FSUSB30UMX - Fairchild - Datasheet.Directory

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.7

February 2012

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in Simplified Chinese!

FSUSB30

Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps)

Switch

Features

?Low On Capacitance: 3.7pF (Typical)

?Low On Resistance: 6.5 (Typical)

?Low Power Consumption: 1µA (Maximum)

– 10µA Maximum ICCT over an Expanded Control

Voltage Range (VIN = 2.6V, VCC = 4.3V)

?Wide -3dB Bandwidth, >720MHz

?8KV ESD Protection

?Power-Of f Pr otect ion whe n V CC = 0V ; D+/D- Pins can

Tolerate up to 5.5V

?Packaged in:

– 10-lead MicroPak™ (1.6 x 2.1mm)

– 14-lead DQFN

– 10-lead MSOP

– 10-lead UMLP (1.4 x 1.8mm)

Applications

?Cell phone, PDA, Digital Camera, and Notebook LCD

Monitor, TV, and Set-top Box

Related Application Notes

?AN-6022 Using the FSUSB30 / FSUSB31 to Comply

with USB 2.0 Fault Condition Requirements

Description

The FSUSB30 is a low-power, two-port, high-speed USB

2.0 switch. Configured as a double-pole double-throw

(DPDT) switch, it is optimized for switching between two

high-speed (480Mbps) sources or a Hi-Speed and Full-

Speed (12Mbps) source. The FSUSB30 is compatible

with the requirements of USB2.0 and features an

extremely low on capacitance (CON) of 3.7pF. The wide

bandwidth of this device (720MHz), exceeds the band-

width needed to pass the third harmonic, resulting in sig-

nals with minimum edge and phase distortion. Superior

channel-to-channel crosstalk minimizes interference.

The FSUSB30 contains special circuitry on the D+/D-

pins which allows the device to withstand an overvoltage

condition when powered off. This device is also designed

to minimize current consumption even when the control

voltage applied to the S pin, is lower than the supply volt-

age (VCC). This feature is especially valuable to ultra-

portable applications such as cell phones, allowing for

direct interface with the general purpose I/Os of the

baseband processor. Other applications include switch-

ing and connector sharing in portable cell phones, PDAs,

digital cameras, printers, and notebook computers.

Ordering Information

Figure 1. Typical Application

MicroPak is a trademark of Fairchild Semiconductor Corporation.

Order

Number Package

Number Product Code

Top Mark Package Description

FSUSB30L10X MAC010A FJ 10-Lead MicroPak, 1.6 x 2.1mm

FSUSB30BQX MLP014A USB30 14-Terminal Depopulated Quad Very-Thin Flat Pack

No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm

FSUSB30MUX MUA10A FSUSB30 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-

187, 3.0mm Wide

FSUSB30UMX MLP010A GJ 10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm

USB2.0

Controller

Set Top Box

(STB) CPU

or

DSP

Processor DVR or

Mass Storage

Controller

1D+ VCC

1D–

2D+

2D–

USB

Connector

FSUSB30

D+

D–

SOE

Control

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 2

Connection Diagrams Analog Symbol

Pin Descriptions

Truth Table

Pin Name Description

OE Bus Switch Enable

S Select Input

D+, D, HSDn+, HSDnDat a Po rts

NC No Connect

SOE Function

X HIGH Disconnect

LOW LOW D+, D = HSD1n

HIGH LOW D+, D = HSD2n

HSD1+

HSD2+

D+

S

OE Control

HSD1–

HSD2–

D–

9

Pad Assignments for MicroPak

(Top View)

Pad Assignments for DQFN

(Top Through View)

Pin Assignment for MSOP

(Top Through View)

876

510

2

14

VCC

13 OE

134

1

87

NC

NCGND

GND

12 HSD1–

11 NC

10 HSD2–

9

2

3

4

5

6D–

S

HSD1+

NC

HSD2+

D+

S

HSD1+

HSD2+

D+

S

HSD1+

GND

HSD2+

D+

OE

HSD1–

HSD2–

D–

Pad Assignments for µMLP

OE

HSD1–

HSD2–

D–

10

9

8

7

6

1

2

3

4

5

VCC

Sel 12

76

3

4

5

10

9

8

GND

HSD1+

HSD2+

D+

HSD1–

HSD2–

OE D–

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 3

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-

ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-

tion, extended exposure to stresse s ab ove the recommended operating conditions may affect device reliability. The

absolute maximum ratings are stress ratings only.

