LTC2327-16
1
232716fa
For more information www.linear.com/LTC2327-16
Typical applicaTion
FeaTures DescripTion
16-Bit, 500ksps, ±10.24V
True Bipolar, Pseudo-Differential
Input ADC with 93.5dB SNR
The LTC
®
2327-16 is a low noise, high speed 16-bit suc-
cessive approximation register (SAR) ADC with pseudo-
differential inputs. Operating from a single 5V supply, the
LTC2327-16 has a ±10.24V true bipolar input range, making
it ideal for high voltage applications which require a wide
dynamic range. The LTC2327-16 achieves ±1.5LSB INL
maximum, no missing codes at 16 bits with 93.5dB SNR.
The LTC2327-16 has an onboard single-shot capable
reference buffer and low drift (20ppm/°C max) 2.048V
temperature compensated reference. The LTC2327-16
also has a high speed SPI-compatible serial interface that
supports 1.8V, 2.5V, 3.3V and 5V logic while also featuring
a daisy-chain mode. The fast 500ksps throughput with
no cycle latency makes the LTC2327-16 ideally suited
for a wide variety of high speed applications. An internal
oscillator sets the conversion time, easing external timing
considerations. The LTC2327-16 dissipates only 36mW
and automatically naps between conversions, leading to
reduced power dissipation that scales with the sampling
rate. A sleep mode is also provided to reduce the power
consumption of the LTC2327-16 to 300μW for further
power savings during inactive periods.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and
SoftSpan is a trademark of Linear Technology Corporation. All other trademarks are the
property of their respective owners. Protected by U.S. Patents, including 7705765, 7961132.
applicaTions
n 500ksps Throughput Rate
n ±1.5LSB INL (Max)
n Guaranteed 16-Bit No Missing Codes
n Pseudo-Differential Inputs
n True Bipolar Input Ranges ±6.25V, ±10.24V, ±12.5V
n 93.5dB SNR (Typ) at fIN = 2kHz
n –111dB THD (Typ) at fIN = 2kHz
n Guaranteed Operation to 125°C
n Single 5V Supply
n Low Drift (20ppm/°C Max) 2.048V Internal Reference
n Onboard Single-Shot Capable Reference Buffer
n No Pipeline Delay, No Cycle Latency
n 1.8V to 5V I/O Voltages
n SPI-Compatible Serial I/O with Daisy-Chain Mode
n Internal Conversion Clock
n Power Dissipation 36mW (Typ)
n 16-Lead MSOP Package
n Programmable Logic Controllers
n Industrial Process Control
n High Speed Data Acquisition
n Portable or Compact Instrumentation
n ATE
32k Point FFT fS = 500ksps,
fIN = 2kHz
FREQUENCY (kHz)
–180
AMPLITUDE (dBFS)
–60
–40
–20
–80
–100
–120
–140
–160
0
232716 TA01b
SNR = 93.5dB
THD = –113dB
SINAD = 93.4dB
SFDR = –117dB
0 50 100 150 250200
+10.24V
–10.24V
–
+
SAMPLE CLOCK
232716 TA01
10µF 0.1µF
5V
REF
1.8V TO 5V
47µF
REFBUF GND
CHAIN
RDL/SDI
SDO
SCK
BUSY
CNV
LTC2327-16
LT®1468
VDD
2.2µF
100nF
REFIN
VDDLBYP OVDD
IN+
IN–
LTC2327-16
2
232716fa
For more information www.linear.com/LTC2327-16
pin conFiguraTionabsoluTe MaxiMuM raTings
Supply Voltage (VDD) ..................................................6V
Supply Voltage (OVDD) ................................................6V
Supply Bypass Voltage (VDDLBYP) ...........................3.2V
Analog Input Voltage
IN+, IN– ..............................................–16.5V to 16.5V
REFBUF ................................................................... 6V
REFIN .................................................................. 2.8V
Digital Input Voltage
(Note 3) ........................... (GND –0.3V) to (OVDD + 0.3V)
Digital Output Voltage
(Note 3) ........................... (GND –0.3V) to (OVDD + 0.3V)
Power Dissipation .............................................. 500mW
Operating Temperature Range
LTC2327C ................................................ 0°C to 70°C
LTC2327I .............................................–40°C to 85°C
LTC2327H .......................................... –40°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
(Notes 1, 2)
1
2
3
4
5
6
7
8
VDDLBYP
VDD
GND
IN+
IN–
GND
REFBUF
REFIN
16
15
14
13
12
11
10
9
GND
OVDD
SDO
SCK
RDL/SDI
BUSY
CHAIN
CNV
TOP VIEW
MS PACKAGE
16-LEAD PLASTIC MSOP
TJMAX = 150°C, θJA = 110°C/W
orDer inForMaTion
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LTC2327CMS-16#PBF LTC2327CMS-16#TRPBF 232716 16-Lead Plastic MSOP 0°C to 70°C
LTC2327IMS-16#PBF LTC2327IMS-16#TRPBF 232716 16-Lead Plastic MSOP –40°C to 85°C
LTC2327HMS-16#PBF LTC2327HMS-16#TRPBF 232716 16-Lead Plastic MSOP –40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on nonstandard lead based finish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through
designated sales channels with #TRMPBF suffix.
