GP2S60
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.:D3-A02101EN-
A
GP2S60
SMT, Detecting Distance : 0.5mm
Phototransistor Output,
Compact Reflective
Photointerrupter
■ Description
GP2S60 is a compact-package, phototransistor output,
reflective photointerrupter, with emitter and detector facing the
same direction in a molding that provides noncontact sensing.
The compact package series is a result of unique technology,
combing transfer and injection molding, that also blocks visible
light to minimize false detection.
This photointerrupter can be ordered in different CTR ranks,
and has a thin, leadless (T&R) package, suitable for reflow
soldering.
■Features
1. Reflective with Phototransistor Output
2. Highlights :
• Compact Size
• Surface Mount Type (SMT), reflow soldering
• Tape and Reel (T&R) 2 000 pcs per reel
3. Key Parameters :
• Optimal Sensing Distance : 0.5mm
• Package : 3.2×1.7×1.1mm
• Visible light cut resin to prevent
4. RoHS directive compliant
■Agency approvals/Compliance
1. Compliant with RoHS directive
■Applications
1. Detection of object presence or motion.
2. Any application, which production is migrating to
100% surface mount components.
Example : printer, optical storage
GP2S60
2 Sheet No.: D3-A02101EN-A
■ Internal Connection Diagram
■ Outline Dimensions (Unit : mm)
• Unspecified tolerance : ±0.15mm.
• Dimensions in parenthesis are shown for reference.
• Dimensions on the outline drawing is the maximum value
excluding burr.
• The dimensions shown do not include burr.
• Burr's dimension : 0.15mm MAX.
Product mass : approx. 0.01g
Plating material : Au
① Collecto
r
② Emitter
③ Cathode
④ Anode
①
②③
④
Top view
2.7
3.2
1.7
(0.63)
(0.7)
Emitter center
(0.65)
(0.7) Detector center
(0.55)
1.1
Opaque resin molding portion
0.4
(1.8)
(0.57)
(0.57)
Pattern for directional
Distinction (NC)
①
②③
④
Plating area
Top view
3
Sheet No.:D3-A02101EN-A
GP2S60
■Absolute Maximum Ratings
■Electro-optical Characteristics
(Ta=25˚C)
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
Reverse voltage VR6V
Power dissipation PD75 mW
Output
Collector-emitter voltage
VCEO 35 V
Emitter-collector voltage
VECO 6V
Collector current IC20 mA
Collector power dissipation PC75 mW
Total power dissipation Ptot 100 mW
Operating temperature Topr −25 to +85 ˚C
Storage temperature Tstg −40 to +100 ˚C
∗1Soldering temperature Tsol 260 ˚C
∗1 For 5s or less
(Ta=25˚C)
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input Forward voltage VFIF=20mA −1.2 1.4 V
Reverse current IRVR=6V −−
10 μA
Output Collector dark current ICEO VCE=20V −1 100 nA
Transfer
charac-
teristics
∗2 Collector Current ICIF=4mA, VCE=2V 40 85 130 μA
∗3 Leak current ILEAK IF=4mA, VCE=2V −−
500 nA
Response time Rise time trVCE=2V, IC=100μA,
RL=1kΩ, d=1mm
−20 100 μs
Fall time tf−20 100
∗2 The condition and arrangement of the refl ective object are shown below.
The rank splitting of collector current (IC) shall be executed according to the table below.
Rank Collector current, IC [μA]
(IF=4mA, VCE=2V)
A 40 to 80
B 65 to 130
∗3 Without refl ective object.
●Test Condition and Arrangement for Collector Current
d=1mm
glass plate
Aluminum evaporation
4
Sheet No.:D3-A02101EN-A
GP2S60
■Model Line-up
Please contact a local SHARP sales representative to see the actial status of the produiction.
Model No. Rank IC(μA) Conditions
GP2S60 A or B 40 to 130 IF=4mA
VCE=2V
Ta=25˚C
GP2S60A A 40 to 80
GP2S60B B 65 to 130
5
Sheet No.:D3-A02101EN-A
GP2S60
Fig.5 Collector Current vs.
Collector-Emitter Voltage
Fig.6 Relative Collector Current vs.
Ambient Temperature
Fig.3 Forward Current vs. Forward
Voltage
Fig.4 Collector Current vs.
