December 2010 Doc ID 17944 Rev 1 1/9
9
STPS2H100-Y
Automotive power Schottky rectifier
Features
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade-off between leakage current and
forward voltage drop
Avalanche capability specified
ECOPACK®2 compliant component
AEC-Q101 qualified
Description
Schottky rectifiers designed for high frequency
miniature switched mode power supplies such as
adaptators and on board DC/DC converters.
Available in SMA and SMB.
Table 1. Device summary
Symbol Value
IF(AV) 2 A
VRRM 100 V
Tj (max) 175 °C
VF (max) 0.65 V
SMA
STPS2H100AY
SMB
STPS2H100UY
K
A
K
A
www.st.com
Characteristics STPS2H100-Y
2/9 Doc ID 17944 Rev 1
1 Characteristics
Table 2. Absolute ratings (limiting values)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 100 V
IF(AV) Average forward current SMA / SMB TL = 130 °C δ = 0.5 2 A
IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 2400 W
Tstg Storage temperature range -65 to +175 °C
TjOperating junction temperature range(1)
1. condition to avoid thermal runaway for a diode on its own heatsink
-40 to +175 °C
Table 3. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to lead SMA 30 °C/W
SMB 25
Table 4. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1)
1. Pulse test: tp = 5 ms, δ < 2%
Reverse leakage current Tj = 25 °C VR = VRRM
--1µA
Tj = 125 °C - 0.4 1 mA
VF(2)
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.56 x IF(AV) + 0.045 IF2(RMS)
Forward voltage drop
Tj = 25 °C IF = 2 A - - 0.79
V
Tj = 125 °C - 0.6 0.65
Tj = 25 °C IF = 4 A - - 0.88
Tj = 125 °C - 0.69 0.74
dPtot
dTj <1
Rth(j-a)
STPS2H100-Y Characteristics
Doc ID 17944 Rev 1 3/9
Figure 1. Average forward power dissipation
versus average forward current
Figure 2. Average forward current versus
ambient temperature (δ = 0.5)
(SMA / SMB)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
P (W)
F(AV)
T
δ=tp/T tp
δ= 1
δ= 0.1
δ= 0.05
I (A)
F(AV)
δ= 0.5
δ= 0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
0 25 50 75 100 125 150 175
I (A)
F(AV)
T
δ=tp/T tp
SMB
R =80°C/W
S =1.5cm
th(j-a)
(CU) 2
T (°C)
amb
R=R
th(j-a) th(j-I)
SMA
R =100°C/W
S =1.5cm
th(j-a)
(CU) 2
SMA
SMB
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Figure 5. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMA)
Figure 6. Non repetitive surge peak forward
current versus overload duration
(maximum values) (SMB)
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5 t(s)
T =125°C
a
T =25°C
a
T =75°C
a
SMA
0
1
2
3
4
5
6
7
8
9
10
1.E-03 1.E-02 1.E-01 1.E+00
I (A)
M
IM
t
δ=0.5 t(s)
T =125°C
a
T =25°C
a
T =75°C
a
SMB
Characteristics STPS2H100-Y
4/9 Doc ID 17944 Rev 1
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SMA / SMB)
Figure 8. Reverse leakage current versus
reverse voltage applied
(typical values)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z/R
th(j-a) th(j-a)
T
δ=tp/T tp
t (s)
p
Single pulse
SMA
SMB
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
0 20406080100
T
j
=150°C
T
j
=125°C
T
j
=25°C
T
j
=100°C
T
j
=75°C
T
j
=50°C
V (V)
R
I (µA)
R
Figure 9. Junction capacitance versus
reverse voltage applied
(typical values)
Figure 10. Forward voltage drop versus
forward current (low level)
10
100
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
I (A)
FM
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
STPS2H100-Y Characteristics
Doc ID 17944 Rev 1 5/9
Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB)
Figure 11. Forward voltage drop versus
forward current (high level)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
I (A)
FM
1
10
100
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMA
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
Package information STPS2H100-Y
6/9 Doc ID 17944 Rev 1
2 Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 14. SMA footprint (dimensions in mm)
Table 5. SMA dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.006 0.016
D 2.25 2.90 0.089 0.114
E 4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
E
CL
E1
D
A1
A2
b
2.63
5.43
1.4
1.64
1.4
STPS2H100-Y Package information
Doc ID 17944 Rev 1 7/9
Figure 15. SMB footprint (dimensions in mm)
Table 6. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
Ordering information STPS2H100-Y
8/9 Doc ID 17944 Rev 1
3 Ordering information
4 Revision history
Table 7. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS2H100AY S21Y SMA 0.068 g 5000 Tape and reel
STPS2H100UY G21Y SMB 0.107 g 2500 Tape and reel
Table 8. Document revision history
Date Revision Changes
03-Dec-2010 1 Initial release.
STPS2H100-Y
Doc ID 17944 Rev 1 9/9
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com