260 CLA-V
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Aluminum Electrolytic Capacitors
SMD (Chip), High Temperature, Low Impedance
High Vibration Capability
Fig. 1
FEATURES
Useful life: up to 2000 h at 150 °C
High reliability
•Low ESR
Polarized aluminum electrolytic capacitors,
non-solid electrolyte, self healing
SMD-version with base plate, lead (Pb)-free reflow
solderable
Charge and discharge proof, no peak current limitation
High temperature reflow soldering according to JEDEC®
J-STD-020
High temperature proof
Vibration proof, 6-pin version up to 30 g
AEC-Q200 qualified
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
SMD technology, for high temperature reflow soldering
High temperature environment, high peak load
Automotive, industrial
Smoothing, filtering, buffering
MARKING
Rated capacitance (in μF)
Rated voltage (in V)
Date code, in accordance with IEC 60062
Black mark or “-” sign indicating the cathode (the anode is
identified by beveled edges)
Code indicating group number (A)
PACKAGING
Supplied in blister tape on reel
QUICK REFERENCE DATA
DESCRIPTION VALUE
Nominal case sizes
(L x W x H in mm)
16 x 16 x 16
to 18 x 18 x 21
Rated capacitance range, CR150 μF to 3300 μF
Tolerance on CR± 20 %
Rated voltage range, UR16 V to 80 V
Category temperature range -55 °C to +150 °C
Endurance test at 150 °C 1000 h to 1500 h
Useful life at 150 °C 1500 h to 2000 h
Useful life at 40 °C
1.8 x lR applied 300 000 h to 400 000 h
Shelf life at 0 V, 150 °C 1000 h
Based on sectional
specification IEC 60384-18 / CECC 32300
Climatic category IEC 60068 55 / 150 / 56
lower Z
lower Z
higher IR
high
vibration
150 CRZ
105 °C
146 CTI
125 °C
140 CRH
125 °C
260 CLA-V
higher temperature
160 CLA
150 °C
260 CLA-V
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Fig. 1 - Dimensional outline
Table 1
SELECTION CHART FOR CR, UR, AND RELEVANT NOMINAL CASE SIZES (L x W x H in mm)
CR
(μF)
UR (V)
16 25 35 50 63 80
150 →→→→→16 x 16 x 16
220 →→→→16 x 16 x 16 18 x 18 x 16
330 →→→16 x 16 x 16 18 x 18 x 16 18 x 18 x 21
470 →→16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 -
680 16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 -
1000 16 x 16 x 16 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 - -
1500 18 x 18 x 16 16 x 16 x 21 18 x 18 x 21 - - -
2200 16 x 16 x 21 18 x 18 x 21 - - - -
2700 18 x 18 x 21 - - - - -
3300 18 x 18 x 21 - - - - -
DIMENSIONS in millimeters AND MASS
NOMINAL
CASE SIZE
L x W x H
CASE
CODE LMAX. WMAX. HMAX. Ø D BMAX. SL1
MAX. MASS
(g)
16 x 16 x 16 1616 16.6 16.6 17.5 16.0 1.3 6.5 18.6 5.8
16 x 16 x 21 1621 16.6 16.6 22.0 16.0 1.3 6.5 18.6 7.1
18 x 18 x 16 1816 19.0 19.0 17.5 18.0 1.3 6.5 21.0 8.0
18 x 18 x 21 1821 19.0 19.0 22.0 18.0 1.3 6.5 21.0 9.3
WMAX.
LMAX.
HMAX.
D
6-pin:
Ø 16 mm
S
B
35V
1000u
H4E A
max. 0.3
min. 0.4 / max. 1.0 (2 x)
L1MAX.
260 CLA-V
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Table 2
Note
Detailed tape dimensions see section “PACKAGING”
MOUNTING
The capacitors are designed for automatic placement on to
printed-circuit boards.
Optimum dimensions of soldering pads depend amongst
others on soldering method, mounting accuracy, print
layout and / or adjacent components.
For recommended soldering pad dimensions, refer to Fig. 3
and Table 3.
SOLDERING
Soldering conditions are defined by the curve, temperature
versus time, where the temperature is that measured on the
component during processing.
For maximum conditions refer to Fig. 4.
