PACKAGE OUTLINES Package SOT23 SOT54 SOT89 SOT96-1 SOT122A SOT122D SOT122E SOT143B SOT143R SOT172A1 SOT172A2 SOT223 SOT323 SOT343N SOT343R SOT353 SOT363 SOT551A Surface-mount yes no yes yes no no no yes yes no no yes yes yes yes yes yes yes Page .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 3 leads SOT23 D E B A X HE v M A 3 Q A A1 1 2 e1 bp c w M B Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max. bp c D E e e1 HE Lp Q v w mm 1.1 0.9 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 1.9 0.95 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-02-28 SOT23 1999 Jul 19 EUROPEAN PROJECTION 2 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 e1 2 D e 3 b1 L1 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 c D d E e e1 L L1(1) mm 5.2 5.0 0.48 0.40 0.66 0.56 0.45 0.40 4.8 4.4 1.7 1.4 4.2 3.6 2.54 1.27 14.5 12.7 2.5 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 1999 Jul 19 REFERENCES IEC JEDEC EIAJ TO-92 SC-43 3 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; collector pad for good heat transfer; 3 leads SOT89 B D A b3 E HE L 1 2 3 c b2 w M b1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b1 b2 b3 c D E e e1 HE L min. w mm 1.6 1.4 0.48 0.35 0.53 0.40 1.8 1.4 0.44 0.37 4.6 4.4 2.6 2.4 3.0 1.5 4.25 3.75 0.8 0.13 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT89 1999 Jul 19 EUROPEAN PROJECTION ISSUE DATE 97-02-28 4 Philips Semiconductors Product specification RF Wideband Transistors Package outlines SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp L 4 1 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 0.16 0.15 0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024 inches 0.010 0.057 0.069 0.004 0.049 0.01 0.01 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1999 Jul 19 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 5 o 8 0o Philips Semiconductors Product specification RF Wideband Transistors Package outlines Studded ceramic package; 4 leads SOT122A D A Q c w1 M A M D1 D2 N A M X M1 W N3 H detail X b 4 3 H 1 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 D2 H M M1 N N3 Q mm 5.92 4.80 5.85 5.58 0.15 0.10 7.50 7.23 6.48 6.22 7.24 6.93 27.43 25.78 3.18 2.67 1.66 1.39 12.95 12.70 3.68 2.92 3.35 2.79 0.233 0.189 0.230 0.220 0.006 0.004 0.295 0.285 0.255 0.245 0.285 0.273 1.080 1.015 0.125 0.105 0.065 0.055 0.510 0.500 0.145 0.115 0.132 0.110 inches OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT122A 1999 Jul 19 W 8-32 UNC w1 0.38 0.015 EUROPEAN PROJECTION ISSUE DATE 99-03-29 6 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Studless ceramic package; 4 leads SOT122D D A Q c D1 H b 4 3 H 1 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 H Q mm 4.14 3.27 5.85 5.58 0.15 0.10 7.50 7.23 7.24 6.99 27.43 25.78 1.57 1.32 inches 0.163 0.129 0.230 0.220 0.006 0.004 0.295 0.285 0.285 0.275 1.080 1.015 0.062 0.052 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 99-03-29 SOT122D 1999 Jul 19 EUROPEAN PROJECTION 7 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Studded ceramic package; 4 leads SOT122E D A Q c w1 M A M D1 N2 D2 A M N W N3 M1 X H detail X b2 b 4 C 3 H 1 b1 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 b2 c D D1 D2 H M M1 N N2 N3 Q mm 5.97 4.80 1.05 0.73 10.75 10.43 14.25 13.94 0.18 0.14 7.50 7.23 6.48 6.22 7.16 6.99 27.56 26.29 3.18 2.92 1.63 1.42 11.82 11.04 8.89 7.36 3.68 2.92 3.38 2.79 0.235 0.189 0.041 0.029 0.423 0.411 0.561 0.549 0.007 0.004 0.295 0.285 0.255 0.245 0.282 0.275 1.085 1.035 0.125 0.115 0.064 0.056 0.465 0.435 0.350 0.290 0.145 0.115 0.133 0.110 inches OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT122E 1999 Jul 19 EUROPEAN PROJECTION W w1 0.38 8-32 UNC 0.015 ISSUE DATE 99-03-29 8 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 4 leads SOT143B D B E A X y HE v M A e bp w M B 4 3 Q A A1 c 1 2 Lp b1 e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.9 0.1 0.48 0.38 0.88 0.78 0.15 0.09 3.0 2.8 1.4 1.2 1.9 1.7 2.5 2.1 0.45 0.15 0.55 0.45 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-02-28 