BergStik(R) Unshrouded Stacking Headers 2.54 mm Wide variety of stack heights in 0.5 mm increments High temperature plastic Selective plating Technical Data Mating Data Page Physical Operating Temperature Range DuboxTM Vertical receptacles Housing: High temperature, black thermoplastic Flammability rating: UL 94 V-0 Pin: Phosphor-bronze Plating: Gold or tin-lead over 1.27 m nickel -65C to +125C DuboxTM Low profile vertical receptacles Packaging 24 26, 28 Processing Information Standard: Bags Compatible with wave, vapor-phase, and IR reflow soldering processes Reference Information File no. E66906 Electrical Performance File no. LR46923 Product drawing: By 5-digit base part number Product specification: BUS-12-114 Current rating: 3 A continuous Insulation resistance: 5000 M min. Dielectric withstanding voltage: 1500 V Specifications subject to change without notice. Mechanical Performance Pin retention to housing: 9 N min. Typical Applications Receptacle mating side mating side Board Space OAL OAL Stack Height solder side OAL Stack Height solder side Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics 12 BergStik(R) Unshrouded Stacking Headers 2.54 mm Part Number 5 4 Lead Solder Side Option 1 = Through Hole (TMT) 2 = Surface Mount (SMT) Row Option Plating Total Positions Pin Style 1 = Single Row (TMT only) 2 = Double Row 1 = 2.41 2 = 3.05 4 = SMT (double row only) 1 = 0.76 m gold on mating area, tin-lead on solder side 4 = 3.81 m tin-lead 8 = 0.38 m gold on mating area, tin-lead on solder side Stack Height 01 to 36 single row (TMT) 04 to 72 double row (TMT) 04 to 50 double row (SMT Pin Style 01 02 03 04 05 06 07 08 09 10 11 12 OAL (TMT) OAL (SMT) mm mm 12.20 13.50 15.90 16.76 17.65 18.91 20.96 23.50 26.04 28.58 31.12 33.66 XX.XX = mm Specify mm (i.e. 08.50 = 8.50 mm in 0.50 mm increments 08.00 min. - 25.00 max.) 10.42 11.72 14.12 14.98 15.87 17.13 19.18 21.72 24.26 26.80 29.34 31.88 Step-by-Step Design 1. Determine desired board spacing (0.50 mm increments) 2. Select DuboxTM receptacle and calculate stack height Stack Height = Board Spacing - Receptacle Height 3. Find the insertion depth from the chart below. Calculate max./ min. OAL OAL = Stack Height + solder side + Insertion Depth 4. Select the Pin Style with OAL between max. and min. values Height Insertion Depth (max.) Insertion Depth (min.) Recommended PCB Layout DuboxTM RECEPTACLES Low Profile Vertical 7.00 8.50 6.10 6.10 3.86 4.34 Example: 1. Application requires a board spacing of 22.50 2. Select the DuboxTM Low Profile Receptacle with height of 7.00 The Header Stack Height is 22.50 - 7.00 = 15.50 3. For standard board applications, the 3.05 solder side is selected OAL (max.) = 15.50 + 3.05 + 6.10 = 24.65 OAL (min.) = 15.50 + 3.05 + 3.86 = 22.41 4. Select Pin Style 08 with OAL = 23.50 5. Part Number is 54122-108-72-1550 Dimensions in mm Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics 13