Make sure the next Card you purchase has... SSP-21116 270 VDC SOLID-STATE POWER CONTROLLERS FEATURES * True I2T Protection * Isolated Control Circuitry * Status Outputs * Instant Trip Protection * Leakage Clamp * Low Power Dissipation * Solid-State Reliability DESCRIPTION The SSP-21116 Series of 270 Volt, dc, Solid-State Power Controllers (SSPC's) replace electromagnetic circuit breakers and solid-state relays rated at 10 and 15 amperes. These SSPC's offer status outputs and permit external input logic control so that they may be remotely located near to the load. There are two models in the series, differing only in rated current, so that fault and I2T trip characteristics can be selected to protect wiring and loads. Using Power MOSFET switches, these Power Controllers offer low "on" resistance, low voltage drop, high "off" impedance, and low power dissipation. Built with Power MOSFET's and custom monolithics and using thick film hybrid technology, they offer small size, low power and high reliability. Built-In-Test (BIT) has been provided to monitor, in real time, the status of the internal circuitry as well as circuitry external to the SSPC. This BIT monitors MOSFET failure and control circuit failure. The SSP-21116 Series will operate over the full military temperature range from -55C to +125C with no thermal derating (see ordering information). APPLICATIONS Designed to replace circuit breakers in land, air and space vehicles, these Solid-State Power Controllers provide status outputs for light and heavy overloads as well as minimum load current. FOR MORE INFORMATION CONTACT: Data Device Corporation 105 Wilbur Place Bohemia, New York 11716 631-567-5600 Fax: 631-567-7358 www.ddc-web.com Technical Support: 1-800-DDC-5757 ext. 7382 All trademarks are the property of their respective owners. (c) 1990, 1999 Data Device Corporation (R) Data Device Corporation www.ddc-web.com HIGH SIDE LOW SIDE OR SWITCH CONFIG. SWITCH CONFIG. +270 Vdc +270 Vdc VCC1 VCC2 POWER IN VBIAS SUPPLY INPUT 2 STATUS1 STATUS2 CONTROL CMD INTERNAL POWER SUPPLIES VEE1 ISOLATED CONTROL CIRCUIT POWER IN MOSFET DRIVER, LOAD SHORT CIRCUIT CONTROL, STATUS CIRCUIT, R SENSE POWER OUT POWER OUT AND LOAD LATCHES SLEW CONTROL VBIAS SUPPLY COMMON SSP-21116 J-03/03-0 FIGURE 1. SSP-21116 BLOCK DIAGRAM SLEW CONTROL SYSTEM GND TABLE 3. SSP-21116 SPECIFICATIONS (CONT.) (SEE NOTES 1 AND 2) TABLE 1. ABSOLUTE MAXIMUM RATINGS PARAMETER Power Input To Power Ground Control Input To Signal Ground Power Ground To Signal Ground V Bias voltage (see note 4) Vdc Vdc Vdc VALUE 450 continuous 500 Volts, 50ms transient -0.5 to +7.0 -1000 to +1000 -0.5 to +7.0 Pin-to-case Vdc -1000 to +1000 C C +300 +150 Lead Temperature (soldering) Junction Temperature UNIT Vdc PARAMETER CONDITIONS UNIT VALUE Output-to Input Parasitic Diode, Continuous Current Per Amp Of Rated Current Power Out Voltage > Power In Voltage A 1.0 typ Output-to Input Parasitic Diode, Pulsed Current Per Amp Of Rated Current Power Out Voltage > Power In Voltage Pulse Width 100S A 4.0 typ Output-to Input Parasitic Diode, Forward Voltage at Continuous Current Power Out Voltage > Power In Voltage V 1.8 max Pin-to-Case Voltage = 100Vdc M 50 min Isolation Resistance Power Ground to Signal Ground Power Ground to Signal M Ground Voltage = 500Vdc 50 min Voltage Drop Trip Characteristics Response Time across pins 6&7, 9&10 Vdc see FIGURE 2 see FIGURE 3 see note 3 TEMPERATURE RANGE Operating (Baseplate) Storage C C -55 to +85 -55 to +125 THERMAL RESISTANCE Case to Sink (CS) Case to Ambient (CA) C/W C/W 0.4 6 C 10 g 115 POWER CIRCUIT (CONTINUED) TABLE 2. RECOMMENDED OPERATING CONDITIONS PARAMETER Power Input To Power Ground Control Input To Signal Ground Power Ground To Signal Ground V Bias voltage (see note 4) UNIT Vdc Vdc Vdc Vdc VALUE +60.0 to +300.0 0 to V Bias -300 to +300 +4.5 to +5.5 Isolation Resistance, Any Pin to Case Note: Power Ground = Neutral; Bias Supply Common = Signal Ground TABLE 3. SSP-21116 SPECIFICATIONS (SEE NOTES 1 AND 2) PARAMETER CONDITIONS UNIT CONTROL CIRCUIT Logic Type V Bias Supply Current Control Turn-On Voltage Control Turn-Off Voltage Control Input Current Control Input Current Control Input Current Status Output Voltage Status Output Voltage Status Truth Table VALUE TTL/CMOS compatible VCC = 4.5 to 5.5Vdc control