PACKAGE OUTLINES
Package Surface-mount Page
SOT23 yes ....
SOT54 no ....
SOT89 yes ....
SOT96-1 yes ....
SOT122A no ....
SOT122D no ....
SOT122E no ....
SOT143B yes ....
SOT143R yes ....
SOT172A1 no ....
SOT172A2 no ....
SOT223 yes ....
SOT323 yes ....
SOT343N yes ....
SOT343R yes ....
SOT353 yes ....
SOT363 yes ....
SOT551A yes ....
1999 Jul 19 2
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A1
max. bpcDE e1HELpQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
97-02-28
IEC JEDEC EIAJ
mm 0.1 0.48
0.38 0.15
0.09 3.0
2.8 1.4
1.2 0.95
e
1.9 2.5
2.1 0.55
0.45 0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
E
wM
vMA
B
AB
0 1 2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface mounted package; 3 leads SOT23
1999 Jul 19 3
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 5.2
5.0
b
0.48
0.40
c
0.45
0.40
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
e
2.54
e1
1.27
L1(1)
2.5
b1
0.66
0.56
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOT54 TO-92 SC-43 97-02-28
A L
0 2.5 5 mm
scale
b
c
D
b1L1
d
E
Plastic single-ended leaded (through hole) package; 3 leads SOT54
e1e
1
2
3
1999 Jul 19 4
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
DIMENSIONS (mm are the original dimensions)
SOT89 97-02-28
wM
e1
e
EHE
B
0 2 4 mm
scale
b3
b2
b1
c
D
L
A
Plastic surface mounted package; collector pad for good heat transfer; 3 leads SOT89
123
UNIT A
mm 1.6
1.4 0.48
0.35
c
0.44
0.37
D
4.6
4.4
E
2.6
2.4
HE
4.25
3.75
e
3.0
w
0.13
e1
1.5
L
min.
0.8
b2
b1
0.53
0.40
b3
1.8
1.4
1999 Jul 19 5
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A
max. A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv Īø
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 5.0
4.8 4.0
3.8 1.27 6.2
5.8 1.05 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.10.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
wM
Īø
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
4
5
pin 1 index
1
8
y
076E03S MS-012AA
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.20
0.19 0.16
0.15 0.050 0.244
0.228 0.028
0.024 0.028
0.012
0.010.010.041 0.004
0.039
0.016
0 2.5 5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
95-02-04
97-05-22
1999 Jul 19 6
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT AD1W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
SOT122A 99-03-29
H
b
H
detail X
D
b
5.85
5.58 0.15
0.10
5.92
4.80
cM
1
MNN
3
12.95
12.70
w1
0.38
Q
3.35
2.79
3.68
2.92
H
27.43
25.78 3.18
2.67 1.66
1.39
7.50
7.23 7.24
6.93
6.48
6.22
inches
8-32
UNC
0.230
0.220 0.006
0.004
0.233
0.189 0.510
0.500 0.015
0.132
0.110
0.145
0.115
1.080
1.015 0.125
0.105 0.065
0.055
0.295
0.285 0.285
0.273
0.255
0.245
0 5 10 mm
scale
D2
MW
Q
A
N
N3
M1
D
c
X
1
4
3
2
Studded ceramic package; 4 leads SOT122A
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
A
D1
D2
w1A
M M
1999 Jul 19 7
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT AD1
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
SOT122D 99-03-29
H
b
H
D
b
5.85
5.58
4.14
3.27 0.15
0.10 7.50
7.23 7.24
6.99
cQ
1.57
1.32
H