Forward Current
Forward current IF (mA)
100
10
0 0.5 1 1.5 2 2.5 3
Forward voltage VF (V)
Ta=75˚C
50˚C
25˚C
0˚C
−25˚C
10
100
200
300
400
500
600
700
0 5 10 15 20
Forward current IF (mA)
Collector current IC (μA)
VCE=2V
Ta=25C
Collector current IC (μA)
0
100
200
300
400
500
600
0246810
Collector-emitter voltage VCE (V)
IF=15mA
10mA
7mA
4mA
2mA
Ta=25˚C
−25
VCE=2V
IF=4mA
0
20
40
60
80
100
120
0255075
Relative collector current (%)
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Power Dissipation vs.
Ambient Temperature
Power dissipation PD, PC, Ptot (mW)
Ambient temperature Ta (˚C)
0
20
15
40
60
80
75
100
120
Ptot
−25 0 1007550 8525
PD,PC
Forward current IF (mA)
0
10
20
30
40
50
60
25 0 1007550 8525
Ambient temperature Ta (˚C)
6
Sheet No.:D3-A02101EN-A
GP2S60
Fig.7 Collector Dark Current vs.
Ambient Temperature
Fig.8 Response Time vs. Load
Resistance
Fig.9
Test Circuit for Response Time
Fig.10 Relative Collector Current vs.
Distance
Fig.11
Spectral Sensitivity
Collector dark current ICEO (A)
10−10
10−6
10−7
10−8
10−9
0 25 50 75 100
Ambient temperature Ta (˚C)
VCE=20V
10%
Input
Output
Input Output
90%
ts
td
VCC
RD
RL
tf
tr
Reflector
Plate
Response time (μs)
1
10
100
1 000
0.1 1 1 00010 100
Load resistance RL (kΩ)
VCE=2V
IC=100μA
Ta=25˚C
tf
ts
td
tr
Relative sensitivity (%)
0
100
80
60
40
20
600 700 800 900 1 000 1 100 1 200
Wavelength λ (nm)
Ta=25˚C
L
Al evaporation glass
10
20
30
40
50
60
70
80
90
100
1 4.523453.52.51.50.50
VCE=2V
IF=4mA
Ta=25˚C
Relative collector current (%)
Distance between sensor and Aluminum evaporation glass L (mm)
Fig.12
Detecting Position Characteristics (1)
20
40
60
80
100
6420351−3−1−2
Relative collector current (%)
OMS card moving distance (mm)
VCE=2V
IF=4mA
d=1mm
1mm
d
0
OMS test card
Sensor −+
7
Sheet No.:D3-A02101EN-A
GP2S60
Fig.13
Detecting Position Characteristics (2)
Sensor
20
40
60
80
100
64203
51−3−1−2
Relative collector current (%)
OMS card moving distance (mm)
VCE=2V
IF=4mA
d=1mm
1mm
d
0
OMS test card
−+
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
Sheet No.:D3-A02101EN-A
GP2S60
■Design Considerations
●Design guide
1) Regarding to prevention of malfunction
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) Distance characteristic
The distance between the photointerrupter and the object to be detected shall be determined the distance
by referencing Fig.10 "Relative collector current vs. distance".
3) For wiring on a mounting PCB
To avoid possibility for short, please do not apply pattern wiring on the back side of the device.
4) Regarding to mounting this product
There is a possibility that the opaque molded resin portion may have a crack by force at mounting etc.
Please use this product after well confi rmation of conditions in your production line.
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
●Parts
This product is assembled using the below parts.
• Light detector (qty. : 1)
Category Material Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm) Response time (μs)
Phototransister Silicon (Si) 930 700 to 1 200 20
• Light emitter (qty. : 1)
Category Material Maximum light emitting
wavelength (nm) I/O Frequency (MHz)
Infrared emitting diode
(non-coherent) Gallium arsenide (GaAs) 950 0.3
• Material
Case PCB Lead frame plating
Epoxy resin
Black polyphenylene sulfi de Glass epoxy resin Au plating
GP2S60
9 Sheet No.: D3-A02101EN-A
● Recommended pattern
(Unit : mm)
area : Please do not apply the pattern wiring to avoid the possibility of short circuit.
Regarding amount of solder, if there is solder leakage in terminal wiring pattern between PCB and housing
main body, the reliability will be deteriorated.