voltage = 5.0V control voltage = 2.4V control voltage = 0.8V VCC= 4.5V, IOL= 2.5mA VCC= 4.5V, IOH= -1.0mA see TABLE 5 mA V V A A A V V 25 typ 2.0 to 5.5 -0.5 to 0.8 50 max 50 max -50 min 0.4 max 2.4 min Temperature Rise, Junction-to-Case PHYSICAL CHARACTERISTICS Size Weight See Table 4 "On" Resistance See Table 4 See Table 4 Power Dissipation Power In to Power Ground V 0 to 300 mA/A 0.1 max V 30 max F/A 4 typ at 100Vdc pF 1000 typ see note 2 pF/A ms A 300 typ 30 min Unlimited Power Out Leakage Current to Power Ground Power In = 60 - 300V (see note 2 ) Power Out Voltage with Switch OFF Max Load Capacitance for Start-Up Signal to Neutral Ground Isolation Power In = 60 - 300V No Load Power In = 60 - 300V (see note 2 ) Output Capacitance Trip Reset Time Rupture Capacity Data Device Corporation www.ddc-web.com see FIGURE 4 TABLES 1-3 notes: 1. -55C Case Temperature 125C. 2. "A" is Amps of Rated SSPC Current. 3. For 2A, 5A, and 10A units the value is 1V max; for 115A unit the value is 1.5V max. 4. An external 0.1f ceramic capacitor from V Bias to the +5V return ground is recommended. POWER CIRCUIT Max. Continuous Current Rated Load Unlimited TABLE 4. POWER DISSIPATION PART NUMBER I-MAX*(AMPS) SSP-21116-010-X SSP-21116-015-X 10 15 POWER "ON" RESISTANCE DISSIPATION (OHMS)** (WATTS)** 0.085 0.085 8.7 19.3 * I-MAX is the maximum continuous current. ** Specified for -55C to +105C; increases 0.6%/C between +105C and +125C. Note: Other Amp ratings are available, consult factory. 3 SSP-21116 J-03/03-0 FUNCTIONAL DESCRIPTION states which indicate the various states of the SSPC. Further explanation of the status lines appears in the applications information section. The SSP-21116 series of Solid-State Power Controllers incorporate the wire protection feature of electromechanical circuit breakers and the reliability of solid-state relays. In addition to the solid-state relay's input logic compatibility, the SSP-21116 series provides logic compatible status outputs. The SSP-21116 series SSPC's are characterized by their current rating and maximum "on" resistance listed in TABLE 4. These parameters are established by the number of Power FET's placed in parallel within the SSPC. A TTL/CMOS compatible input provides external control of the power switch's "ON/OFF" state. A logic high on this control input turns the power to the load "on". A logic low will turn the power switch off, which removes power from the load. The trip function is implemented by two separate circuits, a true I2T trip comparator and a short circuit fault comparator. They are independent of each other but work together to protect the system. In the event of an overload, the SSP-21116 series will trip, just like a circuit breaker, and automatically remove power from the load. In order to turn back on, the control input must be brought to a logic low, and then returned to a logic high state. If the load current is less than 110% of rated current, the SSPC will never trip. If the load current is greater than 145%, the SSPC will always trip. As in a circuit breaker, the SSPC's time to trip depends on the current level. Slight overloads will cause longer trip times. Heavy overloads will cause shorter trip times. The fault ("Instant Trip") and I2T trip curve, FIGURE 2, shows the trip time as a function of current for a single trip or repetitive trips with at least 10 seconds between trip and turn on. Attempts to repeatedly turn on into an overload will result in the thermal memory shortening each trip time. This "memory" protects the wire, load and SolidState Power Controller. For load currents less than 800%, the trip time can be found from FIGURE 2 by drawing a horizontal line on FIGURE 2 at the current level of interest. The SSPC will always trip at a time between the two curves. This is true I2T tripping. When the SSPC trips in accordance with the I2T characteristics, the fall time is 200 s, maximum. For load currents greater than 1200%, the SSPC will turn off in less than 25 s. Between 800% and 1200%, the SSPC will turn off in a time less than the "max. trip limit" shown in FIGURE 2 and may turn off in less than 25 s. When the SSPC turns off under these fault conditions, the fall time is less than 25 s. The status lines are TTL/CMOS compatible outputs which reflect the state of the SSPC, the