http://www.linear.com/product/LTC2327-16#orderinfo
LTC2327-16
3
232716fa
For more information www.linear.com/LTC2327-16
elecTrical characTerisTics
converTer characTerisTics
DynaMic accuracy
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
The
l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C and AIN = –1dBFS. (Notes 4, 8)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN+Absolute Input Range (IN+) (Note 5) l–2.5 • VREFBUF – 0.5 2.5 • VREFBUF + 0.5 V
VIN–Absolute Input Range (IN–) (Note 5) l–0.5 0.5 V
VIN+ – VIN–Input Differential Voltage Range VIN = VIN+ – VIN– l–2.5 • VREFBUF 2.5 • VREFBUF V
IIN Analog Input Current l–7.8 4.8 mA
CIN Analog Input Capacitance 5 pF
RIN Analog Input Resistance 2.083 kΩ
CMRR Input Common Mode Rejection Ratio fIN = 250kHz 66 dB
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Resolution l16 Bits
No Missing Codes l16 Bits
Transition Noise 0.5 LSBRMS
INL Integral Linearity Error (Note 6) l–1.5 ±0.25 1.5 LSB
DNL Differential Linearity Error l–1 ±0.1 1 LSB
BZE Bipolar Zero-Scale Error (Note 7) l–10 0 10 LSB
Bipolar Zero-Scale Error Drift 0.01 LSB/°C
FSE Bipolar Full-Scale Error VREFBUF = 4.096V (REFBUF Overdriven)
(Notes 7, 9)
l–35 35 LSB
REFIN = 2.048V (Note 7) l–45 45 LSB
Bipolar Full-Scale Error Drift ±0.5 ppm/°C
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
SINAD Signal-to-(Noise + Distortion) Ratio ±6.25V Range, fIN = 2kHz, REFIN = 1.25V l87.1 90.4 dB
±10.24V Range, fIN = 2kHz, REFIN = 2.048V l90.2 93.4 dB
±12.5V Range, fIN = 2kHz, REFBUF = 5V l90.5 94.2 dB
SNR Signal-to-Noise Ratio ±6.25V Range, fIN = 2kHz, REFIN = 1.25V l87.5 90.5 dB
±10.24V Range, fIN = 2kHz, REFIN = 2.048V l91 93.5 dB
±12.5V Range, fIN = 2kHz, REFBUF = 5V l92 94.5 dB
THD Total Harmonic Distortion ±6.25V Range, fIN = 2kHz, REFIN = 1.25V l–108 –98 dB
±10.24V Range, fIN = 2kHz, REFIN = 2.048V l–111 –98 dB
±12.5V Range, fIN = 2kHz, REFBUF = 5V l–106 –96 dB
SFDR Spurious Free Dynamic Range ±6.25V Range, fIN = 2kHz, REFIN = 1.25V l98 110 dB
±10.24V Range, fIN = 2kHz, REFIN = 2.048V l98 113 dB
±12.5V Range, fIN = 2kHz, REFBUF = 5V l96 108 dB
–3dB Input Linear Bandwidth 7 MHz
Aperture Delay 500 ps
Aperture Jitter 4 psRMS
Transient Response Full-Scale Step 0.5 µs
LTC2327-16
4
232716fa
For more information www.linear.com/LTC2327-16
inTernal reFerence characTerisTics
reFerence buFFer characTerisTics
DigiTal inpuTs anD DigiTal ouTpuTs
The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VREFIN Internal Reference Output Voltage 2.043 2.048 2.053 V
VREFIN Temperature Coefficient (Note 14) l2 20 ppm/°C
REFIN Output Impedance 15 kΩ
VREFIN Line Regulation VDD = 4.75V to 5.25V 0.08 mV/V
REFIN Input Voltage Range (REFIN Overdriven) (Note 5) 1.25 2.4 V
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VREFBUF Reference Buffer Output Voltage VREFIN = 2.048V l4.091 4.096 4.101 V
REFBUF Input Voltage Range (REFBUF Overdriven) (Notes 5, 9) l2.5 5 V
REFBUF Output Impedance VREFIN = 0V 13 kΩ
IREFBUF REFBUF Load Current VREFBUF = 5V (REFBUF Overdriven) (Notes 9, 10)
VREFBUF = 5V, Nap Mode (REFBUF Overdriven) (Note 9)
l0.64
0.39
0.7 mA
mA
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIH High Level Input Voltage l0.8 • OVDD V
VIL Low Level Input Voltage l0.2 • OVDD V
IIN Digital Input Current VIN = 0V to OVDD l–10 10 μA
CIN Digital Input Capacitance 5 pF
VOH High Level Output Voltage IO = –500µA lOVDD – 0.2 V
VOL Low Level Output Voltage IO = 500µA l0.2 V
IOZ Hi-Z Output Leakage Current VOUT = 0V to OVDD l–10 10 µA
ISOURCE Output Source Current VOUT = 0V –10 mA
ISINK Output Sink Current VOUT = OVDD 10 mA
LTC2327-16
5
232716fa
For more information www.linear.com/LTC2327-16
aDc TiMing characTerisTics
power requireMenTs
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
The
l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VDD Supply Voltage l4.75 5 5.25 V
OVDD Supply Voltage l1.71 5.25 V
IVDD
IOVDD
INAP
ISLEEP
Supply Current
Supply Current
Nap Mode Current
Sleep Mode Current
500ksps Sample Rate (IN+ = –10.24V, IN– = 0V)
500ksps Sample Rate (IN+ = IN– = 0V)
500ksps Sample Rate (CL = 20pF)
Conversion Done (IVDD + IOVDD, IN+ = –10.24V, IN– = 0V)
Sleep Mode (IVDD + IOVDD)
l
l
l
11.4
7.2
0.1
8.4
60
14
10
225
mA
mA
mA
mA
μA
PDPower Dissipation
Nap Mode
Sleep Mode
500ksps Sample Rate (IN+ = –10.24V, IN– = 0V)
500ksps Sample Rate (IN+ = IN– = 0V)
Conversion Done (IVDD + IOVDD, IN+ = –10.24V, IN– = 0V)
Sleep Mode (IVDD + IOVDD)
l
l
l
57
36
42
0.3
70
50
1.1
mW
mW
mW
mW
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
fSMPL Maximum Sampling Frequency l500 ksps
tCONV Conversion Time l1 1.5 µs
tACQ Acquisition Time tACQ = tCYC – tHOLD (Note 11) l1.460 µs
tHOLD Maximum Time between Acquisitions l540 ns
tCYC Time Between Conversions l2 µs
tCNVH CNV High Time l20 ns
tBUSYLH CNV↑ to BUSY Delay CL = 20pF l13 ns
tCNVL Minimum Low Time for CNV (Note 12) l20 ns
tQUIET SCK Quiet Time from CNV↑(Note 11) l20 ns
tSCK SCK Period (Notes 12, 13) l10 ns
tSCKH SCK High Time l4 ns
tSCKL SCK Low Time l4 ns
tSSDISCK SDI Setup Time From SCK↑(Note 12) l4 ns
tHSDISCK SDI Hold Time From SCK↑(Note 12) l1 ns
tSCKCH SCK Period in Chain Mode tSCKCH = tSSDISCK + tDSDO (Note 12) l13.5 ns
tDSDO SDO Data Valid Delay from SCK↑ CL = 20pF, OVDD = 5.25V
CL = 20pF, OVDD = 2.5V
CL = 20pF, OVDD = 1.71V
l
l
l
7.5
8
9.5
ns
ns
ns
tHSDO SDO Data Remains Valid Delay from SCK↑CL = 20pF (Note 11) l1 ns
tDSDOBUSYL SDO Data Valid Delay from BUSY↓CL = 20pF (Note 11) l5 ns
tEN Bus Enable Time After RDL↓(Note 12) l16 ns
tDIS Bus Relinquish Time After RDL↑(Note 12) l13 ns
tWAKE REFBUF Wake-Up Time CREFBUF = 47μF, CREFIN = 100nF 200 ms
LTC2327-16
6
232716fa
For more information www.linear.com/LTC2327-16
elecTrical characTerisTics
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to ground.
Note 3: When these pin voltages are taken below ground or above VDD or
OVDD, they will be clamped by internal diodes. This product can handle
input currents up to 100mA below ground or above VDD or OVDD without
latch-up.
Note 4: VDD = 5V, OVDD = 2.5V, ±10.24V Range, REFIN = 2.048V,
fSMPL = 500kHz.
Note 5: Recommended operating conditions.
Note 6: Integral nonlinearity is defined as the deviation of a code from a
straight line passing through the actual endpoints of the transfer curve.
