TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DLow-Voltage and Single-Supply Operation
VCC = 2 V to 7 V
DCommon-Mode Voltage Range Includes
Ground
DFast Response Time . . . 0.7 µs Typ
DLow Supply Current ...80 µA Typ and
150 µA Max
DFully Specified at 3-V and 5-V Supply
Voltages
description/ordering informaton
The TLV1391 is a differential comparator built using a Texas Instruments low-voltage, high-speed bipolar
process. These devices have been developed specifically for low-voltage, single-supply applications. Their
enhanced performance makes them excellent replacements for the LM393 in the improved 3-V and 5-V system
designs.
The TLV1391, with its typical supply current of only 80 µA, is ideal for low-power systems. Response time also
has been improved to 0.7 µs.
ORDERING INFORMATION
TAPACKAGEORDERABLE
PART NUMBER
TOP-SIDE
MARKING
0°Cto70°C
SOT 23 5 (DBV)
Reel of 3000 TLV1391CDBVR
Y3D
−0°C to 70°CSOT-23-5 (DBV) Reel of 250 TLV1391CDBVT Y3D_
40°Cto85°C
SOT 23 5 (DBV)
Reel of 3000 TLV1391IDBVR
Y3E
−40°C to 85°CSOT-23-5 (DBV) Reel of 250 TLV1391IDBVT Y3E_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
symbol (each comparator)
OUT
IN+
IN−
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2007, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV PACKAGE
(TOP VIEW)
1
2
3
5
4
IN−
VCC−/GND
IN+
VCC+
OUT
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
equivalent schematic
VCC
GND OUT
IN+
IN−
COMPONENT COUNT
Transistors 26
Resistors 1
Diodes 4
Epi-FET 1
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC (see Note 1) 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (any input) −0.3 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage, VO 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output current, IO (each output) 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of short-circuit current to GND (see Note 3) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 4 and 5) 206°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network GND.
2. Differential voltages are at the noninverting input with respect to the inverting input.
3. Short circuits from the outputs to VCC can cause excessive heating and eventual destruction of the chip.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN MAX UNIT
VCC Supply voltage 2 7 V
T
Operating free-air temperature
TLV1391C 0 70
°C
TA
O
perat
i
ng
f
ree-a
i
r temperature TLV1391I −40 85 °C
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics, VCC = 3 V
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
V
Input offset voltage
V V (min)
25°C 1.5 5
mV
VIO Input offset voltage VO = 1.4 V, VIC = VICR(min) Full range 9mV
V
Common mode input voltage range
25°C0 to
VCC−1.5
0 to
VCC−1.2
V
VICR Common-mode input voltage range
Full range 0 to
VCC−2
V
VOL Low-level output voltage VID = −1 V, IOL = 500 µAFull range 120 300 mV
I
Input offset current
V14V
25°C 5 50
nA
IIO Input offset current VO = 1.4 V Full range 150 nA
I
Input bias current
V14V
25°C −40 −250
nA
IIB Input bias current VO = 1.4 V Full range −400 nA
I
High level output current
VID = 1 V, VOH = 3 V 25°C 0.1
nA
IOH High-level output current VID = 1 V, VOH = 5 V Full range 100 nA
IOL Low-level output current VID = −1 V, VOL = 1.5 V 25°C 500 µA
I
High level supply current
V V
25°C 80 125
A
ICC(H) High-level supply current VO = VOH Full range 150 µA
I
Low level supply current
V=V
25°C 80 125
µA
ICC(L) Low-level supply current VO = VOL Full range 150 µA
switching characteristics, VCC = 3 V, CL = 15 pF, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Response time 100-mV input step with 5-mV overdrive, RL = 5.1 k0.7 µs
CL includes the probe and jig capacitance.