Note:

1. The input and output negative voltage ratings may be exceeded if the inp ut and outpu t diode current ratings are

observed.

Recommended Operating Conditions

The Recommended Operating Conditio ns table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to absolute maximum ratings.(2)

Note:

2. Control input must be held HIGH or LOW and it must not float.

Symbol Parameter Minimum Maximum Unit

VCC Supply Voltage -0.5 +5.5 V

VCNTRL DC Input Voltage(1) -0.5 VCC V

VSW DC Switch Voltage(1) HSDnX 0.5 VCC V

D+,D- when VCC > 0 0.5 VCC V

D+,D- when VCC = 0 -0.50 VCC V

IIK DC Input Diode Current -50 mA

IOUT DC Output Current 50 mA

TSTG Storage Temperature -65 +150 °C

ESD Human Body Model All Pins 8 kV

I/O to GND 8 kV

Symbol Parameter Minimum Maximum Unit

VCC Supply Voltage 3.0 4.3 V

VIN Control Input Voltage 0 VCC V

VSW Switch Input Voltage 0 VCC V

TAOperating Temperature -40 +85 °C

JAThermal Resistance, 10 MicroPak 250 °C/W

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 4

DC Electrical Characteristics

All typical values are at 25°C unless otherwise specified.

Notes:

3. Measured by the voltage drop between Dn, HSD1n, HSD2n pins at the indicated current throug h the switch.

On resistance is determined by the lower of the voltage on the two ports.

4.Guaranteed by characterization.

AC Electrical Characteristics

All typical values are for VCC = 3.3V at 25°C unless otherwise specified.

Symbol Parameter Conditions VCC (V) TA = 40°C to +85°C Unit

Min. Typ. Max.

VIK Clamp Diode Voltage IIN = -18mA 3.0 -1.2 V

VIH Input Voltage HIGH 3.0 to 3.6 1.3 V

4.3 1.7 V

VIL Input Voltage LOW 3.0 to 3.6 0.5 V

4.3 0.7 V

IIN Control Input Leakage VSW = 0.0V to VCC 4.3 -1.0 1.0 µA

IOZ OFF State Leakage 0  Dn, HSD1n, HSD2n  VCC 4.3 -2.0 2.0 µA

IOFF Power OFF Leakage

Current (D+, D–) VSW = 0V to 4.3V, VCC = 0V 0 -2.0 2.0 µA

RON Switch On Resistance(3) VSW = 0.4V, ION = -8mA 3.0 6.5 10.0 

VSW = 0V, IO = 30mA at 25°C 3.6 7.0 

RON Delta RON(4) VSW = 0.4V, ION = -8mA 3.0 0.35 

RON Flatness RON Flatness(3) VSW = 0.0V - 1.0V,

ION = -8mA 3.0 2.0 

ICC Quiescent Supply Current VCNTRL = 0.0V or VCC,

IOUT = 0 4.3 1.0 µA

ICCT Increase in ICC Current

per Control Voltage VCNTRL (control input) = 2.6V 4.3 10.0 µA

Symbol Parameter Conditions VCC (V) TA = 40°C to +85°C Unit Figure

Number

Min. Typ. Max.

tON Turn-On Ti me S,

OE to Output HD1n, HD2n = 0.8V,

RL = 50, CL = 5pF 3.0 to 3.6 13 30 ns Figure 9

tOFF Turn-Off Time S,

OE to Output HD1n, HD2n = 0.8V,

RL = 50, CL = 5pF 3.0 to 3.6 12 25 ns Figure 9

tPD Propagation Delay(4) RL = 50, CL = 5pF 3.3 0.25 ns Figure 7

Figure 8

tBBM Break-Before-Make RL = 50, CL = 5pF,

VIN = 0.8V 3.0 to 3.6 2.0 6.5 ns Figure 10

OIRR Off Isolation

(Non-Adjacent) f = 240MHz, RT = 503.0 to 3.6 -30 dB Figure 13

Xtalk Non-Adjacent Channel

Crosstalk RT = 50, f = 240MHz 3.0 to 3.6 -45 dB Figure 14

BW 3dB Bandwidth RT = 50, CL = 0pF 3.0 to 3.6 720 MH z Figure 12

RT = 50, CL = 5pF 550

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 5

USB Hi-Speed Related AC Electrical Characteristics

Note:

