
8.00 + 0.30 / - 0.10
0.315 + 0.012 / - 0.004
Low Capacitance SMD ESD Protection Diode
Marking Code
Part Number
CPDT-5V0USP-HF
Marking Code
E5UP E5UP
3
1 2
Page 4
REV:A
Comchip Technology CO., LTD.
QW-JP049
Standard Packaging
Case Type
3,000
REEL
( pcs )
Reel Size
(inch)
7
REEL PACK
SOT-23
Suggested PAD Layout
Company reserves the right to improve product design , functions and reliability without notice.
A
C
B
D
E
SIZE
(inch)
0.031
(mm)
0.80
1.90
2.02
0.075
0.080
SOT-23
2.82 0.111
A
B
C
D
0.80 0.031
E
Low Capacitance SMD ESD Protection Diode