load and the Built-In-Test (BIT) circuits. The status permits an external subsystem to monitor and ultimately control the SSPC. TABLE 5 defines the status lines' 10,000 INSTANT TRIP . MAX. TRIP LIMIT LOAD CURRENT % I - MAX 1,200 ALWAYS TRIP 1,000 800 600 MIN. TRIP LIMIT 400 NEVER TRIP 200 145% 110% 0 25 s 0.001 0.01 15 AMP I 2 T 0.1 1.0 10 TIME - SECONDS 10 AMP AND BELOW I 2 T FIGURE 2. TRIP CHARACTERISTICS Data Device Corporation www.ddc-web.com 4 SSP-21116 J-03/03-0 While the SSPC will always turn off in less than 25 s when the load current is greater than 1200%, the actual current may "spike" to a value higher than 1200% due to circuit delays. The MOSFET's inherently self limit the maximum current, depending on the number of MOSFET's and their rating. APPLICATIONS INFORMATION During turn on and turn off the rise and fall time of the output voltage is controlled to be less than 200 s. This value is a compromise between faster response time with a greater amount of RFI and EMI generated, and slower response time with less RFI and EMI but greater power dissipated in the SSPC during transitions. Since the Power MOSFET switches are not saturated during transitions the switching power dissipation is much greater than the static dissipation, and longer transitions result in a larger temperature rise. If the SSPC is rapidly turned on and off, the high average dissipation could result in a significant temperature rise in the SSPC. For this reason do not turn the SSPC off and on more rapidly than 30 msec. This will limit the maximum temperature of the switches to a safe level. The shape of the trip curve (I2T) is selected as optimum to protect the system wiring. The power dissipated in the wire is the wire resistance times the load current squared, and the temperature of the wire is determined by the length of time that this power is being dissipated. This makes the wire temperature proportional to the current squared times the on time. Since the trip curve follows this same characteristic the SSPC can accurately predict the wire temperature rise as a result of overloads and remove load current before the wiring is damaged from overtemperature. Of course, the wire I2T product should be greater than the SSPC I2T product for the SSPC to protect the wire. SELECTION The selection of a proper sized SSPC is essential for protection of the wire and load. This selection should be based on the steady state and transient overload currents. PRECAUTIONS When a short circuit causes turn off of the SSPC, precautions have to be taken to limit the transient voltages generated by the wire inductance. The magnitude of this voltage is L*di/dt where The SSP-21116 has been designed to derive its internal power requirements from the bias supply input (+5 Vdc). CONTROL INPUT TRIP POINT LOAD CURRENT STATUS 2 STATUS 1 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 SOLID-STATE POWER CONTROLLER TIMING AT 28 Vdc. TIME T1-T2 T2-T3 T1-T4 T4-T5 T6-T7 T7-T8 T6-T9 T10-T11 T11-T12 T11-T12 T11-T13 DESCRIPTION TURN-ON DELAY CURRENT RISE TIME STATUS 1 & STATUS 2 TURN-ON DELAY STATUS 1 & STATUS 2 RISE AND FALL TIME TURN-OFF DELAY CURRENT FALL TIME STATUS 1 & STATUS 2 TURN-OFF DELAY TRIP TIME AFTER TURN-ON CURRENT FALL TIME AFTER TRIP CURRENT FALL TIME AFTER TRIP TRIP TURN-OFF STATUS 1 DELAY MAXIMUM 350 200 7.5 350 350 200 5.0 SEE FIG. 2 200 25 5.0 UNIT s s ms ns s s ms s s s ms NOTES LOAD CURRENT < 800% LOAD CURRENT > 1200% FIGURE 3. SOLID-STATE POWER CONTROLLER TIMING Data Device Corporation www.ddc-web.com 5 SSP-21116 J-03/03-0 "L" is the wire inductance in Henries and "di/dt" is the rate of change of output current. If the SSPC turns off in 10 msec from a 150 amp overload (1000% for 15 amp unit) with a wire inductance of only 33 mH it would generate a spike of 500 volts. This exceeds the voltage rating of the MOSFET's. In order to provide protection from these transients, transient voltage suppressors should be used between the SSPC Slew Control and the Power In and between the SSPC Slew Control and Power Out terminals. The rating of the transient voltage suppressors should be selected so that at the maximum expected short circuit current, the transient voltage suppressor voltage drop would not exceed the SSPC voltage rating, and the power to be dissipated can be safely