• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
Inductors for Standard Circuits
Multilayer/STD • magnetic shielded
MLF series
Type:
Issue date:
MLF1005L 1005[0402 inch]*
MLF1608 1608[0603 inch]
MLF2012 2012[0805 inch]
* Dimensions Code JIS[EIA]
November 2011
• All specifications are subject to change without notice.
(1/9)
001-05 / 20111129 / e511_mlf_02
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF1005L
Various digital devices are required to be further downsized yet
remain highly functional, and to excel in low power consumption,
and parts mounted on the devices are also required to have lower
resistance.
The MLF1005L type is a new line of inductors that have been
developed to meet such requirements: their resistance has been
lowered by up to 35% in comparison with that of the existing
MLF1005 type.
In addition, the new inductors use similar magnetic shielding,
which enables their high-density mounting.
FEATURES
• The resistance of the MLF1005L type has been lowered by up to
35% in comparison with that of the existing MLF1005 type.
• Magnetically shielded configuration allowing for high-density
mounting.
• Does not contain lead and is compatible with lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Signal processing modules such as cellular phones and tuners
SPECIFICATIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Inductance
(5) Tolerance
(6) Packaging style
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
Operating temperature range –40 to +85°C
Storage temperature range –40 to +85°C(After mount)
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
MLF 1005 L R10 K T
(1) (2) (3) (4) (5) (6) (7)
1005 1.0×0.5×0.5
L Low-resistance type
R10 0.1µH
1R0 1.0µH
K ±10%
T Taping [reel]
Packaging style Quantity
Taping 10000 pieces/reel
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(2/9)
001-05 / 20111129 / e511_mlf_02
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
ELECTRICAL CHARACTERISTICS
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
Q vs. FREQUENCY CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
Inductance
(µH)
Inductance
tolerance
Te s t
frequency
L, Q (MHz)
Tes t
current
L, Q (mA)
Q min.
Self-resonant
frequency
(MHz)min.
DC resistance
(Ω)max.
Rated current
(mA)max. Part No.
0.1 ±10% 25 1.0 10 450 0.51 150 MLF1005LR10KT
0.12 ±10% 25 1.0 10 400 0.59 140 MLF1005LR12KT
0.15 ±10% 25 1.0 10 350 0.63 130 MLF1005LR15KT
0.18 ±10% 25 1.0 10 320 0.76 120 MLF1005LR18KT
0.22 ±10% 25 1.0 10 290 0.79 110 MLF1005LR22KT
0.27 ±10% 25 1.0 10 260 0.91 100 MLF1005LR27KT
0.33 ±10% 25 1.0 10 230 1.05 90 MLF1005LR33KT
0.39 ±10% 10 1.0 25 210 0.41 50 MLF1005LR39KT
0.47 ±10% 10 1.0 25 190 0.42 50 MLF1005LR47KT
0.56 ±10% 10 1.0 25 170 0.47 45 MLF1005LR56KT
0.68 ±10% 10 1.0 25 150 0.55 40 MLF1005LR68KT
0.82 ±10% 10 1.0 25 130 0.59 35 MLF1005LR82KT
1.0 ±10% 10 1.0 25 120 0.64 35 MLF1005L1R0KT
1.2 ±10% 10 1.0 25 110 0.79 35 MLF1005L1R2KT
1.5 ±10% 10 1.0 25 100 0.95 30 MLF1005L1R5KT
1.8 ±10% 10 1.0 25 90 1.05 20 MLF1005L1R8KT
2.2 ±10% 10 1.0 25 80 1.15 15 MLF1005L2R2KT
0.5±0.05
0.5±0.05
0.1min. 0.1min.
1.0±0.05
Weight : 1.2mg Dimensions in mm
0.4 0.50.5
0.5
1
0.01
10
0.1
1
Inductance(µH)
Frequency(MHz)
2.2µH
0.1µH
0.33µH
1.0µH
10 100 1000
1
010 100 1000
Q
Frequency(MHz)
2.2µH
1.0µH0.1µH
0.33µH
10
20
30
40
50
70
60
1
1
10000
1000
10
100
Impedance(Ω)
Frequency(MHz)
2.2µH
0.1µH
0.33µH
1.0µH
10 100 1000
• All specifications are subject to change without notice.