5. Guaranteed by characterization.

Capacitance

Symbol Parameter Conditions VCC (V) TA = 40°C to +85°C Units Figure

Number

Min. Typ. Max.

tSK(O) Channel-to-Channel

Skew(5) RL = 50, CL = 5pF 3.0 to 3.6 50 ps Figure 7

Figure 11

tSK(P)

Skew of Opposite

Transitions of the

Same Output(5) RL = 50, CL = 5pF 3 .0 to 3.6 20 ps Figure 7

Figure 11

tJTotal Jitter(5) RL = 50, CL = 5pF,

tR = tF = 500ps at 480 Mbps

(PRBS = 215  1) 3.0 to 3.6 200 ps

Symbol Parameter Conditions TA = 40°C to +85°C Units Figure

Number

Min. Typ. Max.

CIN Control Pin Input Capacita nce VCC = 0V 1.5 pF Figure 16

CON D1n, D2n, Dn On Capacitance VCC = 3.3, OE = 0V 3.7 pF Figure 15

COFF D1n, D2n Off Capacitance VCC and OE = 3.3 2.5 pF Figure 16

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 6

Typical Characteristics

Figure 2. Gain vs. Frequenc y

Figure 3. Off Isolation

Figure 4. Crosstalk

Frequency Response

-8

-7

-6

-5

-4

-3

-2

-1

0

1 10 100 1000 10000

Frequency (MHz)

Gain (dB)

C

L = 0pF, VCC = 3.3V

Frequency (MHz)

Frequency Response

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

1 10 100 1000

Off Isolation (dB)

Frequency (MHz)

Frequency Response

1 10 100 1000

V

CC

= 3.3V

-120

-110

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

Crosstalk (dB)

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 7

Test Diagrams

Figure 5. On Resistance Figure 6. Off Leakage

Figure 7. AC Test Circuit Load Figure 8. Switch Propagation Delay Waveforms

Figure 9. Turn-On / Turn-Off Waveform

HSDn

I

ON

V

ON

GND

V

IN

Dn

Select

V

S

= 0 to V

CC

R

ON

= V

ON

/ I

ON

GND

V

IN

Select

ID

n(OFF)

V

S

= 0 or V

CC

NC

A

Each switch port is tested separately.

RL

RS

CL

HSDn

VIN

VSel

D+, D–

GND

VOUT

RL, RS, and CL are functions of the application environment

(see AC Electrical tables for specific values).

CL includes test fixture and stray capacitance.

t

RISE

= 500ps

t

PLH

HSDn+,

HSDn–

Input:

Output: D+, D–

t

FALL

= 500ps

V

OH

90%

50% 50%

90%

10% 10%

50%

t

PHL

50%

V

OL

800mV

400mV

tRISE = 2.5ns

tON tOFF

Input – S, OE

Output – VOUT

tFALL = 2.5ns

VOH

90%

VCC/2 VCC/2

90%

10% 10%

90%90%

VOL

VCC

GND

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 8

Figure 10. Break-Before -Make (tBBM)

Figure 11. Switch Skew Tests

Figure 12. Bandwidth

t

D

t

R

= t

F

= 2.5ns (10–90%)

R

L

S

C

L

*

HSDn

V

O

Control

Input

D+, D–

GND

Control

Input

50%

V

CC

0V

V

OUT

V

OUT

V

CC

V

CC

0.9 x V

OUT

*C

L

includes test fixture and stray capacitance.

t

RISE

= 500ps

t

PLH

t

PHL

Input:

Output: D+, D–

HSDn+

HSDn–

t

FALL

= 500ps

V

OH

90% 90%

50% 50%

10% 10%

50%

V

OL

800mV

T

SK(P)

= |

t

PHL

–

t

PLH

|

Pulse Skew, T

SK(P)

400mV

t

RISE

= 500ps

t

PLH1

t

PHL1

Output1:

Input: D+, D–

Output1: D2+, D2–

HSD1+

HSD1–

t

FALL

= 500ps

V

OH

90% 90%

50% 50%

10% 10%

50%

V

OL

800mV

T

SK(O)

= |

t

PLH1

–

t

PLH2

| or |

t

PHL1

–

t

PHL2

|

Output Skew, T

SK(OUT)

400mV

t

PLH2

t

PHL2

V

OH

50%

V

OL

R

S

V

IN

FSUSB30

GND

VSel

Network Analyzer

V

OUT

GND V

S

GND R

T

GND

R

S

and R

T

are functions of the application environment

(See AC Electrical Tables for specific values).

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 9

Figure 13. Channel Off Isolation

Figure 14. Non-Adjacent Channel-to-Channel Crosstalk

Figure 15. Channel On Capacitance Figure 16. Channel Off Capacitance

R

T

R

S

V

IN

FSUSB30

GND

VSel

Network Analyzer

V

OUT

GND V

S

GND

OFF-Isolation = 20 Log (V

OUT

/

V

IN

)

R

T

GND

RT

RS

VIN

FSUSB30

GND

VSel

Network Analyzer

VOUT

GND

NC

VS

GND

RS and RT are functions of the application environment

(50, 75 or 100Ω)

Crosstalk = 20 Log (VOUT / VIN)

RT

GND

FSUSB30

S

Dn

Capacitance

Meter

f = 240MHz

VSel = 0 or VCC

D1n, D2n

FSUSB30

S

Dn

Capacitance

Meter

f = 240MHz VSel = 0 or VCC

D1n, D2n

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 10

Application Guidance: Meeting USB 2.0 Vbus Short Requirements

In section 7. 1.1 of the USB 2.0 specification, it notes th at

USB devices must be able to withstand a Vbus short to

D+ or D- when the USB devices is either powered off or

powered on. The FSUSB3 0 can be successfully config-

ured to meet both these requirements.

Power-Off Protection

For a Vbus short circuit, the switch is expected to with-

stand such a condition for at least 24 hours. The

FSUSB30 has specially designed circuitry which pre-

vents unintended signal bleed through as well as guar-

anteed system reliability during a power-down, over-

voltage condition. The protection has been added to the

common pins (D+, D-).

Power-On Protection

The USB 2.0 specification also notes that the USB

device should be capable of withstanding a Vbus short

during transmission of data. Fairchi ld recomme nds add-

ing a 100 series resister between the switch VCC pin

and supply rail to protect against this case. This modifi-

cation works by limiting current flow back into the VCC

rail during the over-voltage event so current remains

within the safe operating range. In this application, the

switch passes the full 5.25V input signal through to the

selected output, while maintaining specified off isolation

on the un-sel e cted pins.

D+ = 5.25V

VC C = 3.6 V

100 Oh ms

FSUSB30

D- = 5.25V

HSD+

HSD-

Figure 17. Adding 100 resistor in series with the VCC supply allows the FSUSB30 to withstand a

Vbus short when powered up

For more information, see Applications Note AN-6022 Using the FSUSB30 to Comply with USB 2.0 Fault

Condition Requirements at www.fairchildsemi.com

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 11

Tape and Reel Specifications

Ta pe Fo rma t fo r DQ FN

Tape Dimensions

Dimenions are in millimeters unless otherwise specified.

Package

Designator Tape

Section Number

Cavities Cavity

Status Cover Tape

Status

BQX Leader (Start End) 125 (typ) Empty Sealed

Carrier 2500/3000 Filled Sealed

Tr ailer (Hub End) 75 (typ) Empty Sealed

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 12

Reel Dimensions for DQFN

Dimensions are in inches (millimeters) unless otherwise specified.