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics, VCC = 5 V
PARAMETER TEST CONDITIONS TAMIN TYP MAX UNIT
V
Input offset voltage
V V (min)
25°C 1.5 5
mV
VIO Input offset voltage VO = 1.4 V, VIC = VICR(min) Full range 9mV
V
Common mode input voltage range
25°C0 to
VCC−1.5
0 to
VCC−1.2
V
VICR Common-mode input voltage range
Full range 0 to
VCC−2
V
VOL Low-level output voltage VID = −1 V, IOL = 500 µAFull range 120 300 mV
I
Input offset current
V14V
25°C 5 50
nA
IIO Input offset current VO = 1.4 V Full range 150 nA
I
Input bias current
V14V
25°C −40 −250
nA
IIB Input bias current VO = 1.4 V Full range −400 nA
I
High level output current
VID = 1 V, VOH = 3 V 25°C 0.1
nA
IOH High-level output current VID = 1 V, VOH = 5 V Full range 100 nA
IOL Low-level output current VID = −1 V, VOL = 1.5 V 25°C 600 µA
I
High level supply current
V V
25°C 100 150
A
ICC(H) High-level supply current VO = VOH Full range 175 µA
I
Low level supply current
V=V
25°C 100 150
µA
ICC(L) Low-level supply current VO = VOL Full range 175 µA
switching characteristics, VCC = 5 V, CL = 15 pF, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Response time
100-mV input step with 5-mV overdrive, RL = 5.1 k0.65
s
Response time TTL-level input step, RL = 5.1 k0.18 µs
CL includes the probe and jig capacitance.
TLV1391
SINGLE DIFFERENTIAL COMPARATORS
SLCS128F − APRIL 1996 − REVISED JUNE 2007
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 1
LOW-TO HIGH-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
Low-to High-Level Output Response Time − µs
VCC = 3 V
TA = 25° C
40 mV
20 mV
10 mV
5 mV
2 mV
− Output Voltage − VVO
Voltage Step − mV
− InputVI(STEP)
4.5
3
1.5
0
100
0
0 0.5 1 1.5 2 2.5
Figure 2
HIGH-TO LOW-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
High-to Low-Level Output Response Time − µs
VCC = 3 V
TA = 25° C
− Output Voltage − VVO
Voltage Step − mV
− InputVI(STEP)
4.5
3
1.5
0
100
0
0 0.2 0.4 0.6 0.8
40 mV
20 mV
10 mV
5 mV
2 mV
Figure 3
LOW-TO HIGH-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
Low-to High-Level Output Response Time − µs
VCC = 5 V
TA = 25° C
40 mV
20 mV
10 mV
5 mV
2 mV
− Output Voltage − VVO
Voltage Step − mV
− InputVI(STEP)
7.5
5
2.5
0
100
0
0 0.5 1 1.5 2 2.5
Figure 4
HIGH-TO LOW-LEVEL OUTPUT
RESPONSE FOR VARIOUS INPUT OVERDRIVES
High-to Low-Level Output Response Time − µs
VCC = 5 V
TA = 25° C
40 mV
20 mV
10 mV
5 mV
2 mV
− Output Voltage − VVO
Voltage Step − mV
− InputVI(STEP)
7.5
5
2.5
0
100
0
0 0.2 0.4 0.6 0.8
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TLV1391CDBV OBSOLETE SOT-23 DBV 5 TBD Call TI Call TI Replaced by TLV1391CDBVR
TLV1391CDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391CDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391CDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391CDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391CDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391CDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391IDBV OBSOLETE SOT-23 DBV 5 TBD Call TI Call TI Replaced by TLV1391IDBVR
TLV1391IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
TLV1391IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
TLV1391IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
TLV1391IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 7-Jun-2010
Addendum-Page 2
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV1391CDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV1391CDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TLV1391IDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
TLV1391IDBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV1391IDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 2-May-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV1391CDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TLV1391CDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TLV1391IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0
TLV1391IDBVR SOT-23 DBV 5 3000 203.0 203.0 35.0
TLV1391IDBVT SOT-23 DBV 5 250 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-May-2012
Pack Materials-Page 2
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