July 2004 AS7C33512PFD18A (R) 3.3V 512K x 18 pipeline burst synchronous SRAM Features * * * * * * * * * * * * * Organization: 524,288 words x 18 bits Fast clock speeds to 166 MHz in LVTTL/LVCMOS Fast clock to data access: 3.5/3.8/4.0/5.0 ns Fast OE access time: 3.5/3.8/4.0/5.0 ns Fully synchronous register-to-register operation Dual-cycle deselect - Single-cycle deselect also available (AS7C33512PFS18A) * Pentium(R)1 compatible architecture and timing * Asynchronous output enable control Available in 100-pin TQFP package Byte write enables Multiple chip enables for easy expansion 3.3V core power supply 2.5V or 3.3V I/O operation with separate VDDQ 30 mW typical standby power in power down mode NTDTM2 pipeline architecture available (AS7C33512NTD18A) 2. NTDTM is a trademark of Alliance Semiconductor Corporation. All trademarks mentioned in this document are the property of their respective owners. (R) 1. Pentium is a registered trademark of Intel Corporation. Logic block diagram LBO CLK ADV ADSC ADSP CLK CS CLR 19 A[18:0] Burst logic Q D CS Address register 19 512K x 18 Memory array 17 19 CLK 18 18 GWE BWb D DQb BWE CLK D DQa Q Q Byte Write registers BWa 2 Byte Write registers CLK CE0 CE1 CE2 D Enable register OE Q CE CLK ZZ Input registers Output registers CLK CLK D Enable Q Power down delay register CLK 18 OE DQ[a,b] Selection guide -166 -150 -133 -100 Units 6 6.6 7.5 10 ns Maximum clock frequency 166 150 133 100 MHz Maximum clock access time 3.5 3.8 4 5 ns Maximum operating current 475 450 425 325 mA Maximum standby current 130 110 100 90 mA Maximum CMOS standby current (DC) 30 30 30 30 mA Minimum cycle time 7/12/04; v.1.2 Alliance Semiconductor 1 of 16 Copyright (c) Alliance Semiconductor. All rights reserved. AS7C33512PFD18A (R) TQFP 14 x 20mm 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A NC NC VDDQ VSSQ NC DQpa DQa7 DQa6 VSSQ VDDQ DQa5 DQa4 VSS NC VDD ZZ DQa3 DQa2 VDDQ VSSQ DQa1 DQa0 NC NC VSSQ VDDQ NC NC NC LBO A A A A A1 A0 NC NC VSS VDD NC A A A A A A A A VDDQ VSSQ NC NC DQb0 DQb1 VSSQ VDDQ DQb2 DQb3 NC VDD NC VSS DQb4 DQb5 VDDQ VSSQ DQb6 DQb7 DQpb NC VSSQ VDDQ NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NC NC NC 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE0 CE1 NC NC BWb BWa CE2 VDD VSS CLK GWE BWE OE ADSC ADSP ADV A A Pin arrangement 7/12/04; v.1.2 Alliance Semiconductor 2 of 16 AS7C33512PFD18A (R) Functional description The AS7C33512PFD18A is a high performance CMOS 8-Mbit synchronous Static Random Access Memory (SRAM) devices organized as 524,288 words x 18 bits and incorporate a pipeline for highest frequency on any given technology. Timing for this device is compatible with existing Pentium(R) synchronous cache specifications. This architecture is suited for ASIC, DSP, and PowerPCTM-based systems in computing, datacom, instrumentation, and telecommunications systems. Fast cycle times of 6/6.6/7.5/10 ns with clock access times (tCD) of 3.5/3.8/4.0/5.0 ns enable 166, 150, 133 and 100 MHz bus frequencies. Three chip enable inputs permit