1
FEATURES
DESCRIPTION
APPLICATIONS
VBAT
RESET
MR
PFO
8
7
6
5
1
2
3
4
VOUT
VDD
GND
PFI
DGK PACKAGE
(TOP VIEW)
ACTUAL SIZE
3,05 mm x 4,98 mm
TYPICAL OPERATING CIRCUIT
VDD VBAT
PFI
Backup
Battery
RESET
PFO
VOUT
GND
Rx
Ry
External
Source
0.1 µF
Power
Supply
GND
RESET
I/O
VCC
Switchover
Capacitor
0.1 µF
TPS3619
TPS3620 Microcontroller
or
Microprocessor
Manual
Reset
MR
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007www.ti.com
BACKUP-BATTERY SUPERVISORS FOR RAM RETENTION
2
•Supply Current of 40 µA (Max)•Battery-Supply Current of 100 nA (Max)
The TPS3619 and TPS3620 families of supervisorycircuits monitor and control processor activity by•Precision Supply Voltage Monitor 3.3 V, 5 V,
providing backup-battery switchover for data retentionOther Options on Request
of CMOS RAM.•Backup-Battery Voltage Can Exceed V
DD
During power on, RESET is asserted when the•Power On Reset Generator With Fixed 100-ms
supply voltage (V
DD
or V
BAT
) becomes higher than 1.1Reset Delay Time
V. Thereafter, the supply voltage supervisor monitors•Voltage Monitor For Power-Fail or Low-Battery
V
DD
and keeps RESET output active as long as V
DDMonitoring
remains below the threshold voltage (V
IT
). An internaltimer delays the return of the output to the inactive•Battery Freshness Seal (TPS3619)
state (high) to ensure proper system reset. The delay•Pin-For-Pin Compatible With MAX819,
time starts after V
DD
has risen above V
IT
. When theMAX703, and MAX704
supply voltage drops below V
IT,
the output becomes•8-Pin MSOP Package
active (low) again.•Temperature Range – 40 °C to +85 °C
The product spectrum is designed for supply voltagesof 3.3 V and 5 V. The TPS3619 and TPS3620 areavailable in an 8-pin MSOP package and arecharacterized for operation over a temperature range•Fax Machines
of – 40 °C to +85 °C.•Set-Top Boxes•Advanced Voice Mail Systems•Portable Battery-Powered Equipment•Computer Equipment•Advanced Modems•Automotive Systems•Portable Long-Time Monitoring Equipment•Point-of-Sale Equipment
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001 – 2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
STANDARD AND APPLICATION SPECIFIC VERSIONS
TPS361 9 – 33 DGK R
Reel
Nominal Supply Voltage
Package
Functionality
Family
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATING TABLE
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE INFORMATION
(1)
SPECIFIED PACKAGE TRANSPORT MEDIA,PRODUCT ORDERING NUMBERTEMPERATURE RANGE MARKING QUANTITY
TPS3619-33DGK Tube, 80TPS3619-33 AFL
TPS3619-33DGKR Tape and Reel, 2500TPS3619-50DGK Tube, 80TPS3619-50 AFM
TPS3619-50DGKR Tape and Reel, 2500– 40 °C to +85 °C
TPS3620-33DGKT Tape and Reel, 250TPS3620-33 ANL
TPS3620-33DGKR Tape and Reel, 2500TPS3620-50DGKT Tape and Reel, 250TPS3620-50 ANM
TPS3620-50DGKR Tape and Reel, 2500
(1) For the most current specifications and package information, see the Package Option Addendum located at the end of this data sheet orrefer to our web site at www.ti.com .
DEVICE NAME NOMINAL VOLTAGE
(1)
, V
NOM
TPS3619-33 DGK 3.3 VTPS3619-50 DGK 5.0 VTPS3620-33 DGK 3.3 VTPS3620-50 DGK 5.0 V
(1) For other threshold voltage versions, contact the local TI salesoffice for availability and lead-time.
Over operating free-air temperature (unless otherwise noted).
