EMK23H2H-66.666M TR EMK23 H 2 H -66.666M TR Series MEMS Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 3.2mm x 5.0mm Plastic Surface Mount (SMD) Packaging Options Tape & Reel Frequency Tolerance/Stability 50ppm Maximum over -40C to +85C Duty Cycle 50 5(%) Nominal Frequency 66.666MHz Output Control Function Tri-State (Disabled Output: High Impedance) ELECTRICAL SPECIFICATIONS Nominal Frequency 66.666MHz Frequency Tolerance/Stability 50ppm Maximum over -40C to +85C (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25C, 260C Reflow, Shock, and Vibration) Aging at 25C 1ppm Maximum First Year Operating Temperature Range -40C to +85C Supply Voltage 3.3Vdc 10% Input Current 25mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 2nSec Maximum (Measured from 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Output Control Function Tri-State (Disabled Output: High Impedance) Output Control Input Voltage +0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output Peak to Peak Jitter (tPK) 250pSec Maximum, 100pSec Typical Start Up Time 50mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Pads on bottom of package only) Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 1 of 7 EMK23H2H-66.666M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 0.85 0.15 3.20 0.15 1.20 0.10 (x4) 0.08 MAX 2 3 2.39 0.10 5.00 0.15 1 C0.35 0.10 0.80 0.15 4 R0.58 0.10 1.15 0.10 (x4) PIN CONNECTION 1 Tri-State 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1 XXXX or XXXXX XXXX or XXXXX=Ecliptek Manufacturing Lot Code Suggested Solder Pad Layout All Dimensions in Millimeters 0.5 1.60 (X4)MAX 1.50 (X4) Solder Land (X4) 1.04 0.60 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 2 of 7 EMK23H2H-66.666M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 3 of 7 EMK23H2H-66.666M TR Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for `Load Drive Capability'. www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 4 of 7 EMK23H2H-66.666M TR Tape & Reel Dimensions All Dimensions in Millimeters Compliant to EIA-481 Quantity Per Reel: 1,000 units 4.00 0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 0.10 1.75 0.10 7.50 0.10 MARKING ORIENTATION 16.00 0.30 DIA 1.50 MIN 8.00 0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 22.40 MAX DIA 40 MIN Access Hole at Slot Location 180 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 16.4 +2.00/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 5 of 7 EMK23H2H-66.666M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 6 of 7 EMK23H2H-66.666M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision J 04/16/2010 | Page 7 of 7