27.43
25.78
inches 0.230
0.220
0.163
0.129 0.006
0.004 0.295
0.285 0.285
0.275 0.062
0.052
1.080
1.015
0 5 10 mm
scale
Q
A
D1
D
c
1
4
3
2
Studless ceramic package; 4 leads SOT122D
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1999 Jul 19 8
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A D2M1
D1W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
8-32
UNC
SOT122E 99-03-29
H
b
H
detail X
Db
1.05
0.73
5.97
4.80 10.75
10.43 14.25
13.94 0.18
0.14 7.16
6.99
7.50
7.23 6.48
6.22
b1b2cM
0.38
0.015
N2w1
N3Q
3.38
2.79
0.133
0.110
0.350
0.290
0.465
0.435
0.064
0.056
0.125
0.115
1.085
1.035
0.255
0.245 0.282
0.275
0.295
0.285
0.007
0.004
0.561
0.549
0.423
0.411
0.041
0.029
0.235
0.189
8.89
7.36 3.68
2.92
0.145
0.115
H
27.56
26.29 11.82
11.04
3.18
2.92
N
1.63
1.42
0 5 10 mm
scale
MW
Q
A
N2
N
N3
M1
D
c
X
1
4
3
2
Studded ceramic package; 4 leads SOT122E
b2
b1
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
C
A
D2
D1w1A
M M
1999 Jul 19 9
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.1
0.9
A1
max
0.1
b1
0.88
0.78
c
0.15
0.09
D
3.0
2.8
E
1.4
1.2
HEywvQ
2.5
2.1 0.45
0.15 0.55
0.45
e
1.9
e1
1.7
Lp
0.1 0.10.2
bp
0.48
0.38
DIMENSIONS (mm are the original dimensions)
SOT143B 97-02-28
0 1 2 mm
scale
Plastic surface mounted package; 4 leads SOT143B
D
HE
EA
B
vMA
X
A
A1
Lp
Q
detail X
c
y
wM
e1
e
B
21
34
b1
bp
1999 Jul 19 10
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 1.1
0.9
A1
max
0.1
b1
0.88
0.78
c
0.15
0.09
D
3.0
2.8
E
1.4
1.2
HEywvQ
2.5
2.1 0.55
0.25 0.45
0.25
e
1.9
e1
1.7
Lp
0.1 0.10.2
bp
0.48
0.38
DIMENSIONS (mm are the original dimensions)
SOT143R 97-03-10
0 1 2 mm
scale
Plastic surface mounted package; reverse pinning; 4 leads SOT143R
D
HE
EA
B
vMA
X
A
A1
Lp
Q
detail X
c
y
wM
e1
e
B
12
43
b1
bp
1999 Jul 19 11
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT172A1 99-03-29
H
b
b1
H
detail X
0 5 10 mm
scale
MW
Q
A
N
N3M1
D
c
X
Studded ceramic package; 4 leads SOT172A1
1
2
3
4
A
w1A
M M
D1
D2
8-32
UNC
UNIT A W
mm
Db
3.31
3.04
b1
0.89
0.63 0.16
0.10 5.20
4.95 5.33
5.08 26.17
24.63 3.05
2.79 3.69
2.92
5.31
4.34
cD1N3
2.74
2.34
Q
0.38
w1
M1
1.66
1.39
N
11.82
10.89
D2
5.33
5.08
inches 0.130
0.120 0.035
0.025 0.006
0.004 0.205
0.195 0.210
0.200 1.030
0.970 0.120
0.110 0.145
0.115
0.209
0.171 0.108
0.092 0.015
0.065
0.055 0.465
0.429
0.210
0.200
MH
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1999 Jul 19 12
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT172A2 99-03-29
H
b
b1
H
detail X
0 5 10 mm
scale
MW
Q
A
N
N3M1
D
c
X
Studded ceramic package; 4 leads SOT172A2
1
2
3
4
A
w1A
M M
D1
D2
8-32
UNC
UNIT A W
mm
Db
1.66
1.39
b1
0.89
0.63 0.16
0.10 5.20
4.95 5.31
5.05 23.37
22.35 3.05
2.79 3.43
3.18
5.51
4.45
cD1N3
2.95
2.43
Q
0.38
w1
M1
1.66
1.39
N
11.56
11.05
D2
5.33
5.08
inches 0.065
0.055 0.035
0.025 0.006
0.004 0.205
0.195 0.209
0.199 0.920
0.880 0.120
0.110 0.135
0.125
0.217
0.175 0.116
0.096 0.015
0.065
0.055 0.455
0.435
0.210
0.200
MH
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
1999 Jul 19 13
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A1bpcDEe
