VR1005AAA270-T - TAIYO YUDEN - Datasheet.Directory

notice_e-01

Notice for TAIYO YUDEN products　

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2011. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-

fore practical application or usage of the Products.

Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-

rating such products, which are caused under the conditions other than those speciﬁed in this catalog or individual

speciﬁcation.

■ Please contact Taiyo Yuden Co., Ltd. for further details of product speciﬁcations as the individual speciﬁcation is

available.

■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment

before commercial shipment of the equipment.

■ All electronic components or functional modules listed in this catalog are developed, designed and intended for

use in general electronics equipment.(for AV, office automation, household, office supply, information service,

telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any

equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal,

disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have

direct inﬂuence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.

Do not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma-

rine system, military, etc. where higher safety and reliability are especially required.

In addition, even electronic components or functional modules that are used for the general electronic equipment,

if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil-

ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to

install a protective circuit is strongly recommended at customer's design stage.

■ The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu-

tors (so called “TAIYO YUDEN’s ofﬁcial sales channel”).

It is only applicable to the products purchased from any of TAIYO YUDEN’ s ofﬁcial sales channel.

■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-

cur in connection with a third party's intellectual property rights and other related rights arising from your usage of

products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.

■ Caution for export

Certain items in this catalog may require speciﬁc procedures for export according to “Foreign Exchange and For-

eign Trade Control Law” of Japan, “U.S. Export Administration Regulations”, and other applicable regulations.

Should you have any question or inquiry on this matter, please contact our sales staff.

170

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■ FEATURES

■ ORDERING CODE

■ EXTERNAL DIMENSIONS/STANDARD QUANTITY

■ APPLICATIONS

■ PART NUMBERS

●1005 TYPE （Operating Temperature : ー55～＋125℃）

Ordering Code

EHS

(

Environmental

Hazardous

Substances

)

Varistor Voltage

V1mA (V)

Varistor voltage

tolerance

Rated Voltage

DC (V)

Clamping

Voltage

V0.1A (V)

ESD Peak Voltage

150pF 330Ω

contact discharge

(kV)

Peak current

8/20μsec. (A)

Capacitance

(reference value)

1kHz 1Vrms (pF)

VR1005BBA 270 RoHS 27

±20％

15 46

10 80

VR1005A AA 270 RoHS 27 15 46 5 40

VR1005CCA270 RoHS 27 15 46 1 15

VR1005A AA18 0 RoHS 18 10 32 10 140

VR1005A AA120 RoHS 12 7.5 22 5 130

VR1005BBA0 80 RoHS 8 5.5 15 25 650

VR1005DDA080 RoHS 8 5.5 15 20 480

VR1005A AA080 RoHS 8 5.5 15 3 100

VR1005CCA080 RoHS 8 4.5 17 8 1 33

VR1005A AA6R8 RoHS 6.8 ±30％3.5 15 15 3 100

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

◦High speed response realizes effective countermeasure for acute

ESD.

◦No polarity makes effective countermeasure for both directions with

one component.

◦High resistance to static electricity keeps high performance after

static electricity applied.

◦1005 (0402) case size contributes to designing for high density

mounting device.

◦ESD (Electric static discharge) protection.

MULTILAYER CHIP VARISTORS

V R △1 0 0 5 A A A 1 2 0 ーT△ △

❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽

Type L W T e Standard Quantity [pcs]

Taping

1005（0402）1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.10 10000

(0.039±0.002) (0.020±0.002) (0.020±0.002) (0.010±0.004)

Unit : mm (inch)

❶Type

VR△MULTILAYER

CHIP VARISTORS

△=Blank space

❽Internal code

△Standard products

△=Blank space

❼Packaging

ーT Tape & Reel

❷External Dimensions

(L×W) 〔mm〕

1005 (0402) 1.0×0.5

❸Capacitance

A Standard products

B～Special products

❻Varistor voltage

〔V〕

6R8 6.8

080 8×100

120 12×100

180 18×100

270 27×100

❹Withstanding Surge Current

A Standard products

B～Special products

❺Special code

A Standard products

REFLOW

171

chipvaristor01_e-01

NOISE SUPPRESSION COMPONENTS

／

VARISTORS

■ FEATURES

■ ORDERING CODE

■ EXTERNAL DIMENSIONS/STANDARD QUANTITY

■ APPLICATIONS

■ PART NUMBERS

●0603 TYPE (Operating Temperature : ー40～＋85℃）

Ordering Code

EHS

(

Environmental

Hazardous

Substances

)