absorbed without transient suppressor failure. POWER ON RESET When the 5 V bias power is first applied, the SSPC will be off regardless of the CONTROL CMD input. If the CONTROL CMD input is a logic low, the SSPC is turned on by bringing the CONTROL CMD to a logic high. If the CONTROL CMD input is at a logic high when power is applied, the SSPC may be turned on by cycling the CONTROL CMD input to a logic low and then to a logic high. The system controller can be programmed to do this cycling of the CONTROL CMD input. Subsequent loss of the bias supply power causes the SSPC to turn off. Re-application of the bias supply power again causes a power on reset (refer to optional Power on reset.) Loss of power to the POWER IN terminals does not turn off the SSPC and reapplication of this power does not cause a power on reset. While circuit inductance can cause high voltage transients during turn off, lack of circuit inductance can cause current transients prior to turn off. If the output of the SSPC is shorted and there is no circuit inductance, the current from the source can rise instantaneously to a high value. The SSPC will limit the current to about 30 times its rating (3,000%). Circuit inductance will limit the rate of rise of this current. The SSPC can take 25 s to turn off. The current will always overshoot the 1200% maximum level of the SSPC due to this 25 s delay. If the current rises slowly due to circuit inductance, the overshoot will be negligible; if the current rises quickly, the overshoot will be more significant. In any case, the current spike will be less than 25 s. STATUS CODES This section contains a fuller explanation of the conditions and meaning of the status codes shown in TABLE 5. Each paragraph number corresponds to the STATE in TABLE 5. The first four conditions show the control input has commanded the SSPC to be off. 1) The SSPC has failed or shorted to ground. STATUS 1 indicates the load is drawing current but the SSPC should be off. 2) The SSPC has failed. STATUS 1 indicates the load is drawing current; STATUS 2 indicates the Power MOSFET switch is on; the SSPC should be off. In most real applications, there will always be significant circuit inductance. The problem to guard against is voltage transients, not current transients. 3) Normal off condition. STATUS 1 indicates the load is not drawing current; STATUS 2 indicates the Power MOSFET switch is off. When testing individual SSPC's, be careful to simulate actual system conditions. TABLE 5. STATUS CODES STATE INPUT CONTROL CMD OUTPUT STATUS 1 (SEE NOTE 2) OUTPUT STATUS 2 (SEE NOTE 3) 1 L L L SSPC failure or short to ground. 2 L L H Load "on"; showing SSPC failure. 3 L H L Load "off"; showing normal "off" condition. 4 L H H SSPC failure or STATUS 2 shorted to bias supply. 5 H L L SSPC failure or short to ground on STATUS 2 line. 6 H L H Load is "ON", showing normal "on" condition. 7 H H L Load is "OFF", showing "trip" (see note 1). 8 H H H Normal power out with load <5% of rated SSPC current. POWER CONTROLLER AND LOAD STATUS Notes: 1) Any trip condition per Figure 2. 2) STATUS 1 indicates a logic LOW when the load is > 15% of the rated SSPC current. 3) STATUS 2 indicates a logic HIGH when the Power MOSFET switch is on. Data Device Corporation www.ddc-web.com 6 SSP-21116 J-03/03-0 4) The SSPC has failed or STATUS 2 has shorted to the bias supply. STATUS 1 indicates the load is not drawing current; STATUS 2 indicates the Power MOSFET is on; the SSPC should be off. Capacitive loads can present a discharge problem. The SSPC's use Power MOSFET's as the switching element. The MOSFET's contain a parasitic diode which will be forward biased if the SSPC power output terminal is more positive than the power input terminal. If the 270 Vdc source is turned off while a charge is held on the capacitive load, this diode will turn on and discharge the load through the generator. The SSPC can carry a reverse current equal to its forward current rating; however, the dissipation with reverse current is up to four times the forward current dissipation for the same current. The user must ensure that the maximum case temperature is not exceeded. The next four conditions show the control input has commanded the SSPC to be on. 5) The SSPC has failed or there is a short to ground on the STATUS 2 output. STATUS 1 indicates the load is drawing current but STATUS 2 indicates the Power MOSFET switch is off. Incandescent lamps must be treated like capacitive loads for inrush current. Since they do not store charge, they do not present a discharge problem. 