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P/N:PM0370 REV. 3.2, NOV. 07, 2006
32M-BIT (4M x 8 / 2M x 16) Mask ROM
FEATURES
• Bit organization
- 4M x 8 (byte mode)
- 2M x 16 (word mode)
• Fast access time
- Random access:70ns (max.) for 3.0V~3.6V
90ns (max.) for 2.7V~3.6V
• Current
- Operating:40mA
- Standby:15uA
• Supply voltage
- 2.7V~3.6V
• Package
- 44 pin SOP (500mil)
- 48 pin TSOP (12mm x 20mm)
- 44 pin TSOP (Type II)
ORDER INFORMATION
P art No. Access Time P a ck age
MX23L3210MC-10 100ns 44 pin SOP
MX23L3210MC-12 120ns 44 pin SOP
MX23L3210MC-15 150ns 44 pin SOP
MX23L3210TC-70 70ns 48 pin TSOP
MX23L3210TC-90 90ns 48 pin TSOP
MX23L3210TC-10 100ns 48 pin TSOP
MX23L3210TC-12 120ns 48 pin TSOP
MX23L3210TC-15 150ns 48 pin TSOP
MX23L3210RC-70 70ns 48 pin TSOP
(Reverse type)
MX23L3210RC-90 90ns 48 pin TSOP
(Reverse type)
MX23L3210RC-10 100ns 48 pin TSOP
(Reverse type)
MX23L3210RC-12 120ns 48 pin TSOP
(Reverse type)
MX23L3210RC-15 150ns 48 pin TSOP
(Reverse type)
MX23L3210YC-10 100ns 44 pin TSOP
MX23L3210YC-12 120ns 44 pin TSOP
PIN DESCRIPTION
Symbol Pin Function
A0~A20 Address Inputs
D0~D14 Data Outputs
D15/A-1 D15 (Word Mode)/ LSB Address
(Byte Mode)
CE Chip Enable Input
OE Output Enable Input
Byte Word/ Byte Mode Selection
VCC P o wer Supply Pin
VSS Ground Pin
NC No Connection
PIN CONFIGURATION
44 SOP/ 44 TSOP
MODE SELECTION
CE OE Byte D15/A-1 D0~D7 D8~D15 Mode Power
H X X X High Z High Z - Stand-by
L H X X High Z High Z - Activ e
L L H Output D0~D7 D8~D15 Word Active
L L L Input D0~D7 High Z Byte Activ e
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
VSS
OE
D0
D8
D1
D9
D2
D10
D3
D11
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
MX23L3210
MX23L3210
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
48 TSOP (Normal Type)
48 TSOP (Reverse Type)
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
VSS
A20
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VSS
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
VCC
NC
D11
D3
D10
D2
D9
D1
D8
D0
OE
VSS
VSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX23L3210
(Re verse Tp ye)
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
VSS
A20
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
VSS
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
VCC
NC
D11
D3
D10
D2
D9
D1
D8
D0
OE
VSS
VSS
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX23L3210
(Normal Type)
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
Address
Buffer Memory
Array Sense
Amplifier Word/
Byte Output
Buffer
D0
D15/(D7)
A0/(A-1)
A20
CE
BYTE
OE
ABSOLUTE MAXIMUM RATINGS
Item Symbol Ratings
Voltage on any Pin Relative to VSS VIN -0.3V to 3.9V
Ambient Operating Temperature Topr 0°C to 70°C
Sto rage Temperature Tstg -65°C to 125°C
BLOCK DIAGRAM
DC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 2.7V~3.6V)
Item Symbol MIN. MAX. Conditions
Output High Vo ltage V OH 2.3V - IOH = -0.4mA
Output Low Vo ltage V OL - 0.4V IOL = 1.6mA
Input High Vo ltage VIH 2.1V VCC+0.3V
Input Low Voltage VIL -0.3V 0.2xVCC
Input Leakage Current ILI - 5uA 0V, VCC
Output Leakage Current ILO - 5uA 0V, VCC
Operating Current ICC1 - 40mA tRC = 120ns, all output open
Standby Current (TTL) ISTB1 - 1mA CE = VIH
Standby Current (CMOS) ISTB2 - 15uA CE>VCC-0.2V
Input Capacitance CIN - 10pF Ta = 25°C, f = 1MHZ
Output Capacitance COUT - 10pF Ta = 25°C, f = 1MHZ
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
AC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 3.0V~3.6V)
Item Symbol 23L3210-70 23L3210-90 23L3210-10 23L3210-12 23L3210-15
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
Read Cycle Time tRC 70ns - 90ns - 100ns - 120ns - 150ns -
Address Access Time tAA - 70ns - 90ns - 100ns - 120ns - 150ns
Chip Enable Access Time tA CE - 70ns - 90ns - 100ns - 120ns - 150ns
Output Enable Time tOE - 35ns - 45ns - 50ns - 60ns - 70ns
Output Hold After Address tOH 0ns - 0ns - 0ns - 0ns - 0ns -
Output High Z Delay tHZ - 20ns - 20ns - 20ns - 20ns - 20ns
AC Test Conditions
Input Pulse Lev els 0.4V~2.4V
Input Rise and F all Times 10ns
Input Timing Level 1.4V
Output Timing Level 1.4
Output Load See Figure
TIMING DIAGRAM
RANDOM READ
Note:No output loading is present in tester load board.
