- 146 -
.412(10.5)
MAX
.185(4.70)
.175(4.44)
.055(1.40)
.045(1.14)
.27(6.86)
.23(5.84)
.11(2.79)
.10(2.54)
.025(0.64)
.014(0.35)
.154(3.91)
.148(3.74)
DIA
PIN1 2
.113(2.87)
.103(2.62)
.16(4.06)
.14(3.56)
.037(0.94)
.027(0.68)
.205(5.20)
.195(4.95)
.594(15.1)
.587(14.9)
.56(14.22)
.53(13.46)
SFA1601G THRU SFA1608G
16.0 AMPS. Glass Passivated Super Fast Rectifiers
Voltage Range
50 to 600 Volts
Current
16.0 Amperes
Features
a Low forward voltage drop
a High current capability
a High reliability
a High surge current capability
Mechanical Data
a Cases: Molded plastic
a Epoxy: UL 94V-O rate flame retardant
a Terminals: Leads solderable per MIL-
STD-202, Method 208 guaranteed
a Polarity: As marked
a High temperature soldering guaranteed:
250°C/10 seconds .16”,(4.06mm) from
case.
a Weight: 2.24 grams
TO-220A
Dimensions in inches and (millimeters)
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number SFA
1601G SFA
1602G SFA
1603G SFA
1604G SFA
1605G SFA
1606G SFA
1607G SFA
1608G Units
Maximum Recurrent Peak Reverse Voltage 50 100 150 200 300 400 500 600 V
Maximum RMS Voltage 35 70 105 140 210 280 350 420 V
Maximum DC Blocking Voltage 50 100 150 200 300 400 500 600 V
Maximum Average Forward Rectified Current
@TC = 100°C 16.0 A
Peak Forward Surge Current, 8.3 ms Single
Half Sine-wave Superimposed on Rated Load
(JEDEC method ) 200 A
Maximum Instantaneous Forward Voltage
@ 16.0A 0.975 1.3 1.7 V
Maximum DC Reverse Current @ TA=25°C
at Rated DC Blocking Voltage @ TA=100°C 10
400 uA
uA
Maximum Reverse Recovery Time (Note 1) 35 nS
Typical Junction Capacitance (Note 2) 170 140 pF
Typical Thermal Resistance RÛJC (Note 3) 2.0 °C/W
Operating Temperature Range TJ-65 to +150 °C
Storage Temperature Range TSTG -65 to +150 °C
Notes: 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Notes: 2. Measured at 1 MHz and Applied Reverse Voltage of 4.0 V D.C.
Notes: 3. Thermal Resistance from Junction to Case Mounted on Heatsink.