The deviation is measured from the center of the quantization band.
Note 7: Bipolar zero error is the offset voltage measured from –0.5LSB
when the output code flickers between 0000 0000 0000 0000 and 1111
1111 1111 1111. Full-scale bipolar error is the worst-case of –FS or +FS
untrimmed deviation from ideal first and last code transitions and includes
the effect of offset error.
Note 8: All specifications in dB are referred to a full-scale ±10.24V input
with REFIN = 2.048V.
Note 9: When REFBUF is overdriven, the internal reference buffer must be
turned off by setting REFIN = 0V.
Note 10: fSMPL = 500kHz, IREFBUF varies proportionally with sample rate.
Note 11: Guaranteed by design, not subject to test.
Note 12: Parameter tested and guaranteed at OVDD = 1.71V, OVDD = 2.5V
and OVDD = 5.25V.
Note 13: tSCK of 10ns maximum allows a shift clock frequency up to
100MHz for rising edge capture.
Note 14: Temperature coefficient is calculated by dividing the maximum
change in output voltage by the specified temperature range.
Figure 1. Voltage Levels for Timing Specifications
0.8 • OVDD
0.2 • OVDD
50% 50%
232716 F01
0.2 • OVDD
0.8 • OVDD
0.2 • OVDD
0.8 • OVDD
tDELAY
tWIDTH
tDELAY
LTC2327-16
7
232716fa
For more information www.linear.com/LTC2327-16
Typical perForMance characTerisTics
32k Point FFT fS = 500ksps,
fIN = 2kHz SNR, SINAD vs Input Frequency
THD, Harmonics vs Input
Frequency
SNR, SINAD vs Input Level,
fIN = 2kHz
SNR, SINAD vs Temperature,
fIN = 2kHz
THD, Harmonics vs Temperature,
fIN = 2kHz
Integral Nonlinearity
vs Output Code
Differential Nonlinearity
vs Output Code DC Histogram
TA = 25°C, VDD = 5V, OVDD = 2.5V, REFIN = 2.048V,
fSMPL = 500ksps, unless otherwise noted.
OUTPUT CODE
–1.0
INL ERROR (LSB)
0.8
0.6
0.4
0
–0.8
–0.6
–0.4
–0.2
0.2
1.0
232716 G01
–32768 –16384 0 16384 32768
OUTPUT CODE
–0.5
DNL ERROR (LSB)
0.4
0.3
0.2
0.1
0
–0.4
–0.3
–0.2
–0.1
0.5
232716 G02
–32768 –16384 0 16384 32768
CODE
–1 012
0
COUNTS
7000
3000
4000
5000
2000
1000
9000
8000
6000
233716 G03
σ = 0.5
FREQUENCY (kHz)
–180
AMPLITUDE (dBFS)
–60
–40
–20
–80
–100
–120
–140
–160
0
232716 G04
SNR = 93.5dB
THD = –113dB
SINAD = 93.4dB
SFDR = –117dB
0 50 100 150 250200
FREQUENCY (kHz)
0
60
SNR, SINAD (dBFS)
70
80
90
100
25 50 75 100
232716 G05
125 150 175 200
SINAD
SNR
FREQUENCY (kHz)
THD, HARMONICS (dBFS)
–70
–80
232716 G06
–150
–120
–140
–130
–110
–100
–90
0 25 50 10075 150125 175 200
3RD
2ND
THD
INPUT LEVEL (dB)
–40
92
MAGNITUDE (dBFS)
94
93
95
96
–30 –20
232716 G07
–10
SNR
SINAD
0
TEMPERATURE (°C)
–40
90
SNR, SINAD (dBFS)
91
93
94
95
–10 20 35 125
232716 G08
92
–25 550 65 80 95 110
96
SINAD
SNR
TEMPERATURE (°C)
–40 –25 –10 5 20 35 50 65 80 95 110 125
THD, HARMONICS (dBFS)
–105
–110
232716 G09
–125
–120
–115
3RD
2ND
THD
LTC2327-16
8
232716fa
For more information www.linear.com/LTC2327-16
Typical perForMance characTerisTics
Supply Current vs Temperature Sleep Current vs Temperature
Internal Reference Output vs
Temperature
Internal Reference Output
Temperature Coefficient
Distribution CMRR vs Input Frequency Supply Current vs Sampling Rate
INL/DNL vs Temperature Full-Scale Error vs Temperature Offset Error vs Temperature
TA = 25°C, VDD = 5V, OVDD = 2.5V, REFIN = 2.048V,
fSMPL = 500ksps, unless otherwise noted.
SAMPLING FREQUENCY (kHz)
0
0
SUPPLY CURRENT (mA)
2
4
6
8
10
12
100 200 300 400
232716 G18
500
OVDD
VDD (IN+ = –10.24V)
VDD (IN+ = 10.24V)
VDD (IN+ = 0V)
DRIFT (ppm/°C)
–10
0
NUMBER OF PARTS
5
15
20
25
35
–8 04
232716 G16
10
30
–2 810
–6 –4 2 6
232716 G11
TEMPERATURE (°C)
–40 –25 –10 5 20 5035 65 80 95 110 125
FULL-SCALE ERROR (LSB)
20
15
10
5
–20
–15
–10
–5
0
232716 G12
TEMPERATURE (°C)
–40 –25 –10 5 20 35 50 65 80 95 110 125
OFFSET ERROR (LSB)
5
4
3
2
1
–5
–4
–3
–2
–1
0
TEMPERATURE (°C)
CURRENT (mA)
8
7
6
232716 G13
0
1
2
3
4
5
–40 –25 –10 5 20 35 50 65 80 95 110 125
VDD
(IN+ = IN– = OV)
OVDD
TEMPERATURE (°C)
CURRENT (µA)
120
232716 G14
0
20
40
60
80
100
–40 –25 –10 5 20 35 50 65 80 95 110 125
232716 G15
TEMPERATURE (°C)
–40 –25 –10 5 20 35 50 65 80 95 110 125
INTERNAL REFERENCE OUTPUT (V)
2.0484
2.0483
2.0482
2.0481
2.0476
2.0477
2.0478
2.0479
2.0480
TEMPERATURE (°C)
–40 –25 –10 5 20 35 50 65 80 95 110 125
INL, DNL ERROR (LSB)
1.0
0.8
0.6
0.4
232716 G10
–1.0
–0.8
–0.6
–0.4
0
0.2
–0.2
MAX INL
MAX DNL
MIN INL MIN DNL
FREQUENCY (kHz)
0
50
CMRR (dB)
55
60
65
70
75
80
100 15050 200 250
232716 G17
LTC2327-16
9
232716fa
For more information www.linear.com/LTC2327-16
pin FuncTions
VDDLBYP (Pin 1): 2.5V Supply Bypass Pin. The voltage
on this pin is generated via an onboard regulator off of
VDD. This pin must be bypassed with a 2.2μF ceramic
capacitor to GND.
