HTMS8301FTB/AF,115"" - NXP SEMICONDUCTORS

1. General description

The HITAG product line is well known and established in the contactless identification

market.

Due to the open marketing strategy of NXP Semiconductors there are various

manufacturers well established for both the transponders/cards as well as the read/write

devices. All of them supporting HITAG 1, HITAG 2 and HITAG S transponder ICs.

With the new HITAG µ family, this existing infrastructure is extended with the next

generation of ICs being substantially smaller in mechanical size, lower in cost, offering

more operation distance and speed, but still being operated with the same reader

infrastructure and transponder manufacturing equipment.

The protocol and command structure for HITAG µ ISO 18000 is design to support Reader

Talks First (RTF) operation, including anti-collision algorithm.

2. Features and benefits

2.1 Features

Integrated circuit for contactless identification transponders and cards

Integrated resonance capacitor of 210 pF with ±3% tolerance or 280 pF with ±5%

tolerance over full production

Frequency range 100 kHz to 150 kHz

2.2 Protocol

Modulation read/write device → transponder: 100 % ASK and binary pulse length

coding

Modulation transponder → read/write device: Strong ASK modulation with

anti-collision, Manchester coding

Fast anti-collision protocol

Data integrity check (CRC)

Reader Talks First (RTF) Mode

Data rate read/write device to transponder: 5.2 kbit/s

Data rates transponder to read/write device: 4 kbit/s

HITAG µ

ISO 18000 transponder IC

Rev. 3.0 — 18 March 2010

184430

Product data sheet

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Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

2.3 Memory

1760 bit

Up to 10 000 erase/write cycles

10 years non-volatile data retention

Memory Lock functionality

32-bit password feature

2.4 Supported standards

Full compliant to ISO 18000-2

2.5 Security features

48-bit Unique Item Identification (UII)

2.6 Delivery types

Sawn, gold-bumped 8” wafer

HVSON2

SOT-1122

3. Applications

Industrial applications

Casino gambling

4. Ordering information

Table 1. Ordering information

Type number Package

Name Description Type Version

HTMS1301FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ ISO 18000,

210pF

HTMS8301FUG/AM Wafer sawn, megabumped wafer, 150 µm, 8 inch, UV HITAG μ ISO 18000,

280pF

HTMS1301FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1 x 1.45 x 0.5 mm

HITAG μ ISO 18000,

210pF

SOT1122

HTMS8301FTB/AF XSON3 plastic extremely thin small outline package; no

leads; 4 terminals; body 1 x 1.45 x 0.5 mm

HITAG μ ISO 18000,

280pF

SOT1122

HTMS1301FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3 x 2 x

0.85 mm

HITAG μ ISO 18000,

210pF

SOT899-1

HTMS8301FTK/AF HVSON2 plastic thermal enhanced very thin small outline

package; no leads; 2 terminals; body 3 x 2 x

0.85 mm

HITAG μ ISO 18000,

280pF

SOT899-1

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

5. Block diagram

The HITAG µ ISO 18000 transponder IC require no external power supply. The

contactless interface generates the power supply and the system clock via the resonant

circuitry by inductive coupling to the read/write device (RWD). The interface also

demodulates data transmitted from the RWD to the HITAG µ ISO 18000 transponder IC,

and modulates the magnetic field for data transmission from the HITAG µ ISO 18000

transponder IC to the RWD.

Data are stored in a non-volatile memory (EEPROM). The EEPROM has a capacity of

1760 bit and is organized in blocks.

Fig 1. Block diagram of HITAG µ ISO 18000 transponder IC

001aai334

CLK

MOD

DEMOD

VREG

VDD

data

out

clock

R/W

ANALOGUE

RF INTERFACE

PA D

RECT

Cres

DIGITAL CONTROL

TRANSPONDER

ANTICOLLISION

READ/WRITE

CONTROL

ACCESS CONTROL

EEPROM INTERFACE

CONTROL

RF INTERFACE

CONTROL

EEPROM

SEQUENCER

CHARGE PUMP

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

6. Pinning information

Note: All pads except LA and LB are electrically disconnected after dicing.

Fig 2. HITAG µ ISO 1800 - Mega bumps bondpad locations

Table 2. HITAG µ ISO 18000 - Mega bumps dimensions

Description Dimension

(X) chip size 550 µm

(Y) chip size 550 µm

(1) pad center to chip edge 100.5 µm

(2) pad center to chip edge 48.708 µm

(3) pad center to chip edge 180.5 µm

(4) pad center to chip edge 55.5 µm

(5) pad center to chip edge 48.508 µm

(6) pad center to chip edge 165.5 µm

Bump Size:

LA, LB 294 x 164 µm

Remaining pads 60 x 60 µm

001aaj823

(4) (4)

(3)

(Y)

(X)

(2) (5)

(6) (6)

(1)

LA LB

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

7. Mechanical specification

7.1 Wafer specification

See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

7.1.1 Wafer

•Designation: each wafer is scribed with batch number and

wafer number

•Diameter: 200 mm (8”)

•Thickness: 150 μm ± 15 μm

•Process: CMOS 0.14 µm

•Batch size: 25 wafers

•PGDW: 91981

7.1.2 Wafer backside

•Material: Si

•Treatment: ground and stress release

•Roughness: Ra max. 0.5 μm, Rt max. 5 μm

7.1.3 Chip dimensions

•Die size without scribe: 550 μm x 550 μm = 302500 μm2

•Scribe line width:

X-dimension: 15 μm (scribe line width is measured between

nitride edges)

Y-dimension: 15 μm (scribe line width is measured between

nitride edges)

•Number of pads: 5

7.1.4 Passivation on front

•Type: sandwich structure

•Material: PE-Nitride (on top)

•Thickness: 1.75 μm total thickness of passivation

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

7.1.5 Au bump

•Bump material: > 99.9% pure Au

•Bump hardness: 35 – 80 HV 0.005

•Bump shear strength: > 70 MPa

•Bump height: 18 μm

•Bump height uniformity:

–within a die: ± 2 μm

–within a wafer: ± 3 μm

–wafer to wafer: ± 4 μm

•Bump flatness: ± 1.5 μm

•Bump size:

–LA, LB 294 x 164 μm

–TEST, GND, VDD 60 x 60 μm

–Bump size variation: ± 5 μm

•Under bump metallization: sputtered TiW

7.1.6 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

7.1.7 Map file distribution

See Ref. 2 “General specification for 8” wafer on UV-tape with electronic fail die marking”.