(1)
UNIT
Supply voltage: V
DD
(2)
7 VMR and PFI pins
(2)
– 0.3 V to (V
DD
+ 0.3 V)Continuous output current: V
OUT
, I
O
400 mAAll other pins, I
O
(2)
± 10 mAContinuous total power dissipation See Dissipation Rating TableOperating free-air temperature range, T
A
– 40 °C to +85 °CStorage temperature range, T
stg
– 65 °C to +150 °CLead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds +260 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to GND. For reliable operation, the device must not be operated at 7 V for more than t = 1000hcontinuously.
DERATINGθ
JA
θ
JA
T
A
< 25 °C T
A
= +70 °C T
A
= +85 °CPACKAGE θ
JC
FACTOR ABOVE(LOW-K) (HIGH-K) POWER RATING POWER RATING POWER RATINGT
A
= +25 °C
DGK 55 °C/W 266 °C/W 180 °C/W 470 mW 3.76 mW/ °C 301 mW 241 mW
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RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
At specified temperature range.
MIN MAX UNIT
Supply voltage, V
DD
1.65 5.5 VBattery supply voltage, V
BAT
1.5 5.5 VInput voltage, V
I
0 V
DD
+ 0.3 VHigh-level input voltage, V
IH
0.7 x V
DD
VLow-level input voltage, V
IL
0.3 x V
DD
VContinuous output current at V
OUT
, I
O
300 mAInput transition rise and fall rate at MR 100 ns/VSlew rate at V
DD
or V
BAT
,Δt/ ΔV 1 V/ µsOperating free-air temperature range, T
A
– 40 +85 °C
Over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
DD
= 1.8 V, I
OH
= – 400 µA V
DD
– 0.2 VRESET V
DD
= 3.3 V, I
OH
= – 2 mA V
DD
– 0.4 V VV
DD
= 5 V, I
OH
= – 3 mA V
DD
– 0.4 VV
OH
High-level output voltage
V
DD
= 1.8 V, I
OH
= – 20 µA V
DD
– 0.3 VPFO V
DD
= 3.3 V, I
OH
= – 80 µA V
DD
– 0.4 V VV
DD
= 5 V, I
OH
= – 120 µA V
DD
– 0.4 VV
DD
= 1.8 V, I
OL
= – 400 µA 0.2V
OL
Low-level output voltage RESET PFO V
DD
= 3.3 V, I
OL
= 2 mA 0.4 VV
DD
= 5 V, I
OL
= 3 mA 0.4I
OL
= 20 µA, V
BAT
> 1.1 V orV
res
Power-up reset voltage (see
(1)
) 0.4 VV
DD
> 1.1 VI
OUT
= 8.5 mA,
V
DD
= 1.8 V V
DD
– 50 mVV
BAT
= 0 VI
OUT
= 125 mA,Normal mode V
DD
= 3.3 V V
DD
– 150 mV VV
BAT
= 0 VI
OUT
= 200 mA,V
OUT
V
DD
= 5 V V
DD
– 200 mVV
BAT
= 0 VI
OUT
= 0.5 mA,
V
DD
= 0 V V
BAT
– 20 mVV
BAT
= 1.5 VBattery-backup mode VI
OUT
= 7.5 mA,
V
BAT
– 113 mVV
BAT
= 3.3 VV
DD
to V
OUT
on-resistance V
DD
= 5 V 0.6 1r
DS(on)
ΩV
BAT
to V
OUT
on-resistance V
DD
= 3.3 V 8 15TPS3619-33 2.88 2.93 3V
IT –
Negative-going input
TPS3619-50 T
A
= – 40 °C to 85 °C 4.46 4.55 4.64 Vthreshold voltage (see
(2)
)V
PFI
PFI 1.13 1.15 1.171.65 V < V
IT
< 2.5 V 20V
IT
2.5 V < V
IT
< 3.5 V 403.5 V < V
IT
< 5.5 V 60V
hys
Hysteresis mVPFI 12VBSW
V
DD
= 1.8 V 55(see
(3)
)
(1) The lowest supply voltage at which RESET becomes active. t
r,VDD
≥15 µs/V.(2) To ensure the best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 µF) should be placed near the supply terminals.(3) For V
DD
< 1.6 V, V
OUT
switches to V
BAT
regardless of V
BAT
.