VDD (Pin 2): 5V Power Supply. The range of VDD is 4.75V to
5.25V. Bypass VDD to GND with a 10µF ceramic capacitor.
GND (Pins 3, 6 and 16): Ground.
IN+ (Pin 4): Analog Input. IN+ operates differential with
respect to IN– with an IN+-IN– range of –2.5 • VREFBUF to
2.5 • VREFBUF.
IN– (Pin 5): Analog Ground Sense. IN– has an input range
of ±500mV with respect to GND and must be tied to the
ground plane or a remote sense.
REFBUF (Pin 7): Reference Buffer Output. An onboard
buffer nominally outputs 4.096V to this pin. This pin is
referred to GND and should be decoupled closely to the pin
with a 47μF ceramic capacitor. The internal buffer driving
this pin may be disabled by grounding its input at REFIN.
Once the buffer is disabled, an external reference may
overdrive this pin in the range of 2.5V to 5V. A resistive
load greater than 500kΩ can be placed on the reference
buffer output.
REFIN (Pin 8): Reference Output/Reference Buffer Input.
An onboard bandgap reference nominally outputs 2.048V
at this pin. Bypass this pin with a 100nF ceramic capacitor
to GND to limit the reference output noise. If more accu-
racy is desired, this pin may be overdriven by an external
reference in the range of 1.25V to 2.4V.
CNV (Pin 9): Convert Input. A rising edge on this input
powers up the part and initiates a new conversion. Logic
levels are determined by OVDD.
CHAIN (Pin 10): Chain Mode Selector Pin. When low,
the LTC2327-16 operates in normal mode and the
RDL/SDI input pin functions to enable or disable SDO.
When high, the LTC2327-16 operates in chain mode and the
RDL/SDI pin functions as SDI, the daisy-chain serial data
input. Logic levels are determined by OVDD.
BUSY (Pin 11): BUSY Indicator. Goes high at the start of
a new conversion and returns low when the conversion
has finished. Logic levels are determined by OVDD.
RDL/SDI (Pin 12): When CHAIN is low, the part is in nor-
mal mode and the pin is treated as a bus enabling input.
When CHAIN is high, the part is in chain mode and the
pin is treated as a serial data input pin where data from
another ADC in the daisy chain is input. Logic levels are
determined by OVDD.
SCK (Pin 13): Serial Data Clock Input. When SDO is enabled,
the conversion result or daisy-chain data from another
ADC is shifted out on the rising edges of this clock MSB
first. Logic levels are determined by OVDD.
SDO (Pin 14): Serial Data Output. The conversion result or
daisy-chain data is output on this pin on each rising edge
of SCK MSB first. The output data is in 2’s complement
format. Logic levels are determined by OVDD.
OVDD (Pin 15): I/O Interface Digital Power. The range of
OVDD is 1.71V to 5.25V. This supply is nominally set to
the same supply as the host interface (1.8V, 2.5V, 3.3V,
or 5V). Bypass OVDD to GND with a 0.1μF capacitor.
LTC2327-16
10
232716fa
For more information www.linear.com/LTC2327-16
FuncTional block DiagraM
TiMing DiagraM
Conversion Timing Using the Serial Interface
REFBUF = 2.5V
TO 5V
REFIN = 1.25V
TO 2.4V
IN+
VDD = 5V
OVDD = 1.8V
TO 5V
IN–
VDDLBYP = 2.5V
CHAIN
0.63× BUFFER
2× REFERENCE
BUFFER
R
4R
CNV
GND
BUSY
SDO
SCK
RDL/SDI
CONTROL LOGIC
LDO
2.048V
REFERENCE
16-BIT SAMPLING ADC SPI
PORT
+
–
232716 BD01
15k
4R R
NAPCONVERT
ACQUIREHOLD
D13D15 D14 D2 D1 D0
SDO
SCK
CNV
CHAIN, RDL/SDI = 0
BUSY
232716 TD01
LTC2327-16
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OVERVIEW
The LTC2327-16 is a low noise, high speed 16-bit suc-
cessive approximation register (SAR) ADC with pseudo-
differential inputs. Operating from a single 5V supply, the
LTC2327-16 has a ±10.24V true bipolar input range, making
it ideal for high voltage applications which require a wide
dynamic range. The LTC2327-16 achieves ±1.5LSB INL
maximum, no missing codes at 16-bits and 93.5dB SNR.
The LTC2327-16 has an onboard single-shot capable
reference buffer and low drift (20ppm/°C max) 2.048V
temperature-compensated reference. The LTC2327-16
also has a high speed SPI-compatible serial interface that
supports 1.8V, 2.5V, 3.3V and 5V logic while also featuring
a daisy-chain mode. The fast 500ksps throughput with
no cycle latency makes the LTC2327-16 ideally suited
for a wide variety of high speed applications. An internal
oscillator sets the conversion time, easing external timing
considerations. The LTC2327-16 dissipates only 36mW
and automatically naps between conversions, leading to
reduced power dissipation that scales with the sampling
rate. A sleep mode is also provided to reduce the power
consumption of the LTC2327-16 to 300μW for further
power savings during inactive periods.
CONVERTER OPERATION
The LTC2327-16 operates in two phases. During the ac-
quisition phase, the charge redistribution capacitor D/A
converter (CDAC) is connected to the outputs of the resis-
tor divider networks that pins IN+ and IN– drive to sample
an attenuated and level-shifted version of the pseudo-
differential analog input voltage as shown in Figure3. A
rising edge on the CNV pin initiates a conversion. During
the conversion phase, the 16-bit CDAC is sequenced
through a successive approximation algorithm, effectively
comparing the sampled input with binary-weighted frac-
tions of the reference voltage (e.g. VREFBUF/2, VREFBUF/4
… VREFBUF/65536) using the differential comparator. At
the end of conversion, the CDAC output approximates the
sampled analog input. The ADC control logic then prepares
the 16-bit digital output code for serial transfer.
Figure 2. LTC2327-16 Transfer Function
TRANSFER FUNCTION
The LTC2327-16 digitizes the full-scale voltage of ±2.5 •
REFBUF into 216 levels, resulting in an LSB size of 312.5µV
with REFBUF = 4.096V. The ideal transfer function is shown
in Figure 2. The output data is in 2’s complement format.