easy memory expansion. Burst operation is initiated in one of two ways: the controller address strobe (ADSC), or the processor address strobe (ADSP). The burst advance pin (ADV) allows subsequent internally generated burst addresses. Read cycles are initiated with ADSP (regardless of WE and ADSC) using the new external address clocked into the on-chip address register. When ADSP is sampled LOW, the chip enables are sampled active, and the output buffer is enabled with OE. In a read operation the data accessed by the current address, registered in the address registers by the positive edge of CLK, are carried to the data-out registers and driven on the output pins on the next positive edge of CLK. ADV is ignored on the clock edge that samples ADSP asserted but is sampled on all subsequent clock edges. Address is incremented internally for the next access of the burst when ADV is sampled LOW and both address strobes are HIGH. Burst mode is selectable with the LBO input. With LBO unconnected or driven HIGH, burst operations use a Pentium(R)1 count sequence. With LBO driven LOW the device uses a linear count sequence suitable for PowerPCTM and many other applications. Write cycles are performed by disabling the output buffers with OE and asserting a write command. A global write enable GWE writes all 18 bits regardless of the state of individual BW[a:b] inputs. Alternately, when GWE is HIGH, one or more bytes may be written by asserting BWE and the appropriate individual byte BWn signal(s). BWn is ignored on the clock edge that samples ADSP LOW, but is sampled on all subsequent clock edges. Output buffers are disabled when BWn is sampled LOW (regardless of OE). Data is clocked into the data input register when BWn is sampled LOW. Address is incremented internally to the next burst address if BWn and ADV are sampled LOW. This device operates in double-cycle deselect feature during read cycles. Read or write cycles may also be initiated with ADSC instead of ADSP. The differences between cycles initiated with ADSC and ADSP follow. * ADSP must be sampled HIGH when ADSC is sampled LOW to initiate a cycle with ADSC. * WE signals are sampled on the clock edge that samples ADSC LOW (and ADSP HIGH). * Master chip select CE0 blocks ADSP, but not ADSC. The AS7C33512PFD18A operate from a 3.3V supply. I/Os use a separate power supply that can operate at 2.5V or 3.3V. These devices are available in a 100-pin 14x20 mm TQFP packaging. . Capacitance Parameter Symbol Test conditions Max Unit Input capacitance CIN VIN = 0V 5 pF I/O capacitance CI/O VIN = VOUT = 0V 7 pF TQFP thermal resistance Description Thermal resistance (junction to ambient)1 Thermal resistance (junction to top of case)1 Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51 Symbol Typical Units 1-layer JA 40 C/W 4-layer JA 22 C/W JC 8 C/W 1 This parameter is sampled. 