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

8. Functional description

8.1 Memory organization

The EEPROM has a capacity of 1760 bit and is organized in blocks of 4 bytes each

(1 block = 32 bits). A block is the smallest access unit.

The HITAG µ ISO 18000 transponder IC memory organization is shown in Table 3

“Memory organization”.

For permanent lock of blocks please refer to Section 14.8 “LOCK BLOCK”.

8.1.1 Memory organization

[1] RO: Read without password, write with password

[2] R/W: Read and write without password

[3] R/W(P): Read and write with password

Table 3. Memory organization

Block address Content Password Access

FFh User Config

FEh PWD

36h

User Memory

bit6=0 bit5=0 R/W[2]

bit6=0 bit5=1 RO[1]

bit6=1 bit5=0 R/W(P)[3]

bit6=1 bit5=1 R/W(P)[3]

35h

...

14h

13h

12h

11h

10h

0Fh

User Memory bit4=0 R/W[2]

bit4=1 RO[1]

0Eh

0Dh

0Ch

0Bh

0Ah

09h

08h

07h

06h

05h

04h

03h

bit3=0 R/W[2]

bit3=1 RO[1]

02h

01h

00h

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

8.2 Memory configuration

The User Configuration Bock consists of one configurable byte (Byte0) and three reserved

bytes (Byte1 to Byte3)

The bits in the User Configuration Block enable a customized memory configuration of the

HITAG µ ISO 18000 transponder ICs.

Three areas (1 to 127bit, 1 to 511 bits and upper memory) can be restricted to read/write

access.

The User Configuration Block (User Config) is programmable by using WRITE SINGLE

BLOCK command at address FFh. Bits 7 to 31 (Byte1 to Byte3) are reserved for further

usage.

The user configuration block (block address FFh) and the password block (block address

FEh) can be locked with the LOCK BLOCK command.

Attention: The lock of the blocks is permanently and therefore irreversible!

[1] PWD(w)=1: read without password and write with password

[2] PWD(r/w)=1: read and write with password

9. General requirements

The HITAG μ ISO 18000 transponder IC is compatible with the ISO 18000-2 standard.

At the time a HITAG μ ISO 18000 based transponder is in the interrogator field it doesn’t

respond until it receives a request from the RWD.

All communication from reader to HITAG µ ISO 18000 transponder ICs and vice versa and

the CRC error detection bits (if applicable) are transmitted starting with LSB first.

In the case that multiple HITAG µ ISO 18000 based transponders are in the interrogation

field which cause collisions the RWD has to start the anticollision procedure as described

in this document.

Table 4. User configuration block to Byte0

Byte0 Description

bit6 bit5 bit4 bit3 bit2 bit1 bit 0 Bit-no.

PWD (r/w) [2]

Bit512… Max

PWD (w) [1]

Bit512… Max

PWD (w) [1]

Bit128… 511

PWD (w) [1]

Bit0… 127

RFU RFU RFU

Value/meaning

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

10. HITAG μ ISO 18000 transponder IC air interface

10.1 Downlink communication signal interface - RWD to HITAG μ

ISO 18000 transponder IC

10.1.1 Modulation parameters

Communications between RWD and HITAG µ ISO 18000 transponder IC takes place

using ASK modulation with a modulation index of m > 90%.

[1] TFd0 > TF1 + TF3 + 3 × Tc

[2] TC...Carrier period time (1/125kHz = 8 μs nominal)

Fig 3. Modulation details of data transmission from RWD to HITAG µ transponder IC

Table 5. Modulation coding times[1][2]

Symbol Min Max

m = (a-b)/(a+b) 90% 100%

TF1 4 × Tc10 × Tc

TF2 00.5 × TF1

TF3 00.5 × TFd0

x00.05 × a

y00.05 × a

001aaj826

TF2

TF1

TF3

envelope of transceiver field

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

10.1.2 Data rate and data coding

The RWD to HITAG µ ISO 18000 transponder IC communication uses Pulse Interval

Encoding. The RWD creates pulses by switching the carrier off as described in Figure 4.

The time between the falling edges of the pulses determines either the value of the data

bit ’0’, the data bit ’1’, a code violation or a stop condition.

Assuming equal distributed data bits ’0’ and ’1’, the data rate is in the range of about

5.2 kbit/s.

[1] TC...Carrier period time (1/125kHz = 8 μs nominal)

Fig 4. Reader to HITAG µ ISO 18000 transponder IC: Pulse Interval Encoding

Table 6. Data coding times [1]

Meaning Symbol Min Max

Carrier off time TF1 4 × Tc10 × Tc

Data “0” time TFd0 18 × Tc22 × Tc

Data “1” time TFd1 26 × Tc30 × Tc

Code violation time TFcv 34 × Tc38 × Tc

Stop condition time TFsc ≥ 42 × Tcn/a

001aaj827

carrier on

TF1

carrier off

TFsc

"stop condition''

carrier on

TF1

carrier off

TF1

TFcv

"code violation''

carrier on

TF1

carrier off

TF1

TFd1

data "1''

carrier on

TF1

carrier off

TF1

TFd0

data "0''

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

10.1.3 RWD - Start of frame pattern

A RWD request always starts with a SOF pattern for ease of synchronization. The SOF

pattern consists of an encoded data bit ’0’ and a ’code violation’.

The HITAG µ ISO 18000 transponder IC shall be ready to receive a SOF from the RWD

within 1.2 ms after having sent a response to the RWD.

The HITAG µ ISO 18000 transponder IC shall be ready to receive a SOF from the RWD

within 2.5 ms after the RWD has established the powering field.

10.1.4 RWD - End of frame pattern

For slot switching during a multi-slot anticollision sequence, the RWD request is an EOF

pattern. The EOF pattern is represented by a RWD ’Stop condition’.

Fig 5. Start of frame pattern

001aaj828

carrier on

TFd0

TFpSOF

TF1

carrier off

TF1 TF1

TFcv

data "0" "code violation"

Fig 6. End of frame pattern

001aaj829

carrier on

FpEOF

carrier off

Fsc

"stop condition''

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

10.2 Communication signal interface - HITAG µ ISO 18000 transponder IC

to RWD

10.2.1 Data rate and data coding

The HITAG µ ISO 18000 transponder IC accepts the following data rate and encoding

scheme:

•1/TFd Manchester coded data signal on the response to the HITAG µ ISO 18000

transponder IC

•1/(2 ×TFd) dual pattern data coding when responding within the inventory process

TFd = 32 / fc = 32 × Tc

Remark: The slower data rate used during the inventory process allows for improving the

collision detection when several HITAG µ ISO 18000 transponder ICs are present in the

RWD field, especially if some transponder ICs are in the near field and others in the far

field.

