TLV2470, TLV2471, TLV2472, TLV2473, TLV2474, TLV2475, TLV247xA
FAMILY OF 600-µA/Ch 2.8-MHz RAIL-TO-RAIL INPUT/OUTPUT
HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS232A – JUNE 1999 – REVISED AUGUST 1999
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
CMOS Rail-To-Rail Input/Output
D
Input Bias Current . . . 2.5 pA
D
Low Supply Current . . . 600 µA/Channel
D
Ultra-Low Power Shutdown Mode
IDD(SHDN) ... 350 nA/ch at 3 V
IDD(SHDN) ... 1000 nA/ch at 5 V
D
Gain-Bandwidth Product . . . 2.8 MHz
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High Output Drive Capability
– ±10 mA at 180 mV
– ±35 mA at 500 mV
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Input Offset Voltage . . . 250 µV (typ)
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Supply Voltage Range . . . 2.7 V to 6 V
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Ultra-Small Packaging
– 5 or 6 Pin SOT-23 (TLV2470/1)
– 8 or 10 Pin MSOP (TLV2472/3)
description
The TLV247x is a family of CMOS rail-to-rail input/output operational amplifiers that establishes a new
performance point for supply current versus ac performance. These devices consume just 600 µA/channel
while offering 2.8 MHz of gain bandwidth product. Along with increased ac performance, the amplifier provides
high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The
TL V247x can swing to within 180 mV of each supply rail while driving a 10-mA load. For non-RRO applications,
the TLV247x can supply ±35 mA at 500 mV off the rail. Both the inputs and outputs swing rail-to-rail for increased
dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor
interface, portable medical equipment, and other data acquisition circuits.
FAMILY PACKAGE TABLE
NUMBER OF PACKAGE TYPES
UNIVERSAL
CHANNELS PDIP SOIC SOT-23 TSSOP MSOP
EVM BOARD
TLV2470 1 8 8 6‡— — Yes UNIV-OPAMP–2
TLV2471 1 8 8 5‡— — — UNIV-OPAMP–1
TLV2472 2 8 8 — — 8 — UNIV-OPAMP–1
TLV2473 2 14 14 — — 10 Yes UNIV-OPAMP–2
TLV2474 4 14 14 — 14‡— — —
TLV2475 4 16 16 — 16‡—Yes —
‡This device is in the Product Preview stage of development. Please contact your local TI sales office for availability.
A SELECTION OF SINGLE-SUPPLY OPERATIONAL AMPLIFIER PRODUCTS§
DEVICE VDD
(V) BW
(MHz) SLEW RATE
(V/µs) IDD (per channel)
(µA) RAIL-TO-RAIL
TLV247X 2.7 – 6.0 2.8 1.5 600 I/O
TLV245X 2.7 – 6.0 0.22 0.11 23 I/O
TLV246X 2.7 – 6.0 6.4 1.6 550 I/O
TLV277X 2.5 – 6.0 5.1 10.5 1000 O
§All specifications measured at 5 V.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
This document contains information on products in more than one phase
of development. The status of each device is indicated on the page(s)
specifying its electrical characteristics.
Copyright 1999, Texas Instruments Incorporated
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2
4
6
(TOP VIEW)
1
OUT
GND
IN+
VDD+
IN–
TLV2470
DBV† PACKAGE
5SHDN
†This device is in the Product Preview
stage of development. Please contact
your local TI sales office for availability.