1. PowerPCTM is a trademark International Business Machines Corporation 7/12/04; v.1.2 Alliance Semiconductor 3 of 16 AS7C33512PFD18A (R) Signal descriptions Signal I/O Properties Description CLK I CLOCK A,A0,A1 I SYNC Address. Sampled when all chip enables are active and ADSC or ADSP are asserted. DQ[a,b] I/O SYNC Data. Driven as output when the chip is enabled and OE is active. CE0 I SYNC Master chip enable. Sampled on clock edges when ADSP or ADSC is active. When CE0 is inactive, ADSP is blocked. Refer to the Synchronous Truth Table for more information. CE1, CE2 I SYNC Synchronous chip enables. Active HIGH and active LOW, respectively. Sampled on clock edges when ADSC is active or when CE0 and ADSP are active. ADSP I SYNC Address strobe (processor). Asserted LOW to load a new address or to enter standby mode. ADSC I SYNC Address strobe (controller). Asserted LOW to load a new address or to enter standby mode. ADV I SYNC Burst advance. Asserted LOW to continue burst read/write. GWE I SYNC Global write enable. Asserted LOW to write all 18 bits. When HIGH, BWE and BW[a,b] control write enable. BWE I SYNC Byte write enable. Asserted LOW with GWE = HIGH to enable effect of BW[a,b] inputs. BW[a,b] I SYNC Write enables. Used to control write of individual bytes when GWE = HIGH and BWE = LOW. If any of BW[a,b] is active with GWE = HIGH and BWE = LOW the cycle is a write cycle. If all BW[a,b] are inactive, the cycle is a read cycle. OE I ASYNC Asynchronous output enable. I/O pins are driven when OE is active and the chip is in read mode. LBO I STATIC Selects Burst mode. When tied to VDD or left floating, device follows Interleaved Burst order. When driven Low, device follows linear Burst order. This signal is internally pulled High. ZZ I ASYNC Snooze. Places device in low power mode; data is retained. Connect to GND if unused. NC - - Clock. All inputs except OE, ZZ, LBO are synchronous to this clock. No connect Write enable truth table (per byte) Function Write All Bytes Write Byte a Write Byte b Read GWE L H H H H H BWE X L L L H L BWa X L L H X H BWb X L H L X H Key: X = don't care, L = low, H = high, n = a, b; BWE, BWn = internal write signal. 7/12/04; v.1.2 Alliance Semiconductor 4 of 16 AS7C33512PFD18A (R) Burst sequence table Interleaved burst address (LBO = H) A1 A0 A1 A0 A1 A0 Starting Address First Increment Second Increment Third Increment 00 01 10 11 01 00 11 10 Linear burst address (LBO = L) A1 A0 A1 A0 A1 A0 A1 A0 10 11 00 01 11 10 01 00 Starting Address First Increment Second Increment Third Increment 00 01 10 11 01 10 11 10 10 11 00 01 A1 A0 11 00 01 10 Synchronous truth table CE01 CE1 CE2 ADSP ADSC H L L L L L L L L X X X X H H H H L X H X H X L L X X H H H H X X X X X X X X H X X X X X X X H H L L L L X X X X X X X X L X X X X X L H L H L L H H H H H H X X X X H H X H X L X L X L X X L L H H H H H H H H L H H H H ADV WRITE[2] X X X X X X X X X L L H H L L H H X L L H H X X X X X X X H H H H H H H H H H L L L L L OE Address accessed CLK Operation DQ X X X X X L H L H L H L H L H L H X X X X X NA NA NA NA NA External External External External Next Next Current Current Next Next Current Current External Next Next Current