5962-8863603LA(CYPRESS) - e2v Aerospace & Defense

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

A

Changes in accordance with NOR 5962-R231-93. 93-09-21 M. A. Frye

B

Updated boilerplate. Added device types 03-05.

Removed programming requirements from drawing.

TABLE I. changes. Editorial changes throughout.

94-08-19 M. A. Frye

C

Boilerplate update, part of 5 year review. ksr 07-01-30 Joseph Rodenbeck

REV

SHEET

REV

SHEET

REV STATUS REV C C C C C C C C C C C

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11

PMIC N/A PREPARED BY

James E. Jamison

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

Ray Monnin

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

Michael A. Frye

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

88-09-22

MICROCIRCUIT, MEMORY,

DIGITAL, CMOS, 1K X 8

REGISTERED PROM,

MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

C SIZE

A CAGE CODE

67268

5962-88636

SHEET

1 OF

11

DSCC FORM 2233

APR 97 5962-E204-07

.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 2

DSCC FORM 2234

APR 97

1. SCOPE

1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in

accordance with MIL-PRF-38535, appendix A.

1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:

5962-88636 01 K A

Drawing number Device type

(see 1.2.1) Case outline

(see 1.2.2) Lead finish

(see 1.2.3)

1.2.1 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time

01 7C235 1K X 8-bit registered PROM 40

02 7C235 1K X 8-bit registered PROM 30

03 7C235A 1K X 8-bit registered PROM 40

04 7C235A 1K X 8-bit registered PROM 30

05 7C235A 1K X 8-bit registered PROM 25

1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

K CDFP3-F24 or GDFP2-F24 24 flat package

L CDIP4-T24 or GDIP3-T24 24 Dual-in-line

3 CQCC1-N28 28 Square chip carrier

1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.

1.3 Absolute maximum ratings.

Supply voltage range to ground potential (VCC)--------------------------- -0.5 V dc to +7.0 V dc

DC voltage range applied to the outputs in the high Z state----------- -0.5 V dc to +7.0 V dc

DC input voltage - - - - - - - - - - - - - - - - - - - - - -------------------------- -3.0 V dc to +7.0 V dc

Maximum power dissipation ------------------------------------------------- 1.0 W 3/

Lead temperature (soldering, 10 seconds) ------------------------------- +260°C

Thermal resistance, junction-to-case (θJC) - - - - - - - - - --------------- See MIL-STD-1835

Junction temperature (TJ) - - - - - - - - - - - - - - - - - - ------------------- +150°C 4/

Storage temperature range (TSTG) - - - - - - - - - - - - - - ---------------- -65°C to +150°C

Temperature under bias ------------------------------------------------------- -55°C to +125°C

Data retention -------------------------------------------------------------------- 10 years, minimum

1.4 Recommended operating conditions.

Supply voltage range (VCC)---------------------------------------------------- +4.5 V dc minimum to +5.5 V dc maximum

Ground voltage (GND) -------------------------------------------------------- 0 V dc

Input high voltage range (VIH) ------------------------------------------------ +2.0 V dc to VCC

Input low voltage range (VIL) -------------------------------------------------- -0.5 V dc to +0.8 V dc

Case operating temperature range (TC) ----------------------------------- -55°C to +125°C

1/ Generic numbers are also listed on the Standard Microcircuit Drawing Source Approval Bulletin and

in MIL-HDBK-103.

2/ Unless otherwise specified, all voltages are referenced to ground.

3/ Must withstand the added PD due to short circuit test; e.g., IOS.

4/ Maximum junction temperature may be increased to +175°C during burn-in and steady state life tests.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 3

DSCC FORM 2234

APR 97

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in

the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth table. The truth table shall be as specified on figure 2.

3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing

shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.3), the devices shall be programmed by the

manufacturer prior to test with a minimum of 50 percent of the total number of gates programmed or to any altered item

drawing pattern which includes at least 25 percent of the total number of gates programmed.

3.2.2.2 Programmed devices. The truth tables for programmed devices shall be as specified by an attached altered item

drawing.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 4

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics.

