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SUBMINATURE MONOLITHIC TVS ARRAYS
APPLICATIONS
Ethernet - 10 Base T
Cellular Phones
Handheld Electronics
FireWire & USB Interfaces
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
350 Watts P eak Pulse Power per Line (8/20µs)
Low Clamping V oltage
A vailab le in Multiple V oltage Types Ranging from 3V to 24V
Unidirectional & Bidirectional Configurations
Low Standby Current
MECHANICAL CHARACTERISTICS
Molded JEDEC SOT-23-6
Weight 0.6 grams (Approximate)
Flammability Rating UL 94V -0
8mm Tape and Reel Per EIA Standard 481-1-A
Device Marking: Marking Code & Logo
Pin One Defined By DO T on Top of P ackage
CIRCUIT DIAGRAMS
SOT-23-6
3
1
5
6
2
4
3
1
5
6
2
4
UNIDIRECTIONAL BIDIRECTIONAL
05095
. . . engineered solutions for the transient environment™
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
Operating T emperature
SYMBOL VALUE
-55°C to 150°C
°C
-55°C to 150°C
UNITS
TJ
TSTG
PARAMETER
Storage T emperature
P eak Pulse P ow er (tp = 8/20µs) - See Figure 1 PPP 350 Watts
Note 1: Part numbers with an additional “C” suffix are bidirectional devices, i.e., PSMS05C.
Note 2:
Unidirectional Only:
Test between pin 1 to 2 or 5, 4 to 2 or 5, 6 to 2 or 5, 3 to 2 or 5.
Note 3:
Bidirectional Only:
Test between pin 5 to 1 or 3 or 4 or 6. Electr ical characteristics apply in both directions.
Note 4:
Unidirectional Only:
Capacitance measured between pins 1, 3, 4, 6, to 2.
Bidirectional Only:
Capacitance measured between pins 1, 3, 4, 6
to 5.
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Notes 1,
2 & 3)
DEVICE
MARKING MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ IP = 1A
VC
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20µs
VC @ IPP
TYPICAL
CAPACITANCE
(See Note 4)
0V @ 1 MHz
C
pF
PSMS03
PSMS03C
PSMS05
PSMS05C
PSMS12
PSMS12C
PSMS15
PSMS15C
PSMS24
PSMS24C
PRG
PRP
PRH
PRL
PRI
PRM
PRJ
PRN
PRK
PRO
4.0
4.0
6.0
6.0
13.3
13.3
16.7
16.7
26.7
26.7
6.5
6.5
9.8
9.8
19
19
24
24
40
40
17.5V @ 20A
17.5V @ 20A
21.0V @ 17.0A
21.0V @ 17.0A
29.2V @ 12.0A
29.2V @ 12.0A
34.6V @ 10.0A
34.6V @ 10.0A
58.3V @ 6.0A
58.3V @ 6.0A
300
150
150
75
80
40
50
25
40
20
MAXIMUM
LEAKAGE
CURRENT
@VWM
ID
µA
75
75
20
20
1
1
1
1
1
1
RATED
STAND-OFF
VOLTAGE
VWM
VOLTS
3.3
3.3
5.0
5.0
12.0
12.0
15.0
15.0
24.0
24.0
0 5 10 15 20 25 30
t - Time - µs
0
20
40
60
80
100
120 TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
tfP eak V alue IPP
e-t
td = t IPP/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
td - Pulse Duration - µs
IPP - Peak Pulse Current - % of IPP
10
100
1,000
10,000
PPP - Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
350W , 8/20µs W avef orm
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GRAPHS
5 Volts per Division
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PSMS05C
ESD Test Pulse: 25 kilovolt, 1/30ns (waveform)
0
10
20
30
40
0 25 50 75 100 125 150
TL - Lead Temperature - °C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20µs
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 5
TYPICAL REVERSE VOLTAGE VS CAPACITANCE
0 1 2 3 4 5
VR - Reverse Voltage - Volts
C - Capacitance - pF
PSMS05
0
40
80
120
160
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APPLICATION NOTES
The PSMS Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD (> 25kV) or EFT. This product series
provides both unidiretional and bidirectional protection, with a surge capability of 350 Watts PPP per line for an 8/20µs waveform.
UNIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 1)
The PSMS Series provides up to four (4) lines of protection in a common mode configuration as depicted in Figure 1.
Circuit connectivity is as follows:
Line 1 is connected to Pin 1.
Line 2 is connected to Pin 3.
Line 3 is connected to Pin 4.
Line 4 is connected to Pin 6.
Pin 5 is connected to ground.
Pin 2 is not connected.
BIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 1)
The PSMSxxC Series provides up to four (4) lines of protection in a common
mode configuration as depicted in Figure 2.
Circuit connectivity is as follows:
Line 1 is connected to Pin 1.
Line 2 is connected to Pin 3.
Line 3 is connected to Pin 4.
Line 4 is connected to Pin 5.
Pin 6 is connected to ground.
Pin 2 is not connected.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic Compat-
ibility (EMC) protection. The following guidelines are
recommended:
The protection device should be placed near the input
terminals or connectors, the device will divert the
transient current immediately before it can be coupled
into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground loops
should be minimized.
The transient current return path to ground should be
kept as short as possible to reduce parasitic induc-
tance.
Ground planes should be used whenever possible.
For multilayer PCBs, use ground vias.
31
56
2
4
Figure 2 - Bidirectional Configuration
Common-Mode I/O Port Protection
LINE 1
LINE 2
LINE 3
LINE 4
I/O PORT
31
56
2
4
Figure 1 - Unidirectional Configuration
Common-Mode I/O Port Protection
LINE 1
LINE 2
LINE 3
LINE 4
I/O PORT
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COPYRIGHT © ProTek Devices 2001
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyers and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
TAPE & REEL PACKAGING:
Surface mount product is taped and reeled in accordance with EIA-481, reel quantites
and sizes are as follows:
7 Inch Reel - 3,000 pieces per reel; 13 Inch Reel - 10,000 pieces per reel
E
D
A
L
F
54
3
6
B
G
V
J
C
K0º - 10º
12
MJA
B
C
D
E
F
G
J
K
L
M
2.80
1.50
0.90
0.35
0.85
1.70
0.90
0.090
2.60
0.20 TYP
0.35
3.05
1.75
1.30
0.50
1.05
2.10
1.45
0.20
3.00
0.20 TYP
0.55
0.110
0.059
0.036
0.014
0.033
0.067
0.036
0.0035
0.102
0.007 TYP
0.014
0.120
0.070
0.051
0.020
0.040
0.083
0.057
0.008
0.118
0.007 TYP
0.022
DIM MIN MAX MIN MAX
MILLIMETERS INCHES
PACKAGE DIMENSIONS
NOTES:
1. Dimensioning and tolerances per ANSI Y14.5M,
1985.
2. Controlling Dimension: Inches
3. Dimensions are exclusive of mold flash and metal
burrs.
PACKAGE OUTLINE SOT-23-6
MOUNTING PAD
0.094 (2.40mm)
0.028 (0.70mm)
0.037 (0.95mm)
0.074 (1.90mm)
0.039 (1.00mm) 06013 Rev 1 - 11/01