Any temperature versus time curve which does not exceed
the specified maximum curves may be applied.
As a general principle, temperature and duration shall be the
minimum necessary required to ensure good soldering
connections. However, the specified maximum curves
should never be exceeded.
Fig. 2 - Recommended soldering pad dimensions
Table 3
TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES
NOMINAL
CASE SIZE
L x W x H
CASE
CODE
PITCH
P1
TAPE WIDTH
W
TAPE
THICKNESS
T2
REEL DIAMETER
PACKAGING
QUANTITY
PER REEL
16 x 16 x 16 1616 28 44 18.9 380 150
16 x 16 x 21 1621 28 44 23.4 380 100
18 x 18 x 16 1816 32 44 18.9 380 125
18 x 18 x 21 1821 32 44 23.4 380 100
RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters
CASE CODE a b c
1616 7.8 9.6 4.7
1621 7.8 9.6 4.7
1816 8.8 9.6 4.7
1821 8.8 9.6 4.7
Case size Ø D 16 mm
a
a
b
c
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ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS
ACCORDING TO JEDEC J-STD-020
Fig. 3 - Maximum temperature load during reflow soldering
Table 4
Notes
Temperature measuring point on top of the case and on terminals.
Maximum 2 runs with pause of minimum 30 min in between.
REFLOW SOLDERING CONDITIONS for MAL226099xxxE3
PROFILE FEATURES CASE CODE
1616 TO 1821
Maximum time from 25 °C to TPeak 300 s
Maximum ramp-up rate to 150 °C 3 K/s
Maximum time from 150 °C to 200 °C (t1) 150 s
Maximum time from 190 °C to 200 °C (t2) 110 s
Ramp up rate from 200 °C to TPeak 0.5 K/s to 3 K/s
Maximum time above TLiquidus (217 °C) (t3)90 s
Maximum time above 230 °C (t4)60 s
Peak temperature TPeak 245 °C
Maximum time above TPeak minus 5 °C 30 s
Ramp-down rate from TLiquidus 3 K/s to 6 K/s
t1
200
190
150
25
217
230
TPeak
time (s)
T (°C)
t2
t3
t4
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Note
Unless otherwise specified, all electrical values in Table 5 apply
at Tamb = 20 °C, P = 86 kPa to 106 kPa, RH = 45 % to 75 %
ORDERING EXAMPLE
Electrolytic capacitor 260 CLA-V series
330 μF / 50 V; ± 20 %
Nominal case size: 16 mm x 16 mm x 16 mm; taped on reel
Ordering code: MAL226099104E3
Table 5
Note
(1) Determines the applicable row in the table “Endurance Test Duration and Useful Life”
ELECTRICAL DATA
SYMBOL DESCRIPTION
CRRated capacitance at 100 Hz, tolerance ± 20 %
IRRated RMS ripple current at 100 kHz, 150 °C
IL2 Maximum leakage current after 2 min at UR
tan δMaximum dissipation factor at 100 Hz
Z Maximum impedance at 100 kHz
ELECTRICAL DATA AND ORDERING INFORMATION
UR
(V)
CR
(μF)
NOMINAL CASE
SIZE
L x W x H
(mm)
IR
150 °C
100 kHz
(mA)
IL2
2 min
(μA)
tan δ
100 Hz
Z
100 kHz
20 °C
(Ω)
Z
100 kHz
-40 °C
(Ω)
LIFE
CODE (1)
ORDERING CODE
MAL2260...