Active loading is used and under software programming control.
Output loading capacitance includes load board's and all stray capacitance.
DOUT
C<100pF
IOL (load)=1.6mA
IOH (load)=-0.4mA
Note:Output high-impedance delay (tHZ) is measured
from OE going high, and this parameter guaranteed by
design over the full voltage and temperature operating
range - not tested.
tACE
tAA tOH tHZ
ADD ADD ADD
ADD
CE#
OE#
DATA
VALID VALID VALID
tRC
tOE
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
PACKAGE INFORMATION
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
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P/N:PM0370 REV. 3.2, NOV. 07, 2006
MX23L3210
REVISION HISTORY
REVISION DESCRIPTION PAGE DATE
2.5 AC CHARACTERISTICS tOH 10ns-->0ns P4 JAN/29/1999
2.6 Add 120ns (max.) for 3.0V~3.6V ; 150ns(max.) f or 2.7V~3.6V P1 Dec/24/1999
DC characteristics Standby current (ISTB2):5uA-->15uA P1,3
A C characteristics 120ns f or 3.0V~3.6V P4
2.7 1. Added access time:100ns P1,4 JUN/28/2001
2. Modify Package Infor mation P5,6
2.8 1. Added 44-pin TSOP(II) P1,7 JUL/17/2001
2.9 1. Added access time:70ns & 90ns P1,4 MAY/14/2002
3.0 Modify Package Information P5~8 NO V/21/2002
3.1 Change 2.7~3.6V 150ns-->2.7~3.6V 90ns P1 MA Y/19/2004
3.2 1. Added statement P10 NO V/07/2006
MX23L3210
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MACRONIX INTERNATIONAL CO., LTD .
Headquarters
Macronix, Int'l Co., Ltd.
16, Li-Hsin Road, Science Park,
Hsinchu, Taiwan, R.O.C.
Tel: +886-3-5786688
Fax: +886-3-5632888
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Milpitas, CA 95035, U.S.A.
Tel: +1-408-262-8887
Fax: +1-408-262-8810
Email: sales.northamerica@macronix.com
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NKF Bldg. 5F, 1-2 Higashida-cho,
Kawasaki-ku Kawasaki-shi,
Kanagawa Pref. 210-0005, Japan
Tel: +81-44-246-9100
Fax: +81-44-246-9105
Macronix (Hong Kong) Co., Limited.
702-703, 7/F, Building 9,
Hong Kong Science Park,
5 Science Park West Avenue, Sha Tin, N.T.
Tel: +86-852-2607-4289
Fax: +86-852-2607-4229
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.
Taipei Office
Macronix, Int'l Co., Ltd.
19F, 4, Min-Chuan E. Road, Sec. 3,
Taipei, Taiwan, R.O.C.
Tel: +886-2-2509-3300
Fax: +886-2-2509-2200
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Koningin Astridlaan 59, Bus 1
1780 Wemmel Belgium
Tel: +32-2-456-8020
Fax: +32-2-456-8021
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Macronix Pte. Ltd.
1 Marine Parade Central
#11-03 Parkway Centre
Singapore 449408
Tel: +65-6346-5505
Fax: +65-6348-8096
Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure
of a single component co uld cause death, personal injury, severe physical damage , or o ther substantial harm to persons o r
property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix
and its suppliers will not be liable to y ou and/o r any third party for any claims, injuries o r damages that ma y be incurred due
to use of Macronix's products in the prohibited applications.