ANALOG INPUT
The analog inputs of the LTC2327-16 are pseudo-differen-
tial in order to reduce any unwanted signal that is common
to both inputs. The analog inputs can be modeled by the
equivalent circuit shown in Figure 3. The back-to-back
diodes at the inputs form clamps that provide ESD protec-
tion. Each input drives a resistor divider network that has
Figure 3. The Equivalent Circuit for the Differential
Analog Input of the LTC2327-16
RON
50Ω
400Ω CIN
45pF
RON
50Ω
0.63 • VREFBUF
CIN
45pF
IN+
IN–
BIAS
VOLTAGE
1.6k
1.6k 400Ω
0.63 • VREFBUF
232716 F03
INPUT VOLTAGE (V)
0V
OUTPUT CODE (TWO’S COMPLEMENT)
–1
LSB
232716 F02
011...111
011...110
000...001
000...000
100...000
100...001
111...110
1
LSB
BIPOLAR
ZERO
111...111
FSR/2 – 1LSB–FSR/2
FSR = +FS – –FS
1LSB = FSR/65536
LTC2327-16
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Figure 4. Input Signal Chain
a total impedance of 2kΩ. The resistor divider network
attenuates and level shifts the ±2.5 • REFBUF true bipolar
signal swing of each input to the 0-REFBUF input signal
swing of the ADC core. In the acquisition phase, 45pF (CIN)
from the sampling CDAC in series with approximately 50Ω
(RON) from the on-resistance of the sampling switch is
connected to the output of the resistor divider network.
Any unwanted signal that is common to both inputs will
be reduced by the common mode rejection of the ADC
core and resistor divider network. The IN+ input of the
ADC core draws a current spike while charging the CIN
capacitor during acquisition.
INPUT DRIVE CIRCUITS
A low impedance source can directly drive the high im-
pedance input of the LTC2327-16 without gain error. A
high impedance source should be buffered to minimize
settling time during acquisition and to optimize the dis-
tortion performance of the ADC. Minimizing settling time
is important even for DC inputs, because the ADC input
draws a current spike when entering acquisition.
For best performance, a buffer amplifier should be used
to drive the analog input of the LTC2327-16. The amplifier
provides low output impedance to minimize gain error
and allows for fast settling of the analog signal during
the acquisition phase. It also provides isolation between
the signal source and the ADC input which draws a small
current spike during acquisition.
Input Filtering
The noise and distortion of the buffer amplifier and signal
source must be considered since they add to the ADC noise
and distortion. Noisy input signals should be filtered prior
to the buffer amplifier input with a low bandwidth filter to
minimize noise. The simple 1-pole RC lowpass filter shown
in Figure 4 is sufficient for many applications.
The input resistor divider network, sampling switch on-
resistance (RON) and the sample capacitor (CIN) form a
second lowpass filter that limits the input bandwidth to
the ADC core to 7MHz. A buffer amplifier with a low noise
density must be selected to minimize the degradation of
the SNR over this bandwidth.
High quality capacitors and resistors should be used in the
RC filters since these components can add distortion. NPO
and silver mica type dielectric capacitors have excellent
linearity. Carbon surface mount resistors can generate
distortion from self heating and from damage that may
occur during soldering. Metal film surface mount resistors
are much less susceptible to both problems.
Pseudo-Differential Bipolar Inputs
For most applications, we recommend the low power
LT1468 ADC driver to drive the LTC2327-16. With a low
noise density of 5nV/√Hz and a low supply current of 3mA,
the LT1468 is flexible and may be configured to convert
signals of various amplitudes to the ±10.24V input range
of the LTC2327-16.
To achieve the full distortion performance of the
LTC2327-16, a low distortion single-ended signal source
driven through the LT1468 configured as a unity-gain
buffer as shown in Figure 4 can be used to get the full
data sheet THD specification of –111dB.
ADC REFERENCE
There are three ways of providing the ADC reference. The
first is to use both the internal reference and reference
buffer. The second is to externally overdrive the internal
reference and use the internal reference buffer. The third
is to disable the internal reference buffer and overdrive
the REFBUF pin from an external source. The following
tables give examples of these cases and the resulting
bipolar input ranges.
66nF
50Ω
BW = 48kHz
±10.24V
–
+
LT1468
LTC2327-16
IN+
IN–
232716 F04
LTC2327-16
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Figure 5a. LTC2327-16 Internal Reference Circuit
Table 1. Internal Reference with Internal Buffer
REFIN REFBUF BIPOLAR INPUT RANGE
2.048V 4.096V ±10.24V
Table 2. External Reference with Internal Buffer
REFIN
(OVERDRIVE)
REFBUF BIPOLAR INPUT RANGE
1.25V (Min) 2.5V ±6.25V
2.048V 4.096V ±10.24V
2.4V (Max) 4.8V ±12V
Table 3. External Reference Unbuffered
REFIN REFBUF
(OVERDRIVE)
BIPOLAR INPUT RANGE
0V 2.5V (Min) ±6.25V
0V 5V (Max) ±12.5V
Internal Reference with Internal Buffer
The LTC2327-16 has an on-chip, low noise, low drift
(20ppm/°C max), temperature compensated bandgap
reference that is factory trimmed to 2.048V. It is internally
connected to a reference buffer as shown in Figure 5a and
is available at REFIN (Pin 8). REFIN should be bypassed to
GND with a 100nF ceramic capacitor to minimize noise. The
reference buffer gains the REFIN voltage by 2 to 4.096V at
REFBUF (Pin 7). So the input range is ±10.24V, as shown
in Table 1. Bypass REFBUF to GND with at least a 47μF
ceramic capacitor (X7R, 10V, 1210 size) to compensate
the reference buffer and minimize noise.
External Reference with Internal Buffer
If more accuracy and/or lower drift is desired, REFIN
can be easily overdriven by an external reference since
a 15k resistor is in series with the reference as shown
in Figure5b. REFIN can be overdriven in the range from
1.25V to 2.4V. The resulting voltage at REFBUF will be
2•REFIN. So the input range is ±5 • REFIN, as shown
in Table 2. Linear Technology offers a portfolio of high
performance references designed to meet the needs of
many applications. With its small size, low power, and high
accuracy, the LTC6655-2.048 is well suited for use with
the LTC2327-16 when overdriving the internal reference.
The LTC6655-2.048 offers 0.025% (max) initial accuracy
and 2ppm/°C (max) temperature coefficient for high pre-
cision applications. The LTC6655-2.048 is fully specified
over the H-grade temperature range and complements
the extended temperature range of the LTC2327-16 up to
125°C. Bypassing the LTC6655-2.048 with a 2.7μF to 100µF
ceramic capacitor close to the REFIN pin is recommended.
External Reference Unbuffered
The internal reference buffer can also be overdriven from
2.5V to 5V with an external reference at REFBUF as shown
in Figure 5c. So the input ranges are ±6.25V to ±12.5V,
respectively, as shown in Table 3. To do so, REFIN must
be grounded to disable the reference buffer. A 13k resistor
loads the REFBUF pin when the reference buffer is disabled.
To maximize the input signal swing and corresponding
SNR, the LTC6655-5 is recommended when overdriv-
ing REFBUF. The LTC6655-5 offers the same small size,
accuracy, drift and extended temperature range as the
LTC6655-2.048. By using this 5V reference, an SNR of
94.5dB can be achieved. Bypassing the LTC6655-5 with
a 47μF ceramic capacitor (X5R, 0805 size) close to the
REFBUF pin is recommended.