Fig 7. HITAG µ ISO 18000 transponder IC - Load modulation coding

001aaj830

TFd

load offdata "0"

load on

TFd TFd

load off

load on

TFd

load offdata "1"

load on

TFd

load off

load on

TFd

response encoding in

INVENTORY mode

response encoding to a RWD

request in data exchange mode

data

element

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

10.2.2 Start of frame pattern

The HITAG µ ISO 18000 transponder IC response always starts with a SOF pattern. The

SOF is a Manchester encoded bit sequence of ’110’.

10.2.3 End of frame pattern

A specific EOF pattern is neither used nor specified for the HITAG µ ISO 18000

transponder IC response. An EOF is detected by the RWD if there is no load modulation

for more than two data bit periods (TFd).

Fig 8. Start of fame pattern

001aaj832

TFd TFd TFd

load off

data "1" data "1" data "0"

load on

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

11. General protocol timing specification

For requests where an EEPROM erase and/or programming operation is required, the

transponder IC returns its response when it has completed the write/lock operation. This

will be latest after 20 ms upon detection of the last falling edge of the RWD request or

after the RWD has switched off the field.

11.1 Waiting time before transmitting a response after an EOF from the

RWD

When the HITAG µ ISO 18000 transponder IC has detected an EOF of a valid RWD

request or when this EOF is in the normal sequence of a valid RWD request, it shall wait

for TFp1 before starting to transmit its response to a RWD request or when switching to the

next slot in an inventory process.

TFp1 starts from the detection of the falling edge of the EOF received from the RWD.

Remark: The synchronization on the falling edge from the RWD to the EOF of the HITAG

µ ISO 18000 transponder IC is necessary to ensure the required synchronization of the

response.

The minimum value of TFp1 is TFp1min = 204 ×TC

The typical value of TFp1 is TFp1typ = 209 ×TC

The maximum value of TFp1 is TFp1max = 213 ×TC

If the HITAG µ ISO 18000 transponder IC detects a carrier modulation during this time

(TFp1), it shall reset its TFp1-timer and wait for a further time (TFp1) before starting to

transmit its response to a RWD request or to switch to the next slot when in an inventory

process.

Fig 9. General protocol timing diagram

001aaj833

carrier on request

response

request (or EOF)

carrier off

load off

load on

HITAG μ

transceiver

NRT

Fp1

Fp2

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

11.2 RWD waiting time before sending a subsequent request

•When the RWD has received a HITAG µ ISO 18000 response to a previous request

other than inventory or quiet, it needs to wait TFp2 before sending a subsequent

request. TFp2 starts from the time the last bit has been received from the HITAG µ

ISO 18000.

•When the RWD has sent a quiet request, it needs to wait TFp2 before sending a

subsequent request. TFp2 starts from the end of the quiet request's EOF (falling edge

of EOF pulse + 42 ×TC). This results in a waiting time of (150 ×TC + 42 ×TC) before

the next request.

The minimum value of TFp2 is TFp2min = 150 ×TC ensures that the HITAG µ ISO 18000 ICs

are ready to receive a subsequent request.

Remark: The RWD needs to wait at least 2.5 ms after it has activated the electromagnetic

field before sending the first request, to ensure that the HITAG µ ISO 18000 transponder

ICs are ready to receive a request.

•When the RWD has sent an inventory request, it is in an inventory process.

11.3 RWD waiting time before switching to next inventory slot

An inventory process is started when the RWD sends an inventory request. For a detailed

explanation of the inventory process refer to Section 14.3 and Section 14.4.

To switch to the next slot, the RWD sends an EOF after waiting a time period specified in

the following sub-clauses.

11.3.1 RWD started to receive one or more HITAG µ ISO 18000 transponder IC

responses

During an inventory process, when the RWD has started to receive one or more HITAG µ

a ISO 18000 transponder IC responses (i.e. it has detected a transponder IC SOF and/or

a collision), it shall

•wait for the complete reception of the HITAG µ ISO 18000 transponder IC responses

(i.e. when a last bit has been received or when the nominal response time TNRT has

elapsed),

•wait an additional time TFp2 and then send an EOF to switch to the next slot, if a 16

slot anticollision request is processed, or send a subsequent request (which could be

again an inventory request).

TFp2 starts from the time the last bit has been received from the HITAG µ ISO 18000

transponder IC.

The minimum value of TFp2 is TFp2min = 150 ×TC.

TNRT is dependant on the anticollisions current mask value and on the setting of the CRCT

flag.

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

11.3.2 RWD receives no HITAG µ ISO 18000 transponder IC response

During an inventory process, when the RWD has received no HITAG µ ISO 18000

transponder IC response, it needs to wait TFp3 before sending a subsequent EOF to

switch to the next slot, if a 16 slot anticollision request is processed, or sending a

subsequent request (which could be again an inventory request).

TFp3 starts from the time the RWD has generated the falling edge of the last sent EOF.

The minimum value of TFp3 is TFp3min = TFp1max + TFpSOF.

TFpSOF is the time duration for a HITAG µ ISO 18000 transponder IC to transmit an SOF to

the RWD.

[1] TC...Carrier period time (1/125kHz = 8 μs nominal)

Fig 10. Protocol timing diagram without HITAG µ ISO 18000 transponder IC response

Table 7. Overview timing parameters [1]

Symbol Min Max

TFpSOF 3×TFd 3 ×TFd

TFp1 204 ×TC213 ×TC

TFp2 150 ×TC-

TFp3 TFp1max + TFpSOF -

001aaj834

carrier on request

no response

request (or EOF)

carrier off

load off

load on

HITAG μ

reader

FpSOF

Fp3

Fp1MAX

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

12. State diagram

12.1 General description of states

RF Off

The powering magnetic field is switched off or the HITAG µ ISO 18000 transponder IC is

out of the field.

READY

The HITAG µ ISO 18000 transponder IC enters this state when it is activated by the RWD.