6) Normal on condition. STATUS 1 indicates the load is drawing current and STATUS 2 indicates the Power MOSFET switch is on. DC motors also must be treated like capacitive loads for inrush current. If they continue rotating when power is removed, reverse current is a possibility due to back EMF. Voltage transients must also be considered when using dc motors as loads on SSPC's. 7) Tripped condition. STATUS 1 indicates the load is not drawing current and STATUS 2 indicates the Power MOSFET switch is off. The SSPC can be turned back on by cycling the input control to a logic low and then back to a logic high. If the excessive load has not been removed, the SSPC will trip again. HEATSINKING The SSP-21116 series are designed so that the junction temperature can never exceed its maximum rating if the case temperature is held to 125C or less. Heatsinking is recommended to keep the case temperature to 125C when operating at high ambient temperatures. The SSPC's may be operated at room temperature without a heat sink. The maximum ambient temperature, TA, for operation without a heat sink is 125 - Pd x CA (where Pd is the power dissipation from TABLE 4 and CA is the thermal resistance from case-to-ambient from TABLE 3). 8) No load current. STATUS 1 indicates the load is not drawing current; STATUS 2 indicates the Power MOSFET switch is on. LOADS The SSP-21116 series can be used with any type of load: any combination of inductive, resistive, and capacitive. In addition, they can be used with dc motors and lamps. Inductive loads require protecting the SSPC against voltage transients. See the section on Precautions above. The same expression is used for finding the maximum ambient temperature with a heat sink except CA is now the sum of the thermal resistance from case-to-sink and from sink-to-ambient. Capacitive loads require comparing the load inrush current to the trip curve of FIGURE 2. The inrush current must be below the minimum trip curve to avoid tripping on the inrush current. NO OFFSET VOLTAGE The Power MOSFET used in the DDC SSPC's have no inherent voltage offset. The voltage drop across the Power MOSFET is TABLE 6. OPTIONAL STATUS TRUTH TABLE CONTROL STATUS 1 LOW LOW LOW SSPC failure, or STATUS 1 and STATUS 2 shorted to ground, or No Bias LOW LOW HIGH SSPC failure or STATUS 1 shorted to ground LOW HIGH LOW SSPC failure or STATUS 2 shorted to ground LOW HIGH HIGH Load "OFF", Normal Condition HIGH LOW LOW SSPC failure or STATUS 2 shorted to ground HIGH LOW HIGH Load "ON", Normal Condition HIGH HIGH LOW Load is "OFF", Tripped HIGH HIGH HIGH Load is "`ON", Load < 0.5% Rated Current STATUS 2 SYSTEM STATUS STATUS 1 indicates a logic LOW if > 15% of the rated current flowing. STATUS 2 indicates a logic LOW if the SSPC is tripped due to overcurrent. Data Device Corporation www.ddc-web.com 7 SSP-21116 J-03/03-0 The Power MOSFET's have the opposite characteristics from that of thermal runaway in bipolar devices. A local hot spot will steer current away from itself as its resistance in this area goes up. This results in even current sharing throughout the entire device, thereby eliminating hot spots. The inherent advantage of not having secondary breakdown is that the entire MOSFET has to exceed its temperature limitations before damage results. This characteristic makes the Power MOSFET more rugged when used for power switching then bipolar devices. solely dependent on the current flowing through the device and its "ON" resistance. Bipolar transistors, on the other hand, have an inherent dc offset voltage to which is added a voltage drop proportional to the devices' "ON" resistance and the current flowing through it. It is this inherent offset voltage that is missing from the power MOSFET. The Power MOSFET in many applications, leads to a lower voltage drop and power dissipation as an SSPC switch. In addition the Power MOSFET's driver logic requirements are much simpler, especially when multiple MOSFET's are used, as in the SSPC product. NO SECONDARY BREAKDOWN, AND PARALLELING