The REFBUF pin of the LTC2327-16 draws a charge (QCONV)
from the external bypass capacitor during each conversion
cycle. If the internal reference buffer is overdriven, the
external reference must provide all of this charge with a
DC current equivalent to IREFBUF = QCONV/tCYC. Thus, the
DC current draw of REFBUF depends on the sampling
LTC2327-16
BANDGAP
REFERENCE
232716 F05a
47µF
100nF
6.5k
REFBUF
REFIN 15k
6.5k
REFERENCE
BUFFER
GND
–
+
LTC2327-16
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Figure 5b. Using the LTC6655-2.048 as an External Reference
Figure 5c. Overdriving REFBUF Using the LTC6655-5
Figure 6. CNV Waveform Showing Burst Sampling
of the output code. If an external reference is used to
overdrive REFBUF, the fast settling LTC6655-5 reference
is recommended.
Internal Reference Buffer Transient Response
For optimum transient performance, the internal reference
buffer should be used. The internal reference buffer uses a
proprietary design that results in an output voltage change
at REFBUF of less than 0.25LSB when responding to a sud-
den burst of conversions. This makes the internal reference
buffer of the LTC2327-16 truly single-shot capable since the
first sample taken after idling will yield the same result as
a sample taken after the transient response of the internal
reference buffer has settled. Figure 7 shows the transient
responses of the LTC2327-16 with the internal reference
buffer and with the internal reference buffer overdriven by
the LTC6655-5, both with a bypass capacitance of 47μF.
rate and output code. In applications where a burst of
samples is taken after idling for long periods, as shown in
Figure6, IREFBUF quickly goes from approximately 390µA
to a maximum of 0.7mA for REFBUF = 5V at 500ksps. This
step in DC current draw triggers a transient response in
the external reference that must be considered since any
deviation in the voltage at REFBUF will affect the accuracy Figure 7. Transient Response of the LTC2327-16
LTC2327-16
BANDGAP
REFERENCE
LTC6655-2.048
232716 F05b
47µF
2.7µF
6.5k
REFBUF
REFIN 15k
6.5k
REFERENCE
BUFFER
GND
–
+
LTC2327-16
GND
BANDGAP
REFERENCE
LTC6655-5
232716 F05c
47µF
6.5k
REFBUF
REFIN 15k
6.5k
REFERENCE
BUFFER–
+
TIME (µs)
DEVIATION FROM FINAL VALUE (LSB)
0.5
0
–0.5
–1.0
232716 F07
–2.0
–1.5
0 900800700600500400300200100 1000
INTERNAL REFERENCE BUFFER
EXTERNAL SOURCE ON REFBUF
CNV
IDLE
PERIOD
IDLE
PERIOD
232716 F06
LTC2327-16
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DYNAMIC PERFORMANCE
Fast Fourier Transform (FFT) techniques are used to test
the ADC’s frequency response, distortion and noise at the
rated throughput. By applying a low distortion sine wave
and analyzing the digital output using an FFT algorithm,
the ADC’s spectral content can be examined for frequen-
cies outside the fundamental. The LTC2327-16 provides
guaranteed tested limits for both AC distortion and noise
measurements.
Signal-to-Noise and Distortion Ratio (SINAD)
The signal-to-noise and distortion ratio (SINAD) is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the A/D output. The output is band limited
to frequencies from above DC and below half the sampling
frequency. Figure 8 shows that the LTC2327-16 achieves
a typical SINAD of 93.4dB at a 500kHz sampling rate with
a 2kHz input.
Signal-to-Noise Ratio (SNR)
The signal-to-noise ratio (SNR) is the ratio between the
RMS amplitude of the fundamental input frequency and
the RMS amplitude of all other frequency components
except the first five harmonics and DC. Figure 8 shows
that the LTC2327-16 achieves a typical SNR of 93.5dB at
a 500kHz sampling rate with a 2kHz input.
Total Harmonic Distortion (THD)
Total Harmonic Distortion (THD) is the ratio of the RMS sum
of all harmonics of the input signal to the fundamental itself.
The out-of-band harmonics alias into the frequency band
between DC and half the sampling frequency (fSMPL/2).
THD is expressed as:
THD=20log V22+V32+V42+…+ VN2
V1
where V1 is the RMS amplitude of the fundamental
frequency and V2 through VN are the amplitudes of the
second through Nth harmonics.
POWER CONSIDERATIONS
The LTC2327-16 provides two power supply pins: the 5V
power supply (VDD), and the digital input/output interface
power supply (OVDD). The flexible OVDD supply allows
the LTC2327-16 to communicate with any digital logic
operating between 1.8V and 5V, including 2.5V and 3.3V
systems.
Power Supply Sequencing
The LTC2327-16 does not have any specific power supply
sequencing requirements. Care should be taken to adhere
to the maximum voltage relationships described in the
Absolute Maximum Ratings section. The LTC2327-16
has a power-on reset (POR) circuit that will reset the
LTC2327-16 at initial power-up or whenever the power
supply voltage drops below 2V. Once the supply voltage
reenters the nominal supply voltage range, the POR will
re-initialize the ADC. No conversions should be initiated
until 200μs after a POR event to ensure the re-initialization
period has ended. Any conversions initiated before this
time will produce invalid results.
TIMING AND CONTROL
CNV Timing
The LTC2327-16 conversion is controlled by CNV. A ris-
ing edge on CNV will start a conversion and power up
the LTC2327-16. Once a conversion has been initiated,
Figure 8. 32k Point FFT of the LTC2327-16
FREQUENCY (kHz)
–180
AMPLITUDE (dBFS)
–60
–40
–20
–80
–100
–120
–140
–160
0
232716 F08
SNR = 93.5dB
THD = –113dB
SINAD = 93.4dB
SFDR = –117dB
0 50 100 150 250200
LTC2327-16
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Figure 9. Power Supply Current of the LTC2327-16
Versus Sampling Rate
it cannot be restarted until the conversion is complete.
For optimum performance, CNV should be driven by a
clean low jitter signal. Converter status is indicated by the
BUSY output which remains high while the conversion is
in progress. To ensure that no errors occur in the digitized
results, any additional transitions on CNV should occur
within 40ns from the start of the conversion or after the
conversion has been completed. Once the conversion has
completed, the LTC2327-16 powers down.
Acquisition
A proprietary sampling architecture allows the LTC2327-16
to begin acquiring the input signal for the next conver-
sion 527ns after the start of the current conversion. This
extends the acquisition time to 1.460µs, easing settling
requirements and allowing the use of extremely low power
ADC drivers. (Refer to the Timing Diagram.)
Internal Conversion Clock
The LTC2327-16 has an internal clock that is trimmed to
achieve a maximum conversion time of 1.5µs.