16
1000 16 x 16 x 16 850 160 0.16 0.050 0.45 L1 99503E3
1500 18 x 18 x 16 900 240 0.16 0.050 0.45 L1 99504E3
2200 16 x 16 x 21 1100 352 0.18 0.035 0.32 L3 99505E3
2700 18 x 18 x 21 1350 432 0.18 0.035 0.32 L3 99506E3
3300 18 x 18 x 21 1400 528 0.20 0.035 0.32 L3 99507E3
25
680 16 x 16 x 16 800 170 0.14 0.050 0.45 L1 99603E3
1000 18 x 18 x 16 830 250 0.14 0.050 0.45 L1 99604E3
1500 16 x 16 x 21 1050 375 0.14 0.035 0.32 L3 99605E3
2200 18 x 18 x 21 1350 550 0.16 0.035 0.32 L3 99606E3
35
470 16 x 16 x 16 800 165 0.12 0.050 0.45 L1 99003E3
680 18 x 18 x 16 830 238 0.12 0.050 0.45 L1 99004E3
1000 16 x 16 x 21 1000 350 0.12 0.035 0.32 L3 99005E3
1500 18 x 18 x 21 1350 525 0.12 0.035 0.32 L3 99006E3
50
330 16 x 16 x 16 700 165 0.10 0.072 0.65 L1 99104E3
470 18 x 18 x 16 720 235 0.10 0.070 0.63 L1 99105E3
680 16 x 16 x 21 800 340 0.10 0.052 0.47 L3 99106E3
1000 18 x 18 x 21 1100 500 0.10 0.049 0.44 L3 99107E3
63
220 16 x 16 x 16 500 139 0.10 0.100 0.90 L1 99805E3
330 18 x 18 x 16 520 208 0.10 0.095 0.86 L1 99806E3
470 16 x 16 x 21 600 296 0.10 0.075 0.68 L3 99807E3
680 18 x 18 x 21 700 428 0.10 0.072 0.65 L3 99808E3
80
150 16 x 16 x 16 430 120 0.12 0.390 3.12 L1 99703E3
220 18 x 18 x 16 430 176 0.12 0.390 3.12 L1 99704E3
330 18 x 18 x 21 520 264 0.12 0.300 2.40 L2 99705E3
260 CLA-V
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Table 6
Fig. 4 - Vibration profile
Table 7
EXTENDED VIBRATION SPECIFICATIONS
PARAMETER PROCEDURE REQUIREMENTS
Vibration improvement From 10 g to 30 g
No visible damage;
no leakage of electrolyte;
marking legible
ΔC/C: ± 5 % with respect to
initial measurements
Vibration frequency range 10 Hz to 2 kHz
Vibration profile
Constant sinus sweep
•3 directions
8 h per direction
ADDITIONAL ELECTRICAL DATA
PARAMETER CONDITIONS VALUE
Voltage
Surge voltage for short periods IEC 60384-18, subclause 4.14 Us 1.15 x UR
Reverse voltage for short periods IEC 60384-18, subclause 4.16; TA 150 °C Urev 1 V
Current
Leakage current After 2 min at URIL2 0.01 x CR x UR
Inductance
Equivalent series inductance (ESL) Ø D 16 mm Typ. 11 nH
Resistance
Equivalent series resistance (ESR) at 100 Hz Calculated from tan δmax. and CR (see Table 5) ESR = tan δ/2πfCR
0
10
20
30
40
50
60
00.511.52.0
Acceleration
(g)
f (kHz)
Improved SMD
AEC-Q200
Vishay extended
260 CLA-V
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CAPACITANCE (C)
Fig. 5 - Typical multiplier of capacitance
as a function of ambient temperature
Fig. 6 - Typical multiplier of capacitance
as a function of frequency
DISSIPATION FACTOR (tan δ)
Fig. 7 - Typical multiplier of dissipation factor (tan δ)
as a function of ambient temperature
Fig. 8 - Typical multiplier of dissipation factor (tan δ)
as a function of frequency
EQUIVALENT SERIES RESISTANCE (ESR)
Fig. 9 - Typical multiplier of ESR as a function of frequency
0.80
0.90
1.00
1.10
1.20
-60 -40 -20 0 20 40 60 80 100 120 140 160
C/C0
C0 = Capacitance at 20 °C, 100 Hz Tamb (°C)
0.50
0.60
0.70
0.80
0.90
1.00
1.10
10 102 103 104 105
C/C0
f (Hz)
2700 μF
1000 μF
C0 = Typical capacitance C at 20 °C, 100 Hz
0
2
4
6
8
-60 -40 -20 0 20 40 60 80 100 120 140 160
tan/tan0
Tamb (°C)
tan δ= Typical tan δ at 20 °C, 100 Hz
0.1
1
10
