II. Manufacturing Information
A. Description /Function: Single- Phase Quick-PWM Intel IMV P6/6+/GMCH Controller
B. Process: S4
C. Number of Device Transistors: 10146
D. Fabri cation Location: Texas
E. Assembly Location: UTL Thailand
F. Date of Initial Production: December 19, 2007
III. Packaging Information
A. Package Type: 32-pin TQFN 5x5
B. Lead Frame: Copper
C. Lead Finish: 100% matte Tin
D. Die Attach: Conductive Epoxy
E. Bondwire: Gold (1 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagr am: #05-900 0-2634
H. Flammability Rating: Class UL94-V0
MAX8796GTJ+
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Singl e Layer Theta Ja: 47°C/W
K. Single Layer Theta Jc: 1.7°C/W
L. Multi Layer Theta Ja: 29°C/W
M. Multi Layer Theta Jc: 2.7°C/W
IV. Die Information
A. Dimensions: 77 X 73 mils
B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect: Aluminum/Si (Si = 1%)
D. Backside Metallization: None
E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Di electric: SiO2
I. Die Separation Method: Wafer Saw
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