Auto Nap Mode
The LTC2327-16 automatically enters nap mode after a
conversion has been completed and completely powers
up once a new conversion is initiated on the rising edge of
CNV. During nap mode, only the ADC core powers down
and all other circuits remain active. During nap, data from
the last conversion can be clocked out. The auto nap mode
feature will reduce the power dissipation of the LTC2327-16
as the sampling frequency is reduced. Since full power is
consumed only during a conversion, the ADC core of the
LTC2327-16 remains powered down for a larger fraction of
the conversion cycle (tCYC) at lower sample rates, thereby
reducing the average power dissipation which scales with
the sampling rate as shown in Figure 9.
Sleep Mode
The auto nap mode feature provides limited power savings
since only the ADC core powers down. To obtain greater
power savings, the LTC2327-16 provides a sleep mode.
During sleep mode, the entire part is powered down
except for a small standby current resulting in a power
dissipation of 300μW. To enter sleep mode, toggle CNV
twice with no intervening rising edge on SCK. The part
will enter sleep mode on the falling edge of BUSY from
the last conversion initiated. Once in sleep mode, a rising
edge on SCK will wake the part up. Upon emerging from
sleep mode, wait tWAKE ms before initiating a conversion
to allow the reference and reference buffer to wake up
and charge the bypass capacitors at REFIN and REFBUF.
(Refer to the Timing Diagrams section for more detailed
timing information about sleep mode.)
DIGITAL INTERFACE
The LTC2327-16 has a serial digital interface. The flexible
OVDD supply allows the LTC2327-16 to communicate with
any digital logic operating between 1.8V and 5V, including
2.5V and 3.3V systems.
The serial output data is clocked out on the SDO pin when
an external clock is applied to the SCK pin if SDO is enabled.
Clocking out the data after the conversion will yield the
best performance. With a shift clock frequency of at least
40MHz, a 500ksps throughput is still achieved. The serial
output data changes state on the rising edge of SCK and
can be captured on the falling edge or next rising edge of
SCK. D15 remains valid till the first rising edge of SCK.
The serial interface on the LTC2327-16 is simple and
straightforward to use. The following sections describe the
operation of the LTC2327-16. Several modes are provided
depending on whether a single or multiple ADCs share the
SPI bus or are daisy-chained.
SAMPLING FREQUENCY (kHz)
0
0
SUPPLY CURRENT (mA)
2
4
6
8
10
12
100 200 300 400
232716 F09
500
OVDD
VDD (IN+ = –10.24V)
VDD (IN+ = 10.24V)
VDD (IN+ = 0V)
LTC2327-16
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Normal Mode, Single Device
When CHAIN = 0, the LTC2327-16 operates in normal
mode. In normal mode, RDL/SDI enables or disables the
serial data output pin SDO. If RDL/SDI is high, SDO is in
high impedance. If RDL/SDI is low, SDO is driven. Figure10
shows a single LTC2327-16 operated in normal mode
with CHAIN and RDL/SDI tied to ground. With RDL/SDI
grounded, SDO is enabled and the MSB(D15) of the new
conversion data is available at the falling edge of BUSY.
This is the simplest way to operate the LTC2327-16.
Figure 10. Using a Single LTC2327-16 in Normal Mode
232716 F10
CONVERT CONVERT
tACQ
tACQ = tCYC – tHOLD
NAPNAP
CNV
CHAIN = 0
BUSY
SCK
SDO
RDL/SDI = 0
tBUSYLH
tDSDOBUSYL
tSCK
tHSDO
tSCKH tQUIET
tSCKL
tDSDO
tCONV
tCNVH
tHOLD
ACQUIRE
tCYC
tCNVL
D15 D14 D13 D1 D0
1 2 3 14 15 16
ACQUIRE
CNV
LTC2327-16
BUSY
CONVERT
IRQ
DATA IN
DIGITAL HOST
CLK
SDO
SCK
RDL/SDI
CHAIN
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Normal Mode, Multiple Devices
Figure 11 shows multiple LTC2327-16 devices operating
in normal mode (CHAIN = 0) sharing CNV, SCK and SDO.
By sharing CNV, SCK and SDO, the number of required
signals to operate multiple ADCs in parallel is reduced.
Since SDO is shared, the RDL/SDI input of each ADC must
be used to allow only one LTC2327-16 to drive SDO at a
time in order to avoid bus conflicts. As shown in Figure 11,
the RDL/SDI inputs idle high and are individually brought
low to read data out of each device between conversions.
When RDL/SDI is brought low, the MSB of the selected
device is output onto SDO.
Figure 11. Normal Mode with Multiple Devices Sharing CNV, SCK, and SDO
232716 F11
D15A
SDO
SCK
CNV
BUSY
CHAIN = 0
RDL/SDIB
RDL/SDIA
D15BD14BD1BD0B
D13B
D14AD13AD1AD0A
Hi-Z Hi-ZHi-Z
tEN
tHSDO
tDSDO tDIS
tSCKL
tSCKH
tCNVL
1 2 3 14 15 16 17 18 19 30 31 32
tSCK
CONVERTCONVERT
tQUIET
tCONV
tHOLD
tBUSYLH
NAP
ACQUIRE ACQUIRE
NAP
RDLB
RDLA
CONVERT
IRQ
DATA IN
DIGITAL HOST
CLK
CNV
LTC2327-16 SDO
A
SCK
RDL/SDI
CNV
LTC2327-16 SDO
B
SCK
RDL/SDI
CHAIN BUSY
CHAIN
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Chain Mode, Multiple Devices
When CHAIN = OVDD, the LTC2327-16 operates in
chain mode. In chain mode, SDO is always enabled and
RDL/SDI serves as the serial data input pin (SDI) where
daisy-chain data output from another ADC can be input.
This is useful for applications where hardware constraints
may limit the number of lines needed to interface to a large
number of converters. Figure 12 shows an example with
two daisy-chained devices. The MSB of converter A will
appear at SDO of converter B after 16 SCK cycles. The
MSB of converter A is clocked in at the SDI/RDL pin of
converter B on the rising edge of the first SCK.
Figure 12. Chain Mode Timing Diagram
232716 F12
D0A
D1A
D14A
D15A
D13B
D14B
D15B
SDOB
SDOA = RDL/SDIB
RDL/SDIA = 0
D0B
D1B
D13A
D14A
D15AD0A
D1A
1 2 3 14 15 16 17 18 30 31 32
tDSDOBUSYL
tSSDISCK
tHSDISCK
tBUSYLH
tCONV
tHOLD
tHSDO
tDSDO
tSCKL
tSCKH
tSCKCH
tCNVL
tCYC
CONVERT
CONVERT
SCK
CNV
BUSY
CHAIN = OVDD
tQUIET
NAPNAP
ACQUIREACQUIRE
OVDD
CONVERT
IRQ
DATA IN
DIGITAL HOST
CLK
CNV
LTC2327-16
BUSY
SDO
B
SCK
RDL/SDI
CNV
LTC2327-16
SDO
A
SCK
RDL/SDI
CHAIN
OVDD
CHAIN
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Sleep Mode
To enter sleep mode, toggle CNV twice with no interven-
ing rising edge on SCK as shown in Figure 13. The part
will enter sleep mode on the falling edge of BUSY from
the last conversion initiated. Once in sleep mode, a rising
edge on SCK will wake the part up. Upon emerging from
sleep mode, wait tWAKE ms before initiating a conversion
to allow the reference and reference buffer to wake up
and charge the bypass capacitors at REFIN and REFBUF.