Please check the proper amount of solder in advance not to have solder leakage into terminal wiring pattern
between PCB and housing main body.
measure tolerance : ±0.1
10
Sheet No.:D3-A02101EN-A
GP2S60
■Manufacturing Guidelines
●Storage and management after open
Storage condition
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 60%RH
or less in humidity within 2 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125˚C, 16 to 24 hours
∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or fi x temporarily the products to substrate.
11
Sheet No.:D3-A02101EN-A
GP2S60
●Soldering Method
Refl ow Soldering:
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please solder within one time.
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
MAX
240˚C
MAX
165˚C
200˚C
25˚C
1 to 4˚C/s
MAX120s
MAX10s
MAX60s
MAX90s
1 to 4˚C/s
1 to 4˚C/s
GP2S60
12 Sheet No.: D3-A02101EN-A
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information
Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Category
Toxic and hazardous substances
Lead
(Pb）
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
chromium
(Cr6+)
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
Photointerrupter ✔ ✔ ✔ ✔ ✔ ✔
✔ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006 standard.
GP2S60
13 Sheet No.: D3-A02101EN-A
■ Package specification
● Tape and Reel package
Package materials
Carrier tape : PS (with anti-static material)
Reel : PS
Package method
2 000 pcs of products shall be packaged in a reel. One reed is endased in aluminum laminated bag.
After sealing up the bag, it encased in one case (5 bags/case).
Carrier tape structure and Dimensions
Dimensions List （Unit：mm）
A B C D E F
8±0.3 3.5±0.05 1.75±0.1 4±0.1 2
±0.1 4
±0.1
G H I J K L
Φ1.55±0.05 3.6±0.1 0.3±0.05 1.25±0.1 2.2±0.1 Φ1.1±0.1
Reel structure and Dimensions
Dimensions List （Unit：mm）
a b c d
180±2.0 9
±1.0 60＋0.5 Φ13±0.2
e f g
Φ21±0.8 11.4±1.0 2＋0.3
－0
－0
14
Sheet No.:D3-A02101EN-A
GP2S60
Direction of product insertion
[Packing : 2 000pcs/reel]
Storage method
Storage conditions should follow the condition shown below.
Storage temperature : 5 to 30˚C
Storage hunidity : 70%RH or less
Pull-out direction
GP2S60
15 Sheet No.: D3-A02101EN-A
■ Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· These specification sheets include materials protected
under copyright of Sharp Corporation ("Sharp").
Please do not reproduce or cause anyone to reproduce
them without Sharp's consent.
· When using this product, please observe the absolute
maximum ratings and the instructions for use outlined in
these specification sheets, as well as the precautions
mentioned below. Sharp assumes no responsibility for
any damage resulting from use of the product which does
not comply with the absolute maximum ratings and the
instructions included in these specification sheets, and
the precautions mentioned below.
· Please do verify the validity of this part after assembling
it in customer’s products, when customer wants to make
catalogue and instruction manual based on the
specification sheet of this part.
(Precautions)
(1) This product is designed for use in the following
application areas ;
· OA equipment · Audio visual equipment
· Home appliances
· Telecommunication equipment (Terminal)
· Measuring equipment
· Tooling machines · Computers
If the use of the product in the above application areas is
for equipment listed in paragraphs (2) or (3), please be
sure to observe the precautions given in those respective
paragraphs.
(2) Appropriate measures, such as fail-safe design and
redundant design considering the safety design of the
overall system and equipment, should be taken to ensure
reliability and safety when this product is used for
equipment which demands high reliability and safety in
function and precision, such as ;
· Transportation control and safety equipment (aircraft,
train, automobile etc.)
· Traffic signals · Gas leakage sensor breakers
· Rescue and security equipment
· Other safety equipment
(3) Please do not use this product for equipment which
require extremely high reliability and safety in function and
precision, such as ;
· Space equipment
· Telecommunication equipment (for trunk lines)
· Nuclear power control equipment · Medical equipment
· Power generation and power transmission control
system (Key system)
(4) Please contact and consult with a Sharp sales
representative if there are any questions regarding
interpretation of the above four paragraphs.
· Please contact and consult with a Sharp sales
representative for any questions about this product.
· If the SHARP devices listed in this publication fall within
the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP
devices.