Varistor

Voltage

V1mA (V)

Varistor volt-

age tolerance

Rated Voltage

DC (V)

Clamping

Voltage

V0.1A (V)

ESD Peak Voltage

150pF 330Ω

contact discharge

(kV)

Peak current

8/20μsec. (A)

Capacitance

(reference value)

1kHz 1Vrms (pF)

VR063 101A120 RoHS 12 ±20％7.5 22 15 3 100

VR063 330A120 RoHS 12 ±20％7.5 22 8 1 33

VR063 101A080 RoHS 8 ±20％5.5 15 15 3 100

VR063 101A6R8 RoHS 6.8 ±30％3.5 15 8 3 100

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

◦High speed response realizes effective countermeasure for acute

ESD.

◦No polarity makes effective countermeasure for both directions with

one component.

◦High resistance to static electricity keeps high performance after

static electricity applied.

◦0603 (0201) case size contributes to designing for high density

mounting device.

◦ESD (Electric static discharge) protection.

MULTILAYER CHIP VARISTORS

Type L W T e Standard Quantity [pcs]

Taping

0603（0201）0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 15000

(0.024±0.001) (0.012±0.001) (0.012±0.001) (0.006±0.002)

Unit : mm (inch)

❶Type

VR△MULTILAYER

CHIP VARISTORS

△=Blank space

❷External Dimensions (EIA)

(L×W) 〔mm〕

063 (0201) 0.6×0.3

❺Special code

A Standard products

B～Special products

REFLOW

V R △063△330A120ーT△ △

❶ ❷❸❹❺❻ ❼❽

❽Internal code

△Standard products

△=Blank space

❼Packaging

ーT Tape & Reel

❹Capacitance[pF]

330 33×100

101 10×101

❸Series name

△Standard products

△＝Blank space

❻Varistor voltage〔V〕

6R8 6.8

080 8×100

120 12×100

chipv0102_reli-PRP1

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■ PACKAGING

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

①Minimum Quantity

Type Thickness

mm (inch)

Standard Quantity [pcs]

Taping

1005・105C (0402) 0.5 (0.020) 10000

063 (0201) 0.3 (0.012) 15000

②Tape material

⑥Top Tape Strength

The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as

illustrated below.

③Taping Dimensions

◦Paper tape 8mm wide (0.315inches wide)

Unit : mm (inch)

Type Chip cavity Insertion pitch Tape thickness

A B F T

1005・105C

(0402)

0.65±0.1 1.15±0.1 2.0±0.05 0.80 max.

(0.026±0.004) (0.045±0.004) (0.079±0.002) (0.031 max.)

0603 (0201) 0.40±0.06 0.70±0.06 2.0±0.05 0.45 max.

(0.016±0.002) (0.028±0.002) (0.079±0.002) (0.018 max.)

Unit : mm (inch)

④Leader and Blank portion

⑤Reel size

Unit : mm (inch)

chipv0102_reli-PRP2 chipv0102_reli_e-01

■ RELIABILITY DATA

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

1. Operating Temperature Range

Speciﬁed Value VR1005 : ー55～＋125℃

VR063, VR105C : ー40～＋85℃

2. Storage Temperature Range

Speciﬁed Value ー55～＋125℃

3. Rated voltage

Speciﬁed Value Refer to the part number section.

【Test Methods and Remarks】

Maximum DC for continuous application within operating temperature range.

4. Varistor voltage

Speciﬁed Value Refer to the part number section.

【Test Methods and Remarks】

Voltage between terminals at application of DC 1mA.

5. Clamp voltage

Speciﬁed Value Refer to the part number section.