Figure 13. Sleep Mode Timing Diagram
232716 F13
CONVERT CONVERTSLEEP
NAP AND
ACQUIRE
CHAIN = DON’T CARE
RDL/SDI = DON’T CARE
CHAIN = DON’T CARE
RDL/SDI = DON’T CARE
CNV
BUSY
SCK
tBUSYLH
tWAKE
tCONV
tCNVH
CONVERT CONVERTSLEEP
NAP AND
ACQUIRE
NAP
tHOLD tACQ
CNV
BUSY
SCK
tBUSYLH
tWAKE
CONVERT
tCONV
tCONV
tCNVH
ACQUIRE
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LTC2327-16
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boarD layouT
To obtain the best performance from the LTC2327-16 a
printed circuit board (PCB) is recommended. Layout for
PCB should ensure the digital and analog signal lines are
separated as much as possible. In particular, care should
be taken not to run any digital clocks or signals alongside
analog signals or underneath the ADC.
Recommended Layout
The following is an example of a recommended PCB layout.
A single solid ground plane is used. Bypass capacitors to
the supplies are placed as close as possible to the supply
pins. Low impedance common returns for these bypass
capacitors are essential to the low noise operation of the
ADC. The analog input traces are screened by ground.
For more details and information refer to DC1908, the
evaluation kit for the LTC2327-16.
Partial Top Silkscreen
Partial Layer 1 Component Side
LTC2327-16
24
232716fa
For more information www.linear.com/LTC2327-16
package DescripTion
MSOP (MS16) 0213 REV A
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
12345678
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010) 0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ±0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
0.1016 ±0.0508
(.004 ±.002)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.280 ±0.076
(.011 ±.003)
REF
4.90 ±0.152
(.193 ±.006)
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev A)
Please refer to http://www.linear.com/product/LTC2327-16#packaging for the most recent package drawings.
LTC2327-16
25
232716fa
For more information www.linear.com/LTC2327-16
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
revision hisTory
REV DATE DESCRIPTION PAGE NUMBER
A 07/16 Updated graphs G01, G02 and G03 7
LTC2327-16
26
232716fa
For more information www.linear.com/LTC2327-16
LINEAR TECHNOLOGY CORPORATION 2014
LT 0716 REV A • PRINTED IN USA
(408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC2327-16
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
relaTeD parTs
Typical applicaTion
PART NUMBER DESCRIPTION COMMENTS
ADCs
LTC2338-18/LTC2337-18/
LTC2336-18
18-Bit, 1Msps/500ksps/250ksps Serial,
Low Power ADC
5V Supply, ±10.24V True Bipolar, Differential Input, 100dB SNR, Pin-Compatible
Family in MSOP-16 Package
LTC2328-18/LTC2327-18/
LTC2326-18
18-Bit, 1Msps/500ksps/250ksps Serial,
Low Power ADC
5V Supply, ±10.24V True Bipolar, Pseudo-Differential Input, 95dB SNR,
Pin-Compatible Family in MSOP-16 Package
LTC2378-20/LTC2377-20/
LTC2376-20
20-Bit, 1Msps/500ksps/250ksps Serial,
Low Power ADC
2.5V Supply, Differential Input, 0.5ppm INL, ±5V Input Range, DGC, Pin-
Compatible Family in MSOP-16 and 4mm × 3mm DFN-16 Packages
LTC2379-18/LTC2378-18/
LTC2377-18/LTC2376-18
18-Bit, 1.6Msps/1Msps/500ksps/250ksps
Serial, Low Power ADC
2.5V Supply, Differential Input, 101.2dB SNR, ±5V Input Range, DGC,
Pin-Compatible Family in MSOP-16 and 4mm × 3mm DFN-16 Packages
LTC2380-16/LTC2378-16/
LTC2377-16/LTC2376-16
16-Bit, 2Msps/1Msps/500ksps/250ksps
Serial, Low Power ADC
2.5V Supply, Differential Input, 96.2dB SNR, ±5V Input Range, DGC,
Pin-Compatible Family in MSOP-16 and 4mm × 3mm DFN-16 Packages
LTC2369-18/LTC2368-18/
LTC2367-18/LTC2364-18
18-Bit, 1.6Msps/1Msps/500ksps/250ksps
Serial, Low Power ADC
2.5V Supply, Pseudo-Differential Unipolar Input, 96.5dB SNR, 0V to 5V Input
Range, Pin-Compatible Family in MSOP-16 and 4mm × 3mm DFN-16 Packages
LTC2370-16/LTC2368-16/
LTC2367-16/LTC2364-16
16-Bit, 2Msps/1Msps/500ksps/250ksps
Serial, Low Power ADC
2.5V Supply, Pseudo-Differential Unipolar Input, 94dB SNR, 0V to 5V Input
Range, Pin-Compatible Family in MSOP-16 and 4mm × 3mm DFN-16 Packages
LTC2389-18/LTC2389-16 18-Bit/16-Bit, 2.5Msps Parallel/Serial ADC 5V Supply, Pin-Configurable Input Range, 99.8dB/96dB SNR, Parallel or Serial
I/O 7mm × 7mm LQFP-48 and QFN-48 Packages
DACs
LTC2756/LTC2757 18-Bit, Single Serial/Parallel IOUT SoftSpan™
DAC
±1LSB INL/DNL, Software-Selectable Ranges, SSOP-28/7mm × 7mm LQFP-48
Package
LTC2641 16-Bit/14-Bit/12-Bit Single Serial VOUT DAC ±1LSB INL /DNL, MSOP-8 Package, 0V to 5V Output
LTC2630 12-Bit/10-Bit/8-Bit Single VOUT DACs ±1LSB INL (12 Bits), Internal Reference, SC70 6-Pin Package
References
LTC6655 Precision Low Drift Low Noise Buffered
Reference
5V/2.5V/2.048V/1.2V, 2ppm/°C, 0.25ppm Peak-to-Peak Noise, MSOP-8 Package
LTC6652 Precision Low Drift Low Noise Buffered
Reference
5V/2.5V/2.048V/1.2V, 5ppm/°C, 2.1ppm Peak-to-Peak Noise, MSOP-8 Package
Amplifiers
LT1468/LT1469 Single/Dual 90MHz, 22V/μs, 16-Bit Accurate
Op Amp
Low Input Offset: 75μV/125µV
LT1468 Configured to Buffer a ±10.24V Single-Ended Signal Into the LTC2327-16
–10.24V
+10.24V
–15V
15V
LT1468
232716 TA02
LTC2327-16
IN+VDD
5V
IN–
47µF
REFBUF
100nF
REFIN
–
+
2
6
7
4
3