SELECTED

The HITAG µ ISO 18000 transponder IC enters the Selected state after receiving the

SELECT command with a matching UII. In the Selected state the respective commands

with SEL=1 are valid only for selected transponder.

Only one HITAG µ transponder IC should be in the selected state at one time. If one

transponder is selected and a second transponder receives the SELECT Command, the

first transponder will automatically change to Quiet state.

QUIET

The HITAG µ ISO 18000 transponder IC enters this state after receiving a STAY QUIET

command or when he was in selected state and receives a SELECT command addressed

to another transponder.

In this state, the HITAG µ transponder IC reacts to any request commandos where the

ADR flag is set.

Remark:

In case of an invalid command the transponder will remain in his actual state.

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

12.2 State diagram HITAG µ ISO 18000

Fig 11. State diagram of HITAG µ ISO18000 transponder ICs

out of field

or RF off

out of field

or RF off

READY

RF Off

out of field

or RF off

RF on

„read UII“ or

any other request

with SEL flag not set

QUIET SELECTED

„STAY QUIET“

(UII) „SELECT“ (UII)

„STAY QUIET“ or

„SELECT“ (non-matching-UII)

any other request

with ADR flag set

any other request

with ADR flag set or

SEL flag set

Anticollision

„INVENTORY“

„READ MULTIPLE BLOCK

in inventory mode“

„SELECT“ (UII)

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

13. Modes

13.1 Anticollision

The RWD is the master of the communication with one or multiple transponder ICs. It

starts the anticollision sequence by issuing the inventory request (see Section 14.3).

Within the RWD command the NOS flag must be set to the desired setting (1 or 16 slots)

and add the mask length and the mask value after the command field.

The mask length n indicates the number of significant bits of the mask value. It can have

any value between 0 and 44 when 16 slots are used and any value between 0 and 48

when 1 slot is used.

The next two subsections summarize the actions done by the transponder IC during an

inventory round.

13.1.1 Anticollision with 1 slot

The transponder IC will receive one ore more inventory commands with NOS = '1'. Every

time the transponder ICs fractional or whole UII matches the mask value of RWD's

request it responses with remaining UII without mask value.

Transponder ICs responses are modulated by dual pattern data coding as described in

Section 10.2.

13.1.2 Anticollision with 16 slots

The transponder IC will receive several inventory commands with NOS = '0' defining an

amount of 16 slots. Within the request there is the mask specified by length and value

(sent LSB first).

In case of mask length = '0' the four least significant bits of transponder ICs UII become

the starting value of transponder IC's slot counter.

In case of mask length ≠ '0' the received fractional mask is compared to transponder IC's

UII. If it matches the starting value for transponder IC's slot number will be calculated.

Starting at last significant bit of the sent mask the next four less significant bits of UII are

used for this value. At the same time transponder IC's slot counter is reset to '0'.

Now the RWD begins its anticollision algorithm. Every time the transponder IC receives an

EOF it increments slot-counter. Now if mask value and slot-counter value are matching

the transponder IC responses with the remaining UII without mask value but with slot

number

In case of collision within one slot the RWD changes the mask value and starts again

running its algorithm.

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14. Command set

The first part of this section (Section 14.1) describes the flags used in every RWD

command. The following subsections (Section 14.3 until Section 14.11) explain all

implemented commands and their suitable transponder IC responses which are done with

tables showing the command itself and suitable responses.

Within tables flags, parameter bits and parts of a response written in braces are optional.

That means if the suitable flag is set resulting transponder IC's action will be performed

according to Section 14.1.

Every command is embedded in SOF and EOF pattern. As described in Table 8 and

Tab le 9 sending and receiving data is done with the least significant bit of every field on

first position.

Important information:

In this document the fields (i.e. command codes) are written with most significant

bit first.

[1] Values in braces are optional.

[2] Data is sent with least significant bit first.

[1] Values in braces are optional.

[2] Data is sent with least significant bit first.

Table 8. Reader - Transponder IC transmission [1][2]

SOF Flags Commands Parameters Data CRC-16 EOF

- 5 6 var. var. (16) -

- LSB ... MSB LSB ... MSB LSB ... MSB LSB ... MSB LSB ... MSB -

Table 9. Transponder IC - Reader transmission [1][2]

SOF Error flag Data/Error code CRC-16 EOF

- 1 var. (16) -

- - LSB ... MSB LSB ... MSB -

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.1 Flags

Every request command contains five flags which are sent in order Bit 1 (LSB) to Bit 5

(MSB). The specific meaning depends on the context.

Table 10. Command Flags

Bit Flag Full name Value Description

1 PEXT Protocol EXTension 0

No protocol format extension

RFU

2 INV INVentory 0

Flag 4 and Flag 5 are ’SEL’ and ’ADR’ Flag

Flag 4 and Flag 5 are ’RFU’ and ’NOS’ Flag

3 CRCT CRC-Transponder 0

Transponder IC respond without CRC

Transponder IC respond contains CRC

4SEL

(INV==0)

SELect in combination with ADR (see Table 12)

5ADR

(INV==0)

ADdRess in combination with SEL (see Ta b l e 1 2 )

4AFI

(INV==1)

Reserved for future

use

AFI field is not present

AFI field is present

5NOS

(INV==1)

16 slots while performing anti-collision

1 slot while performing anti-collision

Table 11. Command Flags - Bit order

MSB

bit5 bit4 bit3 bit2

LSB

bit1

INV==0 ADR SEL CRCT INV PEXT

INV==1 NOS AFI CRCT INV PEXT

Table 12. Meaning of ADR and SEL flag

ADR SEL Meaning

0 0 Request without UII, all transponder ICs in READY state shall respond

1 0 Request contains UII, one transponder IC (with corresponding UII) shall

respond

0 1 Request without UII, the transponder IC in SELECTED state shall respond

1 1 Reserved for future use

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.2 Error handling

In case an error has been occurred the transponder IC responses with the set error flag

and the three bit code ’111’ (meaning ’unknown error’).

The general response format in case of an error response is shown in Tab le 13 whereas

commands not supporting error responses are excluded. In case of an unsupported

command there will be no response. The format is embedded into SOF and EOF.