1H
EL
pQywv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.10
0.01
1.8
1.5 0.80
0.60
b1
3.1
2.9 0.32
0.22 6.7
6.3 3.7
3.3 2.3
e
4.6 7.3
6.7 1.1
0.7 0.95
0.85 0.1 0.10.2
DIMENSIONS (mm are the original dimensions)
SOT223 96-11-11
97-02-28
wM
bp
D
b1
e1
e
A
A1
Lp
Q
detail X
HE
E
vMA
AB
B
c
y
0 2 4 mm
scale
A
X
132
4
Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223
1999 Jul 19 14
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A1
max bpcD Ee
1
H
E
L
pQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.1
1.1
0.8 0.4
0.3 0.25
0.10 2.2
1.8 1.35
1.15 0.65
e
1.3 2.2
2.0 0.23
0.13 0.20.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT323 SC-70
wM
bp
D
e1
e
A
B
A1
Lp
Q
detail X
c
HE
E
vMA
AB
y
0 1 2 mm
scale
A
X
12
3
Plastic surface mounted package; 3 leads SOT323
97-02-28
1999 Jul 19 15
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
UNIT A1
max bpcD E
b
1H
E
L
pQwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 0.1
1.1
0.8 0.4
0.3 0.25
0.10
0.7
0.5 2.2
1.8 1.35
1.15
e
2.2
2.0
1.3
e1
0.2
y
0.10.21.15
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.23
0.13
SOT343N
D
e1
A
A1
Lp
Q
detail X
c
HE
E
vMA
AB
0 1 2 mm
scale
A
X
12
34
Plastic surface mounted package; 4 leads SOT343N
e
wMB
97-05-21
bp
y
b1
1999 Jul 19 16
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT343R
D
A
A1
Lp
Q
detail X
c
HE
E
vMA
AB
0 1 2 mm
scale
X
21
43
Plastic surface mounted package; reverse pinning; 4 leads SOT343R
wMB
97-05-21
bp
UNIT A1
max bpcD E
b
1H
E
L
pQwv
mm 0.1
1.1
0.8 0.4
0.3 0.25
0.10
0.7
0.5 2.2
1.8 1.35
1.15
e
2.2
2.0
1.3
e1
0.2
y
0.10.21.15
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.23
0.13
e1
A
e
y
b1
1999 Jul 19 17
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT353
wBM
b
p
D
e
1
e
A
A
1
L
p
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
45
Plastic surface mounted package; 5 leads SOT353
UNIT A1
max bpcD
E (2) e1HELpQywv
mm 0.1 0.30
0.20 2.2
1.8
0.25
0.10 1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
97-02-28SC-88A
1999 Jul 19 18
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT363 SC-88
wBM
b
p
D
e
1
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
AB
y
0 1 2 mm
scale
c
X
132
4
56
Plastic surface mounted package; 6 leads SOT363
UNIT A1
max bpcDEe
1H
E
L
p
Qywv
mm 0.1 0.30
0.20 2.2
1.8
0.25
0.10 1.35
1.15 0.65
e
1.3 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.8
97-02-28
1999 Jul 19 19
Philips Semiconductors Product speciļ¬cation
RF Wideband Transistors Package outlines
Package under
development
Philips Semiconductors reserves the
right to make changes without notice.
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOT551A
wBM
b
p
D
e
1
e
2
e
pin 1
index A
A1
Lp
Q
detail X
HE
E
vMA
A
B
0 1 2 mm
scale
c
X
132
45
Plastic surface mounted package; 5 leads SOT551A
UNIT A1
max bpcDEe
1H
E
L
p
Qywv
mm 0.1 0.3
0.2
b1
0.8
1.0 2.2
1.8
0.25
0.10 1.35
1.15 1.3
e2
0.975
e
0.65 2.2
2.0 0.2 0.10.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15 0.25
0.15
A
1.1
0.9
1999-05-07
y
b1