SSPC'S A bipolar transistor has a set of current voltage limits that form an envelope that cannot be exceeded; this is known as the safe operating area of the device. If this envelope is exceeded local hot spots will occur. These hot spots conduct currents more readily then adjacent cool areas and tend to become hotter. This thermal runaway, or secondary breakdown, leads to the ultimate destruction of the device. TABLE 7. PINOUTS FOR FIGURE 4. PIN 1 2 3 4 5 6 7 8 FUNCTION POWER OUT POWER OUT POWER OUT SLEW CONTROL NC NC NC NC FUNCTION PIN 16 15 14 13 12 11 10 9 POWER IN POWER IN POWER IN BIAS SUPPLY COMMON BIAS SUPPLY INPUT STATUS 1 STATUS 2 CONTROL COMMAND 2.000 (MAX) (50.8) DIMENSIONS ARE IN INCHES (mm) 1.54 (39.12) 0.23 (5.84) 0.125 DIA (4 HOLES) (3.18) 8 0.325 MAX (8.26) 0.065 TYP (1.65) 9 0.040 0.002 16 REQD (1.02 0.05) 1.48 (37.59) 3.000 (MAX) (76.20) 2.54 (64.52) 7 EQ. SP @ 0.300 = 2.100 (7.62 = 5.33) 0.300 TYP (7.62) 0.45 (11.43) 1 0.105 (2.67) 16 0.030 (0.76) 0.26 (6.60) Note: See TABLE 7 for pinouts. PIN 1 DENOTED BY CONTRASTING COLORED BEAD 0.240 0.010 TYP (6.10 0.25) SIDE VIEW BOTTOM VIEW FIGURE 4. MECHANICAL OUTLINE FOR 10 - 15 AMP DIP PACKAGING Data Device Corporation www.ddc-web.com 8 SSP-21116 J-03/03-0 OPTIONS The following characteristics can be factory modified on special orders: Due to the current sharing aspects of the power MOSFET, they can be placed in parallel and share the load equally. DDC has a standard 28 Vdc 80 AMP power module which uses this technique. * I2T TRIP CURVE: K-factor adjustments ISOLATION OF CONTROL AND STATUS The SSPC was designed with isolation between the load power and the five volt control logic input and the status outputs. This is necessary to prevent noise caused by transients or power spikes on the power line from adversely affecting the operation of the SSPC. Therefore the case, POWER IN and the Control Circuit are all electrically isolated. FIGURE 1 shows this isolation as the "ISOLATED CONTROL CIRCUIT"; also notice the separation of the power (Slew Control) ground and signal (V bias supply common) ground. * OUTPUT RISE AND FALL TIMES: Turn-Off and Turn-On time can be factory modified (e.g., capacitive loads) * CURRENT RANGE * POWER-ON RESET: Other (V Bias) options are available * LEAKAGE CLAMP: can be deleted * CUSTOM PACKAGING: DIP, Flat Pack, or Smaller 2-5 Amp package The electrical isolation is supported by an internal power oscillator that electrically isolates separate internal power supplies that will power the internal analog and digital monolithics. This isolation prevents load or logic ground loops from affecting the proper operation of the SSPC. The isolation also insures that a fault of the switch (MOSFET) could never propagate back into the SSPC logic or cause damage to the logic side. Data Device Corporation www.ddc-web.com * OPTIONAL STATUS TRUTH TABLE (See Table 6) 9 SSP-21116 J-03/03-0 NOTES: Data Device Corporation www.ddc-web.com 10 SSP-21116 J-03/03-0 ORDERING INFORMATION SSP-21116-XXX-X Reliability Grade: B = Hybrids screened to MIL-PRF-38534 but without QCI testing BLANK = Standard DDC Procedures Current in Amps 10 = 10 Amps 15 = 15 Amps Temperature Range: 0 = -55C to +125C Data Device Corporation www.ddc-web.com 11 SSP-21116 J-03/03-0 The information in this data sheet is believed to be accurate; however, no responsibility is assumed by Data Device Corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. Specifications are subject to change without notice. Please visit our web site at www.ddc-web.com for the latest information. 105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2482 For Technical Support - 1-800-DDC-5757 ext. 7382 Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358 Southeast, U.S.A. - Tel: (703) 450-7900, Fax: (703) 450-6610 West Coast, U.S.A. - Tel: (714) 895-9777, Fax: (714) 895-4988 United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264 Ireland - Tel: +353-21-341065, Fax: +353-21-341568 France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425 Germany - Tel: +49-(0)8141-349-087, Fax: +49-(0)8141-349-089 Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689 World Wide Web - http://www.ddc-web.com RM (R) I FI REG U ST ERED DATA DEVICE CORPORATION REGISTERED TO ISO 9001 FILE NO. A5976 J-03/03-0 12 PRINTED IN THE U.S.A.