10 102 103
102
103
104 105
tan/tan0
f (Hz)
tan δ= Typical tan δ at 20 °C, 100 Hz
Tamb = 20 °C
ESR0 = Typical ESR at 20 °C, 100 Hz
0.1
10 10 4
10 3
10 210 5
1
10
f (Hz)
ESR/ESR0
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IMPEDANCE (Z)
Fig. 10 - Typical multiplier of impedance
as a function of temperature
Fig. 11 - Typical impedance as a function of frequency Fig. 12 - Typical impedance as a function of frequency
RIPPLE CURRENT AND USEFUL LIFE
Table 8
Note
Multiplier of useful life code: MBC245
0.1
1
102
10
-60 -40 -20 0 20 40 60 80 100 120 140 160
Z/Z0
T (°C)
Z0 = Typical impedance Z at 20 °C, 100 kHz
0.01
0.1
1
10
102
10 102103104105
Z (Ω)
f (Hz)
Curve 1: 680-25-1616
Curve 2: 1000-25-1816
Curve 3: 1500-25-1621
Curve 4: 2200-25-1821
Tamb = 20 °C
1
2
3
4
0.01
0.1
1
10
102
103
10 102 103 104 105
Z (Ω)
f (Hz)
Curve 1: 330-50-1616
Curve 2: 470-50-1816
Curve 3: 680-50-1621
Curve 4: 1000-50-1821
Tamb = 20 °C
1
2
3
4
ENDURANCE TEST DURATION AND USEFUL LIFE
LIFE CODE ENDURANCE
AT 150 °C (h)
USEFUL LIFE
AT 150 °C (h)
USEFUL LIFE AT 40 °C
1.8 x IR APPLIED (h)
L1 1000 1500 350 000
L2 1500 1500 350 000
L3 1500 2000 400 000
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Fig. 13 - Multiplier of useful life as a function of ambient temperature and ripple current load
Table 9
MULTIPLIER OF RIPPLE CURRENT (IR) AS A FUNCTION OF FREQUENCY
FREQUENCY (Hz)
50 100 300 1000 3000 10 000 30 000 100 000
IR MULTIPLIER
0.40 0.60 0.75 0.80 0.90 0.95 0.97 1.00
0.0
0.5
0.8
40 50 60 70 80 90 100 110 120 130 140 150 160
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.9
3.8
4.0
4.1
4.2
4.3
4.5
4.8
IA = Actual ripple current at 100 kHz
IR = Rated ripple current at 100 kHz, 150 °C
(1) Useful life at 150 °C and IR applied;
see Table 7
Tamb (°C)
IA
IR
MBC245
(1)
Lifetime multiplier
100
200
400
600
12
20
30
50
2.5
4.0
6.0
8.0
2.0
1.5
1.0
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Table 10
Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the
lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability.
TEST PROCEDURES AND REQUIREMENTS
TEST PROCEDURE
(quick reference) REQUIREMENTS
NAME OF TEST REFERENCE
Mounting IEC 60384-18,
subclause 4.3
Shall be performed prior to tests mentioned below;
reflow soldering;
for maximum temperature load
refer to chapter “Mounting”
ΔC/C: ± 5 %
tan δ spec. limit
IL2 spec. limit
Endurance
IEC 60384-18 /
CECC 32300,
subclause 4.15
Tamb = 150 °C; UR applied;
for test duration see Table 7
ΔC/C: ± 20 %
tan δ 2 x spec. limit
IL2 spec. limit
Useful life CECC 30301,
subclause 1.8.1
Tamb = 150 °C; UR and IR applied;
for test duration see Table 7
ΔC/C: ± 30 %
tan δ 3 x spec. limit
IL2 spec. limit
no short or open circuit
total failure percentage: 1 %
Shelf life
(storage at high
temperature)
IEC 60384-18 /
CECC 32300,
subclause 4.17
Tamb = 150 °C; no voltage applied;
1000 h
After test: UR to be applied for 30 min,
24 h to 48 h before measurement
For requirements
see “Endurance test” above
Reverse voltage
IEC 60384-18 /
CECC 32300,
subclause 4.16
Tamb = 150 °C:
125 h at U = -0.5 V,
followed by 125 h at UR
ΔC/C: ± 15 %
tan δ 1.5 x spec. limit
IL2 spec. limit
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