Table 13. Response format in error case

Error flag Error code CRC-16 Description

1 3 (16) No. of bits

1 111

Fig 12. HITAG µ ISO 18000 transponder IC response - in case of no error

Fig 13. HITAG µ ISO 18000 transponder IC response - in error case

001aak260

SOF Error Flag

''0'' Data (CRC) EOF

001aak262

SOF Error Flag

''1''

Error Code

''111'' (CRC) EOF

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.3 INVENTORY

Upon reception of this command without error, all transponder ICs in the ready state shall

perform the anticollision sequence. The inventory (INV) flag shall be set to '1'. The NOS

flag determines whether 1 or 16 slots are used.

If AFI flag is set to ’1’ the transponder handles the request as error.

If a transponder IC detects any error, it shall remain silent.

[1] Error and CRC are Manchester coded, UII is dual pattern coded.

[2] Response within the according time slot.

Error Flag set to ’0’ indicates no error.

14.4 STAY QUIET

Upon reception of this command without error, a transponder IC in either ready state or

selected state enters the quiet state and shall not send back a response.

The STAY QUIET command with both SEL and ADR flag set to '0' or both set to '1' is not

allowed.

There is no response to the STAY QUIET request, even if the transponder detects an

error.

Table 14. INVENTORY - Request format (00h)

Flags Command Mask length Mask value CRC-16 Description

5 6 6 n (16) No. of bits

10(1)10 000000 0 ≤ n ≤ UII length UII Mask AC with 1

timeslot

00(1)10 000000 0 ≤ n ≤ UII length UII Mask AC with 16

timeslot

Table 15. Response to a successful INVENTORY request [1][2]

Error Flag Data CRC-16 Description

1 48 - n (16) No. of bits

0 Remaining UII without mask value

Table 16. STAY QUIET - request format(01h)

Flags Command Data CRC-16 Description

5 6 (48) (16) No. of bits:

01(1)00 000001 - without UII

10(1)00 000001 UII with UII

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.5 READ UII

Upon reception of this command without error all transponder ICs in the ready state are

sending their UII.

The addressed (ADR), the select (SEL), the inventory (INV) and the (PEXT) flag are set to

'0'.

Error flag set to ’0’ indicates no error.

Table 17. READ UII - request format (02h)

Flags Command CRC-16 Description

5 6 (16) No. of bits

00(1)00 000010

Table 18. Response to a successful READ UII request

Error flag Data CRC-16 Description

1 48 (16) No. of bits

0UII

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.6 READ MULTIPLE BLOCK

Upon reception of this command without error, the transponder reads the requested

block(s) and sends back their value in the response. The blocks are numbered from 0 to

255.

The number of blocks in the request is one less than the number of blocks that the

transponder returns in its response i.e. a value of '6' in the ’Number of blocks’ field

requests to read 7 blocks. A value '0' requests to read a single block.

Error Flag set to ’0’ indicates no error.

Table 19. READ MULTIPLE BLOCKS - request format (12h)

Flags Command Data 1 Data 2 Data 3 CRC-16 Description

5 6 (48) 8 8 (16) No. of bits

00(1)00 010010 - First block

number

Number of

blocks

without UII

in READY

state

10(1)00 010010 UII First block

number

Number of

blocks

with UII

01(1)00 010010 - First block

number

Number of

blocks

without UII

SELECTED

state

Table 20. Response to a successful READ MULTIPLE BLOCKS request

Error Flag Data CRC-16 Description

1 32 x Number of blocks (16) No. of bits

0 User memory block data

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.6.1 READ MULTIPLE BLOCKS in INVENTORY mode

The READ MULTIPLE BLOCK command can also be sent in inventory mode (which is

marked by INV-Flag = '1' within the request). Here request and response will change as

shown in following tables.

If the transponder detects an error during the inventory sequence, it shall remain silent.

After receiving RWD's command without error the transponder IC transmits the remaining

section of the UID in dual pattern code. The following data (Error Flag, Data 2, optional

CRC in no error case; Error Flag, Error Code, optional CRC in error case) is transmitted in

Manchester Code.

[1] Error, CRC and Data are Manchester coded, UID is dual pattern coded.

Table 21. READ MULTIPLE BLOCKS - request format (12h)

Flags Command Mask

length

Mask

value

Parameter 1 Parameter 2 CRC-16 Description

5 6 6 n 8 8 (16) No. of bits

10(1)10 010010 0 ≤ n ≤ UID

length

First block

number

Number of

blocks

AC with 1

timeslot

00(1)10 010010 0 ≤ n ≤ UID

length

First block

number

Number of

blocks

AC with 16

timeslot

Table 22. READ MULTIPLE BLOCKS in INVENTORY mode Response format [1]

Error Flag Data 1 Data 2 CRC-16 Description

1 48 - n 32 x number of blocks (16) No.of bits

0 Remaining section of UID

(without mask value)

User memory block data

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.7 WRITE SINGLE BLOCK

Upon reception of this command without error, the transponder IC writes 32-bit of data into

the requested user memory block and report the success of the operation in the response.

Error Flag set to ’0’ indicates no error.

Table 23. WRITE SINGLE BLOCK - request format (14h)

Flags Command Data 1 Data 2 Data 3 CRC-16 Description

5 6 (48) 8 32 (16) No. of bits

00(1)00 010100 - block number block data without UII

in READY

state

10(1)00 010100 UII block number block data with UII

01(1)00 010100 - block number block data without UII

SELECTED

state

Table 24. Response to a successful WRITE SINGLE BLOCK request

Error Flag CRC-16 Description

1 (16) No. of bits

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.8 LOCK BLOCK

Upon reception of this command without error, the transponder IC is write locking the

requested block (block size = 32-bit) permanently.

Blocks within the block address range from 00h to 18h as well as FEh and FFh can be

locked individually.

A LOCK BLOCK command with a block number value between 19h to 36h will lock all

blocks within the block address range 19h to 36h.

In case a password is applied to the memory a lock is only possible after a successful

Error Flag set to ’0’ indicates no error.

Table 25. LOCK BLOCK - request format (16h)

Flags Command Data 1 Data 2 CRC-16 Description

5 6 (48) 8 (16) No. of bits

00(1)00 010110 - block number without UII

in READY

state

10(1)00 010110 UII block number with UII

01(1)00 010110 - block number without UII

SELECTED

state

Table 26. Response to a successful LOCK BLOCK request

Error flag CRC-16 Description

1 (16) No. of bits

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.9 SELECT

The SELECT command is always be executed with SEL flag set to '0' and ADR flag set to

'1'. There are several possibilities upon reception of this command without error:

•If the UII, received by the transponder IC, is equal to its own UII, the transponder IC

enters the Selected state and shall send a response.

