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Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com
QT581 AND QT588 SERIES
ULTRA-LOW CURRENT, HIGH-TEMPERATURE REAL TIME CLOCK OSCILLATORS
2.5Vdc and 3.3Vdc - 32.768kHz
Q-TECH
CORPORATION
QT581 and QT588 Series (Rev-, December 2010)
Embossed Tape and Reel Information For QT588
Environmental Specifications
The five transition periods for the typical reflow process are:
• Preheat
• Flux activation
• Thermal equalization
• Reflow
• Cool down
Dimensions are in mm. Tape is compliant to EIA-481-A.
Reel size vs. quantity:
Ø178±1
26
FEEDING (PULL) DIRECTION
Ø13.0±0.5
120°
2.5
4.699±0.1 Ø1.5
16±0.1
2.0
1.75±0.1
0.3±.005
2.0±0.1
7.747±0.1
4.0±0.1
or
Ø330±1
Ø1.5
9.271
5°Max
24.0±0.3
11.5
Reel size (Diameter in mm)
Qty per reel (pcs)
178
150
330
800
Q-Tech Standard Screening/QCI (MIL-PRF55310) is available for all of our QT581 and QT588 series. Q-Tech can also customize
screening and test procedures to meet your specific requirements. The QT581 and QT588 series are designed and processed to exceed
the following test conditions:
Environmental Test Test Conditions
Temperature cycling MIL-STD-883, Method 1010, Cond. B
Constant acceleration MIL-STD-883, Method 2001, Cond. A, Y1
Seal: Fine and Gross Leak MIL-STD-883, Method 1014, Cond. A and C
Burn-in 160 hours, 125°C with load
Aging 30 days, 70°C, ±1.5ppm max
Vibration sinusoidal MIL-STD-202, Method 204, Cond. D
Shock, non operating MIL-STD-202, Method 213, Cond. I (See Note 1)
Thermal shock, non operating MIL-STD-202, Method 107, Cond. B
Ambient pressure, non operating MIL-STD-202, 105, Cond. C, 5 minutes dwell time minimum
Resistance to solder heat MIL-STD-202, Method 210, Cond. B
Moisture resistance MIL-STD-202, Method 106
Terminal strength MIL-STD-202, Method 211, Cond. C
Resistance to solvents MIL-STD-202, Method 215
Solderability MIL-STD-202, Method 208
ESD Classification MIL-STD-883, Method 3015, Class 1 HBM 0 to 1,999V
Moisture Sensitivity Level J-STD-020, MSL=1
Note 1: Additional shock results successfully passed on 16MHz, 20MHz, 24MHz, 40MHz, and 80MHz
• Shock 850g peak, half-sine, 1 ms duration (MIL-STD-202, Method 213, Cond. D modified)
• Shock 1,500g peak, half-sine, 0.5ms duration (MIL-STD-883, Method 2002, Cond. B)
• Shock 36,000g peak, half-sine, 0.12 ms duration
Please contact Q-Tech for higher shock requirements
0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420 Time (s)
25
50
75
100
125
150
175
200
225
250
TEMP(*C)
0
60s min.
120s max.
60s min.
120s max.
225º min.
240º max.
60s min.
150s max.
240º
Ramp down (6ºC/s Max)
Ramp up (3ºC/s Max)
TYPICAL REFLOW PROFILE FOR Sn-Pb ASSEMBLY
Reflow Profile