Technical Data 10295
Effective September 2017
Supersedes August 2014
HCM1707
High current power inductors
Product features
•High current carrying capacity
•Magnetically shielded, low EMI
•Frequency range up to 1 MHz
•Inductance range from 1.5 µH to 68 µH
•Current range from 5.2 A to 40 A
•17.5 mm x17.2 mm footprint surface mount
package in a 7.0 mm height
•Iron powder core material
Applications
•Voltage Regulator Module (VRM)
•Multi-phase regulators
•Point-of-load modules
•Desktop and server VRMs and EVRDs
•Data networking and storage systems
•Base station equipment
•Battery power systems
Environmental Data
•Storage temperature range (Component):
-40 °C to +125 °C
•Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
HALOGEN
HF
FREE
Pb
2
www.eaton.com/electronics
Technical Data 10295
Effective September 2017
Product Specifications
HCM1707
High current power inductors
Dimensions - mm
Part Number6
OCL1
±20%
(µH)
FLL min.2
(µH)
Irms
3
(A)
Isat
4
(A)
DCR (mΩ)
@ +20 °C
(typical)
DCR (mΩ)
@ +20 °C
(maximum) K-factor5
HCM1707-1R5-R 1.5 0.96 40 40 1.85 2.15 124
HCM1707-2R2-R 2.2 1.41 37 34 2.15 2.50 103
HCM1707-4R7-R 4.7 3.01 27 24 4.12 4.72 76
HCM1707-6R8-R 6.8 4.35 20 22 6.55 7.55 60
HCM1707-8R2-R 8.2 5.25 16 20 8.10 8.70 55
HCM1707-100-R 10 6.40 14 18 9.30 10 47
HCM1707-150-R 15 9.60 12 13 14.5 15.5 43
HCM1707-220-R 22 14.1 9.5 11 21 23 37
HCM1707-330-R 33 21.1 9.0 10 35 37 28
HCM1707-470-R 47 30.1 6.8 7.5 41 47 25
HCM1707-680-R 68 43.5 5.2 6.5 74 85 20
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc,
+25 °C.
2. Full Load Inductance (FLL): Test parameters: 100 kHz, 0.25 Vrms, Isat, +25 °C.
3. Irms: DC current for an approximate temperature rise of 40 °C without core
loss. Derating is necessary for AC currents. PCB layout, trace thickness and
width, air-flow, and proximity of other heat generating components will affect
the temperature rise. It is recommended that the temperature of the part not
exceed +125 °C under worst case operating conditions verified in the end
application.
4.. sat: Peak current for approximately 20% rolloff at +25 °C.
5. K-factor: Used to determine B p-p for core loss (see graph). B
p-p = K * L * ∆I.
Bp-p :(Gauss), K: (K-factor from table), L: (Inductance in μH), ∆I (Peak to peak
ripple current in amps).
6. Part Number Definition: HCM1707-yyy-R
- HCM1707 = Product code and siz
yyy= Inductance value in uH, R = decimal point
if no R is present then third character = number of zeros.
- “-R” suffix = RoHS compliant
All soldering surfaces coplanar within 0.10 millimeters.
Part marking: HCM1707; XXX = initial inductance in µH, R = decimal point;
if no R is present, last digit equals number of zeros.
wwllyy = date code, R = revision level
Color: Grey.
Do not route traces or vias underneath the inductor
ab
DCR measured between point “a” and point “b”
3
Technical Data 10295
Effective September 2017
www.eaton.com/electronics
HCM1707
High current power inductors
Packaging information - mm
Supplied in tape and reel packaging, 350 parts per 13” diameter reel.
Temperature rise vs. total loss
0
10
20
30
40
50
0.0.501.0.512.0.52
Temperature Rise (˚C)
Total Loss (W)
4
www.eaton.com/electronics
Technical Data 10295
Effective September 2017
Core loss vs. Bp-p
HCM1707
High current power inductors
25K
50K
100K
200K
300K
500K
1.0
10.0
100.0
1000.0
10000.0
100 10000
Core Loss (mW)
1000
Bp-p (Gauss)
Inductance characteristics
40%
50%
60%
70%
80%
90%
100%
110%
001023004 050607
% of OCL
Idc (A)
HCM1707-1R5-R
40%
50%
60%
70%
80%
90%
100%
110%
00102300405 06 07
% of OCL
Idc (A)
HCM1707-2R2-R
Technical Data 10295
Effective September 2017
5
www.eaton.com/electronics
HCM1707
High current power inductors
Inductance characteristics
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30 35
% of OCL
Idc (A)
HCM1707-4R7-R
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30
% of OCL
Idc (A)
HCM1707-6R8-R
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30
% of OCL
Idc (A)
HCM1707-8R2-R
40%
50%
60%
70%
80%
90%
100%
110%
0510 15 20 25 30
% of OCL
Idc (A)
HCM1707-100-R
40%
50%
60%
70%
80%
90%
100%
110%
2000 80121 41618102
% of OCL
Idc (A)
HCM1707-150-R
40%
50%
60%
70%
80%
90%
100%
110%
0020 8012141 6181 02
% of OCL
Idc (A)
HCM1707-220-R
4
646
HCM1707
High current power inductors
6www.eaton.com/electronics
Technical Data 10295
Effective September 2017
Inductance characteristics
40%
50%
60%
70%
80%
90%
100%
110%
00002 10 12 14 16 18
% of OCL
Idc (A)
HCM1707-330-R
40%
50%
60%
70%
80%
90%
100%
110%
0020 8012141
% of OCL
Idc (A)
HCM1707-470-R
40%
50%
60%
70%
80%
90%
100%
110%
0002 8012141
% of OCL
Idc (A)
HCM1707-680-R
46
846
4
6
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 10295 BU-SB14600
September 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Technical Data 10295
Effective September 2017
HCM1707
High current power inductors