•If the received UII is different there are two possibilities

–A transponder IC in a non-selected state (QUIET or READY) is keeping its state

and not sending a response.

–The transponder IC in the Selected state enters the Quiet state and does not send

a response.

Error Flag set to ’0’ indicates no error.

Table 27. SELECT - request format (18h)

Flags Command Data 1 CRC-16 Description

5 6 48 (16) No. of bits

10(1)00 011000 UII

Table 28. Response to a successful SELECT request

Error flag CRC-16 Description

1 (16-bit) No. of bits

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.10 GET SYSTEM INFORMATION

Upon reception of this command without error, the transponder IC reads the requested

system memory block(s) and sends back their values in the response.

Error Flag set to ’0’ indicates no error.

Table 29. GET SYSTEM INFORMATION - request format (17h)

Flags Command Data 1 CRC-16 Description

5 6 (48) (16) No. of bits

00(1)00 010111 without UII

10(1)00 010111 UII with UII

Table 30. GET SYSTEM INFORMATION - response format

Error

flag

Data CRC-16 Description

1 40 8 8 8 8 8 8 8 8 (16) No. of bits

0 system memory block data

MSNMFCICR000 00 0

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

14.11 LOGIN

Upon reception of this command without error, the transponder IC compares received

password with PWD in memory block (FEh) and if correct it permits write (opt. read)

access to the protected memory area (defined in User config, see Table 4) and reports the

success of the operation in the response. In case a wrong password is issued in a further

Default password: FFFFFFFFh

Table 31. LOGIN - request format

Flags Command IC MFC Parameter 1 Password CRC-16 Description

5 6 8 (48) 32 (16) No. of bits

00(1)00 101000 MFC - password without UII in

READY state

10(1)00 101000 MFC UII password with UII

01(1)00 101000 MFC - password without UII in

SELECTED

state

Table 32. Response to a successful LOGIN request

Error flag CRC-16 Description

1 (16) No. of bits

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

15. Data integrity/calculation of CRC

The following explanations show the features of the HITAG µ protocol to protect read and

write access to transponders from undetected errors. The CRC is an 16-bit CRC

according to ISO 11784/11785.

15.1 Data transmission: RWD to HITAG µ ISO 18000 transponder IC

Data stream transmitted by the RWD to the HITAG µ ISO 18000 transponder may include

an optional 16-bit Cyclic Redundancy Check (CRC-16).

The data stream is first verified for data errors by the HITAG µ ISO 18000 transponder IC

and then executed.

The generator polynomial for the CRC-16 is:

u16 + u12 + u5+ 1 = 1021h

The CRC pre set value is: 0000h

15.2 Data transmission: HITAG µ ISO 18000 transponder IC to RWD

The HITAG µ ISO 18000 transponder IC calculates the CRC on all received bits of the

request. Whether the HITAG µ ISO 18000 transponder IC calculated CRC is appended to

the response depends on the setting of the CRCT flag.

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

16. Limiting values

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical

Characteristics section of this specification is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static

charge. Nonetheless, it is suggested that conventional precautions should be taken to avoid applying values greater than the rated

maxima

17. Characteristics

[1] Typical ratings are not guaranteed. Values are at 25 °C.

[2] Measured with an HP4285A LCR meter at 125 kHz/room temperature (25 °C)

[3] Integrated Resonance Capacitor: 210pF ±3%

[4] Integrated Resonance Capacitor: 280pF ±5%

Table 33. Limiting values[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Tstg storage temperature −55 +125 °C

VESD electrostatic discharge voltage JEDEC JESD 22-A114-AB

Human Body Model

±2- kV

Ii(max) maximum input current IN1-IN2 −±20 mApeak

Tj junction temperature −40 +85 °C

Table 34. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

foper operating frequency 100 125 150 kHz

VIN1-IN2 input voltage 456V

peak

IIinput current IN1-IN2 - - ±10 mApeak

Ciinput capacitance between

IN1-IN2

VIN1-IN2 = 0.5 Vrms [2][3] 203.7 210 216.3 pF

Ciinput capacitance between

IN1-IN2

VIN1-IN2 = 0.5 Vrms [2][4] 266 280 294 pF

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

18. Marking

18.1 Marking SOT1122

18.2 Marking HVSON2

Only two lines are available for marking (Figure 14).

First line consists on five digits and contains the diffusion lot number. Second line consists

on four digits and describes the product type, HTSH5601ETK or HTSH4801ETK (see

example in Ta bl e 37).

Table 35. Marking SOT1122

Type Type code

HTMS1301FTB/AF 13

HTMS8301FTB/AF 83

Table 36. Pin description SOT1122

Pin Description

1IN 1

2IN 2

3 n.c not connected

Fig 14. Marking overview

Table 37. Marking example

Line Marking Description

A 70960 5 digits, Diffusion Lot Number, First letter truncated

B HM10 4 digits, Type: Table 38 “Marking HVSON2”

Table 38. Marking HVSON2

Type Type code

HTMS1301FTK/AF HM13

HTMS8301FTK/AF HM82

: 5

B : 4

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

19. Package outline

Fig 15. Package outline SOT1122

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

sot1122

Unit

max

nom

min

0.50 0.04

0.55 0.425

0.30

0.25

0.22

0.35

0.30

0.27

A(1)

mensions

tes

Dimension A is including plating thickness.

Can be visible in some manufacturing processes.