Test

Symbol

Group A

subgroups

Device

type

Limits

Unit

Conditions

-55°C ≤ TC ≤ +125°C

4.5 V ≤ VCC ≤ 5.5 V

unless otherwise specified Min Max

Output high voltage VOH V

CC =Min, IOH = -4.0 mA, 1, 2, 3 All 2.4 V

V

IN = VIH or VIL

Output low voltage VOL V

CC = Min, IOL = 16.0 mA, 1, 2, 3 All 0.4 V

V

IN = VIH or VIL

Input high voltage

VIH 1/ 1, 2, 3 All 2.0 V

Input low voltage

VIL 1/ 1, 2, 3 All 0.8 V

Input leakage current

IIX V

CC =Max

VIN = 5.5 V and GND 1, 2, 3 All -10 10 µA

Output leakage current IOZ V

CC = Max 1, 2, 3 All -10 10 µA

V

OUT = 5.5 V and GND 2/

Outputs disabled

Output short circuit IOS V

CC = Max 3/, 4/ 1, 2, 3 All -20 -90 mA

current VOUT = GND

ICC V

CC = Max 1, 2, 3 All 120 mA Power supply current I

OUT = 0 mA

Input capacitance CIN V

CC = 5.0 V 4 All 10 pF

TC = +25°C

f = 1 MHz VIN = 0 V

Output capacitance

COUT (see 4.3.1c) VOUT = 0 V 4 All 10 pF

Functional tests

See 4.3.1e 7, 8A, 8B All

Address setup to clock tSA 9, 10, 11 01, 03 40 ns

high 02, 04 30

5/ 05 25

Address hold from clock tHA 9, 10, 11 ns

high

All 0

Clock high to output tCO 9, 10, 11 01, 03 20 ns

valid 02, 04 15

05 12

Clock pulse width tPWC 9, 10, 11 01, 03 20 ns

02, 04 15

05 12

Es setup to clock high tSEs 9, 10, 11 01, 03 15 ns

02, 04

05 10

See footnotes at end of table.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 5

DSCC FORM 2234

APR 97

TABLE I. Electrical performance characteristics - Continued.

Test

Symbol

Conditions

-55°C ≤ TC ≤ +125°C

4.5 V ≤ VCC ≤ 5.5 V

Group A

subgroups

Device

type

Limits

Unit

unless otherwise specified Min Max

Es hold from clock

high tHEs 5/ 9, 10, 11 All 5

ns

Inactive to valid output tCOS 9, 10, 11 01, 03 25 ns

from clock high 6/ 02, 04,

05 20

Inactive output from tHZC 9, 10, 11 01, 03 25 ns

clock high 3/, 6/, 7/ 02, 04,

05 20

Valid output from E low tDOE 9, 10, 11 01, 03 25 ns

8/ 02, 04,

05 20

Inactive output from E tHZE 9, 10, 11 01, 03 25 ns

high 3/, 7/, 8/ 02, 04,

05 20

Delay from INIT to tDI 9, 10, 11 01, 03 35

valid output 3/ 02, 04,

05 25 ns

INIT recovery to clock

high 3/ tRI 9, 10, 11 All 20

ns

INIT pulse width tPWI 9, 10, 11 01, 03 25

3/ 02, 04,

05 20 ns

1/ These are absolute values with respect to device ground pin and include all overshoots due to system or tester

noise. Do not attempt to test these values without suitable equipment.

2/ For devices using synchronous enable, the device must be clocked after applying these voltages to perform this

measurement.

3/ These parameters may not be tested, but shall be guaranteed to the limits specified in table I.

4/ For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed

30 seconds.

5/ AC tests are performed with input rise and fall times of 5 ns or less, timing reference levels of 1.5 V, input pulse levels of

0 V to 3.0 V, output loading of the specified IOL or IOH and 50 pF load capacitance. See figure 3.

6/ Applies only when the synchronous Es function is used.

7/ Transition is measured at steady state high level -500 mV or steady state low level +500 mV on the output from the

1.5 V level on the input and 5 pF load capacitance. See figure 3.

8/ Applies only when the asynchronous E function is used.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 6

DSCC FORM 2234

APR 97

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN

listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD

PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in

compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification

mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-

38535, appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result

in a wide variety of configurations; two processing options are provided for selection in the contract, using an altered item

drawing.

3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in

3.2.2.1 and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program

configuration.

3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions

herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prior to delivery.

