Walsin Technology Corporation
Page 1 of 7 WA06X_D Version 04 Dec.-2006
WA06X
±0.5%, Convex Type
Precision chip resistors array
Size 0603x4
Customer :
Approval No :
Issue Date :
Customer Approval :
Walsin Technology Corporation
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FEATURE
1. Small size and light weight
2. Reduced size of final equipment
3. Lower surface mounted assembly costs
4. Higher component and equipment reliability
5. Lead (Pb) free terminations is available.
APPLICATION
• Consumer electrical equipment
• EDP, Computer application
• Telecom
DESCRIPTION
The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are
added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The
composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to
within tolerance by laser cutting of this resistive layer.
The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For
ease of soldering the outer layer of these end terminations is a Lead-tin or Tin (Pb free) solder alloy.
Fig 1. Consctruction of a Chip-R array WA06X, 0.5% product
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QUICK REFERENCE DATA
Item General Specification
Series No. WA06X
Size 0603x4 (1608x4)
Termination construction Convex type
Resistance Tolerance ±0.5% (E24/E96 series)
Resistance Range 10Ω ~ 1MΩ
TCR (ppm/°C) ≤ ± 100 ppm/°C
Max. dissipation at Tamb=70°C 1/10 W
Max. Operation Voltage (DC or RMS) 50V
Max. overload voltage 100V
Climatic category (IEC 60068) 55/155/56
Note :
1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication
60115-8”
2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by
ValueResistancePower RatedRCWV ×= or Max. RCWV listed above, whichever is lower.
Dimensions
WA06X
L 3.20 ± 0.10
W 1.60 ± 0.10
T 0.50 ± 0.10
P 0.80 ± 0.10
A 0.60 ± 0.10
B 0.30 ± 0.10
C 0.40 ± 0.10
G 0.30 ± 0.20
CONSTRUCTION
R1=R2=R3=R4
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Marking
3-digits marking for E24 series resistance
Each resistor is marked with a three digits code on the protective coating to designate the nominal resistance
value.
For values up to 91Ω the R is used as a decimal point. For values of 100Ω or greater the first 3 digits apply to
the resistance value and fourth indicate the number of zeros to follow.
Example
RESISTANCE 10Ω 12Ω 100Ω 6800Ω 47000Ω
3-digits marking 100 120 101 682 473
No marking for E96 series resistance
FUNCTIONAL DESCRIPTION
Product characterization
Standard values of nominal resistance are taken from the E24/E96 series for resistors with a tolerance of
±1%, The values of the E24/E96 series are in accordance with “IEC publication 60063”
Derating
The power that the resistor can dissipate depends
on the operating temperature; see Fig.2
Figure 2. Maximum dissipation in percentage of rated power
As a function of the ambient temperature
MOUNTING
Due to their rectangular shapes and small tolerances, Su rface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
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SOLDERING CONDITION
The robust construction of chip resistors
allows them to be completely immersed in a
solder bath of 260°C for one minute.
Therefore, it is possible to mount Surface
Mount Resistors on one side of a PCB and
other discrete components on the reverse
(mixed PCBs).
Surface Mount Resistors are tested for
solderability at 235°C during 2 seconds. The
test condition for no leaching is 260°C for 60
seconds. Typical examples of soldering
processes that provide reliable joints without
any damage are given in Fig 3.
Fig 3. Infrared soldering p ro file for Chip Resistors array
CATALOGUE NUMBERS
The resistors have a catalogue number starting with .
WA06 X 472_ D T _
Size code
WA06 : 0603 per
element
Type code
X : x4, convex
Resistance code
E24 : 2 significant digits followed
by no. of zeros and a blank
10Ω =100_
220Ω =221_
Jumper =000_
(“_” means a blank)
E96 : 3 significant digits followed
by no. of zeros
102Ω =1020
37.4KΩ =3742
Tolerance
D : ±0.5%
F : ±1%
J : ±5%
Packaging code
T : 7” Reel taping
B : Bulk
Termination code
_ = SnPb base (“_”
means a blank)
L = Sn base (lead
free)
1. Reeled tape packaging : 8mm width paper taping 5000pcs per reel.
2. Bulk packaging : 5000pcs per polybag
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TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST PROCEDURE REQUIREMENT
DC resistance
Clause 4.5
DC resistance values measured at the test voltages specified
below :
<10Ω@0.1V, <100Ω@0.3V, <1KΩ@1.0V,
<10KΩ@3V, <100KΩ@10V, <1MΩ@25V, <10MΩ@30V
Within the specified tolerance
Temperature
Coefficient of
Resistance(T.C.R)
Clause 4.8
Natural resistance change per change in degree centigrade.
()
6
121
12 10×
−
−
ttR RR (ppm/°C) t1 : 20°C+5°C-1°C
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Test temperature -55~+155°C
≤±100ppm/°C
Short time overload
(S.T.O.L) Clause
4.13
Permanent resistance change after a 5second application of a
voltage 2.5 times RCWV or the maximum overload voltage
specified in the above list, whichever is less.
∆R/R max. ±(1%+0.05Ω)
Resistance to
soldering heat(R.S.H)
Clause 4.18
Un-mounted chips completely immersed for 10±1second in a
solder bath at 270℃±5ºC no visible damage
∆ R/R max. ±(0.5%+0.05Ω)
Solderability Clause
4.17 Un-mounted chips completely immersed for 2±0.5second in a
solder bath at 235℃±5℃ good tinning (>95% covered)
no visible damage
Leach Test Clause
4.18 Un-mounted chips completely immersed for 60±1second in a
solder bath at 260℃±5℃ Ditto
Temperature cycling
Clause 4.19
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30
minutes at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5
continuous cycles
no visible damage
∆R/R max. ±(0.5%+0.05Ω)
Load life (endurance)
Clause 4.25 70±2ºC, 1000 hours, loaded with RCWV or Vmax,1.5
hours on and 0.5 hours off ∆R/R max. ±(1%+0.05Ω)
Load life in Humidity
Clause 4.24 1000 hours, at rated continuous working voltage in
humidity chamber controller at 40°C±2°C and 90~95%
relative humidity, 1.5hours on and 0.5 hours off
∆R/R max. ±(1%+0.05Ω)
Adhesion Clause
4.32 Pressurizing force: 5N, Test time: 10±1sec. No remarkable damage or
removal of the terminations
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PACKAGING
Paper Tape specifications (unit :mm)
Symbol A B W F E
Dimension 3.60±0.20 2.00±0.20 8.00±0.30 3.50±0.20 1.75±0.10
Symbol P1 P0 ΦD T
Dimension 4.00±0.10 4.00±0.10 1.0 0.0
50.1 +
−
Φ Max. 1.0
Reel dimensions
Symbol A B C D
(unit : mm) Φ178.0±2.0 Φ60.0±1.0 13.0±0.2 9.0±0.5