Current L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H Deselect Deselect Deselect Deselect Deselect Begin read Begin read Begin read Begin read Continue read Continue read Suspend read Suspend read Continue read Continue read Suspend read Suspend read Begin write Continue write Continue write Suspend write Suspend write Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z Q Hi-Z Q Hi-Z Q Hi-Z Q Hi-Z Q Hi-Z Q Hi-Z D3 D D D D 1 X = don't care, L = low, H = high 2 For WRITE, L means any one or more byte write enable signals (BWa or BWb) and BWE are LOW or GWE is LOW. WRITE = HIGH for all BWx, BWE, GWE HIGH. See "Write enable truth table (per byte)," on page 5 for more information. 3 For write operation following a READ, OE must be high before the input data set up time and held high throughout the input hold time 7/12/04; v.1.2 Alliance Semiconductor 5 of 16 AS7C33512PFD18A (R) Absolute maximum ratings1 Parameter Symbol Min Max Unit VDD, VDDQ -0.5 +4.6 V Input voltage relative to GND (input pins) VIN -0.5 VDD + 0.5 V Input voltage relative to GND (I/O pins) VIN -0.5 VDDQ + 0.5 V Power dissipation PD - 1.8 W DC output current IOUT - 50 mA Storage temperature (plastic) Tstg -65 +150 C Temperature under bias Tbias -65 +135 C Power supply voltage relative to GND 1 Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect reliability. Recommended operating conditions at 3.3V I/O Parameter Supply voltage for inputs Supply voltage for I/O Ground supply Symbol VDD VDDQ Vss Min 3.135 3.135 0 Nominal 3.3 3.3 0 Max 3.465 3.465 0 Unit V V V Min 3.135 2.375 0 Nominal 3.3 2.5 0 Max 3.465 2.625 0 Unit V V V Recommended operating conditions at 2.5V I/O Parameter Supply voltage for inputs Supply voltage for I/O Ground supply 7/12/04; v.1.2 Symbol VDD VDDQ Vss Alliance Semiconductor 6 of 16 AS7C33512PFD18A (R) DC electrical characteristics for 3.3V I/O operation Parameter Input leakage current1 Output leakage current Sym |ILI| |ILO| Input high (logic 1) voltage VIH Input low (logic 0) voltage VIL Output high voltage Output low voltage VOH VOL Conditions VDD = Max, 0V < VIN < VDD OE VIH, VDD = Max, 0V < VOUT < VDDQ Address and control pins I/O pins Address and control pins I/O pins IOH = -4 mA, VDDQ = 3.135V IOL = 8 mA, VDDQ = 3.465V Min -2 -2 2 2 -0.3* -0.5* 2.4 - Max 2 2 VDD+0.3 VDDQ+0.3 0.8 0.8 - 0.4 Unit A A V V V V 1 LBO, and ZZ pins and the have an internal pull-up or pull-down, and input leakage = 10 A. DC electrical characteristics for 2.5V I/O operation Parameter Input leakage current Output leakage current Sym |ILI| |ILO| Input high (logic 1) voltage VIH Input low (logic 0) voltage VIL Output high voltage Output low voltage VOH VOL *V min IL Conditions VDD = Max, 0V < VIN < VDD OE VIH, VDD = Max, 0V < VOUT < VDDQ Address and control pins I/O pins Address and control pins I/O pins IOH = -4 mA, VDDQ = 2.375V IOL = 8 mA, VDDQ = 2.625V Min -2 -2 1.7 1.7 -0.3* -0.3* 1.7 - Max 2 2 VDD+0.3 VDDQ+0.3 0.7 0.7 - 0.7 Unit A A V V V V V V = -1.5 for pulse width less than 0.2 X tCYC IDD