(3/9)
001-05 / 20111129 / e511_mlf_02
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1
2.0±0.05 2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
1.15±0.1
0.8max. 0.65±0.1
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(4/9)
001-05 / 20111129 / e511_mlf_02
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF1608
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, tuner, personal computers, audio, or various
electronic appliances
SPECIFICATIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Inductance
(5) Tolerance
(6) Packaging style
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
Operating temperature range –40 to +85°C
Storage temperature range –40 to +85°C(After mount)
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
MLF 1608 A 1R0 K T
(1) (2) (3) (4) (5) (6) (7)
1608 1.6×0.8mm
47N 47nH[0.047µH]
R15 0.15µH
1R0 1µH
K ±10%
M ±20%
T Taping [reel]
Packaging style Quantity
Taping 4000 pieces/reel
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(5/9)
001-05 / 20111129 / e511_mlf_02
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
ELECTRICAL CHARACTERISTICS
∗ 47N means for 47nH (0.047µH).
• Test equipment
Inductance, Q: Ag4294A-16034G
Inductance
(µH)
Inductance
tolerance
QTes t
frequency
L, Q (MHz)
Te st
current
L, Q (mA)
Self-resonant
frequency (MHz)
DC resistance
(Ω)Rated current
(mA)max. Part No.
min. typ. min. typ. max. typ.
0.047 ±20% 10 20 50 1.0 600 900 0.20 0.10 200 MLF1608D47N∗MT
0.068 ±20% 10 20 50 1.0 550 700 0.30 0.15 200 MLF1608D68NMT
0.082 ±20% 10 20 50 1.0 500 650 0.30 0.15 200 MLF1608D82NMT
0.1 ±10% 15 25 25 1.0 450 600 0.35 0.20 200 MLF1608DR10KT
0.12 ±10% 15 25 25 1.0 400 550 0.40 0.20 200 MLF1608DR12KT
0.15 ±10% 15 25 25 1.0 350 500 0.45 0.25 200 MLF1608DR15KT
0.18 ±10% 15 25 25 1.0 320 450 0.50 0.25 150 MLF1608DR18KT
0.22 ±10% 15 25 25 1.0 290 400 0.55 0.30 150 MLF1608DR22KT
0.27 ±10% 15 25 25 1.0 260 350 0.60 0.35 150 MLF1608DR27KT
0.33 ±10% 15 25 25 1.0 230 320 0.75 0.40 100 MLF1608DR33KT
0.39 ±10% 15 25 25 1.0 210 290 0.85 0.45 100 MLF1608DR39KT
0.47 ±10% 15 30 25 1.0 190 260 0.95 0.50 100 MLF1608DR47KT
0.56 ±10% 15 30 25 1.0 170 230 1.05 0.55 100 MLF1608DR56KT
0.68 ±10% 15 30 25 1.0 150 210 1.25 0.65 70 MLF1608DR68KT
0.82 ±10% 15 30 25 1.0 130 190 1.40 0.75 70 MLF1608DR82KT
1 ±10% 35 50 10 1.0 120 170 0.50 0.25 50 MLF1608A1R0KT
1.2 ±10% 35 50 10 1.0 110 150 0.65 0.25 50 MLF1608A1R2KT
1.5 ±10% 35 55 10 1.0 100 140 0.70 0.30 50 MLF1608A1R5KT
1.8 ±10% 35 55 10 1.0 90 130 0.85 0.35 50 MLF1608A1R8KT
2.2 ±10% 35 55 10 1.0 80 120 1.00 0.45 30 MLF1608A2R2KT
2.7 ±10% 35 55 10 1.0 70 110 1.15 0.50 30 MLF1608A2R7KT
3.3 ±10% 35 60 10 1.0 65 100 1.30 0.55 30 MLF1608A3R3KT
3.9 ±10% 35 60 10 1.0 60 90 1.45 0.65 30 MLF1608A3R9KT
4.7 ±10% 35 60 10 1.0 55 80 1.60 0.75 30 MLF1608A4R7KT
5.6 ±10% 35 60 4 0.1 45 70 1.10 0.55 15 MLF1608E5R6KT
6.8 ±10% 35 60 4 0.1 40 60 1.30 0.65 15 MLF1608E6R8KT
8.2 ±10% 35 60 4 0.1 35 55 1.50 0.80 10 MLF1608E8R2KT
10 ±10% 30 55 2 0.1 30 50 1.70 1.00 10 MLF1608E100KT
12 ±10% 30 55 2 0.1 25 45 1.80 1.20 10 MLF1608E120KT
15 ±10% 20 40 1 0.1 22 42 1.50 0.80 2 MLF1608C150KT
18 ±10% 20 40 1 0.1 20 40 1.60 0.85 2 MLF1608C180KT
22 ±10% 20 40 1 0.1 18 38 1.70 0.90 2 MLF1608C220KT
27 ±10% 20 40 1 0.1 15 35 1.80 1.20 2 MLF1608C270KT
33 ±10% 20 40 1 0.1 10 30 2.20 1.40 2 MLF1608C330KT
0.3±0.2
1.6±0.15
0.8±0.15
0.80.6 0.6
0.8
0.8±0.15
Dimensions in mm
Weight: 4mg
• All specifications are subject to change without notice.