Copyright © 2001 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 3
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TIMING REQUIREMENTS
SWITCHING CHARACTERISTICS
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
ELECTRICAL CHARACTERISTICS (continued)Over recommended operating conditions (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
IH
High-level input current MR = 0.7 x V
DD
– 33 – 76MR V
DD
= 5 V µAI
IL
Low-level input current MR = 0 V – 110 – 255I
I
Input current PFI – 25 25 nAV
DD
= 1.8 V – 0.3I
OS
Short-circuit current PFO PFO = 0 V V
DD
= 3.3 V – 1.1 mAV
DD
= 5 V – 2.4V
OUT
= V
DD
40I
DD
V
DD
supply current µAV
OUT
= V
BAT
40V
OUT
= V
DD
– 0.1 0.1I
(BAT)
V
BAT
supply current µAV
OUT
= V
BAT
0.5C
i
Input capacitance V
I
= 0 V to 5 V 5 pF
At R
L
= 1 M Ω, C
L
= 50 pF, T
A
= – 40 °C to +85 °C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
at V
DD
V
IH
= V
IT
+ 0.2 V, V
IL
= V
IT
– 0.2 V 6 µst
w
Pulse width
at MR V
DD
= V
IT
+ 0.2 V, V
IL
= 0.3 x V
DD
, V
IH
= 0.7 x V
DD
100 ns
At R
L
= 1 M Ω, C
L
= 50 pF, T
A
= – 40 °C to +85 °C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
DD
≥V
IT
+ 0.2 V, MR ≥0.7 x V
DDt
d
Delay time 60 100 140 msSee timing diagramV
DD
to RESET V
IL
= V
IT
– 0.2 V, V
IH
= V
IT
+ 0.2 V 2 5Propagation (delay) time, PFI to PFO delay V
IL
= V
PFI
– 0.2 V, V
IH
= V
PFI
+ 0.2 V 3 5t
PHL
µshigh-to-low level output
V
DD
≥V
IT
+ 0.2 V, V
IL
= 0.3 x V
DD
, 0.1 1MR to RESET
V
IH
= 0.7 x V
DD
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VIT
VBAT
VDD
VOUT
RESET
td
t
t
t
td
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
TIMING DIAGRAM
Table 1. FUNCTION TABLE
V
DD
> V
IT
V
DD
> V
BAT
MR V
OUT
RESET
0 0 0 V
BAT
00 0 1 V
BAT
00 1 0 V
DD
00 1 1 V
DD
01 0 0 V
DD
01 0 1 V
DD
11 1 0 V
DD
01 1 1 V
DD
1
PFI > V
PFI
PFO
0 01 1CONDITION.: V
DD
> V
DD_MIN
Copyright © 2001 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPS3619-33 TPS3619-50 TPS3620-33 TPS3620-50
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_
+Switch
Control
Reference
Voltage
of 1.15 V
_
+
RESET
Logic
+
Timer
_
+
VBAT
VDD
PFI
VOUT
RESET
PFO
MR
TPS3619
TPS3620
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
Table 2. TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTIONNAME NO.