operating conditions and maximum limits Parameter Operating power supply current1 Sym ICC ISB Standby power supply current ISB1 ISB2 Conditions CE0 = VIL, CE1 = VIH, CE2 = VIL, f = fMax, IOUT = 0 mA Deselected, f = fMax, ZZ < VIL Deselected, f = 0, ZZ < 0.2V, all VIN 0.2V or VDD - 0.2V Deselected, f = fMax, ZZ VDD - 0.2V, all VIN VIL or VIH -166 -150 -133 -100 475 450 425 325 130 110 100 90 30 30 30 30 30 30 30 30 Unit mA mA 1 ICC given with no output loading. ICC increases with faster cycle times and greater output loading. 7/12/04; v.1.2 Alliance Semiconductor 7 of 16 AS7C33512PFD18A (R) Timing characteristics for 3.3 V I/O operation -166 Parameter -150 -133 -100 Symbol Min Max Min Max Min Max Min Max Unit Notes1 Clock frequency fMax - 166 - 150 - 133 - Cycle time tCYC 6 - 6.6 - 7.5 - 10 - ns - 3.5 - 3.8 - 4.0 - 5.0 ns Clock access time tCD 100 MHz Output enable low to data valid tOE - 3.5 - 3.8 - 4.0 - 5.0 ns Clock high to output low Z tLZC 0 - 0 - 0 - 0 - ns 2,3,4 Data output invalid from clock high tOH 1.5 - 1.5 - 1.5 - 1.5 - ns 2 Output enable low to output low Z tLZOE 0 - 0 - 0 - 0 - ns 2,3,4 Output enable high to output high Z tHZOE - 3.5 - 3.8 - 4.0 - 4.5 ns 2,3,4 Clock high to output high Z tHZC - 3.5 - 3.8 - 4.0 - 5.0 ns 2,3,4 tOHOE 0 - 0 - 0 - 0 - ns Clock high pulse width tCH 2.4 - 2.5 - 2.5 - 3.5 - ns 5 Clock low pulse width tCL 2.3 - 2.5 - 2.5 - 3.5 - ns 5 Address setup to clock high tAS 1.5 - 1.5 - 1.5 - 2.0 - ns 6 Data setup to clock high tDS 1.5 - 1.5 - 1.5 - 2.0 - ns 6 Write setup to clock high tWS 1.5 - 1.5 - 1.5 - 2.0 - ns 6,7 Chip select setup to clock high tCSS 1.5 - 1.5 - 1.5 - 2.0 - ns 6,8 Address hold from clock high tAH 0.5 - 0.5 - 0.5 - 0.5 - ns 6 Data hold from clock high tDH 0.5 - 0.5 - 0.5 - 0.5 - ns 6 Write hold from clock high tWH 0.5 - 0.5 - 0.5 - 0.5 - ns 6,7 Chip select hold from clock high tCSH 0.5 - 0.5 - 0.5 - 0.5 - ns 6,8 ADV setup to clock high tADVS 1.5 - 1.5 - 1.5 - 2.0 - ns 6 ADSP setup to clock high tADSPS 1.5 - 1.5 - 1.5 - 2.0 - ns 6 ADSC setup to clock high tADSCS 1.5 - 1.5 - 1.5 - 2.0 - ns 6 ADV hold from clock high tADVH 0.5 - 0.5 - 0.5 - 0.5 - ns 6 ADSP hold from clock high tADSPH 0.5 - 0.5 - 0.5 - 0.5 - ns 6 ADSC hold from clock high tADSCH 0.5 - 0.5 - 0.5 - 0.5 - ns 6 Output enable high to invalid output 1 See "Notes" on page 13 7/12/04; v.1.2 Alliance Semiconductor 8 of 16 AS7C33512PFD18A (R) Timing characteristics for 2.5V I/O operation -166 Parameter -150 -133 -100 Symbol Min Max Min Max Min Max Min Max Unit Notes1 Clock frequency fMax - 166 - 150 - 133 - Cycle time tCYC 6 - 6.6 - 7.5 - 10 - ns Clock access time tCD - 4.0 - 4.0 - 4.5 - 5.0 ns Output enable LOW to data valid tOE - 3.5 - 3.8 - 4.0 - 5.0 ns Clock HIGH to output Low Z tLZC 0 - 0 - 0 - 0 - ns 2,3,4 Data output invalid from clock HIGH tOH 1.5 - 1.5 - 1.5 - 1.5 - ns 2 Output enable LOW to output Low Z tLZOE 0 - 0 - 0 - 0 - ns 2,3,4 Output enable HIGH to output High Z tHZOE - 3.5 - 3.8 - 4.0 - 4.5 ns 2,3,4 Clock HIGH to output High Z tHZC - 3.5 - 3.8 - 4.0 - 5.0 