(6/9)
001-05 / 20111129 / e511_mlf_02
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
INDUCTANCE CHANGE vs. TEMPERATURE
CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
Q vs. FREQUENCY CHARACTERISTICS
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
100
10
1
0.1
0.011 5 10 50 100 5001000
DC current(mA)
Inductance(µH)
22µH
8.2µH
1µH
0.068µH
0
–5
–10
25 50 85
Temperature(˚C)
∆L/L(%)
0–25
10
5
22µH
0.68µH
8.2µH
1µH
1µH
8.2µH
0.68µH
22µH
22µH
8.2µH
1µH
0.68µH
100
10
1
0.1
0.011 5 10 50 100 500 1000
Frequency(MHz)
Impedance(kΩ)
22µH
8.2µH1µH
0.68µH
80
60
40
20
00.1 0.5 1 5 10 50 100 500 1000
Q
Frequency(MHz)
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.9±0.2
1.75±0.1
1.1max. 1.1±0.2 4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
• All specifications are subject to change without notice.
(7/9)
001-05 / 20111129 / e511_mlf_02
Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF2012
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high density mounting.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
ous electronic appliances
SPECIFICATIONS
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Type name
(4) Inductance
(5) Tolerance
(6) Packaging style
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
Conformity to RoHS Directive
Operating temperature range –40 to +85°C
Storage temperature range –40 to +85°C(After mount)
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
MLF 2012 A 1R0 K T
(1) (2) (3) (4) (5) (6) (7)
2012 2.0×1.25mm
47N 47nH[0.047µH]
R15 0.15µH
1R0 1µH
100 10µH
K ±10%
M ±20%
T Taping [reel]
Packaging style Product’s thickness Quantity
Taping 0.85mm 4000 pieces/reel
1.25mm 2000 pieces/reel
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
(8/9)
001-05 / 20111129 / e511_mlf_02
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN
ELECTRICAL CHARACTERISTICS
∗ 47N means for 47nH (0.047µH).
• Test equipment
Inductance, Q: Ag4294A-16034G
Inductance
(µH)
Inductance
tolerance
QTe s t
frequency
L, Q (MHz)
Test
current
L, Q (mA)
Self-resonant
frequency (MHz)
DC resistance
(Ω)
Rated
current
(mA)max.
Thickness
T
(mm)
Part No.
min. typ. min. typ. max. typ.
0.047 ±20% 15 25 50 1.0 550 700 0.10 0.05 300 0.85 MLF2012D47N∗MT
0.068 ±20% 15 25 50 1.0 500 600 0.15 0.08 300 0.85 MLF2012D68NMT
0.082 ±20% 15 25 50 1.0 450 550 0.15 0.08 300 0.85 MLF2012D82NMT
0.1 ±10% 20 30 25 1.0 400 500 0.15 0.10 300 0.85 MLF2012DR10KT
0.12 ±10% 20 30 25 1.0 360 450 0.20 0.12 300 0.85 MLF2012DR12KT
0.15 ±10% 20 30 25 1.0 320 410 0.20 0.13 300 0.85 MLF2012DR15KT
0.18 ±10% 20 30 25 1.0 280 370 0.25 0.15 300 0.85 MLF2012DR18KT
0.22 ±10% 20 30 25 1.0 250 330 0.30 0.16 250 0.85 MLF2012DR22KT
0.27 ±10% 20 30 25 1.0 220 300 0.35 0.18 250 0.85 MLF2012DR27KT
0.33 ±10% 20 30 25 1.0 200 270 0.40 0.23 250 0.85 MLF2012DR33KT
0.39 ±10% 25 35 25 1.0 180 250 0.45 0.25 200 0.85 MLF2012DR39KT
0.47 ±10% 25 35 25 1.0 160 230 0.50 0.25 200 1.25 MLF2012DR47KT
0.56 ±10% 25 35 25 1.0 150 210 0.55 0.30 150 1.25 MLF2012DR56KT
0.68 ±10% 25 35 25 1.0 140 190 0.60 0.35 150 1.25 MLF2012DR68KT
0.82 ±10% 25 35 25 1.0 130 170 0.65 0.40 150 1.25 MLF2012DR82KT
