®
BYT 13-600 →1000
FAST RECOVERY RECTIFIER DIODES
SOFT RECOVERY
VERY HIGH VOLTAGE
SMALL RECOVERY CHARGE
APPLICATIONS
ANTISATURATION DIODES FOR TRANSIS-
TOR BASE DRIVE
SNUBB ER DIODES
August 1998 Ed : 1B
DO-201AD
(Plastic)
Symbol Parameter Value Unit
IFRM Repetive Peak Forward Current tp ≤ 20µs50 A
IF (AV) Average Forward Current * Ta = 55°C
δ = 0.5 3A
I
FSM Surge non Repetitive Forward Current tp = 10ms
Sinusoidal 100 A
Ptot Power Dissipation * Ta = 55°C3.75 W
Tstg
TjStorage and Junction Temperature Range - 40 to + 150
- 40 to + 150 °C
TLMaximum Lead Temperature for Soldering during 10s at 4mm
from Case 230 °C
ABS OLU TE MAXIMUM RATINGS (limiting values)
Symbol Parameter Value Unit
Rth (j - a) Junction-ambient* 25 °C/W
THERMAL RESISTANCE
Symbol Parameter BYT 13- Unit
600 800 1000
VRRM Repetitive Peak Reverse Voltage 600 800 1000 V
* On infinite heatsin k wi th 10mm lead length.
1/4
2/4
Synbol Test Conditions Min. Typ. Max. Unit
IRTj = 25°CVR = VRRM 20 µA
VFTj = 25°CIF = 3A 1.3 V
STATIC CHAR ACTERISTIC S
ELECTRICAL CHARACTERISTICS
Symbol Test Conditions Min. Typ. Max. Unit
trr Tj = 25°C I
F
= 0.5A IR = 1A I
rr = 0.25A 150 ns
RECOVERY CHARACTERISTICS
To evaluate the conduction losses use the following equations:
VF = 0.95 + 0. 050 IF P = 0.95 x I
F(AV) + 0.050 IF2(RMS)
Figure 1. Maximum average power
dissipation versus average forward current. Figure 2. Average forward current versus
ambient temperature.
Figure 3. Thermal resistance versus lead
length. Mounting n°1
INFINITE HEATSINK Mounting n°2
PRINTED CIRCUIT
BYT13-600 → 1000
Figure 4. Transient thermal impedance
junction-ambient for mounting n°2 versus
pulse du ration (L = 10 mm).
Figure 5. Peak forward current
versus peak forward voltage drop
(maximum values).
Figure 6. Capacitance versus reverse appl ied
voltage Figure 7. Non repetitive surge peak current
versus number of cycles
3/4
BYT 13- 600 → 1000
4/4
DO-201AD (Plastic)
PACKAGE MECHANICAL DATA
BA
EE
ØD ØD
ØC
B
note 2
note 1
note 1
REF. DIMENSIONS NOTES
Millimeters Inches
Min. Max. Min. Max.
A 9.50 0.374 1 - The lead diameter ∅ D is not c ontrolled over zone E
2 - The minimum axial lengh within which the device may be
placed with its leads bent at right angles is 0. 59"(15 mm)
B 25.40 1.000
∅ C 5.30 0.209
∅ D 1.30 0.051
E 1.25 0.049
Infor mation furni shed is believ ed to be ac curate and reliable. However, STMicr oelectronic s assumes no responsIbility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications m entioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previous ly supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval
of S T M i croelectr oni cs. The ST logo is a registered trademark of STMicroelectronics
© 1998 STMicroelectronics - Printed in Italy - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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Marking : type number, white band indicates cathode
Cooling method : by convection (method A)
Weight : 1.166g
BYT13-600 → 1000