GND 3 I GroundMR 6 I Manual reset inputPFI 4 I Power-fail comparator inputPFO 5 O Power-fail comparator outputRESET 7 O Active-low reset outputV
BAT
8 I Backup-battery inputV
DD
2 I Input supply voltageV
OUT
1 O Supply output
FUNCTIONAL BLOCK DIAGRAM
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TYPICAL CHARACTERISTICS
500
600
700
800
900
1000
50 75 100 125 150 175 200
TA = 85°C
TA = 25°C
TA = 0°C
TA = −40°C
− Static Drain-Source On-State Resistance − m
VDD = 3.3 V
VBAT = GND
IO − Output Current − mA
rDS(on) Ω
5
10
15
20
2.5 4.5 6.5 8.5 10.5 12.5 14.5
TA = 85°C
TA = 25°C
TA = 0°C
TA = −40°C
− Static Drain-Source On-State Resistance −
IO − Output Current − mA
rDS(on) Ω
VBAT = 3.3 V
7.5
12.5
17.5
0
5
10
15
20
25
30
0123456
TA = −40°C
TA = 25°C
TA = 85°C
TA = 0°C
− Supply Current −IDD Aµ
VDD − Supply Voltage − V
VBAT Mode
VBAT = 2.6 V VDD Mode
VBAT = GND
or
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
STATIC DRAIN-SOURCE ON-STATE RESISTANCE STATIC DRAIN-SOURCE ON-STATE RESISTANCE(V
DD
to V
OUT
) (V
BAT
to V
OUT
)vs vsOUTPUT CURRENT OUTPUT CURRENT
Figure 1. Figure 2.
SUPPLY CURRENT NORMALIZED THRESHOLD AT RESETvs vsSUPPLY VOLTAGE FREE-AIR TEMPERATURE
Figure 3. Figure 4.
Copyright © 2001 – 2007, Texas Instruments Incorporated Submit Documentation Feedback 7
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0
1
2
3
4
5
6
−35−30−25−20−15−10−−50
TA = −40°C
TA = 85°C
TA = 0°C
TA = 25°C
− High-Level Output Voltage at RESET − V
VOH
IOH − High-Level Output Current − mA
VDD = 5 V
VBAT = GND
4.5
4.6
4.7
4.8
4.9
5
5.1
−5−4.5−4−3.5−3−2.5−2−1.5−1−0.50
TA = −40°C
TA = 25°C
TA = 85°C
TA = 0°C
IOH − High-Level Output Current − mA
VDD = 5 V
VBAT = GND
Expanded View
− High-Level Output Voltage at RESET − V
VOH
0
1
2
3
4
5
6
−2.5−2−1.5−1−0.50
TA = −40°C
TA = 25°C
TA = 85°C
TA = 0°C
− High-Level Output Voltage at PFO − V
VOH
IOH − High-Level Output Current − mA
VDD = 5.5 V
PFI = 1.4 V
VBAT = GND
5.10
5.15
5.20
5.25
5.30
5.35
5.40
5.45
5.50
5.55
−200−180−160−140−120−100−80−60−40−200
TA = −40°C
TA = 25°C
TA = 85°C
TA = 0°C
IOH − High-Level Output Current − µA
VDD = 5.5 V
PFI = 1.4 V
VBAT = GND
Expanded View
− High-Level Output Voltage at PFO − V
VOH
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
TYPICAL CHARACTERISTICS (continued)
HIGH-LEVEL OUTPUT VOLTAGE AT RESET HIGH-LEVEL OUTPUT VOLTAGE AT RESETvs vsHIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
Figure 5. Figure 6.
HIGH-LEVEL OUTPUT VOLTAGE AT PFO HIGH-LEVEL OUTPUT VOLTAGE AT PFOvs vsHIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
Figure 7. Figure 8.
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0
0.5
1
1.5
2
2.5
3
3.5
0 5 10 15 20 25
TA = 25°C
TA = 85°C
TA = 0°C
TA = −40°C
− Low-Level Output Voltage at RESET − V
VOL
IOL − Low-Level Output Current − mA
VDD = 3.3 V
VBAT = GND
0
1
2
3
4
5
6
7
8
9
10
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Minimum Pulse Duration at − VDD
Threshold Overdrive at VDD − V 1
sµ
0.6
1
1.4
1.8
2.2
2.6
3
3.4
3.8
4.2
4.6
5
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Minimum Pulse Duration at PFI −
Threshold Overdrive at PFI − V
VDD = 1.65 V
sµ
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
TYPICAL CHARACTERISTICS (continued)
LOW-LEVEL OUTPUT VOLTAGE AT RESET LOW-LEVEL OUTPUT VOLTAGE AT RESETvs vsLOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT
Figure 9. Figure 10.