【Test Methods and Remarks】

8/20μs, 0.1A

6. Capacitance

Speciﬁed Value Refer to the part number section.

【Test Methods and Remarks】

Measured at speciﬁed measuring frequency, 1 Vrms, 0V bias.

7. ESD Peak voltage

Speciﬁed Value Refer to the part number section.

【Test Methods and Remarks】

150pF 330Ω contact discharge (IEC61000-4-2)

Maximum ESD voltage that can be withstood without deteriorating varistor characteristics when an ESD voltage is applied once.

8. Withstanding surge current

Speciﬁed Value Refer to the part number section.

【Test Methods and Remarks】

Maximum current that can be withstood without deteriorating varistor characteristics when an impulse current (8/20μs) is applied once.

9. High Temperature Loading

Speciﬁed Value VR1005, 063 : ΔV1mA/V1mA≦±10％

VR105C : ΔCp/Cp≦±30％

【Test Methods and Remarks】

VR1005 : 125±3℃ Rated voltage 500h±12h

VR063, VR105C : 85±3℃ Rated voltage 500h±12h

11. Thermal Shock

Speciﬁed Value

No mechanical damage.

VR1005, VR063 : ΔV1mA/V1mA≦±10％

VR105C : ΔCp/Cp≦±30％

【Test Methods and Remarks】

Conditions for 1 cycle

Step1 : Minimum operating temperature ＋0

ー3℃ : 30±3min.

Step2 : Room temperature : 2 to 3 min.

Step3 : Maximum operating temperature ＋0

ー3℃ : 30±3min.

Step4 : Room temperature : 2 to 3 min.

Number of cycles : 5

12. Solderability

Speciﬁed Value More than 75% of the termination shall be covered with fresh solder.

【Test Methods and Remarks】

235±5℃, 2±0.5 sec. Solder : H63A

Flux : Rosin ethanol solution (25wt%)

13. Resistance to Soldering Heat

Speciﬁed Value

No mechanical damage such as crack.

VR1005, VR063 : ΔV1mA/V1mA≦±10％

VR105C : ΔCp/Cp≦±30％

【Test Methods and Remarks】

260±5℃, 10±1 sec. Solder : H63A

Flux : Rosin ethanol solution (25wt%)

14. Adhesive force of terminal electrodes

Speciﬁed Value Without electrode peeling.

【Test Methods and Remarks】

1005, 105C Type :

After samples have been soldered to the PCB, a force of 5N (0.51kgf) in the horizontal direction shall be applied for 10±1 seconds as shown in below diagram.

063 Type :

After samples have been soldered to the PCB, a force of 2N (0.20kgf) in the horizontal direction shall be applied for 10±1 seconds as shown in below diagram.

10. Humidity Loading

Speciﬁed Value VR1005, VR063 : ΔV1mA/V1mA≦±10％

VR105C : ΔCp/Cp≦±30％

【Test Methods and Remarks】

40±2℃, 90 to 95％ RH, Rated voltage, 500h±12h

chipv0102_reli-PRP3

chipv0102_reli_e-01

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

■ RELIABILITY DATA

15. Bending strength

Speciﬁed Value No mechanical damage.

【Test Methods and Remarks】

Warp : 2mm

Testing board : glass epoxy-resin substrate

Thickness : 0.8mm

Note on standard condition :

"standard condition" referred to herein is deﬁned as follows

5 to 35℃ of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure.

When there are questions concerning measurement result：

In order to provide correlation data, the test shall be conducted under condition of 20±2℃

of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure.

Unless otherwise speciﬁed, all the tests are conducted under the "standard condition."

chipv0102_reli-PRP4 chipv0102_reli_e-01

■ PRECAUTIONS

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

1. Circuit Design

Precautions

◆Veriﬁcation of operating environment, electrical rating and performance

1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramiﬁcations. As such,

any varistors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components

used in general purpose applications.

◆Operating Voltage (Veriﬁcation of Rated voltage)

1. The operating voltage for varistors must always be lower than their rated values.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the varistor chosen. For a circuit where

both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than the varistor's rated voltage.