ns 2,3,4 tOHOE 0 - 0 - 0 - 0 - ns Clock HIGH pulse width tCH 2.4 - 2.5 - 2.5 - 3.5 - ns 5 Clock LOW pulse width tCL 2.3 - 2.5 - 2.5 - 3.5 - ns 5 Address setup to clock HIGH tAS 1.7 - 1.7 - 1.7 - 2.0 - ns 6 Data setup to clock HIGH tDS 1.7 - 1.7 - 1.7 - 2.0 - ns 6 Write setup to clock HIGH tWS 1.7 - 1.7 - 1.7 - 2.0 - ns 6,7 Chip select setup to clock HIGH tCSS 1.7 - 1.7 - 1.7 - 2.0 - ns 6,8 Address hold from clock HIGH tAH 0.7 - 0.7 - 0.7 - 0.7 - ns 6 Data hold from clock HIGH tDH 0.7 - 0.7 - 0.7 - 0.7 - ns 6 Write hold from clock HIGH tWH 0.7 - 0.7 - 0.7 - 0.7 - ns 6,7 Chip select hold from clock HIGH tCSH 0.7 - 0.7 - 0.7 - 0.7 - ns 6,8 ADV setup to clock HIGH tADVS 1.7 - 1.7 - 1.7 - 2.0 - ns 6 ADSP setup to clock HIGH tADSPS 1.7 - 1.7 - 1.7 - 2.0 - ns 6 ADSC setup to clock HIGH tADSCS 1.7 - 1.7 - 1.7 - 2.0 - ns 6 ADV hold from clock HIGH tADVH 0.7 - 0.7 - 0.7 - 0.7 - ns 6 ADSP hold from clock HIGH tADSPH 0.7 - 0.7 - 0.7 - 0.7 - ns 6 ADSC hold from clock HIGH tADSCH 0.7 - 0.7 - 0.7 - 0.7 - ns 6 Output enable HIGH to invalid output 100 MHz 1 See Notes on page 13. 7/12/04; v.1.2 Alliance Semiconductor 9 of 16 AS7C33512PFD18A (R) Key to switching waveforms Rising input Falling input Undefined/don't care Timing waveform of read cycle tCYC tCL tCH CLK tADSPS tADSPH ADSP tADSCS tADSCH ADSC LOAD NEW ADDRESS tAS tAH Address A1 A2 A3 tWS tWH GWE, BWE tCSS tCSH CE0, CE2 CE1 tADVS tADVH ADV ADV inserts wait states OE DOUT tLZOE Read Q(A1) tHZOE tOE Q(A1) Suspend Read Q(A1) Read Q(A2) tCD tHZC tOH Q(A2) Q(A2Y01) Q(A2Y10) Q(A2Y11) Q(A3) Q(A3Y01) Q(A3Y10) Q(A3Y11) Burst Burst Read Suspend Burst Burst Burst Burst Read Read Q(A3) DSEL* Read Read Read Read Read Q(A 2Y01) Q(A 2Y10) Q(A 2Y10) Q(A 2Y11) Q(A 3Y01) Q(A 3Y10) Q(A 3Y11) Note: Y = XOR when LBO = HIGH/No Connect; Y = ADD when LBO = LOW. BW[a:b] is don't care. *Outputs are disabled within two clk cycles after DSEL command 7/12/04; v.1.2 Alliance Semiconductor 10 of 16 AS7C33512PFD18A (R) Timing waveform of write cycle tCH tCYC tCL CLK tADSPS tADSPH ADSP tADSCS tADSCH ADSC ADSC LOADS NEW ADDRESS tAS tAH Address A1 A3 A2 . tWS tWH . BWE BW[a:d] tCSS tCSH CE0, CE2 CE1 tADVS tADVH ADV SUSPENDS BURST ADV OE tDS Data In D(A1) Read Q(A1) Suspend Write D(A1) D(A2) Read Q(A2) Suspend Write D(A 2) D(A2Y01) D(A2Y01) D(A2Y10) D(A2Y11) ADV Suspend ADV ADV Burst Write Burst Burst Write D(A 2Y01) Write Write D(A 2Y01) Q(A 2Y10) Q(A 2Y11) D(A3) Write D(A 3) tDH D(A3Y01) D(A3Y10) Burst Write D(A 3Y01) ADV Burst Write D(A 3Y10) Note: Y = XOR when LBO = HIGH/No Connect; Y = ADD when LBO = LOW. 7/12/04; v.1.2 Alliance Semiconductor 11 of 16 AS7C33512PFD18A (R) Timing waveform of read/write cycle tCYC tCL tCH CLK tADSPS tADSPH ADSP tAS tAH A2 A1 Address A3 tWS tWH GWE CE0, CE2 CE1 tADVS tADVH ADV OE tDS tDH DIN D(A2) tOE tCD tLZC DOUT DSEL Read Q(A1) tHZOE Q(A1) Suspend Read Q(A1) tOH tLZOE Q(A3) Read Q(A2) Suspend Write D(A 2) Read Q(A3) ADV Burst Read D(A 3Y01) Q(A3Y01) ADV Burst Read Q(A 3Y10) Q(A3Y10) ADV Burst Read Q(A 3Y11) Q(A3Y11) Suspend Read Q(A 