Tape SizeABCDNW1W2

(12mm) 13.0

(330) 0.059

(1.50) 0.512

(13.00) 0.795

(20.20) 7.008

(178) 0.488

(12.4) 0.724

(18.4)

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.7 13

Tape Dimensions for MSOP

Dimensions are in inches (millimeters) unless otherwise specified.

Reel Dimensions for MSOP

Dimensions are in inches (millimeters) unle ss otherwise specified

Tape SizeABCDNW1W2W3

(12mm) 13

(330) 0.059

(1.5) 0.512

(13) 0.795

(20.2) 7.008

(178) 0.448

(12.4) 0.724

(18.4) 0.468-0.606

(11.9 -15.4)

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.7 14

Physical Dimensions

Figure 17. 10-Lead MicroPak, 1.6 x 2.1mm

For tape and reel specifications, visit Fairchild’s website: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.

Package drawings are provided as a service to customers consider ing Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the draw ing and contact a Fairchild Semicond uctor r epresentative to ver ify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-

ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

BOTTOM VIEW

TOP VIEW

RECOMMENDED LAND PATTERN

SIDE VIEW

2X

NOTES:

A. PACKAGE CONFORMS TO JEDEC

REGISTRATION MO-255, VARIATION UABD .

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. PRESENCE OF CENTER PAD IS PACKAGE

SUPPLIER DEPENDENT. IF PRESENT IT

IS NOT INTENDED TO BE SOLDERED AND

HAS A BLACK OXIDE FINISH.

E. DRAWING FILENAME: MKT-MAC10Arev5.

0.10 C

0.10 CAB

0.05 C

PIN1 IDENT IS

2X LONGER THAN

OTHER LINES

A

B

C

0.35

0.25

9X

14

96

0.25

0.15

10 5

0.50

0.56

1.62

0.05

0.00

0.05 C

0.55 MAX

0.05 C

1.60

2.10

(0.35)

(0.25)

0.50 10X

10X

(0.11)

1.12

1.62 KEEPOUT ZONE, NO TRACES

OR VIAS ALLO WED

(0.20)

(0.15) 0.35

0.25

0.35

0.25

DETAIL A

DETAIL A 2X SCALE

0.35

0.25

0.65

0.55

D

ALL FEATURES

(0.36)

(0.29)

0.56

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 15

Physical Dimensions

Figure 18. 14-Terminal De-populated Qu ad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner with-

out notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor rep resentative to verify or obtain

the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the

warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.6 16

Physical Dimensions

Figure 19. 10 -Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide

Package drawings are provided as a service to customers consider ing Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the draw ing and contact a Fairchild Semicond uctor r epresentative to ver ify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-

ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.7 17

Physical Dimensions

Figure 20. 10-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm

Package drawings are provided as a service to customers consider ing Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the draw ing and contact a Fairchild Semicond uctor r epresentative to ver ify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-

ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

AB

C

SEATING

PLANE

DETAIL A

PIN#1 IDENT

RECOMMENDED

LAND PATTERN

NOTES:

A. PACKAGE DOES NOT FULLY CONFORM TO

JEDEC STANDARD.

B. DIMENSIONS ARE IN MILLIMETERS.

C. DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

D. LAND PATTERN RECOMMENDATION IS

BASED ON FSC DESIGN ONLY.

E. DRAWING FILENAME: MKT-UMLP10Arev3.

TOP VIEW

BOTTOM VIEW

0.15 C

0.08 C

0.15 C

2X

SIDE VIEW

0.10 C

0.05

3

6

1

0.10 C A B

0.05 C

0.55 MAX.

10

1.40

1.80

0.40

0.15

0.25(10X)

0.35

0.45(9X)

1.70

2.10

0.40

0.663 0.563

(9X)

0.225

(10X)

1

0.152

0.10

0.55

0.45

0.10

DETAIL A

SCALE : 2X

1.85

1.45

0.55

0.40

0.225

(10X)

9X

0.45

PIN#1 IDENT

OPTIONAL MINIMIAL

TOE LAND PATTERN

SCALE : 2X

LEAD

OPTION 1 SCALE : 2X

LEAD

OPTION 2

PACKAGE

EDGE

FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch

FSUSB30 Rev. 1.1.7 18