3.11 Data retention. A data retention stress test shall be completed as part of the vendor's reliability monitors.

This test shall be done initially and after any design or process change which may affect data retention. The methods and

procedures may be vendor specific, but will guarantee the number of years listed in section 1.3 herein over the

full military temperature range. The vendor's procedure shall be kept under document control and shall be made

available upon request.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,

appendix A.

4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all

devices prior to quality conformance inspection. The following additional criteria shall apply:

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1015 of MIL-STD-883.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 7

DSCC FORM 2234

APR 97

4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-

STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.

4.3.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.

c. Subgroup 4 (CIN and COUT measurement) shall be measured only for the initial test and after process or design

changes which may affect capacitance. Sample size is fifteen devices with no failures and all input and output

terminals tested.

d. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of

group A, subgroups 9, 10, and 11. Either of two techniques is acceptable:

(1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify

programmability and ac performance without programming the user array. If this is done, the resulting test

patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with

the sampling plan specified in MIL-STD-883, method 5005.

(2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy

programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be

submitted to programming (see 3.2.2.2). If more than two devices fail to program, the lot shall be rejected.

At the manufacturer's option, the sample may be increased to 24 total devices with no more than 4 total

device failures allowable. Ten devices from the programmability sample shall be submitted to the

requirements of group A, subgroups 9, 10, and 11. If more than two devices fail, the lot shall be rejected.

At the manufacturer's option, the sample may be increased to 20 total devices with no more than 4 total

device failures allowable.

e. Subgroups 7 and 8 shall include verification of the truth table.

4.3.2 Groups C and D inspections.

a. End-point electrical parameters shall be as specified in table II herein.

b. Steady-state life test conditions, method 1005 of MIL-STD-883.

(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified

in method 1005 of MIL-STD-883.

(2) TA = +125°C, minimum.

(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

c. Group C, subgroup 1 sample shall include devices tested in accordance with 4.3.1d.

4.4 Programming procedures. The programming procedures shall be as specified by the device manufacturer.

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990 REVISION LEVEL

C SHEET 8

DSCC FORM 2234

APR 97

Device types All

Case outlines K, L 3

Terminal

number

Terminal

symbol

1 A7 NC

2 A6 A

7

3 A5 A

6

4 A4 A

5

5 A3 A

4

6 A2 A

3

7 A1 A

2

8 A0 A

1

9 O0 A

0

10 O1 NC

11 O2 O

0

12 GND O1

13 O3 O

2

14 O4 GND

15 O5 NC

16 O6 O

3

17 O7 O

4

18 CP O5

19 Es O6

20 INIT O7

21 E NC

22 A9 CP

23 A8 Es

24 VCC INIT

25 ---

E

26 --- A9

27 --- A8

28 ---

VCC

NC = no connection

FIGURE 1. Terminal connections.

STANDARD

MICROCIRCUIT DRAWING

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C SHEET 9

DSCC FORM 2234

APR 97

Read or Output disable A2 CP Es INIT E A1 Outputs

Mode Read 1/ 2/ 3 X X VIL V

IH V

IL X Data out

Output disable 1/ 4/ X X VIH V

IH X X High Z

Output disable 1/ X X X VIH V

IH X High Z

INIT 1/ 5/ X X X VIL V

IL X 1025th

word

1/ X = don't care, but not to exceed VPP = 13.0 V, maximum.

2/ During read operation, the output latches are loaded on a "0" to "1" transition of CP.

3/ Pin 19 must be LOW prior to the "0" to "1" transition on CP (18) that loads the register.

4/ Pin 19 must be HIGH prior to the "0" to "1" transition on CP (18) that loads the register.

5/ Low to high clock transition required to enable outputs.

FIGURE 2. Truth table.

NOTES:

1. CL includes probe and jig capacitance. CL = 50 pF for all switching characteristics except tHZC and tHZE.

C

L = 5 pF for tHZC and tHZE.

2. Tests are performed with rise and fall times of 5 ns or less.

3. All device test loads should be located within two inches of device outputs.

FIGURE 3. Output load circuit and test conditions.

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C SHEET 10

DSCC FORM 2234

APR 97

NOTE: Transition is measured at steady-state high level -500 mV or steady-state low level +500 mV on the

output, from the 1.5 V level on the input and 5 pF load capacitance. See figure 3.