2. PCB Design

Precautions

◆Pattern conﬁgurations (Design of Land-patterns)

1. When varistors are mounted on a PCB, the amount of solder used (size of ﬁllet) can directly affect varistor performance.

Therefore, the following items must be carefully considered in the design of solder land patterns :

（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when

designing land-patterns it is necessary to consider the appropriate size and conﬁguration of the solder pads which in turn determines the amount of

solder necessary to form the ﬁllets.

（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated

by solder-resist.

◆Pattern conﬁgurations (varistor layout on panelized [breakaway] PC boards)

1. After varistors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes (PCB cutting,

board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reﬂow soldered boards etc). For this reason, planning pattern

conﬁgurations and the position of SMD varistors should be carefully performed to minimize stress.

Technical

consider-

ations

◆Pattern conﬁgurations (Design of Land-patterns)

1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. (larger ﬁllets which extend above

the component end terminations) Examples of improper pattern designs are also shown.

（1） Recommended land dimensions for a typical chip varistor land patterns for PCBs Recommended land dimensions for reﬂow-soldering

Type 063 1005, 105C

Size L 0.6 1.0

W 0.3 0.5

A 0.2～0.30 0.45～0.55

B 0.2～0.30 0.40～0.50

C 0.25～0.40 0.45～0.55

Unit : mm

Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.

（2） Examples of good and bad solder application

Items Not recommended Recommended

Mixed mounting of SMD

and leaded components

Component placement

close to the chassis

Hand-soldering of leaded

components near mounted

components

Horizontal component

placement

◆Pattern conﬁgurations (varistor layout on panelized [breakaway] PC boards)

1-1. The following are examples of good and bad varistor layout; SMD varistors should be located to minimize any possible mechanical stresses from board warp

or deﬂection.

Not recommended Recommended

Deﬂection of the board

1-2. To layout the varistors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on varistor layout.

The example below shows recommendations for better design.

1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the varistors can vary according to the method used. The following

methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD varistor layout must also

consider the PCB splitting procedure.

Precautions on the use of Multilayer chip varistors.

Position the component

at a right angle to the direction

of the mechanical stresses that

are anticipated.

chipv0102_reli-PRP5

chipv0102_reli_e-01

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

Precautions on the use of Multilayer chip varistors.

■ PRECAUTIONS

3. Considerations for automatic placement

Precautions

◆Adjustment of mounting machine

1. Excessive impact load should not be imposed on the varistors when mounting onto the PC boards.

2. The maintenance and inspection of the mounters should be conducted periodically.

◆Selection of Adhesives

1. Mounting varistors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded varistor characteristics unless the following

factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is

imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use.

Technical

consider-

ations

◆Adjustment of mounting machine

1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. To avoid this, the following points should

be considered before lowering the pick-up nozzle :

（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deﬂection of the board.

（2） The pick-up pressure should be adjusted between 1 and 3N static loads.

（3） To reduce the amount of deﬂection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC

board. The following diagrams show some typical examples of good pick-up nozzle placement :

Not recommended Recommended

Single-sided mounting

Double-sided mounting

2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the varistors because of mechanical impact on the

varistors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the

pin should be conducted periodically.

◆Selection of Adhesives

1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the varistors may

result in stresses on the varistors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component

placement, so the following precautions should be noted in the application of adhesives.

（1） Required adhesive characteristics

a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive should have sufﬁcient strength at high temperatures.

c. The adhesive should have good coating and thickness consistency.

d. The adhesive should be used during its prescribed shelf life.

e. The adhesive should harden rapidly.

f. The adhesive must not be contaminated.

g. The adhesive should have excellent insulation characteristics.

h. The adhesive should not be toxic and have no emission of toxic gasses.

（2） When the amount of adhesive is inappropriate to mount varistors on a PCB, that may cause a problem in placement of the component.

Too little adhesive may cause the varistors to fall off the board during the solder process.

Too much adhesive may cause defective soldering due to excessive ﬂow of adhesive on to the land or solder pad.

4. Soldering

Precautions

◆Selection of Flux

1. Since ﬂux may have a signiﬁcant effect on the performance of varistors, it is necessary to verify the following conditions prior to use ;

（1） Flux used should be with less than or equal to 0.1 wt% (equivalent to chlorine) of halogenated content. Flux having a strong acidity content should not be

applied.

（2） When soldering varistors on the board, the amount of ﬂux applied should be controlled at the optimum level.

（3） When using water-soluble ﬂux, special care should be taken to properly clean the boards.

◆Soldering

1. Temperature, time, amount of solder, etc. are speciﬁed in accordance with the following recommended conditions.

Technical

consider-

ations

◆Selection of Flux

1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the ﬂux, or highly acidic ﬂux is used, an excessive amount of residue after

soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the varistors.

1-2. Since the residue of water-soluble ﬂux is easily dissolved by water content in the air, the residue on the surface of varistors in high humidity conditions may

cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines

used should also be considered carefully when selecting water-soluble ﬂux.

◆Soldering

1-1. Preheating when soldering

Heating : Ceramic chip components should be preheated to within 100 to 130℃ of the soldering.

Cooling : The temperature difference between the components and cleaning process should not be greater than 100℃.

Ceramic chip varistors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process

must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.

Recommended conditions for soldering

[Reﬂow soldering]

Temperature proﬁle

Caution

1. The ideal condition is to have solder mass (ﬁllet) controlled to 1/2 to 1/3 of the thickness of the varistor, as shown below :

2. Because excessive dwell times can detrimentally affect solder ability, soldering duration should be kept as close to recommended times as possible.

chipv0102_reli-PRP6 chipv0102_reli_e-01

■ PRECAUTIONS

Precautions on the use of Multilayer chip varistors.

＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

5. Cleaning

Precautions

◆Cleaning conditions

1. When cleaning the PC board after the varistors are all mounted, select the appropriate cleaning solution according to the type of ﬂux used and purpose of the

cleaning (e.g. to remove soldering ﬂux or other materials from the production process.)

2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the varistor's characteristics.

Technical

consider-

ations

◆Cleaning conditions

1. The use of inappropriate solutions can cause foreign substances such as ﬂux residue to adhere to the varistor or deteriorate the varistor's outer coating,

resulting in a degradation of the varistor's electrical properties (especially insulation resistance).

2. Inappropriate cleaning conditions (insufﬁcient or excessive cleaning) may detrimentally affect the performance of the varistors.

（1） Excessive cleaning

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the varistor or

the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked;

Ultrasonic output : Below 20W/ℓ

Ultrasonic frequency : Below 40kHz

Ultrasonic washing period : 5 min. or less

6. Post cleaning processes

Precautions

◆Application of resin coating, molding, etc. to the PCB and components

1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal

storage conditions resulting in the deterioration of the varistor's performance.

2. When a resin's hardening temperature is higher than the varistor's operating temperature, the stresses generated by the excess heat may lead to varistor

damage or destruction. The use of such resins, molding materials etc. is not recommended.

7. Handling

Precautions

◆Breakaway PC boards (splitting along perforations)

1. When splitting the PC board after mounting varistors and other components, care is required so as not to give any stresses of deﬂection or twisting to the

board.

2. Board separation should not be done manually, but by using the appropriate devices.

◆Mechanical considerations

1. Be careful not to apply excessive mechanical shocks to the varistors.

（1） If ceramic varistors are dropped onto the ﬂoor or a hard surface, they should not be used.

（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components.

8. Storage conditions

Precautions

◆Storage

1. To maintain the solder ability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and

humidity in the storage area. Humidity should especially be kept as low as possible.

・

Recommended conditions

Ambient temperature : Below 40℃

Humidity : Below 70% RH

The ambient temperature must be kept below 30℃. Even under ideal storage conditions varistor electrode solderability decreases as time passes, so

should be used within 6 months from the time of delivery.

・

Ceramic chip varistors should be kept where no chlorine or sulfur exists in the air.

Technical

consider-

ations

◆Storage

1. If the parts are stored in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes

and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If ex-

ceeding the above period, please check the solderability before using the varistors.