MAX6685/MAX6686
Detailed Description
The MAX6685/MAX6686 dual-output remote-sensing
junction temperature switches incorporate a precision
remote-junction temperature sensor and two compara-
tors. These devices use an external P-N junction as the
temperature-sensing element (see Typical Operating
Circuits).
The MAX6685/MAX6686 provide noise immunity by
integration and oversampling of the diode voltage, but
good design practice includes routing the DXP and
DXN lines away from noise sources, such as high-
speed digital lines, switching regulators, inductors, and
transformers. The DXP and DXN traces should be
paired together and surrounded by a ground plane
whenever possible.
The 5°C hysteresis keeps the outputs from “chattering”
when the measured temperature is close to the threshold
temperature. The MAX6685/MAX6686 are available with
preset upper temperature thresholds of +120°C or
+125°C. The lower temperature thresholds are pin pro-
grammable in 5°C increments (Table 1). Two tempera-
ture ranges are available for the lower trip threshold:
+40°C to +80°C and +75°C to +115°C. S1 and S2 pins
must be set to the desired trip temperature before power
is applied to the VDD pin. If this is done after the power is
turned on, the lower trip threshold remains set to the
point where S1 and S2 were when power was applied.
Applications Information
Remote-Diode Selection
The MAX6685/MAX6686 are optimized to measure the
die temperature of CPUs and other ICs that have on-chip
temperature-sensing diodes. These on-chip diodes are
substrate PNPs with their collectors grounded. Connect
the base of the PNP to DXN and the emitter to DXP. When
using a discrete, diode-connected NPN or PNP as a
sensing diode, use a good-quality small-signal device.
Examples are listed in Table 2. Tight specifications for for-
ward current gain indicate the manufacturer has good
process controls and that the devices have consistent
Vbe characteristics. Always use a transistor for the sens-
ing junction; diodes do not work.
Dual-Output Remote-Junction
Temperature Switches
4 _______________________________________________________________________________________
Pin Description
PIN
MAX6685 MAX6686 NAME FUNCTION
11V
DD Power-Supply Input. Bypass to GND with a 0.1µF capacitor.
2 2 GND Ground
3 3 DXP This pin connects to the positive (anode) terminal of the external P-N sense junction. It sources
current into the external junction. A 2200pF capacitor should be connected across DXP and DXN.
4 4 DXN
This pin connects to the negative (cathode) terminal of the external P-N sense junction. It sinks
current from the external junction. A 2200pF capacitor should be connected across DXP and
DXN. DXN must be connected to the GND pin with the shortest possible connection.
55T
HIGH
Open-Drain, Active-Low Output. THIGH goes low when the temperature exceeds the factory-
programmed upper temperature threshold, either +120°C or +125°C. Connect a pullup resistor
(typically 10kΩ) between THIGH and a positive supply up to 5.5V.
6—T
LOW CMOS Push-Pull, Active-High Output. TLOW goes HIGH when the temperature exceeds the pin-
programmed lower temperature threshold.
—6T
LOW
Open-Drain, Active-Low Output. TLOW goes LOW when the temperature exceeds the pin-
programmed lower temperature threshold. Connect a pullup resistor (typically 10kΩ) between
TLOW and a positive supply up to 5.5V.
77S1
Threshold Select Input. Used in conjunction with S2 to set the lower threshold for TLOW (Table 1).
It can be connected to VDD, GND, or left floating.
88S2
Threshold Select Input. Used in conjunction with S1 to set the lower threshold for TLOW (Table 1).
It can be connected to VDD, GND, or left floating.