FIGURE 4. Switching waveforms.

STANDARD

MICROCIRCUIT DRAWING

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5962-88636

DEFENSE SUPPLY CENTER COLUMBUS

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C SHEET 11

DSCC FORM 2234

APR 97

TABLE II. Electrical test requirements. 1/ 2/ 3/ 4/

MIL-STD-883 test requirements Subgroups

(per method

5005, table I)

Interim electrical parameters

(method 5004)

---

Final electrical test parameters

(method 5004) f

1*, 2, 3, 7*, 8A, 8B,

9, 10,11

Group A test requirements

(method 5005)

1,2,3,4**,7,8A,8B,

9, 10,11

Groups C and D end-point electrical

parameters (method 5005)

2, 3, 7, 8A, 8B

1/ * indicates PDA applies to subgroups 1 and 7.

2/ Any or all subgroups may be combined when using high-speed testers.

3/ ** see 4.3.1c.

4/ As a minimum, subgroups 7 and 8 shall consist of verifying the data pattern.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be

used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC

5962) should contact DSCC-VA, telephone (614) 692-0544.

6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone

(614) 692-0547.

6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-

HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted

by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 07-01-30

Approved sources of supply for SMD 5962-88636 are listed below for immediate acquisition information only and shall

be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised

to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate

of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of

supply at http://www.dscc.dla.mil/Programs/Smcr/.

Standard

microcircuit

drawing PIN 1/

Vendor

CAGE

number

Vendor

similar PIN 2/

5962-8863601KA 3/

0C7V7

CY7C235-40KMB

7C235A-40

QP7C235A-40KMB

5962-8863601LA 3/

0C7V7

CY7C235-40DMB

7C235A-40

QP7C235A-40DMB

5962-88636013A 3/

0C7V7

CY7C235-40LMB

7C235A-40

QP7C235A-40LMB

5962-8863602KA 3/

0C7V7

CY7C235-30KMB

7C235A-30

QP7C235A-30KMB

5962-8863602LA 3/

0C7V7

CY7C235-30DMB

7C235A-30

QP7C235A-30DMB

5962-88636023A 3/

0C7V7

CY7C235-30LMB

7C235A-30

QP7C235A-30LMB

5962-8863603KA 3/

0C7V7

CY7C235A-40KMB

7C235A-40

QP7C235A-40KMB

5962-8863603LA 65786

0C7V7

CY7C235A-40DMB

QP7C235A-40DMB

5962-88636033A 3/

0C7V7

CY7C235A-40LMB

7C235A-40

QP7C235A-40LMB

5962-8863604KA 3/

0C7V7

CY7C235A-30KMB

7C235A-30

QP7C235A-30KMB

5962-8863604LA 3/

3/

0C7V7

CY7C235A-30DMB

7C235A-30

QP7C235A-30DMB

5962-88636043A 3/

0C7V7

CY7C235A-30LMB

7C235A-30

QP7C235A-30LMB

See footnotes at end of table.

Page 1 of 2

STANDARD MICROCIRCUIT DRAWI NG BULLETIN – Continued.

Standard

microcircuit

drawing PIN 1/

Vendor

CAGE

number

Vendor

similar PIN 2/

5962-8863605KA 3/

0C7V7

CY7C235A-25KMB

7C235A-25

QP7C235A-25KMB

5962-8863605LA 3/

0C7V7

CY7C235A-25DMB

7C235A-25

QP7C235A-25DMB

5962-88636053A 3/

0C7V7

CY7C235A-25LMB

7C235A-25

QP7C235A-25LMB

1/ The lead finish shown for each PIN representing a hermetic package

is the most readily available from the manufacturer listed for that

part. If the desired lead finish is not listed, contact the Vendor to

determine its availability.

2/ Caution: Do not use this number for item acquisition. Items

acquired to this number may not satisfy the performance

requirements of this drawing.

3/ Not available from an approved source.

Vendor CAGE Vendor name

number and address

0C7V7 QP Semiconductor

2945 Oakmead Village Court

Santa Clara, CA 95051

65786 Cypress Semiconductor

3901 North First Street

San Jose, CA 95134-1506

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

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