3Y11) Note: Y = XOR when LBO = HIGH/No Connect; Y = ADD when LBO = LOW. 7/12/04; v.1.2 Alliance Semiconductor 12 of 16 AS7C33512PFD18A (R) AC test conditions * Output load: see Figure B, except for tLZC, tLZOE, tHZOE, tHZC, see Figure C. * Input pulse level: GND to 3V. See Figure A. Thevenin equivalent: * Input rise and fall time (measured at 0.3V and 2.7V): 2 ns. See Figure A. +3.3V for 3.3V I/O; /+2.5V for 2.5V I/O * Input and output timing reference levels: 1.5V. +3.0V 90% 10% GND 90% 10% Figure A: Input waveform DOUT Z0 = 50 50 VL = 1.5V for 3.3V I/O; 30 pF* = V DDQ/2 for 2.5V I/O Figure B: Output load (A) DOUT 353 / 1538 319 / 1667 5 pF* GND *including scope and jig capacitance Figure C: Output load (B) Notes: 1) For test conditions, see "AC Test Conditions", Figures A, B, C 2) This parameter measured with output load condition in Figure C. 3) This parameter is sampled, but not 100% tested. 4) tHZOE is less than tLZOE and tHZC is less than tLZC at any given temperature and voltage. 5) tCH measured HIGH above VIH and tCL measured as LOW below VIL 6) This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK. All other synchronous inputs must meet the setup and hold times with stable logic levels for all rising edges of CLK when chip is enabled. 7) Write refers to GWE, BWE, BW[a,b]. 8) Chip select refers to CE0, CE1, CE2. 7/12/04; v.1.2 Alliance Semiconductor 13 of 16 AS7C33512PFD18A (R) Package Dimensions 100-pin quad flat pack (TQFP) Hd TQFP Min Max A1 A2 b c D E e Hd He L L1 0.05 0.15 1.35 1.45 0.22 0.38 0.09 0.20 13.90 14.10 19.90 20.10 D b e He E 0.65 nominal 15.90 16.10 21.90 22.10 0.45 0.75 c L1 L A1 A2 1.00 nominal 0 7 Dimensions in millimeters 7/12/04; v.1.2 Alliance Semiconductor 14 of 16 AS7C33512PFD18A (R) Ordering information Package -166 MHz -150 MHz -133 MHz -100 MHz TQFP x18 AS7C33512PFD18A166TQC AS7C33512PFD18A150TQC AS7C33512PFD18A133TQC AS7C33512PFD18A100TQC TQFP x18 AS7C33512PFD18A166TQI AS7C33512PFD18A150TQI AS7C33512PFD18A133TQI AS7C33512PFD18A100TQI Note: Add suffix `N' with the above part number for Lead Free Parts (Ex. AS7C33512PFD18A-166TQCN) Part numbering guide AS7C 33 512 PF D 18 A -XXX TQ C/I X 1 2 3 4 5 6 7 8 9 10 11 1.Alliance Semiconductor SRAM prefix 2.Operating voltage: 33=3.3V 3.Organization: 512=512K 4.Pipeline-Flowthrough (each device works in both modes) 5.Deselect: D=Double cycle deselect 6.Organization: 18=x18 7.Production version: A=first production version 8. Clock speed (MHz) 9. Package type: TQ=TQFP 10. Operating temperature: C=Commercial (0 C to 70 C); I=Industrial (-40 C to 85 C) 11. N = Lead free part 7/12/04; v.1.2 Alliance Semiconductor 15 of 16 AS7C33512PFD18A (R) (R) Alliance Semiconductor Corporation 2575, Augustine Drive, Santa Clara, CA 95054 Tel: 408 - 855 - 4900 Fax: 408 - 855 - 4999 www.alsc.com Copyright (c) Alliance Semiconductor All Rights Reserved Part Number: AS7C33512PFD18A Document Version: v.1.2 (c) Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. 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