1 ±10% 45 55 10 1.0 120 160 0.30 0.15 80 0.85 MLF2012A1R0KT
1.2 ±10% 45 55 10 1.0 110 150 0.35 0.15 80 0.85 MLF2012A1R2KT
1.5 ±10% 45 60 10 1.0 100 140 0.40 0.18 80 0.85 MLF2012A1R5KT
1.8 ±10% 45 60 10 1.0 90 130 0.45 0.20 80 0.85 MLF2012A1R8KT
2.2 ±10% 45 60 10 1.0 80 120 0.50 0.22 50 0.85 MLF2012A2R2KT
2.7 ±10% 45 70 10 1.0 70 100 0.55 0.25 50 1.25 MLF2012A2R7KT
3.3 ±10% 45 70 10 1.0 60 90 0.60 0.28 50 1.25 MLF2012A3R3KT
3.9 ±10% 45 70 10 1.0 55 80 0.65 0.30 30 1.25 MLF2012A3R9KT
4.7 ±10% 45 70 10 1.0 50 70 0.70 0.35 30 1.25 MLF2012A4R7KT
5.6 ±10% 50 75 4 0.1 45 65 0.60 0.30 15 1.25 MLF2012E5R6KT
6.8 ±10% 50 75 4 0.1 40 60 0.65 0.32 15 1.25 MLF2012E6R8KT
8.2 ±10% 50 75 4 0.1 35 55 0.70 0.35 15 1.25 MLF2012E8R2KT
10 ±10% 50 75 2 0.1 30 50 0.80 0.40 15 1.25 MLF2012E100KT
12 ±10% 50 75 2 0.1 25 45 0.90 0.50 15 1.25 MLF2012E120KT
15 ±10% 30 45 1 0.1 22 40 0.70 0.35 5 1.25 MLF2012C150KT
18 ±10% 30 45 1 0.1 20 38 0.80 0.38 5 1.25 MLF2012C180KT
22 ±10% 30 45 1 0.1 18 35 0.90 0.45 5 1.25 MLF2012C220KT
27 ±10% 30 45 1 0.1 17 33 1.00 0.50 5 1.25 MLF2012C270KT
33 ±10% 30 45 0.4 0.1 15 28 1.10 0.55 5 1.25 MLF2012C330KT
39 ±10% 35 55 2 0.1 13 23 2.40 1.30 4 1.25 MLF2012K390KT
47 ±10% 35 55 2 0.1 11 20 2.70 1.60 4 1.25 MLF2012K470KT
56 ±10% 35 55 2 0.1 10 18 2.80 1.80 4 1.25 MLF2012K560KT
68 ±10% 25 45 1 0.1 9 16 2.90 2.00 2 1.25 MLF2012C680KT
82 ±10% 25 45 1 0.1 8 14 3.00 2.40 2 1.25 MLF2012C820KT
100 ±10% 25 45 1 0.1 7 12 3.10 2.50 2 1.25 MLF2012C101KT
0.5±0.3
1.25±0.2
10.8 0.8
1.2
T
Dimensions in mm
2.0±0.2
T(Thickness)
0.85±0.2
1.25±0.2
Weight(mg)
10
14
• All specifications are subject to change without notice.
(9/9)
001-05 / 20111129 / e511_mlf_02
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE CHANGE vs. DC SUPERPOSITION
CHARACTERISTICS
INDUCTANCE CHANGE vs. TEMPERATURE
CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
Q vs. FREQUENCY CHARACTERISTICS
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
100
10
1
0.1
0.011 5 10 50 100 5001000
DC current(mA)
Inductance(µH)
22µH
10µH
0.1µH
1µH
0
–4
–8
–12
–16
25 50 85
10µH
0.1µH
22µH
0.1µH
1µH
10µH
Temperature(˚C)
∆L/L(%)
0–25
12
8
4
1µH
22µH
Frequency(MHz)
22µH
10µH
1µH 0.1µH
1 5 10 50 100 500 1000
100
10
1
0.1
0.01
Impedance(kΩ)
0.1 0.5 1 5 10 50 100 500 1000
80
60
40
20
0
Q
Frequency(MHz)
10µH
1µH
22µH
0.1µH
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
1.1max. 4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
2.3±0.2
1.5±0.2
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
8.0±0.3 3.5±0.05
1.75±0.1
0.3max. 4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole 0.5min. Cavity
2.3±0.2
1.5max.
1.5±0.2
t=0.85mm
t=1.25mm
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
TDK:
MLF2012DR10KT000 MLF2012E120KT000 MLF1608D47NMTA00 MLF2012DR22KT000 MLF1608DR15KTA00
MLF1608DR68KTA00 MLF1608DR56KTA00 MLF2012E100KT000 MLF1608DR22KTA00 MLF1608DR10KTA00
MLF1608A3R3KTA00 MLF1608DR27KTA00 MLF2012K470KT000 MLF2012C150KT000 MLF2012C101KT000
MLF2012DR47KT000 MLF1608C330KTD00 MLF2012DR56KT000 MLF1608A2R7KTA00 MLF1608E100KTD00
MLF2012DR82KT000 MLF1608A2R2KTA00 MLF1608A1R8KTA00 MLF1608A1R5KTA00