SOT143B 1999 Jul 19 EUROPEAN PROJECTION 9 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; reverse pinning; 4 leads D SOT143R B E A X y HE v M A e bp w M B 3 4 Q A A1 c 2 1 Lp b1 e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.9 0.1 0.48 0.38 0.88 0.78 0.15 0.09 3.0 2.8 1.4 1.2 1.9 1.7 2.5 2.1 0.55 0.25 0.45 0.25 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-03-10 SOT143R 1999 Jul 19 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Studded ceramic package; 4 leads SOT172A1 D A Q A D1 c M N W w1 M A M D2 N3 M1 X detail X H b 4 b1 H 1 3 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 c D D1 D2 H M M1 N N3 Q mm 5.31 4.34 3.31 3.04 0.89 0.63 0.16 0.10 5.20 4.95 5.33 5.08 5.33 5.08 26.17 24.63 3.05 2.79 1.66 1.39 11.82 10.89 3.69 2.92 2.74 2.34 0.209 0.171 0.130 0.120 0.035 0.006 0.025 0.004 0.065 0.465 0.145 0.055 0.429 0.115 0.108 0.092 inches OUTLINE VERSION 0.205 0.210 0.210 0.195 0.200 0.200 1.030 0.120 0.970 0.110 REFERENCES IEC JEDEC EIAJ w1 0.38 8-32 UNC 0.015 EUROPEAN PROJECTION ISSUE DATE 99-03-29 SOT172A1 1999 Jul 19 W 11 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Studded ceramic package; 4 leads SOT172A2 D A Q A D1 c M N W w1 M A M D2 N3 M1 X H detail X b 4 b1 H 1 3 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 c D D1 D2 H M M1 N N3 Q mm 5.51 4.45 1.66 1.39 0.89 0.63 0.16 0.10 5.20 4.95 5.31 5.05 5.33 5.08 23.37 22.35 3.05 2.79 1.66 1.39 11.56 11.05 3.43 3.18 2.95 2.43 0.217 0.175 0.065 0.055 0.035 0.025 0.006 0.004 0.205 0.209 0.210 0.920 0.120 0.195 0.199 0.200 0.880 0.110 0.065 0.455 0.055 0.435 0.135 0.125 0.116 0.096 inches OUTLINE VERSION REFERENCES IEC JEDEC EIAJ w1 0.38 8-32 UNC 0.015 EUROPEAN PROJECTION ISSUE DATE 99-03-29 SOT172A2 1999 Jul 19 W 12 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-11-11 97-02-28 SOT223 1999 Jul 19 EUROPEAN PROJECTION 13 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 3 leads SOT323 D E B A X HE y v M A 3 Q A A1 c 1 2 e1 bp Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w mm 1.1 0.8 0.1 0.4 0.3 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 OUTLINE VERSION SOT323 1999 Jul 19 REFERENCES IEC JEDEC EIAJ SC-70 14 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 4 leads SOT343N D E B A X HE y v M A e 4 3 Q A A1 c 1 2 b1 bp w M B Lp e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.4 0.3 0.7 0.5 0.25 0.10 2.2 1.8 1.35 1.15 1.3 1.15 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-05-21 SOT343N 1999 Jul 19 EUROPEAN PROJECTION 15 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; reverse pinning; 4 leads D SOT343R E B A X HE y v M A e 3 4 Q A A1 c 2 w M B 1 bp Lp b1 e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.4 0.3 0.7 0.5 0.25 0.10 2.2 1.8 1.35 1.15 1.3 1.15 2.2 2.0 0.45 0.15 0.23 0.13 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-05-21 SOT343R 1999 Jul 19 EUROPEAN PROJECTION 16 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 5 leads SOT353 D E B y X A HE 5 v M A 4 Q A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E (2) e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT353 1999 Jul 19 REFERENCES IEC JEDEC EIAJ SC-88A 17 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 6 leads SOT363 D E B y X A HE 6 v M A 4 5 Q pin 1 index A A1 1 2 e1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION SOT363 1999 Jul 19 REFERENCES IEC JEDEC EIAJ SC-88 18 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Philips Semiconductors Product specification RF Wideband Transistors Package outlines Plastic surface mounted package; 5 leads SOT551A Package under development Philips Semiconductors reserves the right to make changes without notice. D E B X A y HE v M A e2 b1 5 4 Q pin 1 index A A1 1 2 3 bp e c Lp w M B e1 detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp b1 c D E e e1 e2 HE Lp Q v w y mm 1.1 0.9 0.1 0.3 0.2 0.8 1.0 0.25 0.10 2.2 1.8 1.35 1.15 0.65 1.3 0.975 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 1999-05-07 SOT551A 1999 Jul 19 EUROPEAN PROJECTION 19