INTEGRATED CIRCUITS DIVISION
DS-IXD_614-R03 www.ixysic.com 1
RoHS
2002/95/EC e
3
Pb
Features
•14A Peak Source/Sink Drive Current
•Wide Operating Voltage Range: 4.5V to 35V
•-40°C to +125°C Extended Operating Temperature
Range
•Logic Input Withstands Negative Swing of up to 5V
•Low Propagation Delay Time
•Low, 10A Supply Current
•Low Output Impedance
Applications
•Efficient Power MOSFET and IGBT Switching
•Switch Mode Power Supplies
•Motor Controls
•DC to DC Converters
•Class-D Switching Amplifiers
•Pulse Transformer Driver
Description
The IXDD614 / IXDI614 / IXDN614 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. Each output can source
and sink 14A of peak current while producing voltage
rise and fall times of less than 30ns. Internal circuitry
eliminates cross-conduction and current
"shoot-through," making the driver virtually immune to
latch up. Low propagation delay with fast rise and fall
times make the IXD_614 family ideal for
high-frequency and high-power applications.
The IXDD614 is configured as a non-inverting driver
with an enable. The IXDN614 is configured as a
non-inverting driver, and the IXDI614 is configured as
an inverting driver.
The IXD_614 family is available in an 8-pin DIP (PI),
an 8-pin Power SOIC with an exposed metal back (SI),
a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package.
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD614PI 8-Pin DIP Tube 50
IXDD614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD614SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD614CI 5-Pin TO-220 Tube 50
IXDD614YI 5-Pin TO-263 Tube 50
IXDI614PI 8-Pin DIP Tube 50
IXDI614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI614SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI614CI 5-Pin TO-220 Tube 50
IXDI614YI 5-Pin TO-263 Tube 50
IXDN614PI 8-Pin DIP Tube 50
IXDN614SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN614SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN614CI 5-Pin TO-220 Tube 50
IXDN614YI 5-Pin TO-263 Tube 50
IN
EN
OUT
INOUT
INOUT
IXD_614
14-Ampere Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
IXD_614
2www.ixysic.com R03
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.4.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.4.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
INTEGRATED CIRCUITS DIVISION
IXD_614
R03 www.ixysic.com 3
1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
Note: IXYS Integrated Circuits Division recommends
that the exposed metal pad on the back of the “SI”
package be connected to GND. The pad is not
suitable for carrying current.
1.3 Absolute Maximum Ratings
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
1
4
3
2
8
5
6
7
VCC
IN
EN
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
EN
1
4
3
2
8
5
6
7
VCC
IN
NC
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
NC
1
4
3
2
8
5
6
7
VCC
IN
NC
GND
VCC
OUT
OUT
GND
1
4
3
2
5
VCC
OUT
GND
IN
NC
IXDD614 PI / SI
IXDI614 PI / SI
IXDN614 PI / SI
IXDD614 CI / YI
IXDI614 CI / YI
IXDN614 CI / YI
Pin Name Description
IN Logic Input
EN Output Enable - Drive pin low to disable output,
and force output to a high impedance state
OUT Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
NC Not connected
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage VIN , VEN -5 VCC+0.3 V
Output Current IOUT -±14A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Range Units
Supply Voltage VCC 4.5 to 35 V
Operating Temperature Range T
A-40 to +125 °C
INTEGRATED CIRCUITS DIVISION
IXD_614
4www.ixysic.com R03
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 35V (unless otherwise noted).
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V
Input Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
EN Input Voltage, High IXDD614 only VENH 2/3VCC --
V
EN Input Voltage, Low IXDD614 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -0.40.8
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -0.30.6
Output Current, Continuous Limited by package power
dissipation IDC --±4A
Rise Time CLOAD=15nF, VCC=18V tR-2535
ns
Fall Time CLOAD=15nF, VCC=18V tF-1825
On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY -5070
Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY -5070
Enable to Output-High Delay Time IXDD614 only tENOH -3160
Disable to High Impedance State Delay Time IXDD614 only tDOLD -4470
Enable Pull-Up Resistor IXDD614 only REN -200-k
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-12mA
VCC=18V, VIN=0V -<110
A
VCC=18V, VIN=VCC -<110
INTEGRATED CIRCUITS DIVISION
IXD_614
R03 www.ixysic.com 5
1.6 Electrical Characteristics: TA = - 40°C to +125°C
Test Conditions: 4.5V < VCC < 35V.