A1D

1.50

1.45

1.40

1.05

1.00

0.95

Eee

0.55

0.50

0.47

0.45

0.40

0.37

1LL

0 1 2 mm

scale

4×

(2)

4×

(2)

pin 1 indication

type code

terminal 1

index area

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

Fig 16. Package outline HVSON2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT899-1

05-02-25

05-05-09

Note

1. Plastic or metal protrusions of 0.75 mm maximum per side are not included

UNIT A

max

mm 1 0.05

2.1

1.9

1.35

1.05

3.1

2.9

1.35

1.05

0.5

0.3

DIMENSIONS (mm are the original dimensions)

HVSON2: plastic thermal enhanced very thin small outline package; no leads;

2 terminals; body 3 × 2 × 0.85 mm

0.9

0.7

b DhE Ehe

2.5

L y1

0.1

0.05

012 mm

scale

detail X

terminal 1

index area

AC B

∅ vM

C∅ wM

terminal 1

index area

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

20. Abbreviations

Table 39. Abbreviations

Abbreviation Definition

AC Anticollision Code

AFI Application Family Identifier

ASK Amplitude Shift Keying

BC Bi-phase Code

BPLC Binary Pulse Length Coding

CRC Cyclic Redundancy Check

DSFID Data Storage Format Identifier

EEPROM Electrically Erasable Programmable Memory

EOF End Of Frame

ICR Integrated Circuit Reference number

LSB Least Significant Bit

LSByte Least Significant Byte

m Modulation Index

MC Manchester Code

MFC integrated circuit Manufacturer Code

MSB Most Significant Bit

MSByte Most Significant Byte

MSN Manufacturer Serial Number

NA No Access

NOB Number Of Block

NOP Number Of Pages

NOS Number Of Slots

NSS Number Of Sensors

OTP One Time Programmable

PID Product Identifier

PWD Password

RFU Reserved for Future Use

RND Random Number

RO Read Only

RTF Reader Talks First

R/W Read/Write

RWD Read/Write Device

SOF Start of Frame

UII Unique Item Identifier

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

21. References

[1] Application note — AN10214, HITAG Coil Design Guide, Transponder IC

BL-ID Doc.No.: 0814**1

[2] General specification for 8” wafer on UV-tape with electronic fail die

marking — Delivery type description, BL-ID Doc.No.: 1093**1

1. ** ... document version number

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

22. Revision history

Table 40: Revision history

Document ID Release date Data sheet status Change notice Supersedes

184430 20100318 Product data sheet - -

Product data sheet

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NXP Semiconductors HITAG µ

ISO 18000 transponder IC

23. Legal information

23.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

23.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

23.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on a weakness or default in the

customer application/use or the application/use of customer’s third party

customer(s) (hereinafter both referred to as “Application”). It is customer’s

sole responsibility to check whether the NXP Semiconductors product is

suitable and fit for the Application planned. Customer has to do all necessary

testing for the Application in order to avoid a default of the Application and the

product. NXP Semiconductors does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet

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184430 41 of 44

NXP Semiconductors HITAG µ

ISO 18000 transponder IC

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

23.4 Licenses

23.5 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

HITAG — is a trademark of NXP B.V.

24. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

ICs with HITAG functionality

NXP Semiconductors owns a worldwide perpetual license for the patents

US 5214409, US 5499017, US 5235326 and for any foreign counterparts

or equivalents of these patents. The license is granted for the Field-of-Use

covering: (a) all non-animal applications, and (b) any application for animals

raised for human consumption (including but not limited to dairy animals),

including without limitation livestock and fish.

Please note that the license does not include rights outside the specified

Field-of-Use, and that NXP Semiconductors does not provide indemnity for

the foregoing patents outside the Field-of-Use.

Product data sheet

PUBLIC

Rev. 3.0 — 18 March 2010

184430 42 of 44

NXP Semiconductors HITAG µ

ISO 18000 transponder IC

25. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . . .2

Table 2. HITAG µ ISO 18000 - Mega bumps dimensions.4

Table 3. Memory organization . . . . . . . . . . . . . . . . . . . . .7

Table 4. User configuration block to Byte0. . . . . . . . . . . .8

Table 5. Modulation coding times[1][2] . . . . . . . . . . . . . . . .9

Table 6. Data coding times [1] . . . . . . . . . . . . . . . . . . . . .10

Table 7. Overview timing parameters [1] . . . . . . . . . . . . .16

Table 8. Reader - Transponder IC transmission [1][2] . . .20

Table 9. Transponder IC - Reader transmission [1][2] . . .20

Table 10. Command Flags . . . . . . . . . . . . . . . . . . . . . . . .21

Table 11. Command Flags - Bit order. . . . . . . . . . . . . . . .21

Table 12. Meaning of ADR and SEL flag . . . . . . . . . . . . .21

Table 13. Response format in error case . . . . . . . . . . . . .22

Table 14. INVENTORY - Request format (00h) . . . . . . . .23

Table 15. Response to a successful INVENTORY request

[1][2] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Table 16. STAY QUIET - request format(01h) . . . . . . . . .23

Table 17. READ UII - request format (02h) . . . . . . . . . . .24

Table 18. Response to a successful READ UII request .24

Table 19. READ MULTIPLE BLOCKS - request format

(12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Table 20. Response to a successful READ MULTIPLE

BLOCKS request . . . . . . . . . . . . . . . . . . . . . . .25

Table 21. READ MULTIPLE BLOCKS - request format

(12h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Table 22. READ MULTIPLE BLOCKS in INVENTORY mode

Response format [1] . . . . . . . . . . . . . . . . . . . . . 26

Table 23. WRITE SINGLE BLOCK - request format

(14h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 24. Response to a successful WRITE SINGLE

BLOCK request . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 25. LOCK BLOCK - request format (16h) . . . . . . . 28

Table 26. Response to a successful LOCK BLOCK

request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 27. SELECT - request format (18h) . . . . . . . . . . . . 29

Table 28. Response to a successful SELECT request . . 29

Table 29. GET SYSTEM INFORMATION - request format

(17h). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 30. GET SYSTEM INFORMATION - response

format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 31. LOGIN - request format . . . . . . . . . . . . . . . . . . 31

Table 32. Response to a successful LOGIN request . . . . 31

Table 33. Limiting values[1][2] . . . . . . . . . . . . . . . . . . . . . . 33

Table 34. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 35. Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . . 34

Table 36. Pin description SOT1122 . . . . . . . . . . . . . . . . . 34

Table 37. Marking example . . . . . . . . . . . . . . . . . . . . . . . 34

Table 38. Marking HVSON2 . . . . . . . . . . . . . . . . . . . . . . 34

Table 39. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 40: Revision history . . . . . . . . . . . . . . . . . . . . . . . . 39

26. Figures

Fig 1. Block diagram of HITAG µ ISO 18000 transponder

IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Fig 2. HITAG µ ISO 1800 - Mega bumps bondpad

locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Fig 3. Modulation details of data transmission from RWD

to HITAG µ transponder IC . . . . . . . . . . . . . . . . . .9

Fig 4. Reader to HITAG µ ISO 18000 transponder IC:

Pulse Interval Encoding . . . . . . . . . . . . . . . . . . . .10

Fig 5. Start of frame pattern . . . . . . . . . . . . . . . . . . . . . . 11

Fig 6. End of frame pattern . . . . . . . . . . . . . . . . . . . . . . 11

Fig 7. HITAG µ ISO 18000 transponder IC - Load

modulation coding . . . . . . . . . . . . . . . . . . . . . . . .12

Fig 8. Start of fame pattern . . . . . . . . . . . . . . . . . . . . . .13

Fig 9. General protocol timing diagram . . . . . . . . . . . . .14

Fig 10. Protocol timing diagram without HITAG µ ISO 18000

transponder IC response . . . . . . . . . . . . . . . . . . .16

Fig 11. State diagram of HITAG µ ISO18000 transponder

ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Fig 12. HITAG µ ISO 18000 transponder IC response - in

case of no error . . . . . . . . . . . . . . . . . . . . . . . . . .22

Fig 13. HITAG µ ISO 18000 transponder IC response - in

error case. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

Fig 14. Marking overview. . . . . . . . . . . . . . . . . . . . . . . . .34

Fig 15. Package outline SOT1122 . . . . . . . . . . . . . . . . . .35

Fig 16. Package outline HVSON2 . . . . . . . . . . . . . . . . . .36

Product data sheet

PUBLIC

Rev. 3.0 — 18 March 2010

184430 43 of 44

continued >>

NXP Semiconductors HITAG µ

ISO 18000 transponder IC

27. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.2 Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.3 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.4 Supported standards . . . . . . . . . . . . . . . . . . . . 2

2.5 Security features. . . . . . . . . . . . . . . . . . . . . . . . 2

2.6 Delivery types . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7 Mechanical specification . . . . . . . . . . . . . . . . . 5

7.1 Wafer specification . . . . . . . . . . . . . . . . . . . . . . 5

7.1.1 Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.2 Wafer backside . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.3 Chip dimensions . . . . . . . . . . . . . . . . . . . . . . . . 5

7.1.4 Passivation on front . . . . . . . . . . . . . . . . . . . . . 5

7.1.5 Au bump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.1.6 Fail die identification . . . . . . . . . . . . . . . . . . . . 6

7.1.7 Map file distribution. . . . . . . . . . . . . . . . . . . . . . 6

8 Functional description . . . . . . . . . . . . . . . . . . . 7

8.1 Memory organization . . . . . . . . . . . . . . . . . . . . 7

8.1.1 Memory organization . . . . . . . . . . . . . . . . . . . . 7

8.2 Memory configuration . . . . . . . . . . . . . . . . . . . . 8

9 General requirements . . . . . . . . . . . . . . . . . . . . 8

10 HITAG m ISO 18000 transponder IC air

interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

10.1 Downlink communication signal interface - RWD

to HITAG m ISO 18000 transponder IC . . . . . . 9

10.1.1 Modulation parameters . . . . . . . . . . . . . . . . . . . 9

10.1.2 Data rate and data coding . . . . . . . . . . . . . . . 10

10.1.3 RWD - Start of frame pattern . . . . . . . . . . . . . 11

10.1.4 RWD - End of frame pattern . . . . . . . . . . . . . . 11

10.2 Communication signal interface -

HITAG µ ISO 18000 transponder IC to RWD . 12

10.2.1 Data rate and data coding . . . . . . . . . . . . . . . 12

10.2.2 Start of frame pattern . . . . . . . . . . . . . . . . . . . 13

10.2.3 End of frame pattern. . . . . . . . . . . . . . . . . . . . 13

11 General protocol timing specification . . . . . . 14

11.1 Waiting time before transmitting a response after

an EOF from the RWD . . . . . . . . . . . . . . . . . . 14

11.2 RWD waiting time before sending a subsequent

request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

11.3 RWD waiting time before switching to next

inventory slot . . . . . . . . . . . . . . . . . . . . . . . . . 15

11.3.1 RWD started to receive one or more HITAG µ

ISO 18000 transponder IC responses . . . . . . 15

11.3.2 RWD receives no HITAG µ ISO 18000

transponder IC response . . . . . . . . . . . . . . . . 16

12 State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 17

12.1 General description of states . . . . . . . . . . . . . 17

12.2 State diagram HITAG µ ISO 18000 . . . . . . . . 18

13 Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13.1 Anticollision . . . . . . . . . . . . . . . . . . . . . . . . . . 19

13.1.1 Anticollision with 1 slot . . . . . . . . . . . . . . . . . . 19

13.1.2 Anticollision with 16 slots . . . . . . . . . . . . . . . . 19

14 Command set . . . . . . . . . . . . . . . . . . . . . . . . . 20

14.1 Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

14.2 Error handling . . . . . . . . . . . . . . . . . . . . . . . . 22

14.3 INVENTORY . . . . . . . . . . . . . . . . . . . . . . . . . 23

14.4 STAY QUIET . . . . . . . . . . . . . . . . . . . . . . . . . 23

14.5 READ UII . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

14.6 READ MULTIPLE BLOCK . . . . . . . . . . . . . . . 25

14.6.1 READ MULTIPLE BLOCKS in INVENTORY

mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

14.7 WRITE SINGLE BLOCK . . . . . . . . . . . . . . . . 27

14.8 LOCK BLOCK . . . . . . . . . . . . . . . . . . . . . . . . 28

14.9 SELECT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

14.10 GET SYSTEM INFORMATION . . . . . . . . . . . 30

14.11 LOGIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

15 Data integrity/calculation of CRC . . . . . . . . . 32

15.1 Data transmission: RWD to HITAG µ ISO 18000

transponder IC . . . . . . . . . . . . . . . . . . . . . . . . 32

15.2 Data transmission: HITAG µ ISO 18000

transponder IC to RWD . . . . . . . . . . . . . . . . . 32

16 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 33

17 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33

18 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

18.1 Marking SOT1122 . . . . . . . . . . . . . . . . . . . . . 34

18.2 Marking HVSON2 . . . . . . . . . . . . . . . . . . . . . 34

19 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 35

20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 37

21 References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

22 Revision history . . . . . . . . . . . . . . . . . . . . . . . 39

23 Legal information . . . . . . . . . . . . . . . . . . . . . . 40

23.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 40

23.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

23.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 40

23.4 Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

23.5 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 41

NXP Semiconductors HITAG µ

ISO 18000 transponder IC

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 18 March 2010

184430

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

24 Contact information. . . . . . . . . . . . . . . . . . . . . 41

25 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

26 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

27 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43