(0,80mm) .0315"
QTE SERIES
QTE–060–01–L–D–A
QTE–014–01–L–D–A–RT1
QTE–014–01–F–D–DP–A
Polarized
Integral metal plane
for power or ground Standard
stack heights
from 5mm
to 25mm
WWW.SAMTEC.COM
For complete specifi cations and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC mated with QSE
& 5mm Stack Height
Max Cycles: 100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Ye s
Processing:
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080)
Board Stacking:
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
(5,97)
.235
(0,76)
.030
(0,89)
.035 DIA
(20,00) .7875
–D = (No. of Positions per Row/20)
x (20,00) .7875
–D–DP = (No. of Positions per Row/14)
x (20,00) .7875
(0,20)
.008
(0,80)
.0315
01
02
(7,11)
.280
A
(3,30)
.130
(1,57)
.062
(1,57)
.062
DIA
(0,64)
.025
–RT1 ––L
Board Mates:
QSE
Cable Mates:
EQCD, EQSD,
EQDP, EQRF
(See Application
Specifi c note)
• 14mm, 15mm, 22mm
and 30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifi cations.)
• 30µ" (0,76µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount
• 100 positions per row
• Guide Posts, Screw Down
& Friction Lock
Call Samtec.
APPLICATION
SPECIFIC OPTION
F-211
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable.
Board Spacing Standoffs.
See SO Series.
ALSO
AVAILABLE
QTE PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–020, –040, –060, –080
(40 total pins per bank = –D)
–014, –028, –042, –056
(14 pairs per bank = –D–DP)
–F
= Gold Flash
on Signal Pins and
Ground Plane,
Matte Tin on tails
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50µ" (1,27µm) min
Au over 150µ"
(3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min Au
over 50µ" (1,27µm) Ni
on Ground Plane in
contact area,
Matte Tin over 50µ"
(1,27µm) min Ni on
all solder tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
LEAD
STYLE TYPE AOTHER
OPTION
–K
= (7,00mm)
.275" DIA
Polyimide Film
Pick & Place
Pad
–TR
= Tape & Reel
Packaging
(N/A on 56 &
80 positions)
–RT1
= Retention
Option
(-01 Lead
Style only)
(N/A on 56 &
80 positions
or –L (latch)
option)
–L
= Latching
Option
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
Specify
LEAD
STYLE
from
chart
SPECIFICATIONS
XAUI
PCI Express
®
SATA
MGT (Rocket I/O)
Infiniband
Download app notes at
www.samtec.com/appnote
Contact SIG @ samtec.com
for questions on protocols
Protocols
Supported
®
HIGH SPEED GROUND PLANE HEADER
f
i
n
a
l
i
n
c
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.
c
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®
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
TM
Call Samtec for maximum cycles mated with QSE
5mm Stack Height Type Rated @ 3dB Insertion Loss
Single-Ended Signaling –D 9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps
Performance data for other stack heights and complete test data
available at www.samtec.com?QTE or contact sig@samtec.com
• E.L.P.TM plating
option (–C)
• Retention pin option
QTE
LEAD
STYLE AHEIGHT
WITH
QSE*
–01 (4,27)
.168
(5,00)
.197
–02 (7,26)
.286
(8,00)
.315
–03 (10,27)
.404
(11,00)
.433
–04 (15,25)
.600
(16,00)
.630
–05 (18,26)
.718
(19,00)
.748
–07 (24,24)
.954
(25,00)
.984
*Processing conditions
will affect mated height.