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - V
Input Voltage, Low 4.5V < VCC < 18V VIL -0.65
Input Current 0V < VIN < VCC IIN -±10A
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -1.5
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -1.2
Output Current, Continuous Limited by package power
dissipation IDC -±1A
Rise Time CLOAD=15nF, VCC=18V tR-50
ns
Fall Time CLOAD=15nF, VCC=18V tF-40
On-Time Propagation Delay CLOAD=15nF, VCC=18V tONDELAY -90
Off-Time Propagation Delay CLOAD=15nF, VCC=18V tOFFDELAY -90
Enable to Output-High Delay Time IXDD614 only tENOH -75
Disable to High Impedance State Delay Time IXDD614 only tDOLD -85
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-3mA
VCC=18V, VIN=0V -150
A
VCC=18V, VIN=VCC -150
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IXD_614
6www.ixysic.com R03
1.7 Thermal Characteristics
2 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
CI (5-Pin TO-220)
Thermal Resistance, Junction-to-Ambient JA
36
°C/W
PI (8-Pin DIP) 125
SI (8-Pin Power SOIC) 85
YI (5-Pin TO-263) 46
CI (5-Pin TO-220)
Thermal Resistance, Junction-to-Case JC
3
°C/W
SI (8-Pin Power SOIC) 10
YI (5-Pin TO-263) 2
10%
90%
t
ONDELAY
t
OFFDELAY
t
R
t
F
V
IH
V
IL
IN
OUT
10%
90%
t
ONDELAY
t
OFFDELAY
t
F
t
R
V
IH
V
IL
IN
OUT
EN
INOUT
GND
V
CC
V
CC
+
-
V
IN
0.1μF10μF
Tektronix
Current Probe
6302
C
LOAD
V
CC
INTEGRATED CIRCUITS DIVISION
IXD_614
R03 www.ixysic.com 7
3 Block Diagrams & Truth Tables
3.1 IXDD614
3.2 IXDI614
3.3 IXDN614
IN EN OUT
0 1 or open 0
1 1 or open 1
x0
Z
IN OUT
01
10
GND
IN
EN
VCC
OUT
IN
V
CC
GND
OUT
IN OUT
00
11
IN
V
CC
GND
OUT
INTEGRATED CIRCUITS DIVISION
IXD_614
8www.ixysic.com R03
4 Typical Performance Characteristics
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Rise Time (ns)
0
10
20
30
40
50
60
70
80
Rise Time vs. Supply Voltage
(VIN=0-5V, f=10kHz, TA=25ºC)
C
L
=15nF
C
L
=7.5nF
C
L
=3.6nF
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Fall Time (ns)
0
10
20
30
40
50
60
Fall Time vs. Supply Voltage
(VIN=0V-5V, f=10kHz, TA=25ºC)
C
L
=15nF
C
L
=7.5nF
C
L
=3.6nF
Load Capacitance (nF)
246810 12 14 16
Rise Time (ns)
Rise Time vs. Load Capacitance
5
10
15
20
25
30
35
40
45
50 VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Load Capacitance (nF)
246810 12 14 16
Fall Time (ns)
5
10
15
20
25
30
35
40
45
50
Fall Time vs. Load Capacitance
V
CC
=4.5V
V
CC
=8V
V
CC
=12V
V
CC
=18V
V
CC
=25V
V
CC
=30V
V
CC
=35V
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Propagation Delay (ns)
0
50
100
150
200
250
Propagation Delay vs. Supply Voltage
(VIN=0-5V, f=1kHz, CL=15nF)
t
OFFDLY
t
ONDLY
Input Voltage (V)
246810 12 14
Propagation Delay (ns)
40
60
80
100
120
140
160
Propagation Delay vs. Input Voltage
(VIN=0-5V, f=1kHz, CL=15nF, VCC=12V)
t
OFFDLY
t
ONDLY
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Propagation Delay (ns)
40
45
50
55
60
65
70
Propogation Delay
vs. Junction Temperature
(VIN=0-5V, f=1kHz, CL=15nF, VCC=18V)
t
OFFDLY
t
ONDLY
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Input Threshold (V)
1.5
2.0
2.5
3.0
3.5
Input Threshold
vs. Supply Voltage
Min V
IH
Max V
IL
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Enable Threshold (V)
0
5
10
15
20
25
Enable Threshold
vs. Supply Voltage
Min V
ENH
Max V
ENL
INTEGRATED CIRCUITS DIVISION
IXD_614
R03 www.ixysic.com 9
Load Capacitance (pF)
246810 12 14 16 18
Supply Current (mA)
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=35V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=2MHz
Load Capacitance (nF)
246810 12 14 16 18
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=18V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Load Capacitance (nF)
246810 12 14 16 18
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=35V)
C
L
=15nF
C
L
=7.5nF
C
L
=3.6nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(V
CC
=18V)
C
L
=15nF
C
L
=7.5nF
C
L
=3.6nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(V
CC
=12V)
C
L
=15nF
C
L
=7.5nF
C
L
=3.6nF
Load Capacitance (nF)
246810 12 14 16 18
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Load Capacitance
(VCC=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
-0.5
0.0
0.5
1.0
1.5
2.0
Quiescent Supply Current
