nFeatures
EXB24AT type : Unbalanced p type
lUnbalanced p type attenuator circuit in one chip(1.0 mm ´ 1.0 mm)
lMounting cost reduction : Mounting times 3 times Õ 1 time
lAttenuation : 1 dB to 10 dB
EXB24AB type : Balanced O type
lBalanced O type attenuator circuit in one chip(1.0 mm ´ 1.0 mm)
lMounting cost reduction : Mounting times 4 times Õ 1 time
lAttenuation : 0 dB to 10 dB
nRecommended Applications
cellular phones(GSM, CDMA, PDC, etc.), PHS, PDA, for example.
Chip Attenuator
0404
Type: EXB24AT (Unbalanced p type)
Type: EXB24AB (Balanced O type)
Chip Attenuator
lMounting occupation area reduction : about 50 % reduction compared with an attenuator circuit consisting of
three 0402 chip resistors, almost equal to an attenuator circuit consisting of three 0201 chip resistors
lMounting occupation area reduction : about 64 % reduction compared with an attenuator circuit consisting of four
0402 chip resistors, about 26 % reduction compared with attenuator circuit consisting of four 0201 chip resistors
lAttenuation / level control / impedance matching of high frequency signals of communication equipment;
nAttenuation-Frequency Characteristics (typical) (EXB24AT type)
E
1
X
2
B
3
2
4
4
56
T
7
3
8
A
9
R
10
3 X
11 12
A
E
1
X
2
B
3
2
4
4
56
B
7
3
8
G
9
R
10
8 X
11 12
A
nExplanation of Part Numbers
lEXB24AT type : Unbalanced p type
lEXB24AB type : Balanced O type
Chip Attenuator
nConstruction
nCircuit Configuration
nDimensions (not to scale)
<Marking Configuration>
The bar marking for recognizing terminal direction is
located on the side of terminal 4.
Dimensions
(mm)
LWTAB
1.00±0.10 1.00+0.10 0.35±0.10 0.33±0.10 0.15±0.10
C P(typical value)
0.25±0.10 0.65
Dimensions
(mm)
Chip Attenuator
EXB24AT
EXB24AT
EXB24AT
EXB24AB
EXB24AB
EXB24AB
Dimensions
(mm)
LWT A B
1.00±0.10 1.00+0.10 0.35±0.10 0.33±0.10 0.15±0.10
C P(typical value)
0.30±0.10 0.65
Dimensions
(mm)
Type Thickness (mm) Weight (mg) Punched (Paper) Taping (2 mm Pitch)
(inches)
EXB24AT/AB 0.35 1.1 10000 pcs./reel
(0404)
n Packaging Methods
n Taping Dimensions
lTaping Reel lPunched (Paper) Taping
fAfBfCWT
180.0
60 min.
13.0±1.0 9.0±1.0 11.4±2.0
Ð3.0
Dimensions
(mm)
ABWFE
1.20±0.05 1.20±0.05 8.00±0.20 3.50±0.05 1.75±0.10
P0P1P2fD0T
4.00±0.10 2.00±0.10 2.00±0.05 1.50+0.10 0.45±0.10
0
<Product direction in the chip pocket of carrier tape>
Products shall be sealed so as to locate the terminal
1 and 2 on the side of feeding direction in the chip
pocket.
Chip Attenuator
Dimensions
(mm)
Dimensions
(mm) 0
Attenuation Value
Attenuation Value Tolerance
Characteristic Impedance
Power Rating
Frequency Range
VSWR
(Voltage Standing Wave Ratio)
Number of Resistors
Number of Terminals
Category Temperature Range
(Operating Temperature Range)
50 W*
0.04 W /package
DC to 2 GHz
1.3 Max.
3 resistors
4 terminals
-55 ¡C to +125 ¡C
Item
nRatings
EXB24AT
1 dB, 2 dB, 3 dB, 4 dB, 5 dB, 6 dB, 10 dB*
1 dB, 2 dB, 3 dB, 4 dB, 5 dB : ± 0.3 dB
6 dB, 10 dB : ± 0.5 dB
*Please inquire about the other attenuator value / characteristics impedance.
Power Derating Curve
For resistors operated in ambient temperature above
70¡C, power rating shall be derated in accordance
100 W, 200 W, 300 W*
0.04 W /package
DC to 2.5 GHz
1.2 Max.(typical value)
1.5 Max.(0 dB, typical value)
4 resistors
4 terminals
-55 ¡C to +125 ¡C
EXB24AB
0 dB, 1 dB, 2 dB, 3 dB, 6 dB, 10 dB*
0 dB to 3 dB : ± 0.8 dB
6 dB
10 dB
: ± 1.0 dB
: ± 2.0 dB
with the figure on the right.
lStandard Quantity
1. Soldering
Recommendation for soldering method is noted below.
lReflow soldering
Rising temperature IThe normal to Preheating temperature 30 s to 60 s
Preheating 140 ¡C to 160 ¡C 60 s to 120 s
Rising temperature II Preheating to 200 ¡C 20 s to 40 s
Main heating (cf. The limits of resistance to reflow soldering heat)
Gradual cooling 200 ¡C to 100 ¡C 1 ¡C/s to 4 ¡C/s
lFlow soldering
narrow 0.65 mm pitch.
lIron soldering
1Solder at 280 ¡C max. and 3 seconds max. with the soldering iron tip.
2The soldering iron tip shall not touch the protective coating of the part.
lUse rosin type flux. Do not use high-activity flux (the chlorine content is 0.2 wt % or more).
lAllow enough preheating so that the difference of soldering temperature and temperature of surface of
the part is 100 ¡C or less. This temperature difference shall be kept in rapid cooling by immersion into
solvent.
characteristics. Avoid excessive amount of solder.
2. Cleaning
lResidual flux after board washing may cause solder migration. Carefully check the status of board
washing.
trouble.
3. Others
l
lDo not use the product in dewy atmosphere.
(Reflow soldering shall be within two times.)
Chip Attenuator
nRecommend Land Pattern
Dimensions
(mm)
abcd
0.5 0.35 to 0.4 0.3 1.4 to 1.5
Safety Precautions
Precautions and recommendations are described below.
lPlease inquire with us when you use the different conditions.
lPlease measure a temperature of terminations and study the solderability for every type of board before using.
lUse of more solder results in more mechanical stress to the part resulting in cracking or impaired
Study the type and amount of flux to be used when no washing is made. Study the type of water-soluble flux
and cleaning agent and drying condition when water washing is done. Confirm they will not cause any
Take necessary precautions to avoid any abnormal stress caused by bending of board.
We cannot recommend the flow soldering, because a solder bridge may occur owing to