MINIMUM PULSE DURATION AT V
DD
MINIMUM PULSE DURATION AT PFIvs vsTHRESHOLD OVERDRIVE AT V
DD
THRESHOLD OVERDRIVE AT PFI
Figure 11. Figure 12.
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DETAILED DESCRIPTION
Battery Freshness Seal (TPS3619)
Power-Fail Comparator (PFI and PFO)
Backup-Battery Switchover
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
The battery freshness seal of the TPS3619 family disconnects the backup-battery from internal circuitry until it isneeded. This function prevents the backup-battery from being discharged unitl the final product is put to use. Thefollowing steps explain how to enable the freshness seal mode.1. Connect V
BAT
(V
BAT
> V
BAT
min)2. Ground PFO3. Connect PFI to V
DD
(PFI = V
DD
)4. Connect V
DD
to power supply (V
DD
> V
IT
) and keep connected for 5 ms < t < 35 ms
The battery freshness seal mode is automatically removed by the positive-going edge of RESET when V
DD
isapplied.
An additional comparator is provided to monitor voltages other than the nominal supply voltage. Thepower-fail-input (PFI) is compared with an internal voltage reference of 1.15 V. If the input voltage falls below thepower-fail threshold V
IT(PFI)
of typical 1.15 V, the power-fail output ( PFO) goes low. If V
IT(PFI)
goes above V
(PFI)
,plus about 12-mV hysteresis, the output returns to high. By connecting two external resistors, it is possible tosupervise any voltages above V
(PFI)
. The sum of both resistors should be about 1 M Ω, to minimize powerconsumption and also to assure that the current in the PFI pin can be ignored compared with the current throughthe resistor network. The tolerance of the external resistors should be not more than 1% to ensure minimalvariation of sensed voltage. If the power-fail comparator is unused, PFI should be connected to ground and PFOleft unconnected.
In case of a brownout or power failure, it may be necessary to preserve the contents of RAM. If a backup batteryis installed at V
BAT
, the device automatically switches the connected RAM to backup power when V
DD
fails. Inorder to allow the backup battery (e.g., a 3.6-V lithium cell) to have a higher voltage than V
DD
, these supervisorsdo not connect V
BAT
to V
OUT
when V
BAT
is greater than V
DD
. V
BAT
only connects to V
OUT
(through a 15- Ωswitch)when V
DD
falls below V
IT
and V
BAT
is greater than V
DD
. When V
DD
recovers, switchover is deferred either untilV
DD
crosses V
BAT
, or until V
DD
rises above the reset threshold V
IT
. V
OUT
connects to V
DD
through a 1- Ω(max)PMOS switch when V
DD
crosses the reset threshold.
FUNCTION TABLE
V
DD
> V
BAT
V
DD
> V
IT
V
OUT
1 1 V
DD
1 0 V
DD
0 1 V
DD
0 0 V
BAT
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Undefined
VBSW Hysteresis
VBAT Mode
VDD Mode VIT Hysteresis
– Normal Supply Voltage – VVDD
VBAT – Backup-Battery Supply Voltage – V
TPS3619-33 , , TPS3619-50TPS3620-33 , TPS3620-50
SLVS387H – APRIL 2001 – REVISED DECEMBER 2007
Figure 13. Normal Supply Voltage vs Backup-Battery Supply Voltage
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PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS3619-33DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-33DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-33DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-33DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-50DGK ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-50DGKG4 ACTIVE VSSOP DGK 8 80 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-50DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3619-50DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-33DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-33DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-33DGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-33DGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-50DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-50DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-50DGKT ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3620-50DGKTG4 ACTIVE VSSOP DGK 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS3619-33, TPS3620-33 :
•Enhanced Product: TPS3619-33-EP, TPS3620-33-EP
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3619-33DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3619-50DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3620-33DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3620-33DGKT VSSOP DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3620-50DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3620-50DGKT VSSOP DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3619-33DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TPS3619-50DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TPS3620-33DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TPS3620-33DGKT VSSOP DGK 8 250 358.0 335.0 35.0
TPS3620-50DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
TPS3620-50DGKT VSSOP DGK 8 250 358.0 335.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2
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