vs. Temperature
3.5V
5V
10V
0V & 18V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Dynamic Supply Current
vs. Temperature
(VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V)
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(VCC=8V)
CL=15nF
CL=7.5nF
CL=3.6nF
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Output Source Current (A)
0
-5
-10
-15
-20
-25
-30
-35
Output Source Current
vs. Supply Voltage
(CL=330nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Output Sink Current (A)
0
5
10
15
20
25
30
35
40
45
Output Sink Current
vs. Supply Voltage
(CL=330nF)
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IXD_614
10 www.ixysic.com R03
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Source Current (A)
-10
-12
-14
-16
-18
-20
-22
Output Source Current
vs. Temperature
(CL=330nF, VCC=18V)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Sink Current (A)
16
17
18
19
20
21
22
23
24
Output Sink Current
vs. Temperature
(CL=330nF, VCC=18V)
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Output Resistance (Ω)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
High-State Output Resistance @ -10mA
vs. Supply Voltage
Supply Voltage (V)
0 5 10 15 20 25 30 35 40
Output Resistance (Ω)
0.1
0.2
0.3
0.4
0.5
0.6
0.7
Low-State Output Resistance @ +10mA
vs. Supply Voltage
INTEGRATED CIRCUITS DIVISION
IXD_614
R03 www.ixysic.com 11
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device Moisture Sensitivity Level (MSL) Rating
IXD_614SI / IXD_614PI /IXD_614CI / IXD_614YI MSL 1
Device Maximum Temperature x Time
IXD_614CI / IXD_614YI 245°C for 30 seconds
IXD_614PI 250°C for 30 seconds
IXD_614SI 260°C for 30 seconds
RoHS
2002/95/EC e
3
Pb
INTEGRATED CIRCUITS DIVISION
IXD_614
12 www.ixysic.com R03
5.4 Mechanical Dimensions
5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back)
5.4.2 SI Package Tape & Reel Information
Recommended PCB Land Pattern
Dimensions
mm
(inches)
1.346 ± 0.076
(0.053 ± 0.003)
0.051 MIN - 0.254 MAX
(0.002 MIN - 0.010 MAX)
4.928 ± 0.254
(0.194 ± 0.010)
Pin 1
0.406 ± 0.076
(0.016 ± 0.003)
5.994 ± 0.254
(0.236 ± 0.010)
3.937 ± 0.254
(0.155 ± 0.010)
1.270 REF
(0.050)
0.762 ± 0.254
(0.030 ± 0.010)
7º
2.540 ± 0.254
(0.100 ± 0.010)
3.556 ± 0.254
(0.140 ±0.010)
1.27
(0.050)
5.40
(0.209)
1.55
(0.061)
0.60
(0.024)
2.75
(0.108)
3.80
(0.150)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256)
P=8.00
(0.315)
INTEGRATED CIRCUITS DIVISION
IXD_614
R03 www.ixysic.com 13
5.4.3 YI (5-Pin TO-263)
5.4.4 CI (5-Pin TO-220)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
8.636 / 9.144
(0.340 / 0.360)
14.605 / 15.875
(0.575 / 0.625)
9.652 / 10.312
(0.380 / 0.406)
1.70 BSC
(0.067 BSC)
1 2 3 4 5
0.737 / 0.889
(0.029 / 0.035)
1.143 / 1.651
(0.045 / 0.065)
4.318 / 4.597
(0.170 / 0.181)
1.143 / 1.397
(0.045 / 0.055)
2.286 / 2.794
(0.090 / 0.110)
0º - 8º
6.858 MIN
(0.270 MIN)
6.223 MIN
(0.245 MIN)
6
3.95
(0.156)
3.65
(0.144)
6.35
(0.250)
1.00
(0.039)
1.70
(0.067)
10.40
(0.409)
9.30
(0.366)
Recommended PCB Pattern
NOTES:
1. This drawing will meet all dimensions requirement of
JEDEC outlines TS-001AA and 5-lead version TO-220AB.
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)
3. The metal tab is connected to pin 3 (GND).
Finished Hole Diameter = 1.45mm (0.057 in.)
Recommended Hole Pattern
1.70mm (0.067 in.)
25.27 / 26.54
(0.995 / 1.045)
11.94 / 12.95
(0.470 / 0.510)
14.73 / 15.75
(0.580 / 0.620)
9.91 / 10.54
(0.390 / 0.415)
1.70 BSC
(0.067 BSC)
0.64 / 1.02
(0.025 / 0.040)
8.64 / 9.40
(0.340 / 0.370)
4.32 / 4.83
(0.170 / 0.190)
1.14 / 1.40
(0.045 / 0.055)
0.38 / 0.64
(0.015 / 0.025)
2.29 / 2.92
(0.090 / 0.115)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
12.387
(0.487)
6.299
(0.248)
7.823
(0.308)
12.70 / 14.73
(0.50 / 0.58)
7.620
(0.300)
6.502
(0.256)
1 2 3 4 5
3
INTEGRATED CIRCUITS DIVISION
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14 www.ixysic.com R03
5.4.5 PI (8-Pin DIP)
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.889 ± 0.102
(0.035 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 TYP
(0.01